CN206498078U - 10G minimizes the encapsulating structure of coaxial EML lasers - Google Patents
10G minimizes the encapsulating structure of coaxial EML lasers Download PDFInfo
- Publication number
- CN206498078U CN206498078U CN201720202610.9U CN201720202610U CN206498078U CN 206498078 U CN206498078 U CN 206498078U CN 201720202610 U CN201720202610 U CN 201720202610U CN 206498078 U CN206498078 U CN 206498078U
- Authority
- CN
- China
- Prior art keywords
- chip
- laser
- ceramic substrate
- pasted
- pipe cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model is related to optical communication field, propose the encapsulating structure that a kind of 10G minimizes coaxial EML lasers, flat window pipe cap is connected with base, die assemblies are packaged in flat window pipe cap, condenser lens is fixed on the surface of flat window pipe cap by regulation ring, and metal shell set is fixed on the outside of flat window pipe cap, and metal shell top is pasted with isolator, isolator is located at the surface of condenser lens, and metal shell is welded and fixed by metal regulation ring and fiber stub；Die assemblies include electric refrigerator and ceramic substrate, the lower surface of electric refrigerator is mounted on base, the upper surface of electric refrigerator is pasted with ceramic substrate, chip of laser is pasted with ceramic substrate, it is pasted with immediately ahead of chip of laser exiting surface on ceramic substrate on the piece that is all-trans, the ceramic substrate in chip of laser dead astern and is pasted with monitoring back light chip.The utility model can effectively reduce the packaging cost of EML lasers, while helping to realize high-speed, minimizing the automation package platforms of laser.
Description
Technical field
The utility model is related to optical communication field, and in particular to a kind of coaxial packaging structure of 10G EA lasers.
Background technology
10G miniaturization electro-absorption modulation generating lasers are a photo elements for being specifically applied to long distance line data transfer
Device, it is mainly comprising chip of laser, photo-detector, isolator, Dew Point, optical interface and electrical interface etc..Existing market
Upper general 10G electro-absorption lasers are generally BOX encapsulation, and cost remains high.And continuing to increase and light with communication flows
Conveyer is set up, and its communication line also constantly develops to high speed, the inexpensive direction of high capacity, therefore seeks a kind of low
The encapsulation technology of cost is extremely urgent.
The content of the invention
The utility model is to can absorb the problem that individual laser package cost is high, packaging technology is complicated to solve 10G, is proposed
A kind of coaxial packaging structure of EML lasers, greatly reduce traditional EML BOX individual laser packages material and it is artificial into
This.
To achieve the above object, following technical scheme is employed：Propose a kind of 10G and minimize coaxial EML lasers
Encapsulating structure, including base, die assemblies, flat window pipe cap, condenser lens, metal shell and fiber stub, flat window pipe cap and bottom
Seat is connected, and die assemblies are packaged in flat window pipe cap, and condenser lens is fixed on the surface of flat window pipe cap by regulation ring, gold
Category casing is fixed on the outside of flat window pipe cap, and metal shell top is pasted with isolator, and isolator is located at the surface of condenser lens,
Metal shell is welded and fixed by metal regulation ring and fiber stub；The die assemblies include electric refrigerator and ceramic substrate,
The lower surface of electric refrigerator is mounted on base, and the upper surface of electric refrigerator, which is pasted with ceramic substrate, ceramic substrate, to be pasted with
The piece that is all-trans is pasted with ceramic substrate immediately ahead of thermistor, film resistor and chip of laser, chip of laser exiting surface, is swashed
Monitoring back light chip is pasted with the ceramic substrate in light device chip dead astern.
High frequency cushion block is provided with the base, the mounting position of high frequency cushion block is close to chip of laser.
Also include filter capacitor in the die assemblies, the first filter capacitor is mounted on ceramic substrate, the second filtered electrical
Appearance is mounted on base.
Mounting angle between the monitoring back light chip and chip of laser is 6 ° -8 °.
The light hole of the light extraction optical axis of the chip of laser exiting surface, the primary optical axis of condenser lens and isolator is located at same
On one axis.
The utility model compared with the existing technology, has the following advantages that：
1) coaxial packaging technology is used, the material and cost of labor of traditional EML BOX individual laser packages is greatly reduced；
2）The utility model employs flat window pipe cap encapsulation, flat window pipe cap top and entered by way of regulation ring coupled lens
Row lens are fixed, compared to traditional directly seam weld pipe cap mode, so the tolerance to lens mounting position and height is loosened to+
0.1mm, reduces attachment difficulty；
3）High frequency cushion block is provided with the position of chip of laser on base, wire length can be shortened, letter is improved
Number transmission quality；
4）Overall package length of the present utility model is 17mm, and size is better than laser of the same trade, more minimizes, be easy to
Encapsulate the modules such as SFP+；
Encapsulating structure of the present utility model can effectively reduce the packaging cost of 10G EML lasers, using the encapsulating structure
Transmission range under coaxial wavelength-division multiplex technique can be achieved and reaches 40KM commercial coaxial laser, while helping to realize at a high speed
Rate, the automation package platforms for minimizing laser, so as to greatly improve production efficiency.
Brief description of the drawings
Fig. 1 is the utility model overall structure diagram；
Fig. 2 is the structural representation of the utility model die assemblies；
In figure：1- bases, 2- electricity refrigerators, 3- die assemblies, the flat window pipe caps of 4-, 5- regulation rings, 6- condenser lenses, 7- gold
Belong to shell, 8- isolators, 9- metal regulation rings, 10- fiber stubs, the filter capacitors of 11- second, 12- ceramic substrates, 13- first
Filter capacitor, 14- monitoring back light chips, 15- high frequency cushion blocks, 16- chip of laser, 17- film resistors, 18- is all-trans piece, 19-
Thermistor.
Embodiment
Below in conjunction with brief description of the drawings embodiment of the present utility model.
10G as shown in Figure 1 minimizes the encapsulating structure of coaxial EML lasers, including base 1, die assemblies 3, flat window
Pipe cap 4, condenser lens 6, metal shell 7 and fiber stub 10, flat window pipe cap 4 are connected with base 1, and die assemblies 3 are packaged in
In flat window pipe cap 4, condenser lens 6 is fixed on the surface of flat window pipe cap 4 by regulation ring 5, and 7 sets of metal shell is fixed in flat window pipe
The outside of cap 4, the top of metal shell 7 is pasted with isolator 8, and isolator 8 is located at the surface of condenser lens 6, and metal shell 7 leads to
Metal regulation ring 9 is crossed to be welded and fixed with fiber stub 10.
Die assemblies 3 include electric refrigerator 3 and ceramic substrate 12, and the lower surface of electric refrigerator 2 is mounted on base 1, electricity
The upper surface of refrigerator 2, which is pasted with ceramic substrate 12, ceramic substrate 12, is pasted with thermistor 19, film resistor 17 and laser
Device chip 16, is pasted with the piece 18 that is all-trans immediately ahead of the exiting surface of chip of laser 16 on ceramic substrate, and the piece 18 that is all-trans is by its incident light
All reflection, reflected light direct projection vertically upward, through flat window pipe cap 4 reflected light line focus lens 6 reflect after enter isolator
8, the positive light that isolator 8 is exported enters optical fiber and exported.Isolator 8 can be effectively isolated backlight, obtain monochromaticjty more preferable
Light.Monitoring back light chip 14, monitoring back light chip and laser are pasted with the ceramic substrate 12 in the dead astern of chip of laser 16
Mounting angle between chip is 6 ° -8 °, and the angular range is conducive to obtaining optimal back facet current, and will not introduce reflection
Light.Also include filter capacitor in die assemblies 3, the first filter capacitor 13 is mounted on ceramic substrate 12, the second filter capacitor 11
It is mounted on base 1.High frequency cushion block 15 is pasted with the base of chip of laser 16.Chip of laser 16 exiting surface goes out
The light hole of light optical axis, the primary optical axis of condenser lens 6 and isolator 8 is located on same axis.
The encapsulation process of encapsulating structure described in the utility model is as follows：Electric refrigerator 2 is glued in base 1, by laser
Device chip 16 is welded on ceramic substrate 12, then ceramic substrate 12 is glued on electric refrigerator 2, monitoring back light chip 14,
Thermistor 19, film resistor 17, the first filter capacitor 13 and the piece 18 that is all-trans are mounted on ceramic substrate 12, the second filter capacitor
11 and high frequency cushion block 15 paste on base 1.Afterwards, in the flat window pipe cap 4 of the top of die assemblies 3 encapsulation, regulation ring 5 is then passed through
The coupling focusing lens 6 above flat window pipe cap 4, metal shell 7 is welded on flat window pipe cap 4 by Laser Welding, outside metal
The top of shell 7 mounts isolator 8, finally by the coupling welding metal spigot 10 of metal regulation ring 9, that is, completes coaxial EML laser
The encapsulation of device, the laser entire length after encapsulation is 17mm.
Claims (5)
1.10G minimizes the encapsulating structure of coaxial EML lasers, it is characterised in that：Including base, die assemblies, flat window pipe cap,
Condenser lens, metal shell and fiber stub, flat window pipe cap are connected with base, and die assemblies are packaged in flat window pipe cap, gather
Focus lens are fixed on the surface of flat window pipe cap by regulation ring, and metal shell set is fixed on the outside of flat window pipe cap, on metal shell
Portion is pasted with isolator, and isolator is located at the surface of condenser lens, and metal shell is welded by metal regulation ring and fiber stub
Connect fixation；The die assemblies include electric refrigerator and ceramic substrate, and the lower surface of electric refrigerator is mounted on base, electricity refrigeration
The upper surface of device, which is pasted with ceramic substrate, ceramic substrate, is pasted with thermistor, film resistor and chip of laser, laser
It is pasted with immediately ahead of chip light-emitting face on ceramic substrate on the piece that is all-trans, the ceramic substrate in chip of laser dead astern and is pasted with backlight
Monitor chip.
2. 10G according to claim 1 minimizes the encapsulating structure of coaxial EML lasers, it is characterised in that：The base
On be provided with high frequency cushion block, the mounting position of high frequency cushion block is close to chip of laser.
3. 10G according to claim 1 or 2 minimizes the encapsulating structure of coaxial EML lasers, it is characterised in that：It is described
Also include filter capacitor in die assemblies, the first filter capacitor is mounted on ceramic substrate, and the second filter capacitor is mounted on base
On.
4. 10G according to claim 1 or 2 minimizes the encapsulating structure of coaxial EML lasers, it is characterised in that：It is described
Mounting angle between monitoring back light chip and chip of laser is 6 ° -8 °.
5. 10G according to claim 1 or 2 minimizes the encapsulating structure of coaxial EML lasers, it is characterised in that：It is described
The light hole of the light extraction optical axis of chip of laser exiting surface, the primary optical axis of condenser lens and isolator is located on same axis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720202610.9U CN206498078U (en) | 2017-03-03 | 2017-03-03 | 10G minimizes the encapsulating structure of coaxial EML lasers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720202610.9U CN206498078U (en) | 2017-03-03 | 2017-03-03 | 10G minimizes the encapsulating structure of coaxial EML lasers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206498078U true CN206498078U (en) | 2017-09-15 |
Family
ID=59806305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720202610.9U Active CN206498078U (en) | 2017-03-03 | 2017-03-03 | 10G minimizes the encapsulating structure of coaxial EML lasers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206498078U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109003973A (en) * | 2018-09-19 | 2018-12-14 | 华天科技（西安）有限公司 | A kind of double cushion block photosensor package structures and its packaging method |
| CN109343180A (en) * | 2018-09-11 | 2019-02-15 | 深圳市易飞扬通信技术有限公司 | Laser and silicon optical chip coupled structure and its encapsulating structure and packaging method |
| CN111504296A (en) * | 2020-04-24 | 2020-08-07 | 武汉光迅科技股份有限公司 | Optical transceiver module and optical fiber sensing device |
| CN113629485A (en) * | 2021-08-05 | 2021-11-09 | 尚宁光电无锡有限公司 | Temperature drift control method of optical communication active device |
| WO2023023907A1 (en) * | 2021-08-23 | 2023-03-02 | 华为技术有限公司 | Receiver optical subassembly, optical module, and communication device |
-
2017
- 2017-03-03 CN CN201720202610.9U patent/CN206498078U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109343180A (en) * | 2018-09-11 | 2019-02-15 | 深圳市易飞扬通信技术有限公司 | Laser and silicon optical chip coupled structure and its encapsulating structure and packaging method |
| CN109003973A (en) * | 2018-09-19 | 2018-12-14 | 华天科技（西安）有限公司 | A kind of double cushion block photosensor package structures and its packaging method |
| CN109003973B (en) * | 2018-09-19 | 2023-11-28 | 华天科技（西安）有限公司 | Double-cushion block photoelectric sensor packaging structure and packaging method thereof |
| CN111504296A (en) * | 2020-04-24 | 2020-08-07 | 武汉光迅科技股份有限公司 | Optical transceiver module and optical fiber sensing device |
| CN113629485A (en) * | 2021-08-05 | 2021-11-09 | 尚宁光电无锡有限公司 | Temperature drift control method of optical communication active device |
| WO2023023907A1 (en) * | 2021-08-23 | 2023-03-02 | 华为技术有限公司 | Receiver optical subassembly, optical module, and communication device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206498078U (en) | 10G minimizes the encapsulating structure of coaxial EML lasers | |
| CN202423821U (en) | High speed packaging structure of laser diode | |
| CN100516953C (en) | Compact optical sub-assembly with integrated flexible circuit | |
| CN104459907B (en) | Light module and preparing method thereof | |
| CN103984066B (en) | Multi-path parallel optical component and assemble method thereof for high-speed transfer | |
| CN203660271U (en) | 10G micro high-speed laser emitter | |
| CN202434505U (en) | Photoelectricity chip assembly | |
| CN101872760A (en) | Photoelectric conversion module | |
| CN203241580U (en) | Photoelectric module with silicon-based optical base | |
| CN104020536B (en) | The packaging method of optical transceiver module | |
| CN112558243A (en) | Signal transmission optical module | |
| CN110178065A (en) | Light emission component and preparation method thereof | |
| CN102569431B (en) | Photoelectric chip assembly and packaging method | |
| CN105717586A (en) | SIP chip and laser device coupling method and optical transceiver module manufactured with same | |
| CN106374008B (en) | A kind of preparation method of large area sensor array | |
| CN210835350U (en) | TO-CAN detector based on positive spherical lens tube cap | |
| CN109844407A (en) | Utilize the encapsulating structure of the wavelength-division multiplex array receiver module of stepped construction | |
| CN216489009U (en) | TO-CAN packaging structure for directly modulating laser | |
| CN103944062A (en) | Semiconductor laser unit of single chip optical fiber coupling output | |
| CN105652393A (en) | Packing structure and method of single-fiber bidirectional device based on optical base | |
| CN211627884U (en) | Light emitter integrated with driving chip and laser | |
| CN201191618Y (en) | LED encapsulated by planoconvex spotlight | |
| CN107422429B (en) | The SiP encapsulating structure and its manufacturing method of optoelectronic transceiver functions | |
| CN1874089A (en) | L type bracket encapsulation for coaxial parts of semiconductor laser | |
| US10700488B2 (en) | COB bonding laser diode interface mating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |