CN102315586A - Semiconductor laser module with multiple detection sensors and protection devices - Google Patents

Semiconductor laser module with multiple detection sensors and protection devices Download PDF

Info

Publication number
CN102315586A
CN102315586A CN201010215178XA CN201010215178A CN102315586A CN 102315586 A CN102315586 A CN 102315586A CN 201010215178X A CN201010215178X A CN 201010215178XA CN 201010215178 A CN201010215178 A CN 201010215178A CN 102315586 A CN102315586 A CN 102315586A
Authority
CN
China
Prior art keywords
semiconductor laser
laser
optical
module
optical fiber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201010215178XA
Other languages
Chinese (zh)
Inventor
杜毅
吴荣亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN LEIMAI TECHNOLOGY Co Ltd
Original Assignee
SHENZHEN LEIMAI TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN LEIMAI TECHNOLOGY Co Ltd filed Critical SHENZHEN LEIMAI TECHNOLOGY Co Ltd
Priority to CN201010215178XA priority Critical patent/CN102315586A/en
Publication of CN102315586A publication Critical patent/CN102315586A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)

Abstract

The invention relates to a semiconductor laser module with multiple detection sensors and protection devices, comprising a semiconductor laser, a laser tube temperature sensor, an optical-fiber interface temperature sensor, an optical power sensor, an optical-fiber inserting detection sensor, an indicating light source, a replaceable protection window, optical components and a light reflecting feedback window. Since the detection sensors and the protection devices are packaged in the laser module, more effective real-time control and monitoring of a control system for the laser can be realized, so that the more stable operation of the laser is ensured; and simultaneously a semiconductor laser chip array package is coupled with a series of optical components, so that the output power of the laser is high. The semiconductor laser module has the advantages that the output power is high, the coupling efficiency is high, the volume is small, the service life is long and the stability is good.

Description

The semiconductor laser module that has multiple detecting sensor and protective device
Technical field
The present invention relates to a kind of laser module, concretely, relate to semiconductor laser module with multiple detecting sensor and protective device.
Background technology
As a kind of potential novel tumor treatment technology; PDT is the high-tech technology that multinomial technology such as set laser technology, light guide techniques, optical information processing is formed; High power semiconductor lasers is an equipment most crucial in the PDT; Its technology content also is the highest; Production optical fiber connector power output is a present technical bottleneck both domestic and external greater than the 630nm laser of 2W, and according at present domestic and international manufacturing technology of semiconductor laser and ability, single laser die power output is mostly below 200-300mW near the 630nm wavelength; And finally the luminous power of our system requirements is less than or equals 10W (considering each grade coupled, loss), even higher luminous power.So after accomplishing tube core, must adopt some special technique to synthesize to obtain a plurality of laser die outputs high-power.Industry generally is to adopt two kinds of methods to solve the laser coupled problem at present: a kind of mode is that each tube core is coupled respectively to single small-bore optical fiber, and then forms light beam (Bundle) output, shown in following Figure 1A:
Adopt the laser of this mode to have following shortcoming: a plurality of single tube series connection of needs or parallel connection at least when optical fiber connector need reach than macro-energy; Each laser also wants Laser Power Devices to supply power separately; Form by many small-bore optical fiber then and close bundle, therefore bulky, the output optical fibre core diameter is thick, failure rate is high, cost is high.Another kind of mode is that laser itself adopts array (Bar) form, energy is coupled in the output optical fibre of a smaller aperture due through one group of optical module system then, and is as shown in Figure 3.Advantage is: volume is little, high-output power, high coupling efficiency, and little, the good stability of spot diameter is prone to drive and control.Native system adopts the second way, adopts the single array fibre coupling of conduction cooling to be made into laser module.
And generally only integrated temperature sensor or the photo-detector diode of being packaged with of traditional laser can not satisfy the particularly practical application in medical operating better, and failure rate is high.
Summary of the invention
The object of the present invention is to provide semiconductor laser with multiple detecting sensor and protective device; In module integrated conventional laser the multiple detection and the defencive function that can't possess; With the real-time monitoring of overall process in the actual operating position that solves laser medicine, guarantee that laser more stably moves.
To achieve these goals, the invention provides following technical scheme:
The semiconductor laser module that has multiple detecting sensor and protective device of the present invention; Comprise substrate; Substrate is provided with semiconductor laser element, and it is used to produce laser and is installed on substrate, and the adjacent locations in this unit is provided with temperature sensor; This temperature sensor is used for the actual work temperature of detection laser, for thermostatic control and overtemperature alarm provide the temperature detection sampled signal; On substrate, be provided with optical power sensor with semiconductor laser element outgoing position, its effect is the actual light power of detection laser, for the outside provides laser power feedback sample signal; Comprise the optical module that optical focus mirror group, polarizing coupler, fast slow axes collimating module are formed; Be arranged on the emitting light path axis of semiconductor laser element; Effect is the laser that semiconductor laser produces to be focused on through this optical module launch on the central shaft of the optical fiber connector; Guarantee simultaneously when external fiber is screwed onto the optical fiber connector, can focus on the fiber optic hub end face, reach maximum light transmissioning efficiency; In optical fiber connector passage, be provided with simultaneously optical fiber and insert detecting sensor and optical fiber interface temperature sensor; Being used for detecting output optical fiber, whether to be connected temperature bad or that therefore interface causes too high, and handle to the control system in the equipment detected signal feedback.
Can also be independently or integrated pilot light light source, replaceable protection window and light reflection feedback window in substrate simultaneously.
Of the present invention at first is to make semiconductor laser element: screening semiconductor laser tube die chip; Heat sink with gold-plated cuboid as intermediate carrier, with the mode of full wafer vapor deposition scolder on heat sink, utilize the scolder semiconductor laser tube core chip that in each heat sink unit, bonds; After finishing, bonding puts into alloying furnace together; Adopt golden tin solder, sintering is 10 seconds~60 seconds under 280 ℃~300 ℃ and logical nitrogen protection condition, and the heat sink unit that is stained with chip behind the sintering is cut down from heat sink of full wafer; Utilize the single array arrangement of silver slurry to be bonded on the alloyed copper layer plane edge; Bonding gold thread on the N of semiconductor laser tube core chip face electrode connects gold thread on the negative electrode pin, and the alloyed copper layer is as positive pole.Adopt parallel connected array to arrange between the chip; Overall fixed is in the can of sealing; Bondd simultaneously temperature sensor, optical power sensor, optical fiber inserts acquisition sensor and pilot light light source part etc., and with its lead-in wire by signal line set of interfaces holding wire output interface the most.Through one group of optics self-built systems, regulate the optical focus point, laser energy is coupled to the optical fiber connector (SMA905 interface) standard output interface, guarantee the highest efficiency of transmission.
Beneficial effect of the present invention is; The actual operating position that can combine laser medicine; Integrated not available multiple detection of conventional laser and defencive function in module insert detecting sensor, optical module and light reflection feedback window etc. like replaceable protection window, optical fiber interface temperature sensor, optical power sensor, optical fiber.Advantage is: high-output power, high coupling efficiency, volume is little, the life-span is long, good stability, can realize that the work overall process monitors in real time, has guaranteed laser more safe and reliable operation in system.
Description of drawings
The principle schematic that Fig. 1 is coupled for the optical fiber according to prior art.
Fig. 2 is the structure side view according to the semiconductor laser module critical piece semiconductor laser element that has multiple detecting sensor and protective device of a kind of embodiment of the present invention;
Fig. 3 is the structural perspective according to the semiconductor laser module critical piece semiconductor laser element that has multiple detecting sensor and protective device of a kind of embodiment of the present invention
Fig. 4 be installed according to a kind of embodiment of the present invention have multiple detecting sensor and protective device the structural representation of integral module.
Fig. 5 is for accordinging to a kind of inner critical piece of semiconductor laser module and sensor signal lead-in wire connection layout that has multiple detecting sensor and protective device of the present invention.
Fig. 6 is for adopting its optical principle and three kinds of applicating examples of practical implementation according to a kind of semiconductor laser module that has multiple detecting sensor and protective device of the present invention.
Embodiment:
Fig. 2, Fig. 3 are for showing critical piece of the present invention; It is the structural representation of semiconductor laser element 10; With reference to Fig. 2,3; This semiconductor laser element 10 comprise one heat sink be that semiconductor laser is anodal 104, be crimped on the semiconductor laser negative pole 103 that this mutual electricity on heat sink is isolated, and be arranged at the semiconductor laser tube core chip array 102 on the semiconductor laser anodal 104.This semiconductor laser positive pole can be the alloyed copper layer, and the heat that the assurance laser is produced in running is by this heat sink conduction.The laser tube core negative pole is welded to above the laser negative pole 103 or the direct surface crimping through the gold thread wire drawing; Semiconductor laser anodal 104 is fixed to shell substrate 100 with semiconductor laser negative pole 103 through copper stud 13, copper stud 14 extensions; Referring to Fig. 4; Use working of plastics to guarantee the good insulation between positive-negative polarity simultaneously, copper stud 14 and the external power source both positive and negative polarity input terminal of copper stud 13 as the laser power supply.A is laser beam and the direction that semiconductor laser tube core chip array 102 penetrates.
The production method of this semiconductor laser element 10 is following: at first screen the semiconductor laser tube die chip, and heat sink with gold-plated cuboid as intermediate carrier, after this; With the mode of full wafer vapor deposition scolder on heat sink, utilize the scolder semiconductor laser tube core chip that in each heat sink unit, bonds, after finishing, bonding puts into alloying furnace together; Adopt golden tin solder, sintering is 10 seconds~60 seconds under 280 ℃~300 ℃ and logical nitrogen protection condition, and the heat sink unit that is stained with chip behind the sintering is cut down from heat sink of full wafer; Utilize the single array arrangement of silver slurry to be bonded on the alloyed copper layer plane edge; Bonding gold thread on the N of semiconductor laser tube core chip face electrode connects gold thread on the negative electrode pin, and the alloyed copper layer is as positive pole; Adopt parallel connected array to arrange between the chip, quantity can single or a plurality of parallel connections.This semiconductor laser wavelength scope is 375nm~980nm.
Like Fig. 4 and shown in Figure 5; The semiconductor laser module that this has multiple detecting sensor and protective device comprises substrate 100, and substrate 100 is provided with semiconductor laser element 10; It is used to produce laser and is installed on substrate; Adjacent locations in this unit 10 is provided with temperature sensor 20, and this temperature sensor 20 is used for the actual work temperature of detection laser, for thermostatic control and overtemperature alarm provide the temperature detection sampled signal; On substrate, be provided with optical power sensor 30 with semiconductor laser element outgoing position, its effect is the actual light power of detection laser, for the outside provides laser power feedback sample signal; Comprise the optical module that optical focus mirror group 87, polarizing coupler 88, fast slow axes collimating module 89 are formed; Like Fig. 4, shown in 6; Be arranged on the emitting light path axis of semiconductor laser element 10, effect is the laser that semiconductor laser produces to be focused on through this optical module launch on the central shaft of the optical fiber connector 40, guarantees when external fiber is screwed onto the optical fiber connector 40 simultaneously; Can focus on the fiber optic hub end face; Reach maximum light transmissioning efficiency, can see, the laser beam of launching from semiconductor laser tube core by Fig. 6 sketch map applicating example; After collimating, arrange, focus on transformation through optical module; Be coupled to the optical fiber connector 40 central shafts to focus, when external fiber is connected this focus through the optical fiber connector, guarantee that laser energy on this focus converges at external fiber center end face and overlaps.This method is than the laser of light beam (Bundle) output form output, arrayed encapsulation between laser tube core that can parallelly connected greater number and tube core, and great advantage is: high power, small size; Also integrated pilot light light source 11 in substrate 100 simultaneously; The light that pilot light is launched gets into polarizing coupler 88 through 86 reflections of mirror group; Can be coupled into simultaneously with the light that semiconductor laser is launched in the external optical fiber through focus lamp group 87 at last, this pilot light light source has the important function of target location and treatment guide in the medical operating process.The optical fiber connector 40 can be SMA or FC interface, and polarizing coupler 8 is 45 ° of installations with mirror group 86.
In the optical fiber connector 40 passages, be provided with optical fiber and insert detecting sensor 50 and optical fiber interface temperature sensor 60; Whether be used for detecting output optical fiber is connected bad or comes off; And the temperature that therefore interface causes is too high; And handle to the control system in the equipment the detected signal feedback, guarantee the maximum transmitted efficient of laser and move safely.These two transducers are that the effective transmission of laser provides detection signal, have protected laser better.
Replaceable protection window 70 is installed on the optical fiber connector 40 rear ends; Main effect is for when frequently connecting external fiber; Foreign matter and dust very easily get in optical module 80 cavitys through the optical fiber connector 40 passages, have hindered axial optics transmission channel, have a strong impact on efficiency of transmission.Can guarantee cavity and outside effective isolation with this protection window; Its two, for pollution face is cleaned and changes, this protection window is the Embedded substrate 100 that is fixed in, and is for convenience detach and change.
Light reflection feedback window 90 is arranged on branch's light path of polarizing coupler 88; Its effect be at laser in transmission course; Because reflexing to this light through polarizing coupler 88, the outside cause reflex time reflects feedback window as laser, for the outside provides the laser-bounce light signal fed back.Make things convenient for control system to detect and control with this function.
Whole module adopts sealed package, and inside is filled with nitrogen, and purpose is in order to prevent under the effect of refrigeration semiconductor laser owing to the temperature difference produces the dewfall phenomenon, thereby damages laser in the course of the work.
Described semiconductor laser can directly be welded on the heat sink laser strip that goes up for single or array arrangement.
It can be mechanical or photoelectric type that described optical fiber inserts acquisition sensor.
Described laser tube temperature transducer is negative tempperature coefficient thermistor (NTC) or semistor (PTC).
Described optical power sensor is the electro-optical pickoff of photodiode (PD) type.
Described pilot light light source is that wave-length coverage is LASER Light Source or the led light source of 375~800nm

Claims (8)

1. semiconductor laser module that has multiple detecting sensor and protective device; It is characterized in that: comprise substrate 100; Substrate 100 is provided with semiconductor laser element 10, and it is used to produce laser and is installed on substrate, and the adjacent locations in this unit 10 is provided with temperature sensor 20; This temperature sensor 20 is used for the actual work temperature of detection laser, for thermostatic control and overtemperature alarm provide the temperature detection sampled signal; On substrate, be provided with optical power sensor 30 with semiconductor laser element outgoing position, its effect is the actual light power of detection laser, for the outside provides laser power feedback sample signal; Comprise the optical module that optical focus mirror group 87, polarizing coupler 88, fast slow axes collimating module 89 are formed; Be arranged on the emitting light path axis of semiconductor laser element 10; Effect is the laser that semiconductor laser produces to be focused on through this optical module launch on the central shaft of the optical fiber connector 40; Guarantee simultaneously when external fiber is screwed onto the optical fiber connector 40, can focus on the fiber optic hub end face, reach maximum light transmissioning efficiency; In the optical fiber connector 40 passages, be provided with simultaneously optical fiber and insert detecting sensor 50 and optical fiber interface temperature sensor 60; Being used for detecting output optical fiber, whether to be connected temperature bad or that therefore interface causes too high, and handle to the control system in the equipment detected signal feedback.
2. the semiconductor laser module that has multiple detecting sensor and protective device according to claim 1; It is characterized in that: also comprise replaceable protection window 70; It is installed between the optical module 80 and the optical fiber connector 40, and main effect is to be convenient for changing when having dust or dirt residual when frequent connection external fiber minute surface.
3. the semiconductor laser module that has multiple detecting sensor and protective device according to claim 1; It is characterized in that: also comprise light reflection feedback window 90; It is arranged on branch's light path of polarizing coupler 88; Its effect be at laser in transmission course, when laser-bounce, reflex to this light reflection feedback window, for the outside provides the laser-bounce feedback through polarizing coupler 88.
4. have the semiconductor laser module of multiple detecting sensor and protective device according to claim 1, it is characterized in that: described semiconductor laser is single or array arrangement directly is welded on the heat sink laser strip that goes up.
5. have the semiconductor laser module of multiple detecting sensor and protective device according to claim 1, it is characterized in that: it can be mechanical or photoelectric type that described optical fiber inserts acquisition sensor.
6. have the semiconductor laser module of multiple detecting sensor and protective device according to claim 1, it is characterized in that: described laser tube temperature transducer is negative tempperature coefficient thermistor (NTC) or semistor (PTC).
7. have the semiconductor laser module of multiple detecting sensor and protective device according to claim 1, it is characterized in that: described optical power sensor is the electro-optical pickoff of photodiode (PD) type.
8. have the semiconductor laser module of multiple detecting sensor and protective device according to claim 1, it is characterized in that: described pilot light light source is that wave-length coverage is LASER Light Source or the led light source of 375~800nm.
CN201010215178XA 2010-06-29 2010-06-29 Semiconductor laser module with multiple detection sensors and protection devices Pending CN102315586A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201010215178XA CN102315586A (en) 2010-06-29 2010-06-29 Semiconductor laser module with multiple detection sensors and protection devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201010215178XA CN102315586A (en) 2010-06-29 2010-06-29 Semiconductor laser module with multiple detection sensors and protection devices

Publications (1)

Publication Number Publication Date
CN102315586A true CN102315586A (en) 2012-01-11

Family

ID=45428500

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010215178XA Pending CN102315586A (en) 2010-06-29 2010-06-29 Semiconductor laser module with multiple detection sensors and protection devices

Country Status (1)

Country Link
CN (1) CN102315586A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104951725A (en) * 2015-06-19 2015-09-30 四川飞阳科技有限公司 Laser barcode scanner and scanning engine thereof
WO2018006657A1 (en) * 2016-07-04 2018-01-11 深圳市光峰光电技术有限公司 Semiconductor laser and temperature control method therefor
CN109564136A (en) * 2016-06-03 2019-04-02 恩耐公司 For monitoring the multifunctional circuit of Connectorized fiber optic cabling health status
CN111628405A (en) * 2019-02-28 2020-09-04 潍坊华光光电子有限公司 High-power conduction cooling packaging structure bar laser sintering fixture and sintering method thereof
CN113236126A (en) * 2021-05-24 2021-08-10 中国工程物理研究院激光聚变研究中心 Underground light source drilling system
CN114665379A (en) * 2022-03-25 2022-06-24 中国工程物理研究院应用电子学研究所 Semiconductor laser device with stable wavelength
CN114878148A (en) * 2022-06-07 2022-08-09 济南大学 Microchannel stacked-array laser performance detection device and detection method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05220101A (en) * 1992-02-17 1993-08-31 Olympus Optical Co Ltd Surgical laser unit
CN2676949Y (en) * 2003-12-31 2005-02-09 上海仁光光电科技有限公司 630 nm large power semiconductor laser system and laser therapeutic instrument using said system
CN1644189A (en) * 2005-01-20 2005-07-27 中国科学院上海光学精密机械研究所 Semiconductor laser alignment coupling device
CN1743898A (en) * 2005-10-14 2006-03-08 左昉 High-precision high-power optical fiber coupled laser lighting device
CN201247905Y (en) * 2008-05-16 2009-05-27 北京中视中科光电技术有限公司 Encapsulation module for semiconductor laser and array thereof
CN201829809U (en) * 2010-06-29 2011-05-11 深圳市雷迈科技有限公司 Semiconductor laser module with various detection sensors and protectors

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05220101A (en) * 1992-02-17 1993-08-31 Olympus Optical Co Ltd Surgical laser unit
CN2676949Y (en) * 2003-12-31 2005-02-09 上海仁光光电科技有限公司 630 nm large power semiconductor laser system and laser therapeutic instrument using said system
CN1644189A (en) * 2005-01-20 2005-07-27 中国科学院上海光学精密机械研究所 Semiconductor laser alignment coupling device
CN1743898A (en) * 2005-10-14 2006-03-08 左昉 High-precision high-power optical fiber coupled laser lighting device
CN201247905Y (en) * 2008-05-16 2009-05-27 北京中视中科光电技术有限公司 Encapsulation module for semiconductor laser and array thereof
CN201829809U (en) * 2010-06-29 2011-05-11 深圳市雷迈科技有限公司 Semiconductor laser module with various detection sensors and protectors

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104951725A (en) * 2015-06-19 2015-09-30 四川飞阳科技有限公司 Laser barcode scanner and scanning engine thereof
CN109564136A (en) * 2016-06-03 2019-04-02 恩耐公司 For monitoring the multifunctional circuit of Connectorized fiber optic cabling health status
WO2018006657A1 (en) * 2016-07-04 2018-01-11 深圳市光峰光电技术有限公司 Semiconductor laser and temperature control method therefor
CN111628405A (en) * 2019-02-28 2020-09-04 潍坊华光光电子有限公司 High-power conduction cooling packaging structure bar laser sintering fixture and sintering method thereof
CN111628405B (en) * 2019-02-28 2022-04-01 潍坊华光光电子有限公司 High-power conduction cooling packaging structure bar laser sintering fixture and sintering method thereof
CN113236126A (en) * 2021-05-24 2021-08-10 中国工程物理研究院激光聚变研究中心 Underground light source drilling system
CN114665379A (en) * 2022-03-25 2022-06-24 中国工程物理研究院应用电子学研究所 Semiconductor laser device with stable wavelength
CN114878148A (en) * 2022-06-07 2022-08-09 济南大学 Microchannel stacked-array laser performance detection device and detection method

Similar Documents

Publication Publication Date Title
CN201829809U (en) Semiconductor laser module with various detection sensors and protectors
CN102315586A (en) Semiconductor laser module with multiple detection sensors and protection devices
EP2479594A1 (en) Robust pigtail system for high power laser modules
CN110429453A (en) A high power laser with back light monitoring system
JPH10173207A (en) Optical transceiver module
CN202134793U (en) A semiconductor laser
CN208283580U (en) Mirror lens, laser emitter, light emission component and light emitting receiving unit
JP6794140B2 (en) Optical transmitter and optical module including it
CN104678517B (en) A kind of integrated semiconductor optical device
CN103944062A (en) Semiconductor laser unit of single chip optical fiber coupling output
CN214849532U (en) Coaxial packaged semiconductor optical amplifier
CN116203682A (en) Miniaturized optical transceiver and manufacturing method thereof
CN103779765B (en) A kind of optical fiber laser fiber-optic output package module
CN201656243U (en) Semiconductor laser with optical fiber coupled output
CN109980498A (en) A kind of high power pulse-width tunable semiconductor laser module
CN104122634B (en) A kind of optically-coupled equipment being applied to opto-electronic device encapsulation
CN111504296A (en) Optical transceiver module and optical fiber sensing device
CN204613454U (en) The semiconductor optical device that based semiconductor laser instrument is integrated
CN102034899A (en) TO-CAN coaxial miniaturization package method for BOSA
CN220272950U (en) Multi-wavelength optical fiber coupling laser with strong heat dissipation
JP3417200B2 (en) Optical transmission / reception module
CN212586603U (en) A beam expanding fiber coupling device
CN104199150B (en) Assisting method and device for coupling of optical waveguide chip and PD (photo diode) array
CN105161972A (en) Optical fiber output large-power semiconductor laser module
CN211180308U (en) High-power pulse tail laser subassembly

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C53 Correction of patent of invention or patent application
CB03 Change of inventor or designer information

Inventor after: Du Yi

Inventor after: Wu Rongliang

Inventor after: Liu Jian

Inventor before: Du Yi

Inventor before: Wu Rongliang

COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: DU YI WU RONGLIANG TO: DU YI WU RONGLIANG LIU JIAN

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120111