CN109845143A - Wavelength-division multiplex optical receiver module - Google Patents
Wavelength-division multiplex optical receiver module Download PDFInfo
- Publication number
- CN109845143A CN109845143A CN201780064929.2A CN201780064929A CN109845143A CN 109845143 A CN109845143 A CN 109845143A CN 201780064929 A CN201780064929 A CN 201780064929A CN 109845143 A CN109845143 A CN 109845143A
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- China
- Prior art keywords
- optical
- wavelength
- receiver module
- signal
- division multiplex
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/60—Receivers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04J—MULTIPLEX COMMUNICATION
- H04J14/00—Optical multiplex systems
- H04J14/02—Wavelength-division multiplex systems
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention relates to wavelength-division multiplex optical receiver module, do not need individually it is hermetically sealed, by optical receiver module encapsulating structure, compact dimensioning can be fabricated to.Wavelength-division multiplex optical receiver module of the invention includes: optical link, for connecting the optical connector and optical receiver module that are located at optical link end；Optical package portion assembles and reflects each optical signal of separation after being separated into the optical signal of each wavelength from the received optical signal of the optical link；Amplifier element portion, reception are transformed to electric signal after the optical signal that the optical package portion is reflected；The electric signal converted by the amplifier element portion is transmitted to external circuit by printed circuit board；And silicon substrate, groove portion is formed with so that multiple constituent elements in the optical package portion are assembled in top, the deep trouth of lower open is formed, to cover the constituent element in the amplifier element portion；It is bonded and seals by flip-chip bonded process between the two sides of the silicon substrate of the printed circuit board.
Description
Technical field
The present invention relates to wavelength-division multiplex optical receiver modules.
The present invention relates to wavelength-division multiplex optical receiver module, do not need individually it is hermetically sealed, optical receiver module is encapsulated
Structuring can be fabricated to compact dimensioning.
Especially, it is related to wavelength-division multiplex optical receiver module, is assembled in the top of printed circuit board with silicon substrate covering
Electronic chip (preamplifier, photodiode etc.) will be glued between printed circuit board and silicon substrate by flip-chip bonded process
Connecing makes its sealing.
Background technique
The smart phone game based on augmented reality (AR) causes upsurge, this game in worldwide recently
Type also gradually diversely increase.But in order to drive augmented reality (AR) content, a considerable amount of data communications can be generated
Amount, causes excess load to system.Nevertheless, the method that can giocoso enjoy respective service relies on " optic communication " technology.
It is the communication hand for replacing existing electric signal and utilizing light as the optic communication for having one of wireless communication technique
Section is the technology that can be transmitted a large amount of data with hypervelocity un-interrupted.
As Internet penetration, internet average speed and broadband internet first internet power South Korea,
This is intended to the technology used of course, but is the cause to attract attention in the also insufficient country of the communications infrastructure.
There is the optical communication technique for reaching 10Gbps or more transmit capacity using an optical fiber by commercialization, has used recently
The optic communication of wavelength-division multiplex (WDM, Wavelength Division Multiplexing) mode, that is, will in an optical fiber
Transmission speed is that the optical signal of the mutually different wavelength of 10Gbps or 25Gbps is multiplexed, the number of transmission tens to 100Gbps
According to, also, in order to realize more high transmission speed, exploitation is still continuing.
In the case where at most using the company, Large-Scale Interconnected net portal website of optical communication technique, run in large-scale data
The heart, in order to meet the transmission speed of several hundred Gps, data center is compactly connected with great scale.In order to improve in this data
The density of the optical communications module of the heart, the size for reducing optical communications module are critically important.
Existing technical literature discloses an example of this technology.
A kind of transmitting path expander is disclosed in following existing technical literatures characterized by comprising arrangement board, tool
There are setting unit, the first datum hole and the second datum hole, the setting unit is installed in setting position for optical element to be arranged in
On substrate, second datum hole and first datum hole are formed across the first interval；Optical fiber fixed block, be fixedly installed with
The optical element carries out the optical fiber of optic communication, has the first column for being inserted in first datum hole and is inserted in described second
Second column of datum hole；And shell, surround the optical fiber fixed block and the arrangement board；Second column is than described first
Column is inserted in second datum hole in the insertion more loose ground of first datum hole, and the setting position is located at by described
First reference line of the first datum hole and second datum hole, with first reference line report to the leadship after accomplishing a task and from the first datum hole across
The position at the second interval, is determined by being located at second reference line on opposite of second datum hole across first datum hole.
But the prior art as described above, the shell of high price is set to surround optical fiber fixed block and arrangement board, is applied
In the case where the structure of shell sealing, needs one by one to assemble a variety of optical element components one by one and pasted arrangement, so
There is the problem of complex procedures price rising.
Summary of the invention
Technical task
The present invention is proposed to solve the problem above-mentioned, it is intended that providing a kind of wavelength-division multiplex light-receiving
Module, do not need individually it is hermetically sealed, by optical receiver module encapsulating structure, compact dimensioning can be fabricated to.
In addition, being assembled in print with silicon substrate covering the purpose of the present invention is to provide a kind of wavelength-division multiplex optical receiver module
The electronic chip (preamplifier, photodiode etc.) on the top of circuit board processed will lead between printed circuit board and silicon substrate
Crossing flip-chip bonded process bonding makes its sealing.
Problem solution
To achieve the goals above, wavelength-division multiplex optical receiver module according to the present invention is characterised by comprising: optics connects
Socket part 100, for connecting the optical connector and optical receiver module that are located at optical link end；Optical package portion 110, will be from the light
It learns the received optical signal of interconnecting piece to be separated into after the optical signal of each wavelength, assembles and reflect each optical signal of separation；Amplification member
Part portion 120, reception are transformed to electric signal after the optical signal that the optical package portion is reflected；Printed circuit board 130 will pass through
The electric signal of the amplifier element portion transformation is transmitted to external circuit；And silicon substrate 140, groove portion 141 is formed in upper group
The multiple constituent elements for filling the optical package portion form the deep trouth 142 of lower open to cover the amplifier element portion
Constituent element；It is bonded and is sealed between the printed circuit board 130 and the two sides of silicon substrate by flip-chip bonded process.
In addition, which is characterized in that the optical link 100 includes: socket 101, with the light for being formed in optical link end
Fiber connector combines；Becket 102 is aligned light positioned at the inner space of the socket；Columnar casing 103 is located at institute
It states between socket and becket；And gradient-index lens 104 will positioned at the rear end side of the becket and the inside of socket
The dispersed light of input is transformed to directional light.
In addition, which is characterized in that the optical package portion 110 includes: glass blocks 111, as optical signal inverse multiplexing element；
Non reflecting film coating 112 is formed in the one side of the glass blocks, passes through optical signal；Reflectance coating coating 113 is formed in institute
State the one side of glass blocks, reflected light signal；Thin Film Filter 114 is being formed with the non reflecting film coating and reflectance coating plating
The another side of the glass blocks of layer is formed at certain intervals, passes through the wavelength of corresponding frequency band；Reflecting mirror 115, will be from
Thin Film Filter separation and the directional light of horizontal divergence vertical transitions in downward direction；And array lens 116, it is located at described anti-
The directional light reflected from the reflecting mirror is transformed to converging light by the downside for penetrating mirror.
In addition, which is characterized in that the amplifier element portion 120 includes: photodetector 121, detects the meeting based on diverging
The electric signal of optically focused；The electric signal detected from the photodetector is amplified and is exported by amplifier element 122；And lead 123,
Connecting the photodetector and amplifier element makes signal flow.
The effect of invention
As described above, wavelength-division multiplex optical receiver module according to the present invention, do not need it is individually hermetically sealed, by light-receiving
Module encapsulation construction has the effect of that compact dimensioning can be fabricated to.
In addition, being bonded between printed circuit board and silicon substrate by flip-chip bonded process makes its sealing, production process becomes
Simply, even if not forming hole on the printed circuit board and glued silicon substrate for being assembled with electronic chip, light also by, thus
The omission of through hole forming operation has the effect of reducing Production Time and expense.
Detailed description of the invention
Fig. 1 is the top view for indicating wavelength-division multiplex optical receiver module according to the present invention.
Fig. 2 is the sectional view for indicating wavelength-division multiplex optical receiver module according to the present invention.
Fig. 3 is the sectional view for indicating the moving process of optical signal of wavelength-division multiplex optical receiver module according to the present invention.
Fig. 4 is the figure for illustrating the assembling procedure of wavelength-division multiplex optical receiver module according to the present invention.
Specific embodiment
Term and word used in present specification and claims should not necessarily be limited by the meaning on usual or dictionary to solve
It releases, it, should based on applicant in order to illustrate that the invention of oneself can suitably define the principle of the concept of term with optimal method
It is construed to meet the meaning and concept of technical idea of the invention.
Therefore, structure shown in the embodiment and attached drawing recorded in this specification is only most preferred implementation of the invention
Example, does not represent whole technical ideas of the invention, it should be understood that in the presence of can replace the more of them at the time of the application proposes
The equivalent and variation of sample.
In the following, in order to protrude purport of the invention, statement is to unnecessary item in advance before being described with reference to
The known features that those of ordinary skill in the art can apparently add not are illustrated or are illustrated.
In the following, being described with reference to the preferred embodiment of the present invention.
Fig. 1 is the top view for indicating wavelength-division multiplex optical receiver module according to the present invention；Fig. 2 is to indicate according to the present invention
The sectional view of wavelength-division multiplex optical receiver module.
As shown in Figures 1 and 2, wavelength-division multiplex optical receiver module according to the present invention includes: optical link 100, optics
Encapsulation part 110, amplifier element portion 120, printed circuit board 130, silicon substrate 140, by the printed circuit board 130 and silicon substrate
Pass through flip-chip bonded process adhering and sealing between 140 two sides.
In wavelength-division multiplex optical receiver module, the light that the optical link 100 is used to connect positioned at optical link end connects
Connect device and optical receiver module.
The optical link 100 includes: socket 101, in conjunction with the optical fiber connector for being formed in optical link end；Metal
Ring 102 is aligned light positioned at the inner space of the socket；Columnar casing 103, be located at the socket and becket it
Between；And gradient-index lens 104 convert the dispersed light of input positioned at the rear end side of the becket and the inside of socket
For directional light.At this moment the gradient-index lens for forming directional light can be replaced with the convex lens with focal length appropriate.
The becket 112, casing 113 and gradient-index lens 114 have mutually the same in the inside of socket 111
Central axis.
The optical link 100 is the same as only compared with the existing receptacle portion that becket and casing are constituted, additional setting is terraced
Index lens are spent, the gradient-index lens or convex lens have the function that dispersed light is transformed to directional light.
It can be not required to about the focal position for being used to form perfect directional light using the gradient-index lens 104
In the case where wanting individual active alignment, more perfect directional light can be formed.
It is tied inside with columnar structured container with cylindrical shape having the same in addition, gradient-index lens are used
The becket 102 of structure is inserted into the structure for being installed to socket 101 without being individually aligned process, so as to only with mechanicalness
Precision be secured to accurate position.
The optical package portion 110 by be separated into from the received optical signal of the optical link each wavelength optical signal it
Afterwards, assemble and reflect each optical signal of separation.
The optical package portion 110 includes: the glass blocks 111 as optical signal inverse multiplexing element；It is formed in the glass
The one side of block, the non reflecting film coating 112 for passing through optical signal；It is formed in the one side of the glass blocks, reflected light signal
Reflectance coating coating 113；The another side for being formed with the glass blocks of the non reflecting film coating and reflectance coating coating with
Certain interval is formed, the Thin Film Filter 114 for passing through the wavelength of corresponding frequency band；It will be separated and water from the Thin Film Filter
The reflecting mirror 115 of the directional light of flat diverging vertical transitions in downward direction；It, will be from the reflection and positioned at the downside of the reflecting mirror
The directional light of mirror reflection is transformed to the array lens 116 of converging light.
The non reflecting film coating 112 have make due to reflecting band by glass blocks by the light of gradient-index lens incidence
The effect for the minimization of loss come, reflectance coating coating 113 are reflected from the Thin Film Filter for being formed in opposite side with making
Light is incident on the function of Thin Film Filter after reflecting again.
That is, the optical package portion 110 can be made by following process: in the glass with defined refractive index and thickness
One region processing non reflecting film coating 112 of block one side, the same face other region processing reflectance coating coating 113 it
Afterwards, it cuts as with defined size, the glass blocks cut is formed parallelogram by section of accurate angle grinding
Form after, it is that multiple Thin Film Filters of pre-production are successively pasted onto glass blocks with one side that is being formed with coating portion
The defined position of corresponding another side.
The reflecting mirror 115 be for will photodetector 121 from the optical signal from Thin Film Filter 114 to lower layer it is anti-
The structure penetrated, is inclined at an angle to be formed, and can be formed as being plated with the mirror form of the stick state of reflectance coating in one side.
The array lens 116 be the lens that the diverging light reflected is transformed to converging light are integrated into a component and
At, by the way that reflecting mirror 115 and array lens 116 are combined into one, it is possible to reduce unnecessary volume and space.But
As needed, array lens portion and mirror part can be separated, two separate parts are configured to.
The amplifier element portion 120 receives and is transformed to electric signal after the optical signal that the optical package portion is reflected.
The amplifier element portion 120 includes: the photodetector 121 for detecting the electric signal of the converging light based on diverging；It will
The amplifier element 122 of the electric signal amplification output detected from the photodetector；And it connects the photodetector and puts
Big element and the lead 123 for making signal flow.
The photodetector 121, which refers to, to be had the function of detecting optical signal and is transformed to the element of electric signal, as generation
Table has the avalanche photodide (APD) etc. of PIN photodiode (PIN-PD) or the enlarging function with optical signal.
The photodetector 121 is formed on a semiconductor substrate by the way that multiple element is made into single component, tool
Have the advantages that the alignment of each photodetector is easy.
The amplifier element 122 is the element for amplifying the electric signal transmitted from photodetector, can choose signal to adjust
Section.
The lead 123 has the function of electrical connection photodetector and amplifier element, can pass through wire bonding (Wire
Bonding) process is bonded.
Here, lead-in wire bonding process is the process in the attachment of electrodes conducting wire of component etc., it is in the microballoon being heated
(Pellet) method of conducting wire transient heating compression is put.
The printed circuit board 130 is be bonded by flip-chip bonded process with aftermentioned silicon substrate 140, and having will be by described
The electric signal of amplifier element portion transformation is transmitted to the effect of external circuit.
The silicon substrate 140 is formed with groove portion 141, so that multiple constituent elements in the optical package portion are assembled in
Portion；Also, the deep trouth 142 of lower open is formed, to cover multiple constituent elements in the amplifier element portion.
The silicon substrate 140 is placed in the groove portion 141 for being formed in top and the fixed composition as optical package portion 110 is wanted
Glass blocks 111, Thin Film Filter 114, reflecting mirror 115 and the array lens 116 of element utilize etching to form the groove portion
(Etching) method.
In optical signal transmitting, the wavelength of light can by the silicon of the silicon substrate 140, therefore be assembled with electronics core
The silicon substrate of the printed circuit board bonding of piece does not form hole can also be by light, to can be contracted by omitting hole forming operation
Short manufacturing process.
It on the other hand,, can be in order to minimize the loss of optical signal in the case where by the silicon substrate communicating optical signals
Non reflecting film coating is processed on the surface of silicon substrate.
On the other hand, existing optical receiver module needs when assembling alignment each component every time when assembling constituent element
It monitors and confirms angle, therefore there is the problems such as productivity decline and price increase, the present invention passes through flip-chip bonded process group
When filling optical receiver module, the dynamic real-time monitor of the angle for being aligned directional light is not needed.
Fig. 3 is the sectional view for indicating the moving process of optical signal of wavelength-division multiplex optical receiver module according to the present invention；Fig. 4
It is the figure for illustrating the assembling procedure of wavelength-division multiplex optical receiver module according to the present invention.
As shown in Figures 3 and 4, wavelength-division multiplex optical receiver module according to the present invention, if completing the one of amplifier element portion 120
Body then places solder pads on the top of printed circuit board 130 by flip-chip bonded, is adhesively fixed with silicon substrate 140.
At this moment, it is adhesively fixed by the flip-chip bonded process of the printed circuit board and silicon substrate, along printed circuit board
With the peripheral sealing of silicon substrate.
This is because optical package portion 110 but is assembled with photodetector 121 and amplifier element with whether there is or not sealing is unrelated
The sealing of 122 printed circuit board and disqualification rate are most closely related.
Especially, not needing to be put into the encapsulation individually sealed also has sealing effect, it is possible to reduce volume, with qualification rate
Increase, has the effect of that price becomes cheap.
The present invention is illustrated centered on preferred embodiment referring to attached drawing, but those of ordinary skill in the art can
It is obvious to carry out various deformation without departing from the scope of the present invention according to such record.
Claims (4)
1. a kind of wavelength-division multiplex optical receiver module characterized by comprising
Optical link (100), for connecting the optical connector and optical receiver module that are located at optical link end；
Optical package portion (110), after being separated into the optical signal of each wavelength from the received optical signal of the optical link, meeting
Poly- and reflection separation each optical signal；
Amplifier element portion (120), reception are transformed to electric signal after the optical signal that the optical package portion is reflected；
The electric signal converted by the amplifier element portion is transmitted to external circuit by printed circuit board (130)；And
Silicon substrate (140) is formed with groove portion (141) to assemble multiple constituent elements in the optical package portion on top, is formed
The deep trouth (142) of lower open is to cover the constituent element in the amplifier element portion；
It is bonded and is sealed between the printed circuit board (130) and the two sides of silicon substrate (140) by flip-chip bonded process.
2. wavelength-division multiplex optical receiver module as described in claim 1, which is characterized in that
The optical link (100) includes:
Socket (101), in conjunction with the optical fiber connector for being formed in optical link end；
Becket (102) is aligned light positioned at the inner space of the socket；
Columnar casing (103), between the socket and becket；And
Gradient-index lens (104) convert the dispersed light of input positioned at the rear end side of the becket and the inside of socket
For directional light.
3. wavelength-division multiplex optical receiver module as described in claim 1, which is characterized in that
The optical package portion (110) includes:
Glass blocks (111), as optical signal inverse multiplexing element；
Non reflecting film coating (112), is formed in the one side of the glass blocks, passes through optical signal；
Reflectance coating coating (113), is formed in the one side of the glass blocks, reflected light signal；
Thin Film Filter (114), in the other side for the glass blocks for being formed with the non reflecting film coating and reflectance coating coating
Face is formed at certain intervals, passes through the wavelength of corresponding frequency band；
Reflecting mirror (115) will separate and the directional light of horizontal divergence vertical transitions in downward direction from the Thin Film Filter；And
The directional light reflected from the reflecting mirror is transformed to assemble by array lens (116) positioned at the side of the reflecting mirror
Light.
4. wavelength-division multiplex optical receiver module as described in claim 1, which is characterized in that
The amplifier element portion (120) includes:
Photodetector (121) detects the electric signal of the converging light based on diverging；
The electric signal detected from the photodetector is amplified and is exported by amplifier element (122)；And
Lead (123), connecting the photodetector and amplifier element makes signal flow.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160136046A KR101885080B1 (en) | 2016-10-19 | 2016-10-19 | Wavelength multiplexing optical receiving module |
| KR10-2016-0136046 | 2016-10-19 | ||
| PCT/KR2017/007218 WO2018074705A1 (en) | 2016-10-19 | 2017-07-06 | Wavelength multiplexing optical receiver module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109845143A true CN109845143A (en) | 2019-06-04 |
| CN109845143B CN109845143B (en) | 2021-11-19 |
Family
ID=62019209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780064929.2A Active CN109845143B (en) | 2016-10-19 | 2017-07-06 | Wavelength division multiplexing optical receiving module |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101885080B1 (en) |
| CN (1) | CN109845143B (en) |
| WO (1) | WO2018074705A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114325968A (en) * | 2022-01-04 | 2022-04-12 | 武汉光迅科技股份有限公司 | Be applied to airtight structure in optical module |
| WO2022083040A1 (en) * | 2020-10-19 | 2022-04-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10862610B1 (en) * | 2019-11-11 | 2020-12-08 | X Development Llc | Multi-channel integrated photonic wavelength demultiplexer |
| US11187854B2 (en) | 2019-11-15 | 2021-11-30 | X Development Llc | Two-channel integrated photonic wavelength demultiplexer |
| US11536907B2 (en) | 2021-04-21 | 2022-12-27 | X Development Llc | Cascaded integrated photonic wavelength demultiplexer |
| US11962351B2 (en) | 2021-12-01 | 2024-04-16 | X Development Llc | Multilayer photonic devices with metastructured layers |
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| CN1146560A (en) * | 1995-07-26 | 1997-04-02 | 富士通株式会社 | Virtual image plase-control array used as wave length signal separator |
| CN105278056A (en) * | 2015-11-06 | 2016-01-27 | 武汉电信器件有限公司 | Wavelength division multiplexing and de-multiplexing optical assembly |
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| JP3767156B2 (en) * | 1998-02-23 | 2006-04-19 | 住友電気工業株式会社 | Optical transceiver module |
| US6754407B2 (en) * | 2001-06-26 | 2004-06-22 | Intel Corporation | Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board |
| KR20070023420A (en) * | 2005-08-24 | 2007-02-28 | (주) 파이오닉스 | Optical transceiver module using silicon optical bench |
| JP2007071912A (en) * | 2005-09-02 | 2007-03-22 | Ntt Electornics Corp | Optical receptacle and optical module with same |
| US8488244B1 (en) * | 2010-07-12 | 2013-07-16 | Alliance Fiber Optic Products, Inc. | Ultra compact optical multiplexer or demultiplexer |
| JP2013201473A (en) * | 2012-03-23 | 2013-10-03 | Sumitomo Electric Ind Ltd | Optica receiver module |
| JP2014072804A (en) * | 2012-09-28 | 2014-04-21 | Sumitomo Osaka Cement Co Ltd | Optical receiver module |
| KR101480025B1 (en) | 2013-11-28 | 2015-01-07 | (주)옵토마인드 | Transmission Path Extender |
-
2016
- 2016-10-19 KR KR1020160136046A patent/KR101885080B1/en active IP Right Grant
-
2017
- 2017-07-06 WO PCT/KR2017/007218 patent/WO2018074705A1/en active Application Filing
- 2017-07-06 CN CN201780064929.2A patent/CN109845143B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1146560A (en) * | 1995-07-26 | 1997-04-02 | 富士通株式会社 | Virtual image plase-control array used as wave length signal separator |
| CN105278056A (en) * | 2015-11-06 | 2016-01-27 | 武汉电信器件有限公司 | Wavelength division multiplexing and de-multiplexing optical assembly |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022083040A1 (en) * | 2020-10-19 | 2022-04-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114325968A (en) * | 2022-01-04 | 2022-04-12 | 武汉光迅科技股份有限公司 | Be applied to airtight structure in optical module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018074705A1 (en) | 2018-04-26 |
| CN109845143B (en) | 2021-11-19 |
| KR101885080B1 (en) | 2018-08-03 |
| KR20180043125A (en) | 2018-04-27 |
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