JPH01140791A - Semiconductor laser device - Google Patents
Semiconductor laser deviceInfo
- Publication number
- JPH01140791A JPH01140791A JP29766087A JP29766087A JPH01140791A JP H01140791 A JPH01140791 A JP H01140791A JP 29766087 A JP29766087 A JP 29766087A JP 29766087 A JP29766087 A JP 29766087A JP H01140791 A JPH01140791 A JP H01140791A
- Authority
- JP
- Japan
- Prior art keywords
- cap
- integrally molded
- coating
- light
- semiconductor laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 12
- 239000011248 coating agent Substances 0.000 claims abstract description 29
- 238000000576 coating method Methods 0.000 claims abstract description 29
- 230000003287 optical effect Effects 0.000 claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000011347 resin Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 6
- 239000011521 glass Substances 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims abstract description 3
- 238000000605 extraction Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Landscapes
- Semiconductor Lasers (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野〕
本発明は、同時成形された半導体レーザー用キャップの
外周部にコーティングを施すことにより、遮光効果と、
耐水性を高めた半導体レーザー用パッケージに関するも
のである。Detailed Description of the Invention (Industrial Application Field) The present invention provides a light shielding effect and
This invention relates to a semiconductor laser package with improved water resistance.
（従来の技術）
従来、半導体レーザー用キャップは第４図に示すように
、金属性キャップ部分５とレーザー光を射出させる窓部
材７を低融点ガラス等の接着材６を用いて接着し、気密
性を得ている。また半導体レーザーは、その構造のため
出射するレーザー光は光の回折により、発射光となり、
そのため光源（発光点）にできる限り近くの場所にレン
ズ等の光学素子を設けることがより効率を高める。また
光学素子は、形状が複雑なものも多く、金属性キャップ
部との貼り付は精度を考慮すると金属性キャップ部、光
学素子をとりつけたキャップの製造歩留りは低くなる。(Prior art) Conventionally, as shown in FIG. 4, a cap for a semiconductor laser is made by bonding a metal cap portion 5 and a window member 7 for emitting laser light using an adhesive 6 such as low-melting point glass to create an airtight seal. gaining sex. Also, due to the structure of semiconductor lasers, the emitted laser light becomes emitted light due to light diffraction.
Therefore, it is more efficient to provide an optical element such as a lens as close as possible to the light source (light emitting point). In addition, many optical elements have complicated shapes, and considering the precision of attachment to the metal cap, the manufacturing yield of the metal cap and the cap to which the optical element is attached will be low.
そこで、キャップ部分と光学素子部分を一体同時成形し
、高精度、高歩留りを達成する方法が、とられている。Therefore, a method has been adopted in which the cap portion and the optical element portion are integrally molded at the same time to achieve high precision and high yield.
しかしながら、上記従来例では、レーザー出射部である
光学素子部分とキャップ部分とは、同一材質であり、樹
脂であるため次めような欠点があった。（１）材質が樹
脂であるため、金属性キャップと比較した場合吸湿が多
く、気密性が低下し、信頼性が下がる。（２）キャップ
部分も、レーザー出射部と同じ透明材質のため、キャッ
プ内部散乱光が、外部に出射し、ノイズとなる。However, in the above-mentioned conventional example, the optical element portion, which is the laser emitting portion, and the cap portion are made of the same material, which is resin, and therefore have the following drawbacks. (1) Since the material is resin, it absorbs more moisture than a metal cap, resulting in lower airtightness and lower reliability. (2) Since the cap part is also made of the same transparent material as the laser emitting part, light scattered inside the cap is emitted to the outside and becomes noise.
本発明は上記の問題点を解決すべくなされたもので、一
体成形キャップに耐水コートと遮光コートを施した、よ
り信頼性の高い半導体レーザー用パッケージを提供する
ことを目的とする。The present invention was made to solve the above problems, and an object of the present invention is to provide a more reliable semiconductor laser package in which an integrally molded cap is coated with a water-resistant coat and a light-shielding coat.
本発明は半導体レーザーの気密封止用キャップ部分とレ
ーザー出射光取り出し窓部材を、光学特性を満足する透
明樹脂またはガラスにより一体成形したキャップに、耐
水性コーティングおよび／または遮光性コーティングを
施したことを特徴とする半導体レーザー用パッケージで
ある。The present invention provides a cap in which a cap portion for airtight sealing of a semiconductor laser and a window member for extracting laser emitted light are integrally molded from transparent resin or glass that satisfies optical properties, and a water-resistant coating and/or a light-shielding coating is applied to the cap. This is a semiconductor laser package featuring:
本発明によれば、キャップと光学素子一体成形されたキ
ャップのレーザー出射部分である光学素子部分をのぞく
部分に、耐水コーティングと、光を遮光するコーティン
グを設けることにより、キャップ内部への水の侵入を阻
止し、信４頼性を高め、またレーザー出射部分以外を遮
光することにより、キャップ内部散乱光が外部に出射す
ることを防ぐものである。According to the present invention, a water-resistant coating and a light-shielding coating are provided on the portion of the cap that is integrally molded with the optical element, which is the laser emitting portion, except for the optical element portion, which prevents water from entering the inside of the cap. This prevents light scattered inside the cap from being emitted to the outside by blocking light from areas other than the laser emitting part.
以下に本発明を実施例によって説明する。 The present invention will be explained below by way of examples.
第１図は本発明の特徴を最もよく表わす耐水、遮光コー
トを施した一体成形キャップの断面図であり、１は一体
成形キャップの光学素子部分、２は遮光コート、３は耐
水コート、４は一体成形キャップのキャップ部分である
。まず、一体成形されたキャップの光学素子部分１を除
く外周部すべてに耐水コート３をほどこし、その後にキ
ャップ内部での散乱光が外に出射しないように十分な厚
みもしくは吸収率をもつ遮光コート２をほどこす。この
ようにして、従来の樹脂一体成形キャップと比較すれば
、水の侵入を防ぎ、また散乱光の出射のない、信頼性の
高い一体成形キャップが得られる。FIG. 1 is a cross-sectional view of an integrally molded cap with a water-resistant and light-shielding coating that best represents the features of the present invention. 1 is an optical element portion of the integrally-molded cap, 2 is a light-shielding coat, 3 is a water-resistant coat, and 4 is a This is the cap part of the integrally molded cap. First, a water-resistant coat 3 is applied to the entire outer periphery of the integrally molded cap except for the optical element part 1, and then a light-shielding coat 2 is applied with sufficient thickness or absorption rate to prevent the scattered light inside the cap from exiting. Apply. In this way, compared to conventional resin integrally molded caps, a highly reliable integrally molded cap that prevents water from entering and does not emit scattered light can be obtained.
第１図においては、光学素子部分として球レンズを示し
たが、一体成形キャップにおいて光学素子部分は他の非
球面レンズ、プリズム、凹凸レンズなどであってもよい
ことは、もちろんである。In FIG. 1, a spherical lens is shown as the optical element portion, but it goes without saying that the optical element portion of the integrally molded cap may be another aspherical lens, a prism, a convex-convex lens, or the like.
第２図は他の実施例による内外全面を耐水コートした一
体成形キャップの断面図を示す。図において、１は、一
体成形キャップの光学素子部分、２は遮光コート、３は
耐水コート、４は一体成形キャップのキャップ部分であ
る。本実施例においては、一体成形キャップの内、外周
すべてに、耐水コート３をほどこし、その後に、一体成
形キャップ外周の光学素子部分１を除く場所すべてに、
遮光コートを行ったものである。本実施例の特色として
、内、外周全周に、耐水コートを行うことで水の侵入が
完全になくなり、より信頼性は高くなり、また、すべて
にコートすることによりマスキングが不用となり、パッ
ケージ製造工数は大巾に低減し、コストダウンがはかれ
るものである。FIG. 2 shows a cross-sectional view of another embodiment of an integrally molded cap whose entire inner and outer surfaces are coated with waterproof coating. In the figure, 1 is an optical element portion of the integrally molded cap, 2 is a light shielding coat, 3 is a water resistant coat, and 4 is a cap portion of the integrally molded cap. In this embodiment, a water-resistant coating 3 is applied to the entire inner and outer periphery of the integrally molded cap, and then to all areas on the outer periphery of the integrally molded cap except for the optical element portion 1.
It has a light-shielding coating. The feature of this example is that by applying a waterproof coating to the entire inner and outer periphery, water intrusion is completely eliminated and reliability is increased.Also, by coating everything, masking is not required, and package manufacturing The number of man-hours is greatly reduced and costs can be reduced.
第３図には、さらに他の実施例として遮光コートのみを
施した一体成形キャップの断面図を示す。１は一体成形
キャップの光学素子部分、２は遮光コート、４は一体成
形キャップのキャップ部分である。本実施例においては
、一体成形キャップの光学素子部分以外の外周に、遮光
コート２を十分厚く、また、一体成形キャップを構成す
る材質と極めてよく接着するようにコートすることによ
り、簡易的に耐水コートと、遮光コートの２つの効果を
同時に果すことが可能となり、上記のように、１回のコ
ートのみで完成すれば、パッケージ製造のための工数の
低下、ひいては、コストダウンが可能となる。FIG. 3 shows a sectional view of an integrally molded cap provided with only a light-shielding coat as yet another embodiment. 1 is an optical element portion of the integrally molded cap, 2 is a light shielding coat, and 4 is a cap portion of the integrally molded cap. In this example, the light-shielding coat 2 is coated on the outer periphery of the integrally molded cap except for the optical element part, so that it is sufficiently thick and adheres extremely well to the material that constitutes the integrally molded cap, thereby easily making it waterproof. It is possible to achieve the two effects of a coating and a light shielding coating at the same time, and as mentioned above, if the coating is completed with only one coating, it is possible to reduce the number of man-hours for package manufacturing and, by extension, to reduce costs.
以上説明したように、一体成形キャップに耐水コートと
遮光コートを行うことにより、より信頼性の高い一体成
形キャップが低コストで製造できる。As explained above, by applying a waterproof coating and a light shielding coat to an integrally molded cap, a more reliable integrally molded cap can be manufactured at low cost.
第１図は本発明の耐水、遮光コートをほどこした一体成
形キャップの断面図、第２図は本発明の内外周全面を耐
水コートした一体成形キャップの断面図、第３図は本発
明の遮光コートのみをほどこした一体成形キャップの断
面図、第４図は従来の半導体レーザー用キャップの断面
図である。
１は一体成形キャップの光学素子部分、２は遮光コート
、
３は耐水コート、
４は一体成形キャップのキャップ部分、５は金属キャッ
プ、
６は接着材、
７は窓部材。
特許出願人 キャノン株式会社Fig. 1 is a sectional view of an integrally molded cap of the present invention coated with a water-resistant and light-shielding coating, Fig. 2 is a sectional view of an integrally-molded cap of the present invention whose entire inner and outer peripheries are coated with a water-resistant coating, and Fig. 3 is a sectional view of an integrally molded cap of the present invention coated with a water-resistant and light-shielding coat. FIG. 4 is a sectional view of an integrally molded cap with only a coating applied, and FIG. 4 is a sectional view of a conventional semiconductor laser cap. 1 is an optical element portion of an integrally molded cap, 2 is a light shielding coat, 3 is a water resistant coat, 4 is a cap portion of an integrally molded cap, 5 is a metal cap, 6 is an adhesive, and 7 is a window member. Patent applicant Canon Co., Ltd.
Claims (3)
ザー出射光取り出し窓部材を、光学特性を満足する透明
樹脂またはガラスにより一体成形したキャップに、耐水
性コーティングおよび／または遮光性コーティングを施
したことを特徴とする半導体レーザー用パッケージ。(1) Water-resistant coating and/or light-shielding coating is applied to the cap, which is made of a transparent resin or glass that satisfies optical properties and is integrally formed with the semiconductor laser's airtight sealing cap part and the laser output light extraction window member. A semiconductor laser package featuring:
グが、レーザー出射部分以外のキャップ部分に施される
特許請求の範囲第１項記載の半導体レーザー用パッケー
ジ。(2) The semiconductor laser package according to claim 1, wherein the water-resistant coating or the light-shielding coating is applied to a cap portion other than the laser emitting portion.
レーザー出射部分を含む内外全面部分に施される特許請
求の範囲第１項記載の半導体レーザー用パッケージ。(3) The semiconductor laser package according to claim 1, wherein the water-resistant coating is applied to the entire inner and outer surfaces of the integrally molded cap, including the laser emitting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29766087A JPH01140791A (en) | 1987-11-27 | 1987-11-27 | Semiconductor laser device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29766087A JPH01140791A (en) | 1987-11-27 | 1987-11-27 | Semiconductor laser device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140791A true JPH01140791A (en) | 1989-06-01 |
Family
ID=17849472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29766087A Pending JPH01140791A (en) | 1987-11-27 | 1987-11-27 | Semiconductor laser device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140791A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09205251A (en) * | 1995-12-29 | 1997-08-05 | Ind Technol Res Inst | Plastic molding apparatus for semiconductor laser |
| US6792178B1 (en) | 2000-01-12 | 2004-09-14 | Finisar Corporation | Fiber optic header with integrated power monitor |
| US6932522B2 (en) | 1998-12-30 | 2005-08-23 | Finisar Corporation | Method and apparatus for hermetically sealing photonic devices |
| JP2006267154A (en) * | 2005-03-22 | 2006-10-05 | Ngk Insulators Ltd | Optical device and device for optical monitoring |
| JP2007027471A (en) * | 2005-07-19 | 2007-02-01 | Fuji Xerox Co Ltd | Semiconductor laser device and light transmitting device using the same |
| CN102213803A (en) * | 2010-04-09 | 2011-10-12 | 三菱电机株式会社 | Optical semiconductor device module |
-
1987
- 1987-11-27 JP JP29766087A patent/JPH01140791A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09205251A (en) * | 1995-12-29 | 1997-08-05 | Ind Technol Res Inst | Plastic molding apparatus for semiconductor laser |
| US6932522B2 (en) | 1998-12-30 | 2005-08-23 | Finisar Corporation | Method and apparatus for hermetically sealing photonic devices |
| US6792178B1 (en) | 2000-01-12 | 2004-09-14 | Finisar Corporation | Fiber optic header with integrated power monitor |
| JP2006267154A (en) * | 2005-03-22 | 2006-10-05 | Ngk Insulators Ltd | Optical device and device for optical monitoring |
| JP2007027471A (en) * | 2005-07-19 | 2007-02-01 | Fuji Xerox Co Ltd | Semiconductor laser device and light transmitting device using the same |
| CN102213803A (en) * | 2010-04-09 | 2011-10-12 | 三菱电机株式会社 | Optical semiconductor device module |
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