CN110178065A - Light emission component and preparation method thereof - Google Patents
Light emission component and preparation method thereof Download PDFInfo
- Publication number
- CN110178065A CN110178065A CN201980000608.5A CN201980000608A CN110178065A CN 110178065 A CN110178065 A CN 110178065A CN 201980000608 A CN201980000608 A CN 201980000608A CN 110178065 A CN110178065 A CN 110178065A
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- Prior art keywords
- laser
- light emission
- emission component
- refrigerator
- heat sink
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention discloses a kind of light emission component and preparation method thereof, wherein the light emission component includes tube socket；Refrigerator, the refrigerator are set to the tube socket；First conducting block, first conducting block is set to the tube socket, and is arranged with the refrigerator interval；Laser, the laser are set on the refrigerator；And driving chip, the driving chip is set on first conducting block, and is electrically connected with the laser.Technical solution of the present invention can reduce influence of the heat of laser generation to driving chip, reduces the power consumption of light emission component, improves the stability of light emission component.
Description
Technical field
The present invention relates to field of communication technology, in particular to the production method of a kind of light emission component and light emission component.
Background technique
5th third-generation mobile communication technology (5G) will march toward commercialization, in order to meet the characteristic requirements to telecommunication network, at present
Technology in, mostly use single channel 50G PAM4 technology as adaptation the network 5G optimal solution.Existing 50G
Laser (Direct Modulation is directly modulated using encapsulation non-brake method in laser emitting portion in PAM4 technology
Laser is abbreviated as DML) formed light emission component (Transmitter Optical Subassembly, be abbreviated as TOSA),
Although having the advantages that for this light emission component is at low cost, is easy to volume production, since existing laser and chip are all set
It sets on refrigerator, at work, the amount of heat that laser generates can be transferred directly to core by refrigerator to light emission component
Piece makes the operating temperature of chip be forced to increase, and also increases the power consumption of entire light emission component, affects chip and entire light hair
Penetrate the performance of component.
Summary of the invention
The main object of the present invention is to provide a kind of light emission component, it is intended to reduce the heat of laser generation to driving core
The influence of piece reduces the power consumption of light emission component, improves the stability of light emission component.
To achieve the above object, a kind of light emission component proposed by the present invention, comprising:
Tube socket；
Refrigerator, the refrigerator are set to the tube socket；
First conducting block, first conducting block is set to the tube socket, and is arranged with the refrigerator interval；
Laser, the laser are set on the refrigerator；And
Driving chip, the driving chip is set on first conducting block, and is electrically connected with the laser.
Optionally, the light emission component further include: first is heat sink, and described first is heat sink on the refrigerator,
The laser is set to first heat sink surface；
Second is heat sink, and described second is heat sink on first conducting block, and the driving chip is set to described second
Heat sink surface.
Optionally, the described first heat sink surface include the first mounting surface and the second mounting surface, first mounting surface with
Second mounting surface is located at described first heat sink ipsilateral, and first mounting surface is higher than second mounting surface, described to swash
Light device is set to first mounting surface.
Optionally, the light emission component further includes reflector, and the reflector is set to second mounting surface, for anti-
Penetrate the laser that the laser issues.
Optionally, the light emission component further includes lens subassembly, and the lens subassembly is set on the reflector, institute
The laser for stating laser sending is successively projected via the reflector, the lens subassembly.
Optionally, the light emission component further includes the shunt capacitance set on the described second heat sink surface, the bypass
Capacitor and the driving chip interval are arranged, and the laser is electrically connected by the shunt capacitance with the driving chip.
Optionally, the laser is Electroabsorption Modulated Laser or directly modulates laser.
Optionally, the refrigerator is equal with the height of first conducting block.
Optionally, the light emission component further includes thermistor, the thermistor be set to the refrigerator, and with institute
State the setting of laser interval.
Optionally, the light emission component further includes pipe cap, and the pipe cap is covered on the tube socket, and the pipe cap, which is equipped with, to be used
In the transmittance section of laser penetration.
The present invention also provides a kind of production methods of light emission component, comprising steps of
Refrigerator is fixed on tube socket, and laser is fixed on refrigerator；
First conducting block is fixed on tube socket, and driving chip is fixed on the first conducting block, and make the refrigerator with
Described first conductive block gap setting；
The driving chip is electrically connected with the laser and tube socket respectively.
Technical solution of the present invention by the way that laser and driving chip are separately positioned on refrigerator and the first conducting block,
And refrigerator and the first conducting block are interval setting, in this way, light emission component is at work, the heat that laser generates on refrigerator
It will not mutually be conducted between amount and the heat of the first conducting block, so that laser and driving chip not will receive at work
The interference of other side's heat, so that the influence of stimulated light device is not forced to rise the temperature of driving chip.In compared with the existing technology
Laser and the common scheme that refrigerator is arranged in of driving chip, the solution of the present invention can generate at work to avoid laser
Heat directly pass through refrigerator and be transferred to driving chip, to guarantee that the temperature of driving chip will not heat produced by stimulated light device
The influence of amount, it is ensured that driving chip is able to maintain to work at appropriate temperatures, to keep the superperformance of driving chip, improves light hair
The stability for penetrating component reduces the power consumption of light emission component.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The structure shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of light emission component of the present invention；
Fig. 2 is the structural decomposition diagram of light emission component in Fig. 1；
Fig. 3 is that light emission component of the present invention is installed on the schematic diagram on tube socket；
Fig. 4 is that the optical path of light emission component of the present invention emits schematic diagram.
Drawing reference numeral explanation:
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, if should
When particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In the present invention unless specifically defined or limited otherwise, term " connection ", " fixation " etc. shall be understood in a broad sense,
For example, " fixation " may be a fixed connection, it may be a detachable connection, or integral；It can be mechanical connection, be also possible to
Electrical connection；It can be directly connected, the connection inside two elements or two can also be can be indirectly connected through an intermediary
The interaction relationship of a element, unless otherwise restricted clearly.It for the ordinary skill in the art, can basis
Concrete condition understands the concrete meaning of above-mentioned term in the present invention.
In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and should not be understood as
Its relative importance of indication or suggestion or the quantity for implicitly indicating indicated technical characteristic.Define as a result, " first ",
The feature of " second " can explicitly or implicitly include at least one of the features.In addition, the technical side between each embodiment
Case can be combined with each other, but must be based on can be realized by those of ordinary skill in the art, when the combination of technical solution
Conflicting or cannot achieve when occur will be understood that the combination of this technical solution is not present, also not the present invention claims guarantor
Within the scope of shield.
Please refer to Fig. 1 to Fig. 4.
In one embodiment of the invention, a kind of light emission component 1000, comprising: tube socket 200；Refrigerator 300, the refrigerator
300 are set to the tube socket 200；First conducting block 400, first conducting block 400 be set to the tube socket 200, and with the system
The setting of the interval of cooler 300；Laser 20, the laser 20 are set on the refrigerator 300；And driving chip 40, institute
Driving chip 40 is stated on first conducting block 400, and is electrically connected with the laser 20.
In the technical solution of the embodiment of the present invention, by by laser 20 and driving chip 40 and being separately positioned on refrigerator
300 and first on conducting block 400, and is spaced refrigerator 300 and the first conducting block 400 and is arranged, in this way, at work, laser
Device 20 shines a large amount of heat transfer generated to refrigerator 300, the heat of the heat of refrigerator 300 and the first conducting block 400
Between will not mutually conduct so that laser 20 and driving chip 40 not will receive the interference of other side's heat at work,
So that the influence of stimulated light device 20 is not forced to rise the temperature of driving chip 40.Laser 20 and drive in compared with the existing technology
Dynamic chip 40 shares the scheme that a refrigerator 300 is arranged in, and the solution of the present invention can produce at work to avoid laser 20
Raw amount of heat directly passes through refrigerator 300 and is transferred to driving chip 40, to guarantee that the temperature of driving chip 40 will not be by
The influence of heat produced by laser 20, it is ensured that driving chip 40 is able to maintain to work at appropriate temperatures, to keep driving chip
40 superperformance improves the stability of light emission component 1000, reduces the power consumption of light emission component 1000.
Referring to figure 2. and Fig. 3, in one embodiment of the invention, the light emission component 1000 further includes the first conducting block
400, first conducting block 400 is fixed on the stationary plane 210, and is spaced and is arranged with the refrigerator 300, second heat
Heavy 30 are set to the surface that first conducting block 400 deviates from the stationary plane 210.
In the scheme of the embodiment of the present invention, since refrigerator 300 has certain altitude, when first heat sink 10 set on refrigeration
After on face 310, it will increase the length for being bonded gold thread between driving chip 40 and laser 20, influence light emission component 1000
Performance.In order to overcome the problem, in the scheme of the present embodiment, being also sticked on tube socket 200 has the first conducting block 400, and first leads
Electric block 400 is arranged with the interval of refrigerator 300, it should be noted that the first conducting block 400 and refrigerator 300 be spaced at a distance from extremely
It is greater than 50 μm less, it is poor allows to meet required assembling work when assembly.When second heat sink 30 set on 400 table of the first conducting block
When face, second heat sink 30 height is consistent with first heat sink 10 height.That is, padded by the first conducting block 400
The height of driving chip 40.It should be understood that the height of the first conducting block 400 is consistent with the height of refrigerator 300, when drive second
Heat sink 30 be set to the first conducting block 400 on when, with first it is heat sink 10 height it is equal, in this way, can shorten driving chip 40 and swash
The length of gold thread between light device 20 reduces energy loss and noise caused by signal transduction process, optimizes light emitting group
The performance of part 1000, it should be noted that connection, driving chip 40 are bonded by gold thread between the first conducting block 400 and pin
First conducting block 400 is bonded by gold thread and is connected.
Similarly, in order to shorten the gold thread length of other circuits in light emission component 1000, also in refrigerator 300 and tube socket
The second conducting block 500 of ground connection is provided between 200, the second conducting block 500 is bonded with refrigerator 300 by gold thread.Further,
Conductive bar 800 also is provided on chill surface 310, conductive bar 800 is fixed on chill surface 310 by third heat sink (not indicating),
And be arranged with the first heat sink 10 interval, conductive bar 800 is bonded with power pin by gold thread, to reduce pressure drop.Further,
Two heat sink 30 is heat sink in sustained height with third, so that the gold thread on third is heat sink is bonded to the driving circuit of driving chip 40
When, the distance of required gold thread is shorter, reduces the loss in optical signal transmittance process and noise.
Further, two conductive columns 330, the height and system of two conductive columns 330 are additionally provided on the positive and negative anodes of refrigerator 300
Huyashi-chuuka (cold chinese-style noodles) 310 is contour, shortens the distance that positive and negative anodes conductive column 330 is bonded with pin by gold thread, to enhance the intensity of gold thread bonding.
It should be noted that the gold thread that the preferred diameter of gold thread in the present invention is 1~2mil.
Referring to figure 2. and Fig. 3, it invents in an embodiment, the light emission component 1000 further include: first heat sink 10, it is described
First heat sink 10 is set on the refrigerator 300, and the laser 20 is set to the described first heat sink 10 surface；Second is heat sink
30, described second heat sink 30 is set on first conducting block 400, and the driving chip 40 is set to the described second heat sink 30 table
Face.
In this embodiment scheme, by be arranged between laser 20 and refrigerator 300 first heat sink 10, in driving core
Piece 40 is arranged second heat sink 30 between the first conducting block 400.First heat sink 10 and second heat sink 30 can be further improved
Radiating efficiency maintains laser 20 and the normal operating temperature of driving chip 40, improves the stability of light emission component 1000.
Referring to figure 2. and Fig. 3, it invents in an embodiment, first heat sink 10 surface includes 11 He of the first mounting surface
Second mounting surface 15, first mounting surface 11 and second mounting surface 15 positioned at described first heat sink 10 it is ipsilateral, it is described
First mounting surface 11 is higher than second mounting surface 15, and the laser 20 is set to first mounting surface 11.It is described to further include
Reflector 60, the reflector 60 are set to second mounting surface 15, the laser issued for reflecting the laser 20.
In the technical solution of the embodiment of the present invention, reflector 60 has bottom surface and reflecting surface, reflecting surface and reflector 60
The angled setting in bottom surface, in general, the angle is 45 degree, in this way, passing through after reflector 60 convenient for the laser for issuing laser 20
It is vertical to project.The bottom surface of reflector 60 is used for fixed with the second mounting surface 15.It should be noted that usual first mounting surface 11 is wanted
It is arranged higher than the second mounting surface 15, in this way, the laser for facilitating laser 20 to issue vertically is penetrated after can injecting the middle part of reflecting surface
Out.Wherein, the height of 11 the second mounting surface of distance 15 of the first mounting surface can be carried out according to concrete model, the size of reflector 60
Flexible setting, it is not limited here.
Further, a groove 13 is additionally provided between the first mounting surface 11 and the second mounting surface 15, which can subtract
In the heat transfer to reflector 60 that small laser 20 generates, the heat Surface Subsidence directly down for generating laser 20, with
Improve the efficiency of heat dissipation.In the technical solution of the embodiment of the present invention, the bottom surface of reflector 60 is attached on the second mounting surface 15,
So set, on the one hand, it is ensured that on the other hand the stability that reflector 60 is installed also is effectively utilized space, so that the
One heat sink 10 can fit to more in large area on refrigerator 300, improve the efficiency of heat dissipation, reduce the temperature of laser 20.
Referring to figure 4., in one embodiment of the invention, described further includes lens subassembly 70, and the lens subassembly 70 is set to institute
60 top of reflector is stated, the laser that the laser 20 issues successively is penetrated via the reflector 60, the lens subassembly 70
Out.
Include convex lens in lens subassembly 70 in the technical solution of the embodiment of the present invention, can to the laser of injection into
Row converges, the reflecting surface setting of the center face reflector 60 of the convex lens in lens subassembly 70 in the present embodiment, lens
The effect of component 70 is exactly to converge the laser that reflector 60 projects, to reduce the diverging and loss of laser.
Referring to figure 2. and Fig. 3, in one embodiment of the invention, described further includes set on described second heat sink 30 surface
Shunt capacitance 50, the shunt capacitance 50 are arranged with the driving chip 40 interval, and the laser 20 passes through the bypass electricity
Hold 50 to be electrically connected with the driving chip 40.
In the technical solution of the embodiment of the present invention, the shunt capacitance 50 be arranged second heat sink 30 surface, and with driving core
The setting of the interval of piece 40, it is possible to understand that, shunt capacitance 50 is set between driving chip 40 and laser 20, to reduce the gold of bonding
The length of line.Shunt capacitance 50 is connected between 20 anode of laser and driving chip 40, for reducing power supply noise to laser
The interference of device 20.
In one embodiment of the invention, the laser 20 is Electroabsorption Modulated Laser 20 (EML) or directly modulates laser
Device 20 (DML).
In the technical solution of the embodiment of the present invention, laser 20 can be Electroabsorption Modulated Laser (EML, Electlro-
Absorption Modulated Laser), this laser 20 can be used for long range, high-speed optical signal transmission, performance
It is better.It is also possible to directly modulate laser (DML, Direct Modulation Laser), directly modulates laser and be suitable for
The PAM4 of the every wavelength of the 100Gbps of the uncooled IRFPA of 400Gbps optical module.
In one embodiment of the invention, described first heat sink 10 is not less than 50 μm at a distance from the second heat sink 30 interval.
In the technical solution of the embodiment of the present invention, first heat sink 10 is not less than 50 μm at a distance from the second heat sink 30 interval,
So set, not only facilitated the installation of first heat sink 10 and second heat sink 30, but also will not make first heat sink 10 directly will be hot by heat
Amount be transferred to second heat sink 30, can to avoid the operating temperature stimulated light device 20 of driving chip 40 influence and be forced to rise, both
Facilitate installation, can guarantee good heat dissipation effect.
Referring to figure 2. and Fig. 3, in the embodiment of the present invention, the tube socket 200 is equipped with stationary plane 210, the light emission component
1000 further include refrigerator 300, and the refrigerator 300 has the radiating surface (not indicating) and chill surface 310 being oppositely arranged, described
Radiating surface is bonded with the stationary plane 210, and described first heat sink 10 surface away from the laser 20 fits in the system
Huyashi-chuuka (cold chinese-style noodles) 310.
In the scheme of the embodiment of the present invention, the substantially truncated cone-shaped of tube socket 200, along being provided at circumferentially spaced for tube socket 200
Multiple pins (not indicating), wherein pin includes control pin, radio frequency pin, positive pole pin, power cathode pin
Deng.Tube socket 200 is equipped with stationary plane 210, and refrigerator 300 is provided on stationary plane 210, and the radiating surface of refrigerator 300 is sticked
In on stationary plane 210.It should be noted that refrigerator 300 is be attached at tube socket 200 between two parties upper, when first heat sink 10 table
When face paste is set on refrigerator 300, it should be ensured that the second mounting surface 15 is positioned at the central area for being stationary plane 210, in this way, ability
Guarantee being centrally located for reflector 60, so that the laser for issuing laser 20 can be penetrated between two parties after the reflection of reflector 60
Out.Also, first heat sink 10 can all be fitted on chill surface 310 away from the surface of the laser 20, increase first
Heat sink 10 in the contact area of refrigerator 300, in this way, the heat that laser 20 generates at work can be by first heat sink 10
It is transferred to refrigerator 300, improves the radiating efficiency of laser 20, reduces the operating temperature of laser 20.
Referring to figure 2. and Fig. 3, in one embodiment of the invention, the light emission component 1000 further includes thermistor 600,
The thermistor 600 is set to the chill surface 310, and is arranged with the described first heat sink 10 interval.
In the scheme of the embodiment of the present invention, be additionally provided with thermistor 600 on chill surface 310, thermistor 600 with
Pin electrical connection, this states temperature of the thermistor 600 for 20 working environment of detection laser.
It further include having 3 capacitors 700 in this programme, wherein the wherein pressure stabilizing output of 700 tandem drive chip 40 of a capacitor
Between end and ground terminal, surge current to be eliminated for 40 output end of driving chip and is used, a capacitor 700 is in parallel with voltage source,
For energy storage capacitor 700 and the high frequency noise for filtering out element generation, cutting high frequency noise is propagated by current supply circuit
Access, the noise for preventing power supply from carrying constitute circuit and interfere；There are also a capacitors 700 to overshoot control terminal simultaneously with driving chip 40
Connection, using the noise in input signal as object is filtered out, filters out clutter entrained by prime for eliminating overshoot.Above-mentioned 3
Capacitor 700 is set to 400 surface of the first conducting block, and the distance being spaced between any two is at least more than 50 microns, public as assembling
Official post is used.
Further, backlight detection diode (Monitor is additionally provided on the driving chip 40 in one embodiment of the invention
Photodiode, MPD), which detects the luminescent properties that diode is used for detection laser 20.It should be noted that the back
Light detection diode is consistent with the height of laser 20, and detecting backlight, diode receives and detection laser 20 is launched
Laser, to facilitate the luminescent properties of detection laser 20.In addition, being also provided with Zener diode in the embodiment of the present invention, together
Diode of receiving, which is electrically connected, detects diode with backlight, for reducing the detection interference of backlight detection diode, so that backlight
Detection diode more accurately detects the luminescent properties of laser 20.
Referring to Fig.1 and 2, the light emission component 1000 further includes pipe cap 900, described in one embodiment of the invention
Pipe cap 900 is covered on the stationary plane 210, described to be located in the pipe cap 900, and the pipe cap 900, which is equipped with, is used for laser penetration
Transmittance section 910.
In the scheme of the embodiment of the present invention, the lid of pipe cap 900 closes stationary plane 210, will be sealed in pipe cap 900.It needs to illustrate
, transmittance section 910 is set to 900 top of pipe cap and is centrally located, after pipe cap 900 and fixed tube socket 200, in pipe cap 900
Axis is just overlapped with the central axes of lens subassembly 70, and the laser for issuing light emission component 1000 is projected across transmittance section 910.
Further, transmittance section 910 is additionally provided with convex lens, so that converging again by the laser that lens subassembly 70 converges, allows laser
20 laser issued can converge to fiber end face and propagate in optical fiber, reduce the loss of laser, improve light emission component 1000
Performance.
The present invention also provides a kind of production methods of light emission component 1000, comprising steps of refrigerator 300 is fixed on
Tube socket 200, and laser 20 is fixed on refrigerator 300；First conducting block 400 is fixed on tube socket 200, and by driving chip
40 are fixed on the first conducting block 400, and the refrigerator 300 is arranged with first conducting block 400 interval；By the driving
Chip 40 is electrically connected with the laser 20 and tube socket 200 respectively.
It is by the way that laser 20 is fixed on first heat sink 10, driving chip 40 is fixed in the scheme of the embodiment of the present invention
It is fixed on tube socket 200 in heat sink 30 interval of second heat sink 30, and first heat sink 10 and second, in this way, at work, the first heat
It will not mutually be conducted between heavy 10 heat and second heat sink 30 heat, so that laser 20 and driving chip 40 are in work
The interference of other side's heat is not will receive when making, so that the influence of stimulated light device 20 is not forced to rise the temperature of driving chip 40.With
Ensure that driving chip 40 is able to maintain to work at appropriate temperatures, to keep the superperformance of driving chip 40, improves light emitting group
The stability of part 1000 reduces the power consumption of light emission component 1000.
Certainly, when being provided with first heat sink 10 and second heat sink 30, when packaged, laser 20 is fixed on the first heat
Heavy 10, and tube socket 200 is fixed on by described first heat sink 10；Driving chip 40 is fixed on second heat sink 30, and by described
Two heat sink 30 are fixed on tube socket 200, and make described second heat sink 30 to be arranged with the described first heat sink 10 interval；By the driving core
Piece 40 is electrically connected with the laser 20 and tube socket 200 respectively.
Specifically, in actual production, following specific step can be used:
Laser 20: being fixed on first heat sink 10 the first mounting surface 11 by step 1, and driving chip 40 is fixed on
Two heat sink 30, shunt capacitance 50 is fixed on second heat sink 30, and be disposed adjacent shunt capacitance 50 with driving chip 40；
Step 2: being fixed on tube socket 200 for refrigerator 300, and refrigerator 300 is made to be located at the center of tube socket 200；
First conducting block 400 and the second conducting block 500 are individually fixed in the two sides of tube socket 200,400 He of the first conducting block
Second conducting block 500 and refrigerator phase 300 mutually between need to use at a distance of at least more than 50um as assembling work is poor；
Step 3: first heat sink 10 is attached on the chill surface 310 of refrigerator 300, is attached at for second heat sink 30
The surface of one conducting block 400, and make shunt capacitance 50 between driving chip 40 and laser 20；
Thermistor 600, conductive bar 800 are individually fixed in 300 surfaces of refrigerator, and are located at second heat sink 30
Two sides；
3 capacitors 700, Zener diode (not indicating) are individually fixed in the surface of the first conducting block 400；
Wherein, the width of at least reserved 150um of second heat sink 30 periphery, to facilitate 40 ground wire bonding wire of driving chip to make
With 3 capacitors 700 and Zener diode are between any two at a distance of at least 50um；
Step 4: each element is welded to connect with gold thread；
Step 5: reflector 60 is smooth in first heat sink 10 the second mounting surface 15, and make the reflection of reflector 60
Face is located at and laser side；
Step 6: putting lens subassembly 70 on reflector 60, makes the central axes of convex lens and tube socket 200 in lens subassembly
Central axes be overlapped；
Step 7: pipe cap 900 being set on the stationary plane 210 of tube socket 200, and by welded seal, makes laser 20 etc.
Component is located at the inside of pipe cap, obtains light emission component 1000.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all at this
Under the inventive concept of invention, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/use indirectly
It is included in other related technical areas in scope of patent protection of the invention.
Claims (11)
1. a kind of light emission component characterized by comprising
Tube socket；
Refrigerator, the refrigerator are set to the tube socket；
First conducting block, first conducting block is set to the tube socket, and is arranged with the refrigerator interval；
Laser, the laser are set on the refrigerator；And
Driving chip, the driving chip is set on first conducting block, and is electrically connected with the laser.
2. light emission component as described in claim 1, which is characterized in that the light emission component further include: first is heat sink, institute
State first it is heat sink be set to the refrigerator on, the laser be set to first heat sink surface；
Second is heat sink, and described second is heat sink on first conducting block, and it is heat sink that the driving chip is set to described second
Surface.
3. light emission component as claimed in claim 2, which is characterized in that the described first heat sink surface includes the first mounting surface
With the second mounting surface, first mounting surface is located at the described first heat sink ipsilateral, first peace with second mounting surface
Dress face is higher than second mounting surface, and the laser is set to first mounting surface.
4. light emission component as claimed in claim 3, which is characterized in that the light emission component further includes reflector, described
Reflector is set to second mounting surface, the laser issued for reflecting the laser.
5. light emission component as claimed in claim 4, which is characterized in that the light emission component further includes lens subassembly, institute
Lens subassembly is stated on the reflector, the laser that the laser issues is successively via the reflector, the lens
Component and project.
6. light emission component as described in claim 1, which is characterized in that the light emission component further includes being set to described second
The shunt capacitance on heat sink surface, the shunt capacitance and the driving chip interval are arranged, and the laser passes through the side
Road capacitor is electrically connected with the driving chip.
7. light emission component as described in claim 1, which is characterized in that the laser is for Electroabsorption Modulated Laser or directly
Connect modulation laser.
8. light emission component as described in claim 1, which is characterized in that the height of the refrigerator and first conducting block
It is equal.
9. light emission component as described in claim 1, which is characterized in that the light emission component further includes thermistor, institute
Thermistor is stated set on the refrigerator, and is arranged with the laser interval.
10. light emission component as described in claim 1, which is characterized in that the light emission component further includes pipe cap, the pipe
Cap is equipped with the transmittance section for laser penetration together in the tube socket, the pipe cap.
11. a kind of production method of light emission component, which is characterized in that comprising steps of
Refrigerator is fixed on tube socket, and laser is fixed on refrigerator；
First conducting block is fixed on tube socket, and driving chip is fixed on the first conducting block, and make the refrigerator with it is described
First conductive block gap setting；
The driving chip is electrically connected with the laser and tube socket respectively.
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| Application Number | Priority Date | Filing Date | Title |
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| PCT/CN2019/082209 WO2020206648A1 (en) | 2019-04-11 | 2019-04-11 | Transmitter optical subassembly and manufacturing method thereof |
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| CN110178065A true CN110178065A (en) | 2019-08-27 |
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| CN201980000608.5A Pending CN110178065A (en) | 2019-04-11 | 2019-04-11 | Light emission component and preparation method thereof |
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| WO (1) | WO2020206648A1 (en) |
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| WO2020206648A1 (en) | 2020-10-15 |
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Application publication date: 20190827 |