CN109546526A - The coaxial active package structure of electro-absorption modulation sealed laser - Google Patents
The coaxial active package structure of electro-absorption modulation sealed laser Download PDFInfo
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- CN109546526A CN109546526A CN201811631258.6A CN201811631258A CN109546526A CN 109546526 A CN109546526 A CN 109546526A CN 201811631258 A CN201811631258 A CN 201811631258A CN 109546526 A CN109546526 A CN 109546526A
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- 238000010521 absorption reaction Methods 0.000 title claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims abstract description 40
- 230000008878 coupling Effects 0.000 claims abstract description 18
- 238000010168 coupling process Methods 0.000 claims abstract description 18
- 238000005859 coupling reaction Methods 0.000 claims abstract description 18
- 239000013307 optical fiber Substances 0.000 claims abstract description 9
- 239000011521 glass Substances 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 4
- 230000032683 aging Effects 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 239000005394 sealing glass Substances 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 5
- 238000004891 communication Methods 0.000 abstract description 4
- 239000003990 capacitor Substances 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4244—Mounting of the optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02255—Out-coupling of light using beam deflecting elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention relates to technical field of optical fiber communication, the in particular to coaxial active package structure of electro-absorption modulation sealed laser.The Electroabsorption Modulated Laser chip and reflecting prism of the encapsulating structure are integrated in the heat sink upper surface of tubular body, and when processing does not need to be inverted tube socket, reduce technology difficulty.In addition, the hat shape metal shell of tube body is far from the adjustable metal seat for being equipped with ring-shaped sleeve structure at the top of conductive mixtion, lens are through in the ring-shaped sleeve of adjustable metal seat and the relative position of the two is adjustable.The coaxial active package structure of the electro-absorption modulation sealed laser, using the lens with tube body separate type, it does not need a light transmission slide and is mounted on tubular body, on the one hand the patch required precision to Electroabsorption Modulated Laser chip is reduced, on the other hand since lens can reduce the coupling difficulty of lens by relative distance and the position of the adjustment of adjustable metal seat and reflecting prism in active coupling.
Description
Technical field
The present invention relates to technical field of optical fiber communication, the in particular to coaxial active package of electro-absorption modulation sealed laser
Structure.
Background technique
Demand with the development of optical communications industry, higher rate, the laser of more longer transmission distance continues to increase.Tradition
Laser be mainly to use the straight mode laser of internal modulation technology, straight mode laser is straight to light source itself by modulated signal
Connect modulation, change the parameter of oscillation of laser with modulated signal, by the variation of bias current change output characteristic of laser with
Realize modulation, load signal is carried out during laser generation, it is small in size, structure is simple, easy to accomplish, and cost
It is low.But band efficiency is lower, because of its special chirp, the rate of internal modulation is difficult to meet the biography of Ethernet long distance
It is defeated, it is not able to satisfy the needs of high rate optical communication system.And use the electro-absorption laser of external modulation technology that laser beam is straight
Sending and receiving are penetrated on the modulator, change the physical property of modulator with modulated signal, to make the laser beam light wave by modulator
Parameter change, reduce chirp, the modulation of high rate optical signal easy to accomplish, thus gradually replaced straight mode swash
Light device becomes the market mainstream.
Previous electro-absorption laser mainly uses BOX to encapsulate, but integrates as device manufacturer minimizes, BOX structure
It is unable to satisfy the requirement of its size, cost is encapsulated also much larger than coaxial (TO-CAN).Although TO-CAN encapsulation heat dissipation performance compared with
Difference, be not suitable for long range signal transmission, but be based on cost consideration, transmission range require 40KM laser below substantially all
It can be encapsulated using TO-CAN, can not only reduce the cost of shell, but also can be packaged with the module size of mainstream.
The coaxial packaging structure of electro-absorption laser currently on the market is as shown in Figure 1, it has that two: one are
The devices such as its light emitting chip LD, capacitor needs are encapsulated in tube socket vertically (see part A in Fig. 1), need elder generation when mounting LD
It is inverted tube socket, and using the cooperation welding of a variety of solders, technology difficulty is big；Another be its lens and LD be coupled as it is active
Coupling, but under existing encapsulating structure LMDS Light Coupled Device can only X in the horizontal plane, the adjustment of Y both direction is unfavorable for optical path
Coupling.
Summary of the invention
It is an object of the present invention to avoid above-mentioned shortcoming in the prior art and provide a kind of electricity suction easy to process
Receive the coaxial active package structure of modulation sealed laser.
To achieve the above object, the coaxial active package structure of electro-absorption modulation sealed laser, including tube body are provided, managed
Body one end is extended with conductive mixtion, and the other end is covered with hat shape metal shell, top peace of the hat shape metal shell far from conductive mixtion
Adjustable metal seat equipped with ring-shaped sleeve structure, the bottom of adjustable metal seat extend outward to form annular seal ring and are adjacent to hat shape
The top surface of metal shell, lens are through in the ring-shaped sleeve of adjustable metal seat and the relative position of the two is adjustable, in the tube body
Face hat shape metal shell surface be equipped with it is heat sink, heat sink upper surface is integrated with Electroabsorption Modulated Laser chip and reflection
Prism, the inclined-plane at the degree angle of the light direction of the reflecting surface face Electroabsorption Modulated Laser chip of reflecting prism, electric absorption tune
The laser beam that chip of laser processed issues enters the lens forming main optical path of top after the reflective surface of reflecting prism.
Wherein, the top of hat shape metal shell is equipped with seal glass.
Wherein, seal glass is the circular indent being internally recessed from tube body top surface, the ring-shaped sleeve of adjustable metal seat
Inner ring alignment seal glass circular indent and coaxially.
Wherein, lens are mounted in adjustable metal seat, and lens one end is directed at reflecting prism, and the other end is adsorbed in tube body upper end
Vacuum suction structure, the vacuum suction structure alignment coupling optical fiber light inlet.
Wherein, the vacuum suction structure includes vacuum slot, upper end the entering for fixed coupling optical fiber of vacuum slot
Optical port, the lower end of vacuum slot are equipped with the vacuum suction mouth for adsorbing the lens, and the side of vacuum slot is equipped with for real
The tracheae adsorption orifice now vacuumized.
Wherein, the backlight direction of Electroabsorption Modulated Laser chip is pasted with back light detector.
Wherein, the heat sink bottom is equipped with cooling heat radiator, which, which is connected with, is arranged on heat sink
Thermistor as hygrosensor.
It wherein, is coaxial resistance welding between the tube body and hat shape metal shell.
Wherein, described heat sink equipped with carrier transitional module, including pad and the first pin, first pin is on the one hand
It is connect by pad with Electroabsorption Modulated Laser chip forward direction pole, is on the other hand connected to respectively through decoupling resistor as extending out
Fill the reserved installation position in region.
Wherein, the heat sink carrier transitional module includes aging active line position.
The utility model has the advantages that the coaxial active package structure of the electro-absorption modulation sealed laser, Electroabsorption Modulated Laser core
The devices such as piece and reflecting prism are all integrated in the heat sink upper surface of tubular body, and lens are arranged above reflecting prism, processing
When do not need be inverted tube socket, reduce technology difficulty.In addition, not needing a light transmission slide using the lens with tube body separate type
Be mounted on tubular body, on the one hand reduce the patch required precision to Electroabsorption Modulated Laser chip, on the other hand due to
Lens can reduce lens by relative distance and the position of the adjustment of adjustable metal seat and reflecting prism in active coupling
Coupling difficulty.
Detailed description of the invention
Fig. 1 is the package structure diagram of electro-absorption modulation sealed laser in the prior art.
Fig. 2 is the dismantling schematic diagram of the coaxial active package structure of the electro-absorption modulation sealed laser
Fig. 3 is the intracorporal device arrangements schematic diagram of pipe of the electro-absorption modulation sealed laser.
Fig. 4 is the link structure schematic diagram of the heat sink carrier transitional module of the electro-absorption modulation sealed laser.
Fig. 5 is that the active coupled structure of vacuum suction of the coaxial active package structure of the electro-absorption modulation sealed laser is shown
It is intended to.
Specific embodiment
The coaxial active package structure of the electro-absorption modulation sealed laser, as shown in Fig. 2, including being electroplated using ni-au
The tube body 1 being process, 1 one end of tube body are extended with conductive mixtion 12, and the other end is covered with hat shape metal shell 11.Hat shape metal-back
The top (one end far from conduction mixtion 12) of body 11 is the sealing glass for the circular concave being internally recessed from 1 top surface of tube body
Glass 13, the top of hat shape metal shell 11 are equipped with the adjustable metal seat 9 of ring-shaped sleeve structure, the bottom of adjustable metal seat 9 to
It extends to form annular seal ring outside and is adjacent to the top surface of hat shape metal shell 11, and the inner ring of ring-shaped sleeve is then directed at seal glass
13 circular indent and coaxially.Lens 10 are through in the ring-shaped sleeve of adjustable metal seat 9 and probe into seal glass 13
Circular indent.In tube body 1, as shown in figure 3, the surface for facing hat shape metal shell 11 is positioning reference plane, surface patch
Equipped with semiconductor cooler 2, semiconductor cooler 2 is equipped with heat sink 7, and heat sink 7 upper surface is integrated with electro-absorption modulation laser
Device chip 3, backlight detection chip 4, capacitor 5, reflecting prism 6 and thermistor 8.The reflecting surface of reflecting prism 6 is 45 degree of angles
Inclined-plane, the light direction of the reflecting surface face Electroabsorption Modulated Laser chip 3, what Electroabsorption Modulated Laser chip 3 issued
The lens 10 that laser beam enters top after the reflection of reflecting prism 6 form main optical path.Back light detector 4 is mounted on electric absorption tune
The backlight direction of chip of laser 3 processed is tested 3 back facet optical power of Electroabsorption Modulated Laser chip, to detect it
Light state out.
The light path system of the electro-absorption modulation sealed laser with the positioning reference plane of tube body 1 be X/Y axial plane, perpendicular to
The direction of the positioning reference plane is Z-direction.In processing, first by coaxial packaging equipment and its image identification system to electricity
The contraposition of Absorption modulation chip of laser 3 and heat sink 7 progress eutectic welding is realized to be accurately positioned and install for the first time and be fixed, then
Reflecting prism 6, which is realized second using the light direction of mounted Electroabsorption Modulated Laser chip 3 as benchmark direction, accurately to be determined
Position, and backlight detection chip 4 realizes that third time is accurately positioned with reference direction identical with reflecting prism 6, finally respectively will
Capacitor 5 and thermistor 8 are fixed on heat sink 7.The accurate positioning three times of 1 process of tube body can effectively be associated with electric absorption
The tolerance between chip of laser 3, backlight detection chip 4 and reflecting prism 6 this three is modulated, realizes the consistent of installation accuracy
Property.
1 internal structure of tube body is encapsulated in 11 top of hat shape metal shell after processing is completed, the seal glass 13 of light transmission, so
The coaxial resistance welding between tube body 1 and hat shape metal shell 11 is realized by the accurate positioning of coaxial packaging equipment afterwards, is completed
The sealing of the tube body 1 of the electro-absorption modulation sealed laser.As shown in figure 5, lens 10 are mounted in adjustable metal seat 9, lens
10 one end are directed at seal glass 13, and the other end is positioned at the vacuum of the vacuum slot 14 of the Z axis upper end of tube body 1 by vacuum suction
Adsorption orifice 141.The light inlet of coupling optical fiber 16 is enclosed in vacuum slot 14 and is directed at optical path coupling of the lens 10 both to realize
It closes, the side of vacuum slot 14 is equipped with for realizing the tracheae adsorption orifice 15 vacuumized.When processing, turn in adjustable metal seat 9
Dynamic lens 10 close to adjust coupling optical fiber 16, lens 10 and this three of reflecting prism 6 relative to the position of X/Y axis datum level
System, or lens 10 are moved up and down in adjustable metal seat 9 to adjust this three in the positional relationship of Z-direction, until realizing
Active coupling is fixed on lens 10 in adjustable metal seat 9, to realize the three-dimensional active of the electro-absorption modulation sealed laser
Coupling.
The coaxial active package structure of the electro-absorption modulation sealed laser, using the lens 10 with 1 separate type of tube body, no
It needs light transmission slide to be mounted on inside tube body 1, on the one hand reduces and the patch precision of Electroabsorption Modulated Laser chip 3 is wanted
It asks, on the other hand since 10 position of lens is adjustable, it is difficult with the coupling for coupling optical fiber 16 that lens 10 can be reduced in active coupling
Degree.
As shown in figure 4, multiple carrier transitional modules on heat sink 7 are that COC (chip attachment on substrate) realizes installation positioning,
Stablize the characteristic of Electroabsorption Modulated Laser chip 3.Specifically, Electroabsorption Modulated Laser chip 3 is positioned at heat sink 7 pad
At 70.First pin, 71 one side is connect by pad 31 with the positive pole of Electroabsorption Modulated Laser chip 3, on the other hand respectively
It is connected to outer extended area 72,73 through decoupling resistor, the two outer extended areas 72,73 are reserved installation position, for according to sharp
The characteristics on circuit of light device is adjusted.Backlight detection chip 4 is positioned at heat sink 7 placement section 74, and back is equipped on the right side of it
The long extent block 75 of the positive polar curve of light detecting chip 4, and place section 74 and adjacent outer extended area 72 it
Between be equipped with COC aging active line position 76.It is then respectively equipped in heat sink 7 lower right corner positive by Electroabsorption Modulated Laser chip 3
Excessive extent block 77 of the pole to capacitor 5 and the excessive extent block 78 to thermistor 8.Multiple carrier stage dies that this is heat sink on 7
Block can decompose that gold thread is too long to cause impedance existing for entire link not reciprocity, and solving it causes electro-absorption modulation sealed laser
The problem of radio-frequency performance cracking.The coaxial active package structure of the electro-absorption modulation sealed laser, with electro-absorption modulation laser
Based on device chip 3, the pin arrangement based on Electroabsorption Modulated Laser chip 3 realizes system using multiple carrier transitional modules
The link design of function forms the match circuit of each intermodule, optimal electric signal transmission can be initialized, in small space
Realize that electro-absorption modulation swashs the high-performance optical electrical characteristics of laser, so that Miniaturization Design may be implemented in encapsulation.
Wherein, thermistor 8 predominantly detects the operating temperature of Electroabsorption Modulated Laser chip 3 as hygrosensor,
Semiconductor cooler 2 be mounted on it is heat sink 7 lower section, semiconductor cooler 2 be used as cooling heat radiator, connect with thermistor 8 from
And automatic temperature-controlled circuit is formed to realize that the temperature in tube body 1 is adjusted.
Claims (10)
1. the coaxial active package structure of electro-absorption modulation sealed laser, which is characterized in that including tube body, tube body one end is stretched out
There is conductive mixtion, the other end is covered with hat shape metal shell, is equipped with annular casing at the top of the separate conductive mixtion of hat shape metal shell
The adjustable metal seat of pipe structure, the bottom of adjustable metal seat extend outward to form annular seal ring and are adjacent to hat shape metal shell
Top surface, lens are through in the ring-shaped sleeve of adjustable metal seat and the relative position of the two is adjustable, face hat shape in the tube body
The surface of metal shell be equipped with it is heat sink, heat sink upper surface is integrated with Electroabsorption Modulated Laser chip and reflecting prism, reflection
The inclined-plane at the degree angle of the light direction of the reflecting surface face Electroabsorption Modulated Laser chip of prism, Electroabsorption Modulated Laser core
The laser beam that piece issues enters the lens forming main optical path of top after the reflective surface of reflecting prism.
2. the coaxial active package structure of electro-absorption modulation sealed laser according to claim 1, which is characterized in that cap
The top of shape metal shell is equipped with seal glass.
3. the coaxial active package structure of electro-absorption modulation sealed laser according to claim 2, which is characterized in that close
Envelope glass is the circular indent being internally recessed from tube body top surface, the inner ring alignment sealing glass of the ring-shaped sleeve of adjustable metal seat
The circular indent of glass and coaxially.
4. the coaxial active package structure of electro-absorption modulation sealed laser according to claim 1 or 3, feature exist
In lens are mounted in adjustable metal seat, and lens one end is directed at reflecting prism, and the other end is adsorbed in the vacuum suction of tube body upper end
Structure, the light inlet of vacuum suction structure alignment coupling optical fiber.
5. the coaxial active package structure of electro-absorption modulation sealed laser according to claim 4, which is characterized in that institute
Stating vacuum suction structure includes vacuum slot, and the upper end of vacuum slot is used for the light inlet of fixed coupling optical fiber, vacuum slot
Lower end is equipped with the vacuum suction mouth for adsorbing the lens, and the side of vacuum slot is equipped with for realizing the endotracheal suction vacuumized
Attached mouth.
6. the coaxial active package structure of electro-absorption modulation sealed laser according to claim 1, which is characterized in that electricity
The backlight direction of Absorption modulation chip of laser is pasted with back light detector.
7. the coaxial active package structure of electro-absorption modulation sealed laser according to claim 1, which is characterized in that institute
Heat sink bottom is stated equipped with cooling heat radiator, which is connected with the thermistor being arranged on heat sink as temperature
Spend detector.
8. the coaxial active package structure of electro-absorption modulation sealed laser according to claim 1, which is characterized in that institute
Stating is coaxial resistance welding between tube body and hat shape metal shell.
9. the coaxial active package structure of electro-absorption modulation sealed laser according to claim 1, which is characterized in that institute
State it is heat sink be equipped with carrier transitional module, including pad and the first pin, on the one hand first pin passes through pad and electricity is inhaled
The connection of modulation chip of laser forward direction pole is received, is on the other hand connected to the reserved peace as outer extended area through decoupling resistor respectively
Fill position.
10. the coaxial active package structure of electro-absorption modulation sealed laser according to claim 8, which is characterized in that
The heat sink carrier transitional module includes aging active line position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811631258.6A CN109546526A (en) | 2018-12-29 | 2018-12-29 | The coaxial active package structure of electro-absorption modulation sealed laser |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811631258.6A CN109546526A (en) | 2018-12-29 | 2018-12-29 | The coaxial active package structure of electro-absorption modulation sealed laser |
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| CN201811631258.6A Pending CN109546526A (en) | 2018-12-29 | 2018-12-29 | The coaxial active package structure of electro-absorption modulation sealed laser |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111129956A (en) * | 2019-12-07 | 2020-05-08 | 武汉高跃科技有限责任公司 | Multi-chip pulse tail laser assembly |
| CN111262128A (en) * | 2020-03-20 | 2020-06-09 | 绵阳精恒光通讯有限公司 | High-stability optical transmitter |
| CN111404020A (en) * | 2020-03-30 | 2020-07-10 | 成都英思嘉半导体技术有限公司 | Laser diode chip mounting substrate |
| CN112379490A (en) * | 2020-11-16 | 2021-02-19 | 河北华美光电子有限公司 | Optical module |
| CN112713493A (en) * | 2020-12-29 | 2021-04-27 | 华中光电技术研究所（中国船舶重工集团公司第七一七研究所） | Semiconductor saturable absorption mirror capable of improving thermal damage resistance and manufacturing method thereof |
| CN112803235A (en) * | 2021-02-05 | 2021-05-14 | 广东瑞谷光网通信股份有限公司 | Coaxial packaging laser device |
| CN113764971A (en) * | 2021-06-30 | 2021-12-07 | 武汉敏芯半导体股份有限公司 | Electric absorption modulation laser refrigeration packaging structure |
| CN116344471A (en) * | 2023-05-26 | 2023-06-27 | 四川九州光电子技术有限公司 | TO packaging structure and carrier |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111129956A (en) * | 2019-12-07 | 2020-05-08 | 武汉高跃科技有限责任公司 | Multi-chip pulse tail laser assembly |
| CN111262128A (en) * | 2020-03-20 | 2020-06-09 | 绵阳精恒光通讯有限公司 | High-stability optical transmitter |
| CN111404020A (en) * | 2020-03-30 | 2020-07-10 | 成都英思嘉半导体技术有限公司 | Laser diode chip mounting substrate |
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| CN112713493A (en) * | 2020-12-29 | 2021-04-27 | 华中光电技术研究所（中国船舶重工集团公司第七一七研究所） | Semiconductor saturable absorption mirror capable of improving thermal damage resistance and manufacturing method thereof |
| CN112803235A (en) * | 2021-02-05 | 2021-05-14 | 广东瑞谷光网通信股份有限公司 | Coaxial packaging laser device |
| CN113764971A (en) * | 2021-06-30 | 2021-12-07 | 武汉敏芯半导体股份有限公司 | Electric absorption modulation laser refrigeration packaging structure |
| CN116344471A (en) * | 2023-05-26 | 2023-06-27 | 四川九州光电子技术有限公司 | TO packaging structure and carrier |
| CN116344471B (en) * | 2023-05-26 | 2023-08-01 | 四川九州光电子技术有限公司 | TO packaging structure and carrier |
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