JPS63308973A - Manufacture of optical reflection type sensor - Google Patents
Manufacture of optical reflection type sensorInfo
- Publication number
- JPS63308973A JPS63308973A JP62146587A JP14658787A JPS63308973A JP S63308973 A JPS63308973 A JP S63308973A JP 62146587 A JP62146587 A JP 62146587A JP 14658787 A JP14658787 A JP 14658787A JP S63308973 A JPS63308973 A JP S63308973A
- Authority
- JP
- Japan
- Prior art keywords
- light
- receiving
- resin
- emitting
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 230000003287 optical effect Effects 0.000 title 1
- 239000011347 resin Substances 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000008188 pellet Substances 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は光反射型センサーの製造方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a method for manufacturing a light reflective sensor.
光反射型センサーとは、第７図に示す様に対象物６４の
表面反射率が高い場合には発光素子６］から発せられた
光が対象物６４で反射され、その反射光を受光素子６２
で受けて信号が伝わるが、対象物６４の表面反射率が低
い場合には発光素子６１からの光が受光素子６２に到達
せず信号が伝わらない装置である。As shown in FIG. 7, a light reflection type sensor is a sensor in which, when the surface reflectance of an object 64 is high, light emitted from a light emitting element 6 is reflected by the object 64, and the reflected light is transmitted to a light receiving element 62.
However, if the surface reflectance of the object 64 is low, the light from the light emitting element 61 will not reach the light receiving element 62 and the signal will not be transmitted.
さらに具体的に説明すると、光反射型センサーは第８図
に示す様に、対象物７４には表面反射率の高い明部７５
と表面反射率の低い暗部７６とがあり、かつ対象物が矢
印Ａの向−きに動いた場合には、その動きに対応して、
第８図の下部に示す様な信号が伝わる装置である。第８
図のレベル■は信号が伝わるオン状態、レベル■は信号
が伝わらないオフ状態を示す。More specifically, as shown in FIG.
and a dark area 76 with low surface reflectance, and when the object moves in the direction of arrow A, corresponding to the movement,
This is a device through which signals such as those shown in the lower part of FIG. 8 are transmitted. 8th
In the figure, level ■ indicates an on state in which a signal is transmitted, and level ■ indicates an off state in which a signal is not transmitted.
このような光反射型センサーの従来のものとして、第７
図に示すように別々に樹脂成形されノご発光素子６１と
受光素子６２とを外装ケース６３に組み込んだ構造のも
の、あるいは発光素子と受光素子ともさらにトランスフ
ァーモールドにより２重に樹脂成形した構造のもの等が
ある。すなわち、発光素子ペレットを樹脂成形パッケー
ジ内に有する発光素子６１と受光素子ペレッ１へを樹脂
成形パッケージ内に有する受光素子６２とを各々別に絹
み立て、さらに発光素子から発せられた光が対象物６４
に反射後受光素子に到達する様に１組の発光素子と受光
素子と外装ケース６３に組み込んで構成したもの、ある
いは発光素子と受光素子とをさらにトランスファーモー
ルドにより２重にモールドして所望の位置に固定したも
のである。As a conventional type of light reflection sensor, the 7th
As shown in the figure, the light-emitting element 61 and the light-receiving element 62 are molded separately in resin and are assembled into an exterior case 63, or the light-emitting element and the light-receiving element are further molded in double resin by transfer molding. There are things etc. That is, a light-emitting element 61 having a light-emitting element pellet in a resin-molded package and a light-receiving element 62 having a light-receiving element pellet 1 in a resin-molded package are separately assembled, and the light emitted from the light-emitting element is transmitted to the target object. 64
A combination of a light emitting element, a light receiving element, and an exterior case 63 are assembled so that the light reaches the light receiving element after being reflected, or the light emitting element and the light receiving element are further molded in a double layer using a transfer mold and positioned at a desired position. It is fixed at .
従来の光反射型センサーは前述の様に別々に樹脂封入さ
れた発光素子と、受光素子とをケース等に組む込む構造
であったので、その製造にはまず発光素子ペレットと受
光素子ペレットとを別々にマウント、ワイヤボンディン
グしさらに樹脂封入して、全く別個の発光素子と受光素
子とを作り、次に、外装ケース等に発光素子と受光素子
とを組み込んで光反射型センサーを作らねばならながっ
た。従って、従来の構造の光反射型センサーはコストが
高くなるという欠点を有していた。すなわち、全く別々
に組み立てた発光素子と受光素子とを用いる為に発光素
子１個分のコスト及び受光受光素子１個分のコストを要
し、さらに画素子を発光素子からの光が対象物に反射後
受光素子に到達する様に配置する為に、ケース等に組み
込む費用を要していた。従来の光反射型センサーでは、
発光素子、受光素子と１組として用いるにもかかわらず
、発光素子、受光素子の組み立てを全く別々に行なうの
で製造コスト上には１組として用いる利点が全く反映さ
れない製造方法となっていた。As mentioned above, conventional light reflective sensors have a structure in which a light emitting element and a light receiving element are separately encapsulated in resin and assembled into a case, etc., so to manufacture them, first, a light emitting element pellet and a light receiving element pellet are assembled. It is necessary to create a completely separate light-emitting element and light-receiving element by mounting them separately, wire-bonding them, and enclosing them in resin, and then assemble the light-emitting element and light-receiving element in an exterior case or the like to create a light reflection type sensor. I got angry. Therefore, the light reflection type sensor having the conventional structure has the disadvantage of high cost. In other words, since the light emitting element and the light receiving element are assembled completely separately, the cost of one light emitting element and the cost of one light receiving and receiving element are required. In order to arrange the light so that it reaches the light-receiving element after reflection, it requires the expense of assembling it into a case or the like. With conventional light reflective sensors,
Although the light-emitting element and the light-receiving element are used as a set, the light-emitting element and the light-receiving element are assembled completely separately, resulting in a manufacturing method in which the advantage of using the light-emitting element and the light-receiving element as a set is not reflected at all in terms of manufacturing cost.
本発明の目的は、従来の欠点を除去し、製造コストの安
い光反射型センサーの製造方法を提供することである。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a light reflective sensor that eliminates the conventional drawbacks and is inexpensive to manufacture.
本発明は、発光素子と受光素子とをリードフレーム」二
にマウントし、さらにワイヤボンディングを行なう工程
と、発光素子を含む発光部と受光素子を含む受光部とを
並設する如く結合する連結部を介して発光部と受光部と
を透明な樹脂で１体成形する工程と、成形された樹脂表
面を黒色等の光不透過膜で塗装する工程と、対象物に向
って光を放射する発光面と対象物によって反射された光
を受ける受光面との部分の光不透過膜を削り収る工程と
を有することを特徴とする。The present invention includes a process of mounting a light emitting element and a light receiving element on a lead frame and further performing wire bonding, and a connecting part that connects a light emitting part including a light emitting element and a light receiving part including a light receiving element so as to be arranged side by side. The process of molding the light emitting part and the light receiving part as one piece with transparent resin through the process, the process of painting the molded resin surface with a light-opaque film such as black, and the process of emitting light toward the target object. It is characterized by comprising the step of cutting off the light-opaque film in the area between the surface and the light-receiving surface that receives the light reflected by the object.
次に、図面を参照して本発明の詳細な説明する。 Next, the present invention will be described in detail with reference to the drawings.
第］−図から第５図は、本発明による光反射型センサー
の製造工程を示す図である。まず、第１図に示す様にリ
ードフレーム１１に発光素子ペレット１２と受光素子ペ
レッ１−１．３とを各々１個おきにマウントする。最近
は］一台のマウンターで２種以上のペレットを同一フレ
ームにマウントできるので異種のペレットを同一フレー
ムにマウントすることで全く不具合は発生しない。次に
ボンディングワイヤ１４のボンディングを行なうが、同
一フレーム上の異種のペレットに１台のボンダーでワイ
ヤボンディングを行なうことは容易に可能である。次に
第２図に示すように透明な樹脂によって発光部２］、受
光部２２および連結部２３を１体に樹脂成形する。次に
、第３図のように樹脂成形部の樹脂表面に黒色等の光不
透過膜３１を塗装する。これは例えば液状の黒色樹脂に
樹脂成形部を浸漬して乾燥あるいは加熱して塗装する方
法または、液状樹脂をスプレ一式で樹脂形成部に噴霧す
る方法等を用いる。次に、第４図に示すように光不透過
膜３１を発光面４１及び受光面４２に限って取り去る。Figures 5 to 5 are diagrams showing the manufacturing process of the light reflection type sensor according to the present invention. First, as shown in FIG. 1, every other light emitting element pellet 12 and every other light receiving element pellet 1-1.3 are mounted on a lead frame 11. Nowadays] one mounter can mount two or more types of pellets on the same frame, so there is no problem at all when mounting different types of pellets on the same frame. Next, bonding with the bonding wire 14 is performed, but it is easily possible to perform wire bonding to different types of pellets on the same frame using a single bonder. Next, as shown in FIG. 2, the light emitting section 2], the light receiving section 22, and the connecting section 23 are molded into one body using a transparent resin. Next, as shown in FIG. 3, a light-impermeable film 31 of black or the like is coated on the resin surface of the resin molded part. This can be done, for example, by immersing the resin molded part in a liquid black resin and drying or heating it before painting, or by spraying the resin molded part with a spray set of liquid resin. Next, as shown in FIG. 4, the light-opaque film 31 is removed only from the light-emitting surface 41 and the light-receiving surface 42.
この作業は通常の紙やすり等で簡単に行なうことができ
る。第５図はこのようにして１体樹脂成形された光反射
型センサーの完成斜視図である。This work can be easily done using ordinary sandpaper. FIG. 5 is a completed perspective view of the light reflection type sensor molded as a single piece of resin in this manner.
以上は縦形の光反射型センサーで説明したが、第６図に
示す様な平形の光反射型センサーも本発明による製造方
法で作ることが可能である。Although the above description has been made using a vertical light reflection type sensor, a flat light reflection type sensor as shown in FIG. 6 can also be manufactured by the manufacturing method according to the present invention.
以上説明した様に本発明は、対象物を経由しない光伝達
を防止する処置を行った上で１体樹脂成形する方法を取
るので光反射型センサーの大巾なコストダウンができる
。すなわち、従来は発光素子単体を組み立てる費用、受
光素子単体を組み立てる費用及び画素子を所望の位置に
固定する為にケース等に固定する費用等を要したが、本
発明によると発光部、受光部を１体樹脂成形するので、
材料費を別とすれば従来の素子単体を１個組み立る費用
とほぼ同額であるので大巾なコストダウンが見込めるの
である。As explained above, the present invention takes steps to prevent light transmission that does not go through the target object, and then molds the sensor in one piece with resin, so that it is possible to significantly reduce the cost of the light reflection type sensor. That is, in the past, costs were required to assemble a light emitting element alone, a cost to assemble a light receiving element alone, and a cost to fix the pixel element to a case or the like in order to fix it in a desired position, but according to the present invention, the light emitting part, the light receiving part Since it is molded in resin as a single unit,
Excluding the material cost, the cost is almost the same as the cost of assembling a single conventional element, so a significant cost reduction can be expected.
第１図から第４図は、本発明による製造方法の一実施例
を示す工程説明図、第５図は本発明の光反射型センサー
の完成斜視（Ｉ２１、第６図は本発明の別の構造を示す
光反射型センサーの完成斜視図、第７図は従来の光反射
型センサーの概略構造を示す図、第８図は対象物が移動
した場合その明部と暗部に対応した信号が伝わることを
示す図である。
１１・・・リードフレーム、１２・・・発光素子ペレッ
ト、１．３・・・受光素子ベレッｌ〜、１４・・・ボン
ディングワイヤ、１５．１６，５６．５７・・・リード
、２１．５１・・・発光部、２２．５２・・受光部、２
３゜５３・・・連結部、３１．５８・・・光不透明膜、
４〕。
５４・・・発光面、４．２．５５・・受光面。
代理人 弁理士 内 原 苛（・
第１図 ７７ ’ｌ−１’几−ム
第ｚ図
第５区
１−−１４月帖
第７図1 to 4 are process explanatory diagrams showing one embodiment of the manufacturing method according to the present invention, and FIG. A completed perspective view of a light reflection type sensor showing the structure. Figure 7 is a diagram showing the schematic structure of a conventional light reflection type sensor. Figure 8 shows that when an object moves, signals corresponding to the bright and dark areas are transmitted. 11... Lead frame, 12... Light emitting element pellet, 1.3... Light receiving element pellet ~, 14... Bonding wire, 15.16, 56.57...・Lead, 21.51... Light emitting part, 22.52... Light receiving part, 2
3゜53... Connecting part, 31.58... Light opaque film,
4]. 54... Light emitting surface, 4.2.55... Light receiving surface. Agent: Patent Attorney Isamu Uchihara (Fig.
Claims (1)
光素子を含む受光部と発光素子を含む発光部とを連結部
を介して１体樹脂成形する工程と、成形された樹脂表面
の少なくとも１部に光不透過膜を塗装する工程と、該塗
装した光不透過膜の表面のうち発光部の発光面と受光部
の受光面との光不透過膜を取り去る工程とを含むことを
特徴とする光反射型センサーの製造方法。a step of attaching a light receiving element and a light emitting element to a lead; a step of resin molding a light receiving part including a light receiving element and a light emitting part including a light emitting element through a connecting part; and a step of molding at least a part of the molded resin surface. A light source comprising the steps of: coating a light-impermeable film; and removing the light-impermeable film from a light-emitting surface of a light-emitting section and a light-receiving surface of a light-receiving section among the surfaces of the coated light-impermeable film. Method of manufacturing reflective sensors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62146587A JPS63308973A (en) | 1987-06-11 | 1987-06-11 | Manufacture of optical reflection type sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62146587A JPS63308973A (en) | 1987-06-11 | 1987-06-11 | Manufacture of optical reflection type sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63308973A true JPS63308973A (en) | 1988-12-16 |
Family
ID=15411084
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62146587A Pending JPS63308973A (en) | 1987-06-11 | 1987-06-11 | Manufacture of optical reflection type sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63308973A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010529434A (en) * | 2007-06-01 | 2010-08-26 | フェアチャイルド・セミコンダクター・コーポレーション | Method for reducing crosstalk of optical sensor |
| GB2490386A (en) * | 2011-04-30 | 2012-10-31 | Avago Tech Ecbu Ip Sg Pte Ltd | Optical proximity sensor with attenuating layers to reduce crosstalk |
| US8420999B2 (en) | 2009-05-08 | 2013-04-16 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Metal shield and housing for optical proximity sensor with increased resistance to mechanical deformation |
| US8716665B2 (en) | 2009-09-10 | 2014-05-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Compact optical proximity sensor with ball grid array and windowed substrate |
| US8779361B2 (en) | 2009-06-30 | 2014-07-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components |
| US8957380B2 (en) | 2009-06-30 | 2015-02-17 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared attenuating or blocking layer in optical proximity sensor |
| US9525093B2 (en) | 2009-06-30 | 2016-12-20 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared attenuating or blocking layer in optical proximity sensor |
| US9733357B2 (en) | 2009-11-23 | 2017-08-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared proximity sensor package with improved crosstalk isolation |
| DE102014109230B4 (en) * | 2013-07-02 | 2019-10-31 | Avago Technologies International Sales Pte. Limited | Optical proximity sensor and method of making an optical proximity sensor |
-
1987
- 1987-06-11 JP JP62146587A patent/JPS63308973A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010529434A (en) * | 2007-06-01 | 2010-08-26 | フェアチャイルド・セミコンダクター・コーポレーション | Method for reducing crosstalk of optical sensor |
| JP2013175773A (en) * | 2007-06-01 | 2013-09-05 | Fairchild Semiconductor Corp | Optical sensor and method of optically detecting object |
| US8420999B2 (en) | 2009-05-08 | 2013-04-16 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Metal shield and housing for optical proximity sensor with increased resistance to mechanical deformation |
| US8779361B2 (en) | 2009-06-30 | 2014-07-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components |
| US8957380B2 (en) | 2009-06-30 | 2015-02-17 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared attenuating or blocking layer in optical proximity sensor |
| US9525093B2 (en) | 2009-06-30 | 2016-12-20 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared attenuating or blocking layer in optical proximity sensor |
| US8716665B2 (en) | 2009-09-10 | 2014-05-06 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Compact optical proximity sensor with ball grid array and windowed substrate |
| US9733357B2 (en) | 2009-11-23 | 2017-08-15 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Infrared proximity sensor package with improved crosstalk isolation |
| GB2490386A (en) * | 2011-04-30 | 2012-10-31 | Avago Tech Ecbu Ip Sg Pte Ltd | Optical proximity sensor with attenuating layers to reduce crosstalk |
| DE102014109230B4 (en) * | 2013-07-02 | 2019-10-31 | Avago Technologies International Sales Pte. Limited | Optical proximity sensor and method of making an optical proximity sensor |
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