CN102034899A - TO-CAN coaxial miniaturization package method for BOSA - Google Patents

TO-CAN coaxial miniaturization package method for BOSA Download PDF

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Publication number
CN102034899A
CN102034899A CN2010105179274A CN201010517927A CN102034899A CN 102034899 A CN102034899 A CN 102034899A CN 2010105179274 A CN2010105179274 A CN 2010105179274A CN 201010517927 A CN201010517927 A CN 201010517927A CN 102034899 A CN102034899 A CN 102034899A
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CN
China
Prior art keywords
base
heat sink
welding
coaxial
aluminum nitride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010105179274A
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Chinese (zh)
Inventor
詹敦平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGSU FIBER GRID CO Ltd
Original Assignee
JIANGSU FIBER GRID CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGSU FIBER GRID CO Ltd filed Critical JIANGSU FIBER GRID CO Ltd
Priority to CN2010105179274A priority Critical patent/CN102034899A/en
Publication of CN102034899A publication Critical patent/CN102034899A/en
Pending legal-status Critical Current

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Light Receiving Elements (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention relates to a TO-CAN coaxial miniaturization package method for a bi-directional optical sub-assembly (BOSA), which is used in the field of semiconductor photoelectric devices. The method comprises the following steps of: a, gilding the surface of a TO-CAN base which is made of an iron-nickel-cobalt alloy material, and arranging a Case point for heat conduction on the TO-CAN base which is welded with an aluminum nitride heat sink; b, gliding the surface of the aluminum nitride heat sink by thin film sputtering process, and welding the aluminum nitride heat sink and a laser chip on the TO-CAN base by using Au(80)Ge(20) alloy solder; c, welding a back-light detector on the TO-CAN base; and d, performing gold wire welding, and connecting conducting wires outside the chip continuously. Both the performance and reliability can meet the using requirements; and two beams of light of different wavelengths can be reflected by a light splitting sheet and then are coupled into an optical fiber after being focused by a lens, so that one optical fiber can transmit two beams of light signals, and the volume, power consumption and cost are reduced.

Description

The coaxial miniaturization method for packing of BOSA transmitting-receiving optical device TO-CAN
Technical field
The present invention relates to a kind of coaxial miniaturization method for packing of BOSA transmitting-receiving optical device TO-CAN that is used for the semiconductor photoelectric device field.
Background technology
More and more higher for the requirement of transmitting-receiving optical device miniaturization at present, the overall volume of SFP, SFF can't satisfy the requirement of miniaturization in the existing transmitting-receiving optical device.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of and can reduce the volume of photoelectric device, the coaxial miniaturization method for packing of BOSA transmitting-receiving optical device TO-CAN of reduction power consumption.
Method of the present invention is:
A. gold-plated to the TO-CAN susceptor surface of teleoseal material, welding the Case point that is provided for heat conduction on the heat sink TO-CAN base of aluminium nitride;
B. adopt thin film sputtering technology gold-plated, adopt Au(80 the aluminium nitride heat sink surface) Ge(20) heat sink and chip of laser is welded on the TO-CAN base solder with aluminium nitride;
C. on the TO-CAN base, weld back light detector;
D. carry out the spun gold weldering, connect chip in succession and connect lead outward.
The coaxial miniaturization method for packing of BOSA transmitting-receiving optical device TO-CAN of the present invention, its Performance And Reliability all satisfies instructions for use, it can be reflected in scioptics focusing with two bundle different wave lengths by light splitting piece and be coupled into optical fiber, reach the effect of an Optical Fiber Transmission two-beam signal, thereby reduce volume, reduction power consumption and cost.
Embodiment
The method of the embodiment of the invention is:
A. gold-plated to the TO-CAN susceptor surface of teleoseal material, welding the Case point that is provided for heat conduction on the heat sink TO-CAN base of aluminium nitride;
B. adopt thin film sputtering technology gold-plated, adopt Au(80 the aluminium nitride heat sink surface) Ge(20) heat sink and chip of laser is welded on the TO-CAN base solder with aluminium nitride;
C. on the TO-CAN base, weld back light detector;
D. carry out the spun gold weldering, connect chip in succession and connect lead outward.

Claims (1)

1. a BOSA receives and dispatches the coaxial miniaturization method for packing of optical device TO-CAN, it is characterized in that:
A. gold-plated to the TO-CAN susceptor surface of teleoseal material, welding the Case point that is provided for heat conduction on the heat sink TO-CAN base of aluminium nitride;
B. adopt thin film sputtering technology gold-plated, adopt Au(80 the aluminium nitride heat sink surface) Ge(20) heat sink and chip of laser is welded on the TO-CAN base solder with aluminium nitride;
C. on the TO-CAN base, weld back light detector;
D. carry out the spun gold weldering, connect chip in succession and connect lead outward.
CN2010105179274A 2010-10-25 2010-10-25 TO-CAN coaxial miniaturization package method for BOSA Pending CN102034899A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010105179274A CN102034899A (en) 2010-10-25 2010-10-25 TO-CAN coaxial miniaturization package method for BOSA

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010105179274A CN102034899A (en) 2010-10-25 2010-10-25 TO-CAN coaxial miniaturization package method for BOSA

Publications (1)

Publication Number Publication Date
CN102034899A true CN102034899A (en) 2011-04-27

Family

ID=43887507

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010105179274A Pending CN102034899A (en) 2010-10-25 2010-10-25 TO-CAN coaxial miniaturization package method for BOSA

Country Status (1)

Country Link
CN (1) CN102034899A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102437245A (en) * 2011-12-20 2012-05-02 江苏飞格光电有限公司 Optical transceiver component TO coaxial miniaturized packaging method
CN102780157A (en) * 2012-07-06 2012-11-14 江苏飞格光电有限公司 Chip patching system of semiconductor laser and patching method
CN103576257A (en) * 2013-10-25 2014-02-12 中国科学院半导体研究所 Single-fiber two-way miniaturization optical transceiver sealing device
CN112114446A (en) * 2020-09-30 2020-12-22 武汉光迅科技股份有限公司 Silicon optical modulator, optical transmitting device and optical signal modulation method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1617402A (en) * 2003-11-14 2005-05-18 三星电子株式会社 Transistor shaped can type optical module
CN201063636Y (en) * 2007-07-26 2008-05-21 深圳新飞通光电子技术有限公司 PLC type single fiber bidirectional twin port component
CN201387500Y (en) * 2009-03-24 2010-01-20 深圳新飞通光电子技术有限公司 GPON single fiber bi-directional optical transmitting-receiving component

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1617402A (en) * 2003-11-14 2005-05-18 三星电子株式会社 Transistor shaped can type optical module
CN201063636Y (en) * 2007-07-26 2008-05-21 深圳新飞通光电子技术有限公司 PLC type single fiber bidirectional twin port component
CN201387500Y (en) * 2009-03-24 2010-01-20 深圳新飞通光电子技术有限公司 GPON single fiber bi-directional optical transmitting-receiving component

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102437245A (en) * 2011-12-20 2012-05-02 江苏飞格光电有限公司 Optical transceiver component TO coaxial miniaturized packaging method
CN102780157A (en) * 2012-07-06 2012-11-14 江苏飞格光电有限公司 Chip patching system of semiconductor laser and patching method
CN103576257A (en) * 2013-10-25 2014-02-12 中国科学院半导体研究所 Single-fiber two-way miniaturization optical transceiver sealing device
CN103576257B (en) * 2013-10-25 2015-07-15 中国科学院半导体研究所 Single-fiber two-way miniaturization optical transceiver sealing device
CN112114446A (en) * 2020-09-30 2020-12-22 武汉光迅科技股份有限公司 Silicon optical modulator, optical transmitting device and optical signal modulation method
CN112114446B (en) * 2020-09-30 2023-09-05 武汉光迅科技股份有限公司 Silicon optical modulator, optical transmitting device and optical signal modulation method

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Application publication date: 20110427