JP2006267154A - Optical device and device for optical monitoring - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To promote small size various optical communication equipment etc., mounted with an optical device by reducing the size and thickness of the optical device. <P>SOLUTION: The optical device 10 has a base 12, an optical component 14 which is mounted on the base 12 and has at least one element, and a transparent gap member 16 which is fixed onto the base 12 to cover the optical component 14 and is a single body and transparent. Then the angle θ between the bottom 22a and side wall 22b of a recessed portion 22 is ≤90° and and the boundary 22c between the bottom 22a and side wall 22b of the recessed portion 22 is curved. Further, the depth (h) of the recessed portion 22 is ≤1.0 mm. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an optical device in which an optical component having an optical element or an optoelectronic integrated circuit is sealed, and an optical monitoring device using the optical device.

  In general, in an optical device in which an optical component such as an optical element or an optoelectronic integrated circuit is sealed, a hermetic package is used to obtain high reliability in order to obtain high reliability.

  In order to hermetically seal optical components, a transparent window for entering and exiting light is required. Normally, optical components are die-bonded to a metal base with leads, and the glass for input / output and the metal cap are joined in advance with low-melting glass or solder, and the cap and base are joined together by soldering or welding for airtightness. The method of stopping is common (can package).

  In the case of sealing an array-shaped one such as an image sensor, a method is generally employed in which a chip is die-bonded to a base and a metal and an incident window are bonded in advance as a cap and then sealed ( (See Patent Documents 1 to 7).

  Further, as a sealing method, there is a method of performing simple sealing by potting a transparent resin on a chip die-bonded to a base (see Patent Documents 8 to 10).

  As a simple sealing structure, for example, as shown in Patent Document 11, there is a structure in which a frame portion is provided on a transparent member made of glass or the like, and a light receiving area is positioned in a space formed by the frame portion. According to this, the mounting size can be reduced, the thickness can be reduced, and the weight can be reduced.

JP-A-6-53454 JP-A-6-120460 JP-A-6-151620 JP-A-9-130678 JP-A-9-32261 JP 2002-151705 A JP 2002-203920 A JP-A-5-55537 Japanese Patent Laid-Open No. 5-182999 JP-A-8-274290 Japanese Patent Laid-Open No. 11-26782

  By the way, in the present optical communication technology, the communication quality monitoring technology is an important item. In particular, monitoring of optical output occupies an important position especially in the field of wavelength division multiplexing technology. In recent years, there is an increasing demand for downsizing (thinning) and cost reduction for such optical output monitoring technology.

  In such a situation, the can package type sealing structure has a large number of parts and is not suitable for miniaturization, and also becomes an obstacle to cost reduction and miniaturization. The resin-encapsulated type is not perfect in terms of airtightness and may cause a problem in reliability in a moisture resistance test.

  The sealing structure of Patent Document 11 is a structure in which a light receiving area formed in a semiconductor element is hermetically sealed with a transparent member, but when the semiconductor element itself mounted on the base is hermetically sealed, The above can package type or resin sealed type is used. Moreover, the base part of the frame part of the transparent member has a cross-sectional right-angle shape. Certainly, when covering a small area called a light receiving area, a right-angled shape may be used, but to cover the semiconductor element itself, the fatigue strength decreases due to the size effect or the like, and the reliability decreases accordingly.

  The present invention has been made in consideration of such problems, and an optical component having at least one optical element mounted on a base can be hermetically sealed with a single cap member. It is an object of the present invention to provide an optical device that can be reduced in size and thickness, and that can promote the downsizing of various optical communication devices mounted with the optical device.

  Another object of the present invention is to provide an optical monitoring device capable of promoting the downsizing and thinning of the optical monitoring device used for monitoring the communication quality in the wavelength division multiplexing communication technique, for example.

  An optical device according to the present invention includes a base, an optical component mounted on the base and having at least one optical element, and fixed on the base so as to cover the optical component. And a transparent cap member.

  Accordingly, an optical component having at least one optical element mounted on a base can be hermetically sealed with a single cap member, and the optical device can be reduced in size and thickness. It is also possible to promote downsizing of various optical communication devices and the like that are mounted.

And in the said structure, it is preferable that the difference of the thermal expansion coefficient of the said base and the said cap member is 50 * 10 < ^-7 > / degrees C or less. In this case, the cap member can be made of glass.

  The cap member may be made by press working. For example, when glass is processed by grinding, a scar remains, and light is scattered and lost. However, if it is press processing, it can process in the state close | similar to a mirror surface, and can suppress loss. Moreover, although the method of making it into a mirror surface by etching etc. is also considered, a process process and an etching process will be needed and a process will increase. On the other hand, if it is press processing, it can process in the state near a mirror surface only by press processing, and it can control an increase in a process. This is advantageous for cost reduction.

  The cap member may have at least one recess, and may be fixed to the base so that the optical component is accommodated in the recess. In this case, the depth of the recess is preferably 1.0 mm or less. Thereby, the thinning of the optical device can be further promoted. Note that the depth of the recess may be 3.5 mm or the like. With such a depth, for example, it is possible to collect light with a lens of φ1.5 mm.

  Moreover, it is preferable that the angle | corner which the bottom part and side wall of the said recessed part make is less than 90 degrees. Furthermore, it is preferable that the boundary portion between the bottom portion and the side wall of the concave portion has a curved shape. The boundary portion between the bottom and the side wall of the recess may have a right-angled cross section. However, when the optical component to be accommodated is an optical component in which a plurality of optical elements are arranged in an array as will be described later, the size of the recess In particular, it is necessary to increase the accommodation volume. In this case, fatigue strength is reduced due to dimensional effects and the like, and there is a risk that cracks are likely to occur at the corners of a right-angled shape where stress is likely to concentrate. Therefore, by making the angle formed between the bottom of the concave portion and the side wall less than 90 °, it is possible to disperse the stress concentration and to improve the strength.

  In the above configuration, the optical component may include a plurality of optical elements arranged in an array.

  Next, an optical monitoring device according to the present invention includes at least one optical transmission unit, an optical branching unit provided in the optical transmission unit, and branching a part of signal light propagating through the optical transmission unit, An optical monitoring device having an optical device for receiving the branched light from the optical branching means, the optical device being mounted on the base and at least one light receiving the branched light An optical component having an element and a cap member that is fixed on the base so as to cover the optical component, and that is a single member and is transparent.

  Thereby, for example, the downsizing and thinning of the optical monitoring device used for monitoring the communication quality in the wavelength division multiplexing communication technology can be promoted.

  As described above, according to the optical device according to the present invention, an optical component having at least one optical element mounted on a base can be hermetically sealed with a single cap member, and the optical device can be compact. The size and thickness of the optical device can be reduced, and the downsizing of various optical communication devices mounted with the optical device can be promoted.

  Further, according to the optical monitoring device according to the present invention, it is possible to promote the downsizing and thinning of the optical monitoring device used for monitoring the communication quality in the wavelength division multiplexing communication technology, for example.

  Embodiments of an optical device and an optical monitoring device according to the present invention will be described below with reference to FIGS.

  First, as shown in FIGS. 1A and 1B, an optical device 10 according to the present embodiment includes a base 12, an optical component 14 mounted on the base 12, and having at least one optical element, and a base. It is fixed on the base 12 so as to cover the optical component 14 and has a single and transparent cap member 16. A wiring 18 electrically connected to the optical component 14 is formed on the base 12, and the wiring 18 is led out to the outside through a lead 20 that penetrates the base 12.

The difference in coefficient of thermal expansion between the base 12 and the cap member 16 is 50 × 10 ⁻⁷ / ° C. or less. In this embodiment, the cap member 16 is made of glass.

  Further, as shown in FIG. 2, the cap member 16 has at least one recess 22 and is fixed to the base 12 so that the optical component 14 is accommodated in the recess 22. In this case, it is preferable that the depth h of the recess 22 is 1.0 mm or less. Thereby, thickness reduction of the optical device 10 can further be promoted. The depth h of the recess 22 may be set to 3.5 mm or the like. With such a depth, for example, it is possible to collect light with a lens of φ1.5 mm.

  Further, the angle θ formed by the bottom 22a of the recess 22 and the side wall 22b is less than 90 °, and the boundary portion 22c between the bottom 22a and the side wall 22b of the recess 22 is curved. Of course, the boundary portion 18c may have a right-angle cross section, but as the optical component 14 to be accommodated, a plurality of optical elements are arranged in an array like the optical device 10a according to the modification shown in FIGS. 3A to 3C, for example. In the case of the arranged optical components 24, it is necessary to increase the size of the concave portion 22, in particular, the accommodation volume. In this case, fatigue strength is reduced due to dimensional effects and the like, and there is a risk that cracks are likely to occur at the corners of a right-angled shape where stress is likely to concentrate. Therefore, as in the case of FIG. 2, by making the angle formed between the bottom 22a of the recess 22 and the side wall 22b less than 90 °, it is possible to disperse the stress concentration and to improve the strength. .

  3A to 3B, the optical device 10a according to the modification can be surface-mounted, the leads 20 are mounted horizontally with respect to the base 12, and a 12-channel photodiode chip as the optical component 24 It is an optical device mounted with.

  As described above, in the optical device 10 according to the present embodiment (including the optical device 10a according to the modification), the optical component 14 (or 24) having at least one optical element mounted on the base 12 is provided. The single cap member 16 can be hermetically sealed, and the optical device 10 (and 10a) can be reduced in size and thickness, and various optical communication devices mounted with the optical device 10 (and 10a) can be used. Miniaturization can also be promoted.

  Next, the optical monitoring device 100 according to the present embodiment will be described with reference to FIGS.

  As shown in FIG. 4, the optical monitoring device 100 according to this embodiment is configured by joining the optical device 10 a according to the above-described modification and the optical branching device 102. In this case, the optical component 24 mounted on the optical monitoring device 100 is a PD array 104 in which a plurality of light receiving elements (photodiodes) are arranged.

  The optical branching device 102 includes a substrate 106, an optical fiber array 110 including one or more optical fibers 108 fixed to a plurality of V grooves (not shown) provided on the substrate 106, and each optical fiber 108. A slit 112 (see FIG. 5) provided from the upper surface to the substrate 106 and an optical branching member 114 inserted into the slit 112 are provided. The slit 112 and the light branching member 114 function as the light branching means 116.

  In addition, the surface of the substrate 106 of the optical branching device 102 on which the optical fiber array 110 is fixed and the upper surface of the cap member 16 of the optical device 10 a are opposed to each other, and further, via a spacer 118 provided on the substrate 106. The optical branching device 102 and the optical device 10a are joined.

  The fixing resin 120 is interposed between the optical branching device 102 and the peripheral portion of the optical device 10a, and refraction is made between the portion of the optical branching device 102 where the slit 112 is formed and the upper surface of the cap member 16 of the optical device 10a. A rate matching material 122 is interposed. The refractive index matching material 122 can be made of a silicone-based resin so that the refractive index thereof is substantially the same as the refractive index of the core of the optical fiber 108 or the refractive index of the optical branching member 114 such as a quartz substrate.

  As shown in FIG. 5, out of the signal light 124 transmitted through each optical fiber 108, light (branched light) 126 branched at least by the optical branching member 114 or the like is emitted out of the optical fiber 108 and refracted. The light is incident on the PD array 104 through the rate matching material 122 and the cap member 16.

  In addition, as shown in FIG. 5, the inclination | tilt angle (alpha) of the slit 112 was 15 degrees-25 degrees. When the inclination angle α is too small, the spread of the branched light 126 from the light branching member 114 becomes too large, and there is a possibility that the crosstalk is deteriorated when applied to a multi-channel. On the other hand, if the inclination angle α is too large, the polarization dependency of the branched light 126 from the light branching member 114 increases, which may lead to deterioration of characteristics.

  Thus, in the optical monitoring device 100 according to the present embodiment, since the optical device 10a according to the modification is used, for example, the optical monitoring device used for monitoring the communication quality in the wavelength division multiplexing communication technology is used. Reduction in size and thickness can be promoted.

  Next, an example of the optical device 10 according to the present embodiment shown in FIGS. 1A and 1B (optical device 200A according to the first example) will be described with reference to FIGS. 2 and 6A to 9B.

  In the optical device 200A according to the first example, as shown in FIGS. 6A and 6B, wiring 18 is provided with gold (Au) on a base 12 made of alumina (Al 2 O 3) with a diameter of 5 mm. On the base 12, an optical component 14 composed of a photodiode chip (hereinafter referred to as a PD chip 202) is mounted. The PD chip 202 was mounted with Au solder. A resin such as a silver paste may be used in place of the Au solder. Moreover, the PD chip 202 may be mounted on the base 12 on a glass-sealed pin using a metal such as Kovar.

  In the optical device 200A according to the first embodiment, the back-illuminated type in which the size of the light receiving portion (light receiving diameter) is φ80 μm and the size is 0.4 mm (vertical) × 0.4 mm (horizontal) × 0.3 mm (thickness). PD chip 202 was used. Of course, a front-illuminated PD chip may be used.

  As shown in FIGS. 7A to 7C, Kovar glass 204 was used as the cap member 16. In order to accommodate the PD chip 202 so as to cover it, the Kovar glass 204 was pressed to form a recess (concave portion 22) in the Kovar glass 204 and formed into a cap shape. In the press processing, the cap was processed into a cap shape having a recess (concave portion 22) having a width and height sufficient to accommodate the PD chip 202. In this pressing, for example, as shown in FIG. 2, the distance L between the bottom 22a of the recess 22 and the PD chip 202 is sufficient so that the bottom 22a of the recess 22 does not contact the PD chip 202. In the first embodiment, the diameter D (see FIG. 7A) of the recess 22 is φ1.0 mm, and the depth h of the recess 22 is 0.4 mm. In this pressing process, the cap member 16 may be pressed into a lens shape in order to collect light, and the PD chip 202 may be accommodated. In this pressing, the shape of the recess 22 after the pressing, particularly the angle θ formed between the bottom 22a and the side wall 22b of the recess 22, as shown in FIG. Molding was performed so that a taper (55 ° with respect to the flat surface when the bottom 22a of the recess 22 is flat) was formed instead of a right angle so that the stress was not concentrated.

  The thickness t (see FIG. 2) of the portion (the bottom 22a of the recess 22) that becomes the light receiving window of the cap member 16 was set to 0.1 mm in the first embodiment. The distance L (see FIG. 2) between the surface of the PD chip 202 and the bottom 22a of the recess 22 when the cap member 16 is placed on the PD chip 202 mounted on the base 12 is designed to be 0.1 mm. did. When a front-illuminated PD chip is used, the wire bond may be designed so as not to contact the bottom 22 a of the recess 22.

  Since the surface of the cap member 16 on the PD chip 202 side, that is, the bottom 22a of the recess 22 may interfere with the surface of the PD chip 202 and the bottom 22a of the recess 22 due to the etalon effect when light enters, It is desirable to perform AR coating. Alternatively, interference may be prevented by making the surface of the PD chip 202 and the bottom 22a (flat surface) of the recess 22 non-parallel.

  When the cap member 16 is produced from the Kovar glass 204 that has been pressed, a portion other than the concave portion 22 that is sealed with the base 12 (sealing portion) is made of Ti / Pt / Au. A frame-like metallized pattern 206 (see FIG. 7A) using a multilayer film was formed by sputtering. Thereafter, the Kovar glass 204 was cut into φ4 mm to produce the cap member 16.

  A frame-like metallized pattern 208 (see FIG. 6A) made of a Ti / Pt / Au multilayer film was also formed on the base 12 so as to surround the PD chip 202 by sputtering. The area of the frame-like metallized pattern 208 on the base 12 was larger than the area of the frame-like metallized pattern 206 on the Kovar glass 204. The areas of the metallized patterns 206 and 208 may be the same as the area of the metallized pattern 208 on the base 12 or larger or smaller than the area of the metallized pattern 206 on the kovar glass 204. Further, when a low-melting glass for sealing is used, the formation of these metallized patterns 206 and 208 may be omitted.

Thereafter, as shown in FIG. 8A, the AuSn solder layer 210 is sandwiched between the cap member 16 and the base 12, and then, as shown in FIG. And as shown to FIG. 9B, the optical device 200A based on this 1st Example was produced. As the AuSn solder layer 210 shown in FIG. 8A, a frame-preformed layer was used. The size of the preform was the same shape as the metallized pattern 206 (see FIG. 7A) on the Kovar glass 204, and the thickness was 50 μm. The load shown in FIG. 8B was 900 g / cm ² , the reflow temperature was 300 ° C. at maximum, and the temperature was maintained at 280 ° C. or higher for 3 minutes.

At this time, the difference in coefficient of thermal expansion between the base 12 (alumina) and the cap member 16 (Kovar glass 204) is about 15 × 10 ⁻⁷ / ° C., and the crack of the cap member 16 due to the difference in thermal stress does not occur. Therefore, if the difference in the coefficient of thermal expansion between the cap member 16 and the base 12 is 50 × 10 ⁻⁷ / ° C. or less, cracks do not occur.

When the leak check was performed on the optical device 200A according to the first example performed by the above-described sealing method, a favorable sealing result of 10 ⁻⁸ (Pa · m 3 / s) was obtained. In the reliability test and the liquid tank thermal shock test (0 ° C. → 100 ° C. × 15 cycles, holding time 5 minutes), no deterioration of leakage was observed, and good sealing results were obtained.

  Next, an example of the optical device 10a according to the modification shown in FIGS. 3A to 3C (an optical device 200B according to the second example) will be described with reference to FIGS. 2 and 10A to 13C.

In the optical device according to the second example, as shown in FIGS. 10A to 10C, wiring 18 was applied with gold (Au) on a base 12 made of alumina (Al ₂ O ₃ ). A 12-channel photodiode chip (hereinafter referred to as a 12ch PD chip 212) is mounted on the base 12 as the optical component 24. The 12ch PD chip 212 was mounted using ACP (anisotropic conductive paste). Instead of ACP, solder such as AuGe or AuSn, or resin such as silver paste may be used. The base 12 is a surface-mount type that can be surface-mounted and the leads 20 are mounted horizontally to the base 12.

  In the optical device 200B according to the second embodiment, the back-illuminated type in which the size of the light receiving portion (light receiving diameter) is φ80 μm and the size is 0.5 mm (vertical) × 3.0 mm (horizontal) × 0.2 mm (thickness). 12ch PD chip 212 was used. Of course, a front-illuminated 12ch PD chip may be used.

  As shown in FIGS. 11A to 11C, Kovar glass 204 was used as the cap member 16. In order to accommodate the 12ch PD chip 212 so as to cover it, the Kovar glass 204 was pressed to form a recess (concave portion 22) in the Kovar glass 204, and formed into a cap shape. In the press working, the cap was formed into a rectangular parallelepiped recess (concave portion 22) having a width and height sufficient to accommodate the 12ch PD chip 212. At this time, in this press work, as in the case shown in FIG. 2, the distance L between the bottom 22a of the recess 22 and the 12ch PD chip 212 is sufficient so that the bottom 22a of the recess 22 does not contact the 12ch PD chip 212. However, in this second embodiment, as shown in FIGS. 11A to 11C, a depression (concave portion 22) of 1.0 (vertical) × 4.0 (horizontal) × 0.3 mm (depth) was produced. . In this pressing process, the cap member 16 may be pressed into a lens shape to collect light, and the 12ch PD chip 212 may be accommodated. Further, in this pressing, as in the case of the shape of the recess 22 after the pressing, as shown in FIG. 2, in particular, the angle θ formed between the bottom 22 a and the side wall 22 b of the recess 22 is, for example, sealed with solder In order to prevent stress from concentrating on the surface, molding was performed such that a taper (55 ° with respect to the flat surface when the bottom 22a of the recess 22 is flat) was formed instead of a right angle.

  Similarly to the case shown in FIG. 2, the thickness t of the portion (the bottom 22a of the recess 22) that becomes the light receiving window of the cap member 16 is set to 0.1 mm in this second embodiment. In addition, the distance L between the surface of the 12ch PD chip 212 and the bottom 22a of the recess 22 when the cap member 16 is put on the 12ch PD chip 212 mounted on the base 12 is designed to be 0.1 mm. When a front-illuminated 12ch PD chip is used, the wire bond may be designed so as not to contact the bottom 22a of the recess 22.

  Since the surface of the cap member 16 on the 12ch PD chip 212 side, that is, the bottom 22a of the recess 22 may interfere with the surface of the 12ch PD chip 212 and the bottom 22a of the recess 22 due to the etalon effect when light is incident, It is desirable to perform AR coating. Alternatively, interference may be prevented by making the surface of the 12ch PD chip 212 and the bottom 22a (flat surface) of the recess 22 non-parallel.

  When the cap member 16 is produced from the Kovar glass 204 that has been pressed, a portion other than the concave portion 22 that is sealed with the base 12 (sealing portion) is made of Ti / Pt / Au. A frame-like metallized pattern 206 (see FIG. 11A) made of a multilayer film was formed by sputtering. Thereafter, the Kovar glass 204 was cut into 7.0 × 6.0 mm to produce the cap member 16.

  A frame-like metallized pattern 208 (see FIG. 10A) made of a multilayer film of Ti / Pt / Au was also formed on the base 12 so as to surround the 12ch PD chip 212 by sputtering. The area of the frame-like metallized pattern 208 on the base 12 was larger than the area of the frame-like metallized pattern 206 on the Kovar glass 204. The areas of the metallized patterns 206 and 208 may be the same as the area of the metallized pattern 208 on the base 12 or larger or smaller than the area of the metallized pattern 206 on the kovar glass 204. Further, when a low-melting glass for sealing is used, the formation of these metallized patterns 206 and 208 may be omitted.

Thereafter, as shown in FIG. 12A, the AuSn solder layer 210 is sandwiched between the cap member 16 and the base 12, and then, as shown in FIG. As shown in FIG. 13C, an optical device 200B according to the second example was manufactured. The AuSn solder layer 210 shown in FIG. 12A was pre-formed in a frame shape. The size of the preform was the same as the metallized pattern 206 (see FIG. 11A) on the Kovar glass 204, and the thickness was 50 μm. The load shown in FIG. 12B was 900 g / cm ² , the reflow temperature was 300 ° C. at the maximum, and the temperature was maintained at 280 ° C. or higher for 3 minutes.

At this time, the difference in coefficient of thermal expansion between the base 12 (alumina) and the cap member 16 (Kovar glass 204) is about 15 × 10 ⁻⁷ / ° C., and the crack of the cap member 16 due to the difference in thermal stress does not occur. Therefore, if the difference in the coefficient of thermal expansion between the cap member 16 and the base 12 is 50 × 10 ⁻⁷ / ° C. or less, cracks do not occur.

When the leak check was performed on the optical device 200B according to the second example performed by the above-described sealing method, a favorable sealing result of 10 ⁻⁸ (Pa · m ³ / s) was obtained.

  Next, an example of the optical monitoring device 100 according to the present embodiment shown in FIG. 4 (an optical monitoring device 200C according to a third example) will be described with reference to FIGS.

  The optical monitoring device 200C according to the third embodiment is manufactured by joining the optical branching device 102 shown in FIG. 4 on the optical device according to the second embodiment.

  First, in the optical branching device 102, a 30 μm slit 112 is formed in a 12-channel optical fiber array 110 aligned at an arrangement pitch of 250 μm, and a 25 μm optical branching member 114 (see FIG. 5) is inserted into the slit 112. did. The light branching member 114 has a reflectance of 7%, and the optical path of the branched light 126 is designed so that the branched light (branched light 126) rises perpendicularly to the upper surface of the optical fiber 108.

  The branched light 126 from the optical fiber array 110 is incident on the 12ch PD array 212 of the optical device 200B according to the second embodiment via the bottom 22a (see FIG. 5) of the recess 22 in the cap member 16. , Peak alignment was performed. At this time, the fixing resin 120 is applied to the periphery of the optical branching device 102 and the optical device 200B according to the second embodiment, and between the optical fiber array 110 and the cap member 16 (on the substrate 106 of the optical branching device 102). Refractive index matching material 122 was placed in a space defined by fixed spacers 118, and refractive index matching was performed. Then, as shown in FIG. 15, the 12ch PD array 212 and the optical fiber array 110 were fixed in the aligned state, and the optical monitoring device 200C according to the third example was manufactured.

  A cover (not shown) was attached to the optical monitoring device 200C to produce an inline type optical monitoring device (not shown).

  This optical monitoring device is very excellent in moisture resistance because the 12ch PD chip 212 is hermetically sealed by the cap member 16. In addition, since the glass of the cap member 212 was designed to be as thin as 0.4 mm, a very thin and small optical monitoring device could be manufactured. In addition, since the cap member 16 as the hermetic sealing member of the 12ch PD chip 212 is one component, the cost has been successfully reduced.

  In the optical devices 200A and 200B according to the first and second embodiments described above and the optical monitoring device 200C according to the third embodiment, the cap member 16 having the recess 22 by pressing the Kovar glass 204 is provided. In addition to the above, grinding or wet etching or dry etching may be used. However, when glass is processed by grinding, scars remain, and light is scattered and lost there. However, if press processing is performed, the glass can be processed in a state close to a mirror surface, and loss can be suppressed. Moreover, although the method of making it into a mirror surface by etching etc. is also considered, a process process and an etching process will be needed and a process will increase. On the other hand, if it is press processing, it can process in the state near a mirror surface only by press processing, and it can control an increase in a process. That is, as in this example, by using press working, a flat surface or a lens shape can be easily formed on the bottom 22a of the recess 22, which is advantageous in terms of cost.

Moreover, in the above-mentioned example, the cap member 16 was produced using the Kovar glass 204. However, the cap member 16 has transparency, and if the difference in thermal expansion coefficient from the base 12 is 50 × 10 ⁻⁷ / ° C. or less, Any material is applicable.

  Of course, the optical device and the optical monitoring device according to the present invention are not limited to the above-described embodiments, and various configurations can be adopted without departing from the gist of the present invention.

FIG. 1A is a side view showing a partially broken optical device according to the present embodiment, and FIG. 1B is a top view thereof. It is an expanded sectional view for demonstrating the optical device which concerns on this Embodiment, the optical device which concerns on a 1st Example, and the optical disk which concerns on a 2nd Example. FIG. 3A is a top view showing an optical device according to a modification of the present embodiment, FIG. 3B is a front view showing a partially broken optical device according to the modification of the present embodiment, and FIG. It is a side view which shows the optical device which concerns on the modification of this Embodiment partially fractured | ruptured. It is a side view which shows the optical monitoring device which concerns on this Embodiment partially fractured | ruptured. It is sectional drawing which expands and shows the optical monitoring device which concerns on this Embodiment. FIG. 6A is a top view showing a manufacturing process of the optical device according to the first embodiment, and shows a state where a PD chip is mounted on a base, and FIG. 6B is a side view thereof. 7A is a top view showing a cap member used in the optical device according to the first embodiment, FIG. 7B is a front view thereof, and FIG. 7C is a side view thereof. FIG. 8A shows a manufacturing process of the optical device according to the first embodiment, and is a process diagram showing a state in which an AuSn solder layer and a cap member are placed on a base on which a PD chip is mounted. FIG. It is process drawing which shows the state which applied the load from. FIG. 9A is a side view showing a partially broken optical device according to the first embodiment, and FIG. 9B is a front view thereof. 10A shows a manufacturing process of the optical device according to the second embodiment, and is a top view showing a state in which a 12ch PD chip is mounted on a base, FIG. 10B is a front view thereof, and FIG. 10C is a side view thereof. It is. FIG. 11A is a top view showing a cap member used in the optical device according to the second embodiment, FIG. 11B is a sectional view showing the cap member from the front, and FIG. 11C shows the cap member from the side. FIG. FIG. 12A shows a process of manufacturing an optical device according to the second embodiment, and is a process diagram showing a state in which an AuSn solder layer and a cap member are placed on a base on which a 12ch PD chip is mounted, and FIG. It is process drawing which shows the state which applied the load from. FIG. 13A is a top view showing the optical device according to the second embodiment, FIG. 13B is a front view showing the optical device according to the second embodiment in a partially broken view, and FIG. 13C is the second embodiment. It is a side view which shows a partially broken optical device according to an example. It is process drawing which shows the manufacturing process of the optical monitoring device which concerns on a 3rd Example, and shows the state which has joined the optical branching device on the optical device which concerns on a 2nd Example, aligning. FIG. 10 is a side view showing a partially broken optical monitoring device according to a third embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 10a, 200A, 200B ... Optical device 12 ... Base 14, 24 ... Optical component 16 ... Cap member 22 ... Recess 22a ... Bottom 22b ... Side wall 22c ... Boundary part 100, 200C ... Optical monitoring device 102 ... Optical branching device

Claims (10)

The base,
An optical component mounted on the base and having at least one optical element;
An optical device fixed on the base so as to cover the optical component, and having a single and transparent cap member. The optical device according to claim 1.
The optical device characterized in that a difference in coefficient of thermal expansion between the base and the cap member is 50 × 10 ⁻⁷ / ° C. or less. The optical device according to claim 1 or 2,
An optical device, wherein the cap member is made of glass. The optical device according to any one of claims 1 to 3,
The said cap member is produced by press work, The optical device characterized by the above-mentioned. The optical device according to any one of claims 1 to 4,
The cap member has at least one recess, and is fixed to the base so that the optical component is accommodated in the recess. The optical device according to claim 5.
The depth of the said recessed part is 1.0 mm or less, The optical device characterized by the above-mentioned. The optical device according to claim 5 or 6,
An optical device characterized in that an angle formed between a bottom portion and a side wall of the concave portion is less than 90 °. The optical device according to any one of claims 5 to 7,
An optical device, wherein a boundary portion between a bottom portion and a side wall of the concave portion has a curved shape. The optical device according to claim 1,
The optical component is characterized in that a plurality of optical elements are arranged in an array. One or more light transmission means;
An optical branching unit provided in the optical transmission unit and branching a part of the signal light propagating through the optical transmission unit;
An optical monitoring device having an optical device for receiving the branched light from the optical branching means,
The optical device is:
The base,
An optical component mounted on the base and having at least one light receiving element for receiving the branched light;
An optical monitoring device, which is fixed on the base so as to cover the optical component and has a single and transparent cap member.

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