CN206283097U - Electroabsorption Modulated Laser coaxial packaging tube core - Google Patents
Electroabsorption Modulated Laser coaxial packaging tube core Download PDFInfo
- Publication number
- CN206283097U CN206283097U CN201621384813.6U CN201621384813U CN206283097U CN 206283097 U CN206283097 U CN 206283097U CN 201621384813 U CN201621384813 U CN 201621384813U CN 206283097 U CN206283097 U CN 206283097U
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- Prior art keywords
- modulated laser
- electroabsorption modulated
- heat sink
- fixed
- refrigerator
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
- G02B6/4263—Details of housings characterised by the shape of the housing of the transisitor outline [TO] can type
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Semiconductor Lasers (AREA)
Abstract
The utility model is related to the technical field of fiber optic communication product, and disclosing a kind of Electroabsorption Modulated Laser coaxial packaging tube core includes shell, and shell includes shell base, and through many pins of shell base；Flat window pipe cap, is fixed on shell base and is coaxial therewith to set；It is fixed on the refrigerator of shell base；It is heat sink, it is fixed on the upper surface of refrigerator；And Electroabsorption Modulated Laser chip, back light detector and the thermistor being fixed on heat sink；It is arranged at flat window pipe cap outside and is additionally provided with non-spherical lens.By using coaxial packaging, package dimension is small, with low cost；It is fixed on the upper surface of refrigerator by by heat sink, good heat dissipation effect；Electroabsorption Modulated Laser chip, speculum, thermistor and back light detector are fixed on the heat sink upper upper surface for plane, encapsulation is simple, easily realize automation encapsulation；Non-spherical lens is added outside flat window pipe cap, the requirement to the paster precision of Electroabsorption Modulated Laser chip is reduced.
Description
Technical field
The utility model is related to the technical field of fiber optic communication product, more particularly to a kind of laser coaxial package die.
Background technology
Current mechanics of communication is quickly grown, and optical device is more and more applied among communication, wherein signal transmitting dress
Put essential.
Traditional Electroabsorption Modulated Laser is generally encapsulated using butterfly-type, but, the packaged type has paster precision will
Ask high, metal shell is relatively costly, package dimension is big and is unfavorable for the problem of optical module miniaturization.In addition, also there is part electricity to inhale
Modulation laser is received using coaxial packaging, but, coaxial packaging difficulty is big, is difficult to realize automatic packaging；Meanwhile, the encapsulation knot
Structure radiating effect is poor, and temperature control precision is poor；And it is very high to the paster requirement of laser chip, otherwise emergent light is difficult to outside
Optical component is coupled.
Utility model content
The purpose of this utility model is to provide a kind of Electroabsorption Modulated Laser coaxial packaging tube core, it is intended to solved existing
In technology, common Electroabsorption Modulated Laser coaxial packaging die package difficulty is big, automatic packaging, radiating effect difficult to realize
Difference temperature control precision difference and the problem too high to the paster requirement of laser chip.
The utility model embodiment provides a kind of Electroabsorption Modulated Laser coaxial packaging tube core, including：
Shell, the shell includes shell base, and through many pins of the shell base；
Flat window pipe cap, is fixed on the shell base and is coaxial therewith to set；
Refrigerator, the upper and lower surface of the refrigerator is respectively chill surface and radiating surface, and the refrigerator
Lower surface is fixedly connected with the shell base top surface；
It is heat sink, it is fixed on the upper surface of the refrigerator, and the heat sink upper surface is plane；
Electroabsorption Modulated Laser chip, is fixed on the heat sink upper surface, the Electroabsorption Modulated Laser core
Piece is used to send laser beam；
Back light detector, is fixed on the heat sink upper surface, and on the reverse path of the laser beam, institute
State back light detector and go out light state for detect the Electroabsorption Modulated Laser chip；
Speculum, is fixed on the heat sink upper surface, and on the forward path of the laser beam, it is described anti-
Mirror is penetrated for reflecting the laser beam and passing the flat window pipe cap；
Thermistor, is fixed on the heat sink upper surface, and the thermistor is used to detect the electro-absorption modulation
The temperature of chip of laser；
Non-spherical lens, is arranged at the flat window pipe cap outside, and on the forward path of the laser beam；
Circuit, with the refrigerator, the Electroabsorption Modulated Laser chip, the back light detector and the temperature-sensitive electricity
Resistance is electrically connected with.
Preferably, the thermistor is near the Electroabsorption Modulated Laser chip.
Preferably, the circuit and the refrigerator, the Electroabsorption Modulated Laser chip, the back light detector and
The thermistor gold wire ball welding procedure is electrically connected with.
Further, regulation ring is provided with the upper surface of the flat window pipe cap, the regulation ring is surrounded and fixes described
Non-spherical lens.
Further, many pins include：With Electroabsorption Modulated Laser chip electric connection for passing
First pin of power transmission Absorption modulation signal, the second pin being electrically connected with the refrigerator negative pole, with the refrigerator just
The 3rd pin that pole is electrically connected with, the 4th pin being electrically connected with the thermistor, with the Electroabsorption Modulated Laser
The 5th pin that the positive pole of chip is electrically connected with, and the 6th pin for ground connection being electrically connected with the circuit.
Further, the Electroabsorption Modulated Laser coaxial packaging tube core also includes being electrically connected with the 5th pin
The first electric capacity；And the resistance and the second electric capacity being electrically connected with first pin.
Further, the Electroabsorption Modulated Laser chip is connected with heat sink being welded and fixed by Sn/Au eutectic,
The back light detector, the thermistor and the speculum are heat sink by conductive silver glue die bond mode with described respectively
Be fixedly connected.
Based on above-mentioned technical proposal, compared with prior art, the Electroabsorption Modulated Laser proposed in the utility model is same
Axle package die, using coaxial packaging, package dimension is small, with low cost；It is fixed on the upper surface of refrigerator by by heat sink,
Good heat dissipation effect；It is above flat that Electroabsorption Modulated Laser chip, speculum, thermistor and back light detector are fixed on heat sink
On the upper surface in face, encapsulation is simple, easily realizes automation encapsulation；Non-spherical lens is added outside flat window pipe cap, is reduced
Requirement to the paster precision of Electroabsorption Modulated Laser chip.
Brief description of the drawings
Fig. 1 is that the shell base of the Electroabsorption Modulated Laser coaxial packaging tube core that the utility model embodiment is proposed is overlooked
Schematic diagram；
Fig. 2 is that the shell base side of the Electroabsorption Modulated Laser coaxial packaging tube core that the utility model embodiment is proposed is regarded
Schematic diagram；
Fig. 3 is that the electro-absorption modulation of the Electroabsorption Modulated Laser coaxial packaging tube core that the utility model embodiment is proposed swashs
Schematic diagram after the completion of light device coaxial packaging die package；
Fig. 4 is the pin schematic diagram of the Electroabsorption Modulated Laser coaxial packaging tube core that the utility model embodiment is proposed；
Fig. 5 is that the F-F of the Electroabsorption Modulated Laser coaxial packaging tube core that the utility model embodiment is proposed tangentially illustrates
Figure；
Fig. 6 is the tangential sections of F-F of the Electroabsorption Modulated Laser coaxial packaging tube core that the utility model embodiment is proposed
Schematic diagram；
Fig. 7 is the tangential sections of F-F of the Electroabsorption Modulated Laser coaxial packaging tube core that the utility model embodiment is proposed
Close-up schematic view.
Specific embodiment
In order that the purpose of this utility model, technical scheme and advantage become more apparent, below in conjunction with accompanying drawing and implementation
Example, is further elaborated to the utility model.It should be appreciated that specific embodiment described herein is only used to explain
The utility model, is not used to limit the utility model.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or may be simultaneously present centering elements.When an element is known as " being connected to " another element, it can be with
It is directly to another element or may be simultaneously present centering elements.
In addition, also, it should be noted that the orientation term such as left and right, upper and lower in the utility model embodiment, is only mutual
It is relative concept or is reference with the normal operating condition of product, and should not be regarded as restrictive.Hereinafter tie
Specific embodiment is closed to be described in detail realization of the present utility model.
As shown in Figures 1 to 7, the utility model provides a kind of Electroabsorption Modulated Laser coaxial packaging tube core, and this is same
Axle package die may include shell 1, and shell 1 includes shell base 11, and through many pins of shell base 11；Flat window pipe
Cap 12, is fixed on shell base 11 and is coaxial therewith to set；Refrigerator 21, the upper surface 211 of refrigerator 21 and lower surface 212
Respectively chill surface and radiating surface, and the lower surface 212 of refrigerator 21 is fixedly connected with the top surface of shell base 11；Heat sink 22, Gu
Due on the upper surface 211 of refrigerator 21, and heat sink 22 upper surface 221 is plane；Electroabsorption Modulated Laser chip 23, it is fixed
In on heat sink upper surface 221, Electroabsorption Modulated Laser chip 23 is used to send laser beam 4；Back light detector 24, it is fixed
In on heat sink upper surface 221, and on the reverse path 42 of laser beam 4, back light detector 24 is used to detect electric absorption
That modulates chip of laser 23 goes out light state；Speculum 25, is fixed on heat sink upper surface 221, and positioned at laser beam 4
On forward path 41, speculum 25 is used for reflection laser light beam 4 and passes flat window pipe cap 12；Thermistor 26, is fixed on heat sink
Upper surface 221 on, thermistor 26 is used to detect the temperature of Electroabsorption Modulated Laser chip 23；Non-spherical lens 14, if
The outside of flat window pipe cap 12 is placed in, and on the forward path 41 of laser beam 4；Circuit 5, with refrigerator 21, electro-absorption modulation
Chip of laser 23, back light detector 24 and thermistor 26 are electrically connected with.
In the utility model embodiment, the peaceful window pipe cap 12 of shell 1 uses coaxial packaging, and the size of encapsulation is small, low cost
It is honest and clean；It is fixed on the upper surface 211 of refrigerator 21 by by heat sink 22, good heat dissipation effect；By Electroabsorption Modulated Laser chip
23rd, speculum 25, thermistor 26 and back light detector 24 are fixed on heat sink 22 upper surface 221, and encapsulation is simple, easily
Realize automation encapsulation；Non-spherical lens 14 is added outside flat window pipe cap 12, is reduced to Electroabsorption Modulated Laser chip
The requirement of 23 paster precision.
In the utility model embodiment, above-mentioned Electroabsorption Modulated Laser chip 23, speculum 25, thermistor 26 and the back of the body
Photo-detector 24 is fixed on heat sink 22 upper surface 221, and the upper surface 221 is plane, in this way, then encapsulating easy, it is easier to
Realize automatic packaging.In other embodiments, the component for being fixed on heat sink 22 upper surface 221 is not limited to electric absorption tune
Chip of laser processed 23, speculum 25, thermistor 26 and back light detector 24, can also include the electric capacity 29 of resistance 27 and first
With grade other components of the second electric capacity 28.Meanwhile, also not necessarily all it is fixed on heat sink 22, can be that a part is fixed on
On heat sink 22, another part is fixed on refrigerator 21 or other positions, as long as good cooling effect can be realized,
Do not make sole limitation herein.
In the utility model embodiment, refrigerator 21 uses TEC (semiconductor cooler) as cooling device, in other realities
Apply in example, other kinds of cooling device can be used, or using other types of cooling, as long as can be by electro-absorption modulation
The heat of chip of laser 23 and other components is taken away, and sole limitation is not made herein.
In the utility model embodiment, run through shell base 11 with pin 3 more, be connected simpler with circuit 5.At other
In embodiment, not necessarily through shell base 11, groove can be dug on the surface of shell base 11 and the other modes such as pass through by pin,
As long as signal and power channel can be provided to the grade of Electroabsorption Modulated Laser chip 23 component, unique limit is not made herein
It is fixed.
In the utility model embodiment, non-spherical lens 14 is added outside flat window pipe cap 12, can reduced and ambient light
The coupling difficulty of device is learned, so as to reduce the paster required precision to Electroabsorption Modulated Laser chip 23.In other implementations
In example, non-spherical lens 14 can also be arranged on flat window pipe cap 12, or flat window pipe cap 12 is changed into non-spherical lens 14 manages
Cap, or non-spherical lens 14 is arranged on inside flat window pipe cap 12, as long as can reduce difficult with the coupling of extraneous Optical devices
Degree, does not make sole limitation herein.
In the utility model embodiment, speculum 25 is preferably 45 ° of speculums 25, for by Electroabsorption Modulated Laser core
The laser beam 4 that piece 23 sends by after the reflection of speculum 25, the outgoing from flat window pipe cap 12 so that electric suction need not be adjusted
Receive the direction of modulation chip of laser 23 to adjust the direction of laser beam 4, as long as the angle of reflection of modification speculum 25.
Certainly, in other embodiments, angle of reflection can also be other angles, or other optical modules or optical module
Set, as long as laser beam 4 can be reflexed into flat window pipe cap 12, unique restriction is not made herein.
Preferably, in the utility model embodiment, above-mentioned thermistor 26 is near Electroabsorption Modulated Laser chip 23.Such as
This, then can more accurately detect the temperature change of Electroabsorption Modulated Laser chip 23.Certainly in other embodiments, also
Other positions can be placed on, as long as being capable of the temperature change of effective detection Electroabsorption Modulated Laser chip 23, herein not
Make unique restriction.
Preferably, in the utility model embodiment, foregoing circuit 5 and refrigerator 21, Electroabsorption Modulated Laser chip 23,
Back light detector 24 and the gold wire ball welding procedure of thermistor 26 are electrically connected with.In this way, then effective and rapid reliably by each part
It is attached.Certainly in other embodiments, it is also an option that other electric connection modes, do not make sole limitation herein.
Further, in the utility model embodiment, regulation ring is provided with the upper surface 121 of above-mentioned flat window pipe cap 12
13, regulation ring 13 is surrounded and fixed non-spherical lens 14.Regulation ring 13 can adjust and fix non-spherical lens 14, be easy to non-
The position correction of spherical lens 14 and fixation.Certainly, in other embodiments, can also can be by non-spherical lens using other
14 fix modes, as long as can easily adjust with fixed charge globe lens, do not make herein uniquely limit.
Further, in the utility model embodiment, above-mentioned many pins 3 include：With Electroabsorption Modulated Laser chip
23 the first pins 31 for transmitting electro-absorption modulation signal being electrically connected with, second be electrically connected with the negative pole of refrigerator 21 is drawn
Pin 32, the 3rd pin 33 being electrically connected with the positive pole of refrigerator 21, the 4th pin 34 being electrically connected with thermistor 26, with electricity
The 5th pin 35 that the positive pole of Absorption modulation chip of laser 23 is electrically connected with, and with the electric connection of circuit 5 for being grounded
The 6th pin 36.Above-mentioned many pins 3 through shell base 11, for providing information or power supply to each device.
Certainly in other embodiments, can also increase or reduce the quantity of pin, not make unique restriction herein.
Further, in the utility model embodiment, above-mentioned Electroabsorption Modulated Laser coaxial packaging tube core also include with
The first electric capacity 29 that 5th pin 35 is electrically connected with；And the electric capacity 28 of resistance 27 and second being electrically connected with the first pin 31.
The 5th pin 35 and the first pin 31 can be decoupled respectively, increased the stabilization of system, reduce outer bound pair electric absorption
Modulate the interference of laser coaxial package die.Certainly, in other embodiments, can also be gone using other modes
Coupling, or selection is decoupled to other components, or increases the anti-electromagnetic interference capability of device, as long as can reduce
The interference of the electric or magnetic of outer this device of bound pair, unique restriction is not done herein.
Further, in the utility model embodiment, above-mentioned Electroabsorption Modulated Laser chip 23 is logical with above-mentioned heat sink 22
Cross Sn/Au eutectic and be welded and fixed connection, back light detector 24, thermistor 26 and speculum 25 pass through to lead respectively with heat sink 22
Electric elargol die bond mode is fixedly connected.In this way, then Electroabsorption Modulated Laser chip 23, backlight can be visited to greatest extent
The heat transmission of device 24, thermistor 26 and speculum 25 is surveyed on heat sink 22.Certainly in other embodiments, it can be used
His mode conducts heat, and unique restriction is not herein made.
Embodiment described above, only the utility model specific embodiment, but protection domain of the present utility model is not
This is confined to, any one skilled in the art can readily occur in the technical scope that the utility model is disclosed
Various equivalent modifications, replacement and improvement etc., these modifications, replacement and improvement should all be covered in protection model of the present utility model
Within enclosing.Therefore, protection domain of the present utility model should be defined by scope of the claims.
Claims (7)
1. Electroabsorption Modulated Laser coaxial packaging tube core, it is characterised in that including：
Shell, the shell includes shell base, and through many pins of the shell base；
Flat window pipe cap, is fixed on the shell base and is coaxial therewith to set；
Refrigerator, the upper and lower surface of the refrigerator is respectively chill surface and radiating surface, and the refrigerator following table
Face is fixedly connected with the shell base top surface；
It is heat sink, it is fixed on the upper surface of the refrigerator, and the heat sink upper surface is plane；
Electroabsorption Modulated Laser chip, is fixed on the heat sink upper surface, and the Electroabsorption Modulated Laser chip is used
In sending laser beam；
Back light detector, is fixed on the heat sink upper surface, and on the reverse path of the laser beam, the back of the body
What photo-detector was used to detecting the Electroabsorption Modulated Laser chip goes out light state；
Speculum, is fixed on the heat sink upper surface, and on the forward path of the laser beam, the speculum
For reflecting the laser beam and passing the flat window pipe cap；
Thermistor, is fixed on the heat sink upper surface, and the thermistor is used to detect the electro-absorption modulation laser
The temperature of device chip；
Non-spherical lens, is arranged at the flat window pipe cap outside, and on the forward path of the laser beam；
Circuit, with the refrigerator, the Electroabsorption Modulated Laser chip, the back light detector and the thermistor electricity
Property connection.
2. Electroabsorption Modulated Laser coaxial packaging tube core as claimed in claim 1, it is characterised in that the thermistor is leaned on
The nearly Electroabsorption Modulated Laser chip.
3. Electroabsorption Modulated Laser coaxial packaging tube core as claimed in claim 1, it is characterised in that the circuit with it is described
Refrigerator, the Electroabsorption Modulated Laser chip, the back light detector and the thermistor gold wire ball welding procedure electricity
Property connection.
4. Electroabsorption Modulated Laser coaxial packaging tube core as claimed in claim 1, it is characterised in that the flat window pipe cap
Regulation ring is provided with upper surface, the regulation ring is surrounded and fixes the non-spherical lens.
5. Electroabsorption Modulated Laser coaxial packaging tube core as claimed in claim 1, it is characterised in that many pin bags
Include：The first pin for transmitting electro-absorption modulation signal being electrically connected with the Electroabsorption Modulated Laser chip, with institute
The second pin of refrigerator negative pole electric connection is stated, the 3rd pin being electrically connected with the refrigerator positive pole, with the temperature-sensitive
The 4th pin that resistance is electrically connected with, the 5th pin being electrically connected with the positive pole of the Electroabsorption Modulated Laser chip, with
And the 6th pin for ground connection being electrically connected with the circuit.
6. Electroabsorption Modulated Laser coaxial packaging tube core as claimed in claim 5, it is characterised in that the electro-absorption modulation
Laser coaxial package die also includes the first electric capacity being electrically connected with the 5th pin；And it is electric with first pin
Property connection resistance and the second electric capacity.
7. Electroabsorption Modulated Laser coaxial packaging tube core as claimed in claim 1, it is characterised in that the electro-absorption modulation
Chip of laser is connected with heat sink being welded and fixed by Sn/Au eutectic, the back light detector, the thermistor and institute
State speculum respectively with heat sink being fixedly connected by conductive silver glue die bond mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621384813.6U CN206283097U (en) | 2016-12-15 | 2016-12-15 | Electroabsorption Modulated Laser coaxial packaging tube core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621384813.6U CN206283097U (en) | 2016-12-15 | 2016-12-15 | Electroabsorption Modulated Laser coaxial packaging tube core |
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| Publication Number | Publication Date |
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| CN206283097U true CN206283097U (en) | 2017-06-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201621384813.6U Active CN206283097U (en) | 2016-12-15 | 2016-12-15 | Electroabsorption Modulated Laser coaxial packaging tube core |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110178065A (en) * | 2019-04-11 | 2019-08-27 | 深圳市亚派光电器件有限公司 | Light emission component and preparation method thereof |
| WO2020103277A1 (en) * | 2018-11-23 | 2020-05-28 | 武汉电信器件有限公司 | High-speed eml coaxial transmitting module and manufacturing method therefor |
| CN112164966A (en) * | 2020-10-12 | 2021-01-01 | 苏州苏驼通信科技股份有限公司 | Coaxial packaging laser module and preparation method thereof |
| CN113394208A (en) * | 2021-05-25 | 2021-09-14 | 武汉光迅科技股份有限公司 | Photoelectric detector |
| CN114256734A (en) * | 2021-12-13 | 2022-03-29 | 武汉光迅科技股份有限公司 | Coaxial packaging super-radiation light emitting diode and implementation method thereof |
| CN116780329A (en) * | 2023-05-31 | 2023-09-19 | 河北杰微科技有限公司 | Refrigeration type laser TO packaging structure and packaging method thereof |
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2016
- 2016-12-15 CN CN201621384813.6U patent/CN206283097U/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020103277A1 (en) * | 2018-11-23 | 2020-05-28 | 武汉电信器件有限公司 | High-speed eml coaxial transmitting module and manufacturing method therefor |
| EP3885807A4 (en) * | 2018-11-23 | 2022-08-31 | Wuhan Telecommunication Devices Co., Ltd. | High-speed eml coaxial transmitting module and manufacturing method therefor |
| CN110178065A (en) * | 2019-04-11 | 2019-08-27 | 深圳市亚派光电器件有限公司 | Light emission component and preparation method thereof |
| WO2020206648A1 (en) * | 2019-04-11 | 2020-10-15 | 深圳市亚派光电器件有限公司 | Transmitter optical subassembly and manufacturing method thereof |
| CN112164966A (en) * | 2020-10-12 | 2021-01-01 | 苏州苏驼通信科技股份有限公司 | Coaxial packaging laser module and preparation method thereof |
| CN113394208A (en) * | 2021-05-25 | 2021-09-14 | 武汉光迅科技股份有限公司 | Photoelectric detector |
| CN114256734A (en) * | 2021-12-13 | 2022-03-29 | 武汉光迅科技股份有限公司 | Coaxial packaging super-radiation light emitting diode and implementation method thereof |
| CN114256734B (en) * | 2021-12-13 | 2023-09-22 | 武汉光迅科技股份有限公司 | Coaxially packaged superradiation light-emitting diode and implementation method thereof |
| CN116780329A (en) * | 2023-05-31 | 2023-09-19 | 河北杰微科技有限公司 | Refrigeration type laser TO packaging structure and packaging method thereof |
| CN116780329B (en) * | 2023-05-31 | 2024-04-16 | 河北杰微科技有限公司 | Refrigeration type laser TO packaging structure and packaging method thereof |
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