CN117613056A - Image sensing module, display module and electronic equipment - Google Patents

Abstract

The application relates to an image sensing module, display module and electronic equipment, this image sensing module includes: a sensing chip having a first surface; the cover plate is arranged on one side of the first surface of the sensing chip; a package having an opening and a cavity in communication with the opening; the sensing chip and the cover plate are packaged in the cavity, and the cover plate is arranged closer to the opening than the sensing chip; and a buffer structure connecting the cover plate and the package. The technical scheme of the application can improve the reliability of the packaging structure.

Description

Image sensing module, display module and electronic equipment

Technical Field

The present disclosure relates to chip packaging technology, and more particularly to an image sensor module, a display module, and an electronic device.

Background

In the production and test process of the image sensing module, the reliability of the packaging structure in the image sensing module is low.

Disclosure of Invention

Based on the above, an image sensing module, a display module and an electronic device are provided to improve the reliability of the package structure.

According to a first aspect of the present application, there is provided an image sensor module, including:

a sensing chip having a first surface;

the cover plate is arranged on one side of the first surface of the sensing chip;

a package having an opening and a cavity in communication with the opening; the sensing chip and the cover plate are packaged in the cavity, and the cover plate is arranged closer to the opening than the sensing chip; and

and the buffer structure is connected with the cover plate and the packaging body.

In some of these embodiments, the cushioning structure is disposed around the cover plate.

In some of these embodiments, the circumferentially disposed surface of the cover plate is at least partially connected to the cushioning structure.

In some embodiments, the front projection of the structure formed by the cover plate and the buffer structure on the reference surface and the front projection of the opening on the reference surface coincide with each other;

the reference surface and the first surface are parallel to each other.

In some embodiments, a distance from one side surface of the cover plate, which is far away from the sensing chip, to the reference surface is defined as a first distance, a distance from one side surface of the buffer structure, which is far away from the sensing chip, to the reference surface is defined as a second distance, and a distance from a plane where the opening is located to the reference surface is defined as a third distance; the reference surface and the first surface are parallel to each other;

wherein the first distance, the second distance, and the third distance are equal to each other; or alternatively

At least two of the first distance, the second distance, and the third distance are unequal.

In some embodiments, the image sensor module further includes an adhesive layer; the bonding layer is arranged on the first surface of the sensing chip and is used for connecting the cover plate and the sensing chip;

wherein the bonding layer is connected with the inner wall of the cavity.

In some of these embodiments, the sense die has a sense region and an edge region disposed around the sense region;

the orthographic projection of the adhesive layer on the first surface is positioned in the edge region and disposed around the sensing region.

In some of these embodiments, the adhesive layer is configured as a light shielding material.

In some of these embodiments, a side surface of the cushioning structure facing away from the opening is attached to the adhesive layer; and/or

One side surface of the buffer structure, which is away from the opening, is connected with the inner wall of the cavity.

In some of these embodiments, the buffer structure is configured as a light shielding material.

In some of these embodiments, the cushioning structure is configured as an elastic material.

In some of these embodiments, the package is configured as a light shielding material.

According to a second aspect of the present application, a display module is provided, including an image sensor module as in any one of the previous embodiments.

According to a third aspect of the present application, an electronic device is provided, comprising a display module as in any one of the previous embodiments.

In the above-mentioned image sensing module, display module and electronic equipment, this image sensing module includes sense chip, apron and encapsulation body at least, sense chip and apron encapsulation are in the cavity of encapsulation body, through setting up buffer structure between apron and encapsulation body, so, when image sensing module receives great difference in temperature, absorb the tensile stress that produces owing to thermal expansion degree difference is great between apron and the encapsulation body through buffer structure to reducible apron and encapsulation body between produce the circumstances of peeling off, improve packaging structure's reliability.

Drawings

FIG. 1 is a schematic cross-sectional view of an image sensor module according to an embodiment of the related art.

FIG. 2a is a schematic diagram illustrating a structural change of the image sensor module in FIG. 1 under a low temperature condition.

FIG. 2b is a schematic diagram illustrating a structural change of the image sensor module of FIG. 1 under a high temperature condition.

Fig. 2c is a schematic diagram of a portion of the structure in fig. 2 a.

Fig. 3 is a schematic cross-sectional view of an image sensor module according to an embodiment of the disclosure.

Fig. 4 is a schematic view of a part of the structure in fig. 3.

Fig. 5 is a partial schematic structure of fig. 1.

Fig. 6 is a schematic view of a portion of the structure in fig. 3.

Fig. 7 is a schematic cross-sectional view of an image sensor module according to another embodiment of the disclosure.

Reference numerals illustrate:

an image sensor module 100;

a substrate 110, a sensing chip 120, an adhesive layer 130, a glass plate 140, a sealing structure 150, and a bonding location M;

an image sensor module 10;

the sensing chip 11, the first surface 11a, the sensing region r1 and the edge region r2;

a cover plate 12;

a package 13, an opening 13a, and a cavity 13b;

a buffer structure 14, a second surface 14a;

a substrate 15, a mounting surface 15a;

an adhesive layer 16;

a first pad 17;

a second pad 18;

a connecting wire L, a first part L1 and a second part L2;

a conducting member Q;

a glue layer E;

a first direction F1;

tensile stress P;

and (5) light rays S.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.

In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., these terms refer to the orientation or positional relationship based on the drawings, which are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In this application, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

Referring to fig. 1, in an embodiment of the related art, an image sensing module 100 includes a substrate 110, a sensing chip 120, a glue layer 130 and a glass plate 140; the sensing chip 120 is disposed on the substrate 110, and the glass plate 140 is adhered to the sensing chip 120 through the adhesive layer 130, so as to obtain a structure to be packaged. The sealing structure 150 is generally manufactured by an injection molding process, after the injection molding process is finished, the temperature of the image sensing module 100 needs to be returned to room temperature, and then the temperature of the image sensing module 100 needs to be reduced from 170 ℃ to 25 ℃, and a baking process is needed to cure the sealing structure 150, wherein the temperature of the image sensing module 100 needs to be increased from 25 ℃ to 170 ℃. In addition, during the reliability test of the packaged image sensor module 100, the image sensor module 100 undergoes a temperature cycle test, for example, 1000 cycles in the temperature range of-55 ℃ to 125 ℃.

Referring to fig. 2a and 2b, the inventor has found that, during the above process, the image sensing module 100 repeatedly experiences a high temperature to low temperature situation, and due to the mismatch of the thermal expansion coefficients of the materials in the image sensing module 100, the difference in material expansion and contraction causes the image sensing module 100 to generate opposite warping phenomena at low temperature and high temperature, wherein the glass plate 140, the adhesive layer 130 and the sealing structure 150 generate tensile stress at some abnormal interface positions, and the tensile stress causes the glass plate 140, the adhesive layer 130 and the sealing structure 150 to be more prone to peeling phenomena at some abnormal interfaces, as shown in fig. 2 c.

Referring to table 1 below, table 1 shows the coefficients of thermal expansion of the materials at different temperatures. At temperatures less than 148 ℃, the first coefficient of thermal expansion of the seal 150 is 9ppm/°c, meaning that the volume of the seal 150 increases by 9 parts per million for each 1 ℃ increase in temperature; at temperatures greater than 148 ℃, the second coefficient of thermal expansion of the seal 150 is 39ppm/°c, meaning that the volume of the seal 150 increases by 39 parts per million for every 1 ℃ increase in temperature. At a temperature of less than 230 ℃, the first coefficient of thermal expansion of the substrate 110 in the XY axis direction (planar direction) is 14ppm/°c, and the first coefficient of thermal expansion in the Z axis direction (height direction) is 30ppm/°c; at a temperature greater than 230 ℃, the first coefficient of thermal expansion of the substrate 110 in the XY axis direction is 35ppm/°c, and the first coefficient of thermal expansion in the Z axis direction is 80ppm/°c.

TABLE 1

The sense die 120 is fabricated from a semiconductor material that has a constant coefficient of thermal expansion, i.e., 2.8ppm/°c. Further, at a temperature of less than 557 ℃, the first coefficient of thermal expansion of the glass sheet 140 is 7.2ppm/°c. Since the maximum temperature does not exceed 170 c during the above process, it is known that the difference in thermal expansion coefficients between materials is large in combination with the data shown in table 1, and particularly, the bonding position M between the glass plate 140 and the sealing structure 150 may cause the mismatch in thermal expansion coefficients between the glass plate 140 and the sealing structure 150 due to temperature change, so that a peeling phenomenon occurs, as shown in fig. 2 c. Further, the peeling phenomenon at other abnormal interface positions is accelerated, so that the package structure of the image sensor module 100 becomes unreliable.

Based on this, the embodiment of the application provides an image sensing module, a display module and an electronic device, so as to improve the reliability of the packaging structure.

Referring to fig. 3 and 4, fig. 3 is a schematic cross-sectional structure of an image sensor module according to an embodiment of the disclosure, and fig. 4 is a schematic partial structure of fig. 3. The image sensor module 10 according to an embodiment of the present application includes a sensor chip 11, a cover plate 12, a package 13, and a buffer structure 14. The sensor chip 11 has a first surface 11a. The cover plate 12 is provided on one side of the first surface 11a of the sensor chip 11. The package 13 has an opening 13a and a cavity 13b communicating with the opening 13 a. The cavity 13b encapsulates the sensor chip 11 and the cover plate 12, and the cover plate 12 is disposed closer to the opening 13a than the sensor chip 11. The buffer structure 14 connects the cover plate 12 and the package body 13.

The Sensor chip 11 is an Image Sensor (Image Sensor) for sensing light intensity information of incident light and converting a physical signal into an analog signal. It should be noted that the image sensor module 10 further includes a substrate 15, and the sensor chip 11 is disposed on the substrate 15. The first surface 11a refers to the sensing surface. In particular, a side surface of the sensor chip 11 facing away from the first surface 11a may be bonded to the substrate 15 using, for example, an epoxy glue (i.e., glue line E). The substrate 15 may be a bismaleimide triazine (Bismaleimide Triazine, BT) resin substrate 15, a monosodium glutamate accumulating film (Ajinomoto Build up Film, ABF) substrate 15, a mold interconnect substrate 15 (Molded Interconnect Substrate, MIS) substrate 15, or a carrier of an FR 4 substrate 15 (epoxy glass cloth plate), which is not particularly limited in the embodiment of the present application.

The cover plate 12 refers to a light-transmitting plate for protecting the sensor chip 11. For example, the light-transmitting plate may be a plate made of a material such as general glass (glass), sapphire glass (Safire), polycarbonate (PC), or polymethyl methacrylate (polymethyl methacrylate, PMMA), which is not particularly limited in the embodiments of the present application. In addition, in the first direction F1, the two surfaces of the cover plate 12 disposed opposite to each other are coated with an antireflection film or one of the surfaces is coated with an antireflection film, so that the light transmittance of the cover plate 12 can be increased.

The package 13 is a structure for packaging at least the sensor chip 11 and the cover plate 12. For example, the raw material of the package body 13 may be an epoxy resin as a matrix resin, and include one or more materials of silicone (silicone) adhesive, acrylic resin, polyimide, and two-component adhesive. Specifically, the packaging material is filled between the side surface of the substrate 15 facing the sensor chip 11, the side surface of the sensor chip 11, and the side surface of the cover plate 12 to form the package body 13, which is equivalent to forming a cavity 13b and an opening 13a in the package body 13, the sensor chip 11 and the cover plate 12 are accommodated in the cavity 13b, and the cover plate 12 is disposed closer to the opening 13a than the sensor chip 11. In this embodiment, the package 13 may be manufactured by an injection molding process, that is, using an injection mold. The injection mold may include an upper mold and a lower mold. Specifically, the image sensing module 10 to be packaged (i.e. not including the package body 13) may be placed in the lower mold, and then the upper mold and the lower mold are clamped to form an injection cavity, the cavity wall of the upper mold is abutted against a side surface of the cover plate 12, which is away from the sensing chip 11, and the cavity wall of the lower mold is abutted against a side surface of the substrate 15, which is away from the sensing chip 11, and then the package body 13 is formed by injecting a package material into the injection cavity.

The buffer structure 14 refers to a structure for absorbing stress. The buffer structure 14 may be cured from a semi-liquid material, which may have tackiness. The semi-liquid material of the buffer structure 14 may be bonded to the cover 12, and then the cover 12 and the sensor chip 11 are covered and bonded, and then packaged by the package 13. The buffer structure 14 serves to connect the sidewall of the cap plate 12 and the inner wall of the package body 13, so that a stress variation between the cap plate 12 and the package body 13 can be relieved.

Specifically, a buffer structure 14 is disposed between the cover plate 12 and the package body 13, and the buffer structure 14 connects the cover plate 12 and the package body 13, so as to buffer the stress variation between the cover plate 12 and the package body 13 and absorb the tensile stress P between the cover plate 12 and the package body 13. In this way, the peeling between the cover plate 12 and the package 13 can be reduced, and the reliability of the package structure of the image sensor module 10 can be improved.

Compared with the related art in which the glass plate 140 and the sealing structure 150 are directly connected, the interface between the glass plate 140 and the sealing structure 150 is easily peeled off when a large temperature change is applied. In the present embodiment, the buffer structure 14 is disposed between the cover 12 and the package 13, so that when the image sensor module 10 receives a large temperature difference, the buffer structure 14 absorbs the tensile stress P generated between the cover 12 and the package 13 due to a large difference in thermal expansion, thereby reducing the peeling between the cover 12 and the package 13 and improving the reliability of the package.

In some embodiments, the cushioning structure 14 is disposed about the cover plate 12. In particular, the cushioning structure 14 may be disposed continuously around the sides of the cover plate 12, or the cushioning structure 14 may be disposed intermittently around the sides of the cover plate 12. In this way, by providing the buffer structure 14 around the lid 12, the buffer structure 14 connects the side wall of the lid 12 and the inner wall of the package 13, so that the buffer effect on the tensile stress P between the lid 12 and the package 13 can be improved.

In some embodiments, the circumferentially disposed surface of the cover plate 12 is at least partially connected to the cushioning structure 14. Specifically, the surface of the cover plate 12 disposed along the circumferential direction, that is, the circumferential side surface, may be partially connected to the buffer structure 14, or the entire surface of the cover plate 12 disposed along the circumferential direction may be connected to the buffer structure 14. As described above, various embodiments are provided, and the embodiments may be selected according to the actual situation, as long as a large stress variation between the cover plate 12 and the package 13 can be improved by the buffer structure 14.

In some embodiments, the front projection of the structure formed by cover plate 12 and buffer structure 14 onto the reference plane and the front projection of opening 13a onto the reference plane coincide with each other. The reference plane and the first surface 11a are parallel to each other.

Specifically, the reference surface refers to a plane parallel to the first surface 11a. The structure formed by the cover plate 12 and the buffer structure 14 is projected on the reference plane and the projection of the opening 13a on the reference plane coincide with each other, that is, the side wall of the buffer structure 14 is connected with the inner wall of the package 13 at the opening 13 a. In this way, the situation that the buffer structure 14 and the package body 13 are peeled off at the opening 13a can be reduced, which is helpful for improving the reliability of the package structure of the image sensor module 10.

In some embodiments, a distance from a side surface of the cover plate 12 away from the sensor chip 11 to the reference surface is defined as a first distance. The distance from the side surface of the buffer structure 14 away from the sensor chip 11 to the reference surface is a second distance. The distance from the plane in which the opening 13a is located to the reference plane is a third distance. The reference plane and the first surface 11a are parallel to each other. Wherein the first distance, the second distance, and the third distance are equal to each other. Alternatively, at least two of the first distance, the second distance, and the third distance are unequal.

Specifically, a plane in which the first surface 11a is located may be taken as a reference plane. The first distance refers to the dimension of the cover plate 12 from the side surface of the sensor chip 11 in the first direction F1 (i.e., the vertical direction) to the reference surface. The second distance refers to the dimension of the buffer structure 14 from the first direction F1 to the reference surface on the side surface facing away from the sensor chip 11. The third distance refers to the dimension of the plane in which the opening 13a is located from the first direction F1 to the reference plane. In the present embodiment, the first distance, the second distance, and the third distance are equal, that is, the cover plate 12, the buffer structure 14, and the package body 13 are flush at the opening 13 a. Or, the first distance, the second distance and the third distance are not equal to each other or are not equal to each other. In this way, the size (i.e., the height) of the buffer structure 14 along the first direction F1 may be set according to the actual situation, and the size of the buffer structure 14 may be flexibly set, so long as the tensile stress P between the cover plate 12 and the package body 13 absorbed by the buffer structure 14 can be satisfied.

With continued reference to FIG. 3, in some embodiments, the image sensor module 10 further includes an adhesive layer 16. The adhesive layer 16 is disposed on the first surface 11a of the sensor chip 11, and connects the cover 12 and the sensor chip 11. Wherein the adhesive layer 16 is connected to the inner wall of the cavity 13b.

The adhesive layer 16 is an adhesive structure for bonding the cover plate 12 and the sensor chip 11. The raw material of the adhesive layer 16 may be an epoxy resin as a matrix resin, and include one or more of silicone (silicone) adhesive, acrylic resin, polyimide, and two-component adhesive. Specifically, a glue material is coated on the first surface 11a of the sensor chip 11, then the cover plate 12 is covered on the glue material, and the adhesive layer 16 is obtained after the glue material is cured. The package 13 may then be subsequently manufactured by an injection molding process, and the inner wall of the package 13, i.e. the inner wall of the cavity 13b, is connected to the side wall of the adhesive layer 16. Thus, the packaging of the image sensor module 10 is facilitated.

In some embodiments, the sense chip 11 has a sense region r1 and an edge region r2 disposed around the sense region r 1. The orthographic projection of the adhesive layer 16 on the first surface 11a is located in the edge region r2 and is disposed around the sensing region r 1.

It should be noted that, the sensing region r1 is a region for sensing light intensity information of incident light, and for example, a color filter array may be used, and the color filter array may be used to obtain light intensity information of red, green and blue three colors on each pixel point. The shape of the sensing region r1 may be rectangular, or may be any other desired shape, which is not particularly limited in the embodiment of the present application. The edge region r2 is a region for the adhesive material and the arrangement of the pads. Specifically, the orthographic projection of the adhesive layer 16 on the first surface 11a is located in the edge region r2 and is disposed around the sensing region r1, that is, the adhesive layer 16 is located on the edge region r2 and is disposed annularly around the sensing region r 1. In this way, a containing cavity is enclosed between the sensing chip 11, the bonding layer 16 and the cover plate 12, and the sensing region r1 is located in the containing cavity, so that the sensing region r1 can collect light intensity information of incident light.

In some embodiments, the adhesive layer 16 is configured as a light shielding material. Specifically, as shown in fig. 5, considering that the adhesive layer 130 is made of a transparent material or a semitransparent material in the related art, oblique light S is led to enter the adhesive layer 130 through the cover plate 140, and is reflected, refracted, scattered, etc. in the adhesive layer 130, and finally reaches the sensing area of the sensing chip 120 to generate an interference image signal, thereby causing a glare problem. In this embodiment, as shown in fig. 6, the adhesive layer 16 is set to be a light shielding material, and the color of the adhesive layer 16 is set to be black, so as to play a role in shielding light, and the light S does not enter the adhesive layer 16, so that the interference of image signals can be reduced, the glare problem can be improved, and the definition of the sensing region r1 for image sensing can be improved.

With continued reference to fig. 3, in some embodiments, a side surface of the buffer structure 14 facing away from the opening 13a (i.e., the second surface 14 a) is coupled to the adhesive layer 16. And/or a side surface of the buffer structure 14 facing away from the opening 13a is connected to an inner wall of the cavity 13b.

Specifically, the surface of the buffer structure 14 facing away from the opening 13a is connected to the adhesive layer 16, that is, the orthographic projection of the structure formed by the cover plate 12 and the buffer structure 14 on the reference plane is located in the orthographic projection of the adhesive layer 16 on the reference plane. In some embodiments, the semi-liquid material of the buffer structure 14 may be bonded to the cover 12, after the semi-liquid material is cured, the structure formed by the cover 12 and the buffer structure 14 is covered on the adhesive (i.e. the bonding layer 16) coated on the sensor chip 11, and both the cover 12 and the buffer structure 14 are bonded to the adhesive.

Alternatively, a side surface of the buffer structure 14 facing away from the opening 13a is connected to an inner wall of the cavity 13b. I.e. the orthographic projection of the buffer structure 14 onto the reference plane is located outside the orthographic projection of the adhesive layer 16 onto the reference plane. In particular, in some embodiments, the semi-liquid material of the buffer structure 14 may be bonded to the cover 12, and after the semi-liquid material is cured, the structure formed by the cover 12 and the buffer structure 14 is covered on the adhesive (i.e. the bonding layer 16) coated on the sensor chip 11, where at least a portion of the cover 12 is bonded to the adhesive. In the subsequent process of manufacturing the package body 13 by using an injection molding process, the inner wall of the package body 13, that is, the inner wall of the cavity 13b is respectively connected with the side wall of the buffer structure 14 and the surface of one side of the buffer structure 14 facing away from the opening 13 a.

Alternatively, a part of the side surface of the buffer structure 14 facing away from the opening 13a is connected to the adhesive layer 16, and another part is connected to the inner wall of the cavity 13b. That is, the front projection of the cover plate 12 on the reference plane is located within the front projection of the adhesive layer 16 on the reference plane, and the front projection of the structure formed by the cover plate 12 and the buffer structure 14 on the reference plane is located outside the front projection of the adhesive layer 16 on the reference plane, wherein one part of the surface of the buffer structure 14 facing away from the opening 13a is connected to the adhesive material, and the other part is connected to the inner wall of the cavity 13b.

Therefore, the size and the connection object of the buffer structure 14 can be flexibly set according to the actual requirements, which is helpful for realizing the package of the image sensor module 10 and improving the reliability of the package structure.

In some embodiments, the buffer structure 14 is configured as a light shielding material. Specifically, the buffer structure 14 may be black, so as to play a role in shading, and reduce the glare caused by the oblique light S entering the buffer structure 14 and the adhesive layer 16. In this way, the glare problem can be improved, which is helpful for improving the definition of the image sensing by the sensor chip 11.

In some embodiments, the cushioning structure 14 is configured as an elastic material. Specifically, the material of the buffer structure 14 may be epoxy resin as a matrix resin, and include one or more of silicone (silicone) adhesive, acrylic resin, polyimide, and two-component adhesive. It should be noted that the chemical components and the sizes of the components in the buffer structure 14 may be adjusted so that the thermal expansion coefficient of the buffer structure 14 is between the thermal expansion coefficient of the cover plate 12 and the thermal expansion coefficient of the package body 13 at high and low temperatures. In this way, when the image sensor module 10 receives a larger temperature difference, the buffer structure 14 can absorb the tensile stress P generated between the cover plate 12 and the package body 13 due to a larger difference in thermal expansion coefficient, so as to reduce the peeling between the cover plate 12 and the package body 13, thereby improving the reliability of the package structure.

In some embodiments, the package 13 is configured as a light shielding material. Specifically, the color of the package 13 may be set to be black, so as to play a role in shading, so that the problem that oblique light S enters the package 13 and the adhesive layer 16 to generate glare is reduced, and the definition of the sensing chip 11 for image sensing is improved.

With continued reference to fig. 3, in some embodiments, the image sensor module 10 further includes a first pad 17, a second pad 18, and a connection wire L. The first pads 17 are provided on the first surface 11a of the sensor chip 11. The second bonding pad 18 is disposed on a surface of the substrate 15 facing the sensor chip 11. The connection wire L is electrically connected to the first pad 17 and the second pad 18.

Specifically, the first pads 17 are distributed in the edge region r2 of the first surface 11a of the sensor chip 11. The second bonding pads 18 are distributed on a surface of the substrate 15 facing the sensor chip 11. Each first pad 17 is connected to one second pad 18 by one connecting wire L. Illustratively, the connection wire L may be a metal wire. In this way, the sensor chip 11 and the substrate 15 are electrically connected.

With continued reference to fig. 3, and in conjunction with fig. 7, in some embodiments, the first pad 17, the second pad 18, and the connection wire L are all encapsulated within the package body 13. Alternatively, the connection wire L includes a first portion L1 connected to the first pad 17 and a second portion L2 connected to the second pad 18. Wherein the first portion L1 and the first pad 17 are encapsulated within the adhesive layer 16. The second portion L2 and the second pad 18 are encapsulated in the package body 13. In this way, the sensor chip 11 and the substrate 15 can be flexibly arranged according to the actual situation, as long as the electrical conduction between them is satisfied.

In some embodiments, the substrate 15 has a mounting surface 15a facing away from the sensor chip 11. The image sensor module 10 further includes a conducting element Q disposed on the mounting surface 15a. The mounting surface 15a refers to a surface of the substrate 15 facing away from the sensor chip 11. The conducting element Q is an electrical connection element. The conductive member Q may be a solder ball, a solder pad, a plurality of solder balls of a ball grid array provided on the mounting surface 15a, or a plurality of solder pads of a grid array provided, for example. Further, the substrate 15 may be soldered to a PCB board or a flexible wiring board of an electronic device by means of the via Q. Including but not limited to cell phones, cameras, and vehicle electronics.

Based on the same inventive concept, the present embodiment also provides a display module, including the image sensor module 10 according to any one of the previous embodiments.

Based on the same inventive concept, the embodiment of the application also provides electronic equipment, which comprises the display module. The electronic device may be a cell phone, a camera, an automobile, or the like.

The display module in the embodiment of the application may be applied to the electronic device described above. More specifically, the electronic device may also be an in-vehicle electronic device, an unmanned aerial vehicle, a sweeping robot, a barcode recognition device, a face/biometric recognition device, an intelligent education device, or the like. The display module can also be applied to security monitoring systems, intelligent traffic systems, consumer systems or industrial 4.0 systems and the like.

In summary, in the image sensor module 10, the display module and the electronic device, the image sensor module 10 at least includes the sensor chip 11, the cover plate 12 and the package body 13, the sensor chip 11 and the cover plate 12 are packaged in the cavity 13b of the package body 13, and the buffer structure 14 is disposed between the cover plate 12 and the package body 13, so that when the image sensor module 10 receives a large temperature difference, the buffer structure 14 absorbs the tensile stress P generated between the cover plate 12 and the package body 13 due to a large thermal expansion difference, thereby reducing the peeling between the cover plate 12 and the package body 13 and improving the reliability of the package structure. In addition, the adhesive layer 16 and the buffer structure 14 are made of a light shielding material, so that the interference image signal generated by the non-image light S entering the sensing region r1 of the sensing chip 11 can be reduced, and the definition of the sensing chip 11 for image sensing can be improved.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.

Claims (14)

1. An image sensor module, comprising:

a sensing chip having a first surface;

the cover plate is arranged on one side of the first surface of the sensing chip;

a package having an opening and a cavity in communication with the opening; the sensing chip and the cover plate are packaged in the cavity, and the cover plate is arranged closer to the opening than the sensing chip; and

and the buffer structure is connected with the cover plate and the packaging body.

2. The image sensor module of claim 1, wherein the buffer structure is disposed around the cover plate.

3. The image sensor module of claim 2, wherein the surface of the cover plate disposed along the circumferential direction is at least partially connected to the buffer structure.

4. The image sensor module of claim 2, wherein the orthographic projection of the structure formed by the cover plate and the buffer structure on the reference plane and the orthographic projection of the opening on the reference plane coincide with each other;

the reference surface and the first surface are parallel to each other.

5. The image sensing module according to claim 2, wherein a distance from a side surface of the cover plate, which is far from the sensing chip, to a reference surface is defined as a first distance, a distance from a side surface of the buffer structure, which is far from the sensing chip, to the reference surface is defined as a second distance, and a distance from a plane of the opening to the reference surface is defined as a third distance; the reference surface and the first surface are parallel to each other;

wherein the first distance, the second distance, and the third distance are equal to each other; or alternatively

At least two of the first distance, the second distance, and the third distance are unequal.

6. The image sensor module of any one of claims 1-5, wherein the image sensor module further comprises an adhesive layer; the bonding layer is arranged on the first surface of the sensing chip and is used for connecting the cover plate and the sensing chip;

wherein the bonding layer is connected with the inner wall of the cavity.

7. The image sensor module of claim 6, wherein the sensor chip has a sensing region and an edge region disposed around the sensing region;

an orthographic projection of the adhesive layer on the first surface is located within the edge region and disposed around the sensing region.

8. The image sensor module of claim 7, wherein the adhesive layer is configured as a light shielding material.

9. The image sensor module of claim 7, wherein a side surface of the buffer structure facing away from the opening is connected to the adhesive layer; and/or

The surface of one side of the buffer structure, which is away from the opening, is connected to the inner wall of the cavity.

10. The image sensor module of any one of claims 1-5, wherein the buffer structure is configured as a light shielding material.

11. The image sensor module of any one of claims 1-5, wherein the buffer structure is configured as an elastic material.

12. The image sensor module of claim 11, wherein the package is configured as a light shielding material.

13. A display module comprising an image sensor module according to any one of claims 1-12.

14. An electronic device comprising the display module of claim 13.