CN104516070A - High-reliability non-airtight packaged parallel transceiving component - Google Patents
High-reliability non-airtight packaged parallel transceiving component Download PDFInfo
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- CN104516070A CN104516070A CN201410731222.0A CN201410731222A CN104516070A CN 104516070 A CN104516070 A CN 104516070A CN 201410731222 A CN201410731222 A CN 201410731222A CN 104516070 A CN104516070 A CN 104516070A
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- chip
- collimation lens
- optical filter
- laser
- electrical interface
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
- G02B6/322—Optical coupling means having lens focusing means positioned between opposed fibre ends and having centering means being part of the lens for the self-positioning of the lightguide at the focal point, e.g. holes, wells, indents, nibs
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/34—Optical coupling means utilising prism or grating
Abstract
The invention relates to a high-reliability non-airtight packaged parallel transceiving component. The high-reliability non-airtight packaged parallel transceiving component comprises a light transmitting component and a light receiving component. The light transmitting component comprises a first pin collimator, a first metal pipe shell, a first electrical interface, a first prism, a first isolator, a first glass carrier, a first total-reflection lens, a first band-pass optical filter array, a first laser chip set, a first transmitting and collimating lens set, a first monitoring detector chip set and a first glass frame. The light receiving component comprises a second pin collimator, a second metal pipe shell, a second electrical interface, a second prism, a second glass carrier, a second total-reflection lens, a second band-pass optical filter array, a 45-degree reflection lens, a second detector chip set, a second receiving and collimating lens set and a second glass frame. The high-reliability non-airtight packaged parallel transceiving component has the advantages of high reliability, high productivity, low cost and the like.
Description
Technical field
The present invention relates to the parallel transmitting-receiving subassembly of a kind of high reliability non-hermetically sealed encapsulation, belong to device and the building block technique field of the light transmitting-receiving unification of optical communication field.
Background technology
The multiple packing forms that optical communication is now commonly used with device; as the packing forms such as TO-CAN, BOX, butterfly have high stability and reliability; one of its reason is that these encapsulation are all level Hermetic Package; level Hermetic Package can be eliminated inside cavity steam and stop extraneous steam to invade; play the effect of protection active chip and light path, to obtain high reliability and long-life.
For the LR4 device of CFP2, QSFP+ and QSFP28 module package; as 4 × 10G TOSA/ROSA, 4 × 25G TOSA/ROSA and transmitting-receiving unification device; if employing level Hermetic Package; then need to be connected with metal shell at electrical interface place ceramic member; and ceramic member needs Mold Making; and ceramic member and metal shell adopt special process to seal, the shell cost of this metal-ceramic package is high, is unfavorable for the large-scale production of device.
Existing non-airtight encapsulation scheme is only applicable to short distance, multimode optical fiber occasion, as plastic case encapsulation, based on COB(Chip on board) encapsulate, adopt resin glue hermetically sealed, when these schemes are used for long distance, single mode occasion, the shortcoming such as can show reliability and stability of layout is poor.
For the wavelength-division multiplex/demux architecture of LR4 device, have AWG scheme, etched diffraction grating scheme and optical filter scheme etc., wherein low with optical filter scheme Material Cost, light path is simple, optical index is outstanding etc., and advantage is commercial by scale.For transceiver module, except minority scheme is for except transmitting-receiving unification (as CN201310751180), ballistic device (or assembly) is independently with the light path of receiving device (or assembly), and advantage to adopt particular components (as circulator), cost-saving.For utilizing emitted light assembly, as adopted pH effect plate group as the auxiliary element of coupling in patent CN201210184192, this element increases device cost, increase the length of device simultaneously, and for example have employed the power that laser instrument exports by beam splitter in patent US20120189314 and reflect a certain proportion of energy downwards, for monitoring emissive power, the method increases cost, simultaneously at the volume longitudinally adding device, assembling is slightly complicated; For reception optical assembly, because the routing electrode of the detector chip of routine and photosurface are coplanar, as scheme in patent CN201210184192, detector chip needs vertical placement, and to receive in optical assembly prime amplifier can only horizontal positioned, cause that the electricity of detector chip and prime amplifier is interconnected needs turnover 90 degree, the loss of electric signal can be caused again.
For utilizing emitted light assembly and reception optical assembly, there is the problem that light mouth and shell are fixing, in order to ensure reliability, both need laser bonding, but laser bonding can cause the contact pin at light mouth place and the displacement of collimation lens and inclination, after causing welding, power drop, responsiveness decline, and particularly collimation lens and contact pin are particularly evident when metalwork exists direct Stress transmit outward.
Therefore be necessary to design the parallel transmitting-receiving subassembly of a kind of high reliability non-hermetically sealed encapsulation, to overcome the problems referred to above.
Summary of the invention
The object of the invention is to the defect overcoming prior art, provide the parallel transmitting-receiving subassembly of high reliability non-hermetically sealed encapsulation that a kind of reliability is high, productibility is strong, cost is low.
The present invention is achieved in that
The invention provides the parallel transmitting-receiving subassembly of a kind of high reliability non-hermetically sealed encapsulation, comprise utilizing emitted light assembly and receive optical assembly, described utilizing emitted light assembly comprises the first contact pin collimating apparatus, the first Can, the first electrical interface, the first prism, the first isolator, the first glass carrier, the first total reflection sheet, the first bandpass filter array, the first chip of laser group, the first transmitting collimation lens set, the first monitoring detector chipset and the first instrument bezel, wherein, described first glass carrier, described first total reflection sheet and described first bandpass filter array composition utilizing emitted light optical filter box, described utilizing emitted light optical filter box is located in described first Can, described first launches the top that collimation lens set is arranged at described first chip of laser group, and described first chip of laser group is positioned at the focus place that described first launches collimation lens set, described first monitoring detector chipset is arranged at the rear of described first chip of laser group, described first instrument bezel is fixed on the outside that described first launches collimation lens set, the first chip of laser group and the first monitoring detector chipset, and is positioned at the below of described utilizing emitted light optical filter box, described first isolator is arranged at the top of the light mouth of described utilizing emitted light optical filter box, described first prism is arranged at the top of described first isolator, the light mouth of described utilizing emitted light optical filter box, the first isolator and the first prism coaxially distribute, described first contact pin collimating apparatus is arranged at above the emergent light mouth of described first prism, and being fixed on the upper end of described first Can, described first electrical interface is fixed on the lower end of described first Can, described reception optical assembly comprises the second contact pin collimating apparatus, the second Can, the second electrical interface, the second prism, the second glass carrier, the second total reflection sheet, the second bandpass filter array, 45 ° of reflector plates, the second detector chip groups, second reception collimation lens set and second instrument bezels, wherein the second glass carrier, the second total reflection sheet and the second bandpass filter array composition receive light optical filter box, and described reception light optical filter box is positioned at described second Can, described second receives the top that collimation lens is mounted on described second detector chip group, described second instrument bezel is positioned at the below that described second receives collimation lens set, and be coated on the outside of described second detector chip group, the top that described second receives collimation lens set is located at by described 45 ° of reflector plates, the top of described 45 ° of reflector plates is located at by described reception light optical filter box, described second prism is arranged at above the light mouth of described reception light optical filter box, wherein, light mouth and described second prism of described reception light optical filter box are coaxially arranged, described second contact pin collimating apparatus is arranged at above the incident light mouth of described second prism, and be fixed on the upper end of described second Can, described second electrical interface is fixed on the lower end of described second Can.
Further, described first contact pin collimating apparatus 1 is fixed by laser bonding with described first Can, and the afterbody of described first Can leaves keyway, and described first electrical interface embeds in the keyway of described first Can.
Further, described first electrical interface adopts ceramic wafer and soft ribbons assembling, is provided with insulating material between described first electrical interface and the first Can.
Further, the inside envelope filling of described first instrument bezel and described second instrument bezel has chip protecting glue.
Further, described first total reflection sheet and the first bandpass filter array are pasted on the front and rear surfaces of described first glass carrier respectively, described first total reflection sheet accounts for the area of described first glass carrier front surface 3/4, the area of other 1/4 is transmitted light mouth, and the glass sheet with anti-reflection film is installed at described transmitted light mouth place.
Further, described first transmitting collimation lens set comprises the transmitting collimation lens of four aspherical types, described first chip of laser group comprises four chip of laser, described first monitoring detector chipset comprises four monitoring detector chips, wherein, the each vertical placement in below monitoring detector chip of each chip of laser, collimation lens is launched in each vertical placement one in top of each chip of laser.
Further, described second contact pin collimating apparatus and the second Can are fixed by laser bonding, and the afterbody of described second Can leaves keyway, and described second electrical interface embeds in the keyway of described second Can.
Further, insulating material is provided with between described second electrical interface and the second Can.
Further, described second detector chip group comprises four detection chip, four equal slant settings of detection chip, and the vergence direction of four detector chips is consistent with each other, angle of inclination be greater than 0 °, to be less than between 12 ° arbitrarily angled.
Further, the surface of described first chip of laser group and described second detector chip group all adopts anti-steam protection technique to protect.
The present invention has following beneficial effect:
The parallel transmitting-receiving subassembly of described high reliability non-hermetically sealed encapsulation comprises utilizing emitted light assembly and receives optical assembly, it adopts first, second Can, electrical interface and contact pin collimating apparatus, obviously can reduce the cost of assembly, reduce the volume of assembly, and realize high reliability, contact pin collimating apparatus is adopted at light mouth, the inner light path of optimization component, to ensure optics and electricity index, contributes to the miniaturization of device and module and integrated, make its productibility strong, cost is low.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The structural representation of the utilizing emitted light assembly that Fig. 1 provides for the embodiment of the present invention;
The structural representation at another visual angle of utilizing emitted light assembly that Fig. 2 provides for the embodiment of the present invention;
The schematic diagram of glue sealing in chip of laser place in the utilizing emitted light assembly that Fig. 3 provides for the embodiment of the present invention;
The structural representation of the first embodiment of the first electrical interface that Fig. 4 provides for the embodiment of the present invention;
The structural representation of the second embodiment of the first electrical interface that Fig. 5 provides for the embodiment of the present invention;
The structural representation of the 3rd embodiment of the first electrical interface that Fig. 6 provides for the embodiment of the present invention;
The structural representation of the first prism that Fig. 7 provides for the embodiment of the present invention;
The light path deviation schematic diagram of the first prism that Fig. 8 provides for the embodiment of the present invention;
The structural representation of the utilizing emitted light optical filter box that Fig. 9 provides for the embodiment of the present invention;
The schematic diagram of the multiplexing function of utilizing emitted light optical filter box that Figure 10 provides for the embodiment of the present invention;
The schematic diagram of the utilizing emitted light optical filter box demultiplexing function that Figure 11 provides for the embodiment of the present invention;
Light path schematic diagram in the utilizing emitted light assembly that Figure 12 provides for the embodiment of the present invention;
The structural representation of the reception optical assembly that Figure 13 provides for the embodiment of the present invention;
The structural representation at another visual angle of reception optical assembly that Figure 14 provides for the embodiment of the present invention;
The structural representation of the second detector chip group that Figure 15 provides for the embodiment of the present invention;
The schematic diagram of glue sealing in chip of laser place in the reception optical assembly that Figure 16 provides for the embodiment of the present invention;
The structural representation of the first embodiment of the second electrical interface that Figure 17 provides for the embodiment of the present invention;
The structural representation of the second embodiment of the second electrical interface that Figure 18 provides for the embodiment of the present invention;
The structural representation of the 3rd embodiment of the second electrical interface that Figure 19 provides for the embodiment of the present invention;
Light path schematic diagram in the reception optical assembly that Figure 20 provides for the embodiment of the present invention;
The light path schematic diagram at another visual angle in the reception optical assembly that Figure 21 provides for the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, other embodiments all that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belong to the scope of protection of the invention.
The embodiment of the present invention provides a kind of high reliability non-hermetically sealed to encapsulate parallel transmitting-receiving subassembly, comprises utilizing emitted light assembly and receives optical assembly.The situation that the multichannel wavelength that the parallel transmitting-receiving subassembly of described high reliability non-hermetically sealed encapsulation can be applicable to CWDM, LWDM or 850nm wave band works simultaneously, for the ease of statement, the device formed for four channels transmit optical assemblies and the four channels reception optical assembly of CWDM is below that example is described, wherein operation wavelength adopts conventional four wavelength: λ 1, λ 2, λ 3 and the λ 4 of CWDM, as 1271nm, 1291nm, 1311nm and 1331nm.
As shown in Figures 1 to 12, described utilizing emitted light assembly comprises the first contact pin collimating apparatus 101, first Can 102, first electrical interface 103, first prism 104, first isolator 105, first glass carrier 106, first total reflection sheet 107, first bandpass filter array 108, first chip of laser group 109, first launches collimation lens set 110, first monitoring detector chipset 111 and the first instrument bezel 112, wherein, described first glass carrier 106, described first total reflection sheet 107 and described first bandpass filter array 108 form utilizing emitted light optical filter box, described utilizing emitted light optical filter box is located in described first Can, described first launches the top that collimation lens set 110 is arranged at described first chip of laser group 109, and described first chip of laser group 109 is positioned at the focus place that described first launches collimation lens set 110, described first monitoring detector chipset 111 is arranged at the rear of described first chip of laser group 109, described first instrument bezel 112 is fixed on the outside that described first launches collimation lens set 110, first chip of laser group 109 and the first monitoring detector chipset 111, and is positioned at the below of described utilizing emitted light optical filter box, described first isolator 105 is arranged at the top of the light mouth of described utilizing emitted light optical filter box, described first prism 104 is arranged at the top of described first isolator 105, the light mouth of described utilizing emitted light optical filter box, the first isolator 105 and the first prism 104 coaxially distribute, described first contact pin collimating apparatus 101 is arranged at above the emergent light mouth of described first prism 104, and being fixed on the upper end of described first Can 102, described first electrical interface 103 is fixed on the lower end of described first Can 102.Described first transmitting collimation lens set 110 comprises the transmitting collimation lens of four aspherical types, described first chip of laser group 109 comprises four chip of laser, described first monitoring detector chipset 111 comprises four monitoring detector chips, wherein, the each vertical placement in below monitoring detector chip of each chip of laser, collimation lens is launched in each vertical placement one in top of each chip of laser.
Wherein, the first contact pin collimating apparatus 101 for utilizing emitted light assembly with receive optical assembly and can suitably change, as utilizing emitted light assembly, the first contact pin collimating apparatus 101 accessible site has isolator.
Described utilizing emitted light assembly each parts relative position: the center of all opticses is all positioned at same plane I, and plane I is parallel with the bottom surface of the first Can 102, as shown in Figure 2.First chip of laser group 109 is the chip of laser of four different operating wavelength, and chip of laser equidistantly distributes, or non-equidistance distribution, can suitable spacing according to the feature of light path.The each vertical placement in below monitoring detector chip of each chip of laser, four monitoring detector chips form the first monitoring detector chipset 111, the transmitting collimation lens of each vertical placement aspherical types above the first chip of laser group 109, launch collimation lens composition first for four and launch collimation lens set 110, chip of laser is placed in the focus of transmitting collimation lens, therefore, after the light signal that chip of laser is launched passes through the collimation of transmitting collimation lens, propagate with the form of quasi-parallel light.The first instrument bezel 112 is pasted in the first outside of launching collimation lens set 110, first chip of laser group 109 and the first monitoring detector chipset 111.Utilizing emitted light optical filter box is placed on the top of the transmitting collimation lens of aspherical types, and each launches the corresponding bandpass filter of collimation lens, four bandpass filters form the first bandpass filter array 108, and bandpass filter, transmitting collimation lens, chip of laser and the monitoring detector chip of each channel coaxially distribute.
It is identical lens that first four of launching collimation lens set 110 launch collimation lens, and each lens are independently coupled, independent stickup.Place above the light mouth of utilizing emitted light optical filter box above the first isolator 105, first isolator 105 and place the first prism 104, and the light mouth of utilizing emitted light optical filter box, the first isolator 105 and the first prism 104 coaxially distribute.It is the first contact pin collimating apparatus 101 above the emergent light mouth of the first prism 104, first contact pin collimating apparatus 101 and the first Can 102 are fixed by laser bonding, the afterbody of the first Can 102 leaves keyway, first electrical interface 103 is embedded in the keyway of the first Can 102, can add insulating material if desired between the first electrical interface 103 and the first Can 102.
In first chip of laser group 109, the spectral patterns of each chip of laser can be single longitudinal mode, also can be many longitudinal modes; Using wavelength can be short wavelength (near 850nm), also can be long wavelength (near 1310nm, near 1550nm); Chip type has but is not limited to DFB chip, FP chip, VCSEL chip, EML chip.Transmission Fibers Transmission Fibers in contact pin collimating apparatus can be single-mode fiber also can be multimode optical fiber.First chip of laser group 109 adopts crystal-bonding adhesive to solidify, and as elargol, golden tin solder etc., have high shear resistance, bonding force heat conduction is simultaneously good, crystal-bonding adhesive has good anti-steam characteristic simultaneously.The surface of the first chip of laser group 109 adopts anti-steam protection technique to protect, and as passivation technology, effectively can protect the impact of external environment.
First chip of laser group 109 and first is launched the outside airtight that collimation lens set 110 is coupled and is enclosed the first instrument bezel 112; chip protecting glue 113 is filled with in the first instrument bezel 112 inside envelope; chip protecting glue 113 chooses that water absorptivity is little, adhesion is strong, the kind of high-low temperature resistant; optional type comprises index matching glue, epoxide-resin glue, silica gel etc.; adopt the sealing technology being similar to LED; there is high reliability, can protect IC, prevent steam.Seal and after solidifying above the first instrument bezel 112 sticking glass cover plate 114, as shown in Figure 3.Index matching glue can change optical path difference, therefore needs reserved certain spacing when collimation lens set 110 is launched in coupling first.
For the first electrical interface 103, it adopts simple ceramic wafer and soft ribbons assembling, electrical interface after assembling and shell 102 adopt together with solder solidification, solder used is not limit: epoxide-resin glue, glass cement, silica gel, tin material, solder (as gold-tin alloy) etc., the mode of solidification is different according to solder difference, as heat curing, soldering, fine weldering etc., have that physical strength is high, Heat stability is good and a low advantage of gas penetration potential.First electrical interface 103 part after assembling is positioned at the inside of shell 102, and another part is positioned at the outside of shell 102, as shown in Figure 1 and Figure 2.The assembling mode of the first electrical interface 103 has three kinds at least, first kind of way adopts assembles without the ceramic wafer 115 of layer gold pin and soft ribbons 116, soft ribbons 116 is adopted specific glue to be directly pasted onto on ceramic wafer 115, as shown in Figure 4, in which, soft ribbons can flush with ceramic wafer, without the need to headspace; The second way adopts the ceramic wafer 117 of band layer gold pin and soft ribbons 118 to assemble, and ceramic wafer 117 is coated with layer gold 119, pin and the layer gold 119 of soft ribbons 118 are interconnected by soldering, and which needs headspace on ceramic wafer 117, as shown in Figure 5; The third mode is double-deck soft ribbons structure, as shown in Figure 6, namely on the basis of Fig. 5, again one deck is superposed, first the ceramic wafer 120 of band layer gold pin and soft ribbons 121 are assembled, ceramic wafer 120 is coated with layer gold 122, pin and the layer gold 122 of soft ribbons 121 are interconnected by soldering, afterwards the ceramic wafer 123 of band layer gold pin and soft ribbons 124 are assembled, ceramic wafer 123 is coated with layer gold 125, pin and the layer gold 125 of soft ribbons 124 are interconnected by soldering, are finally fixed by insulating gel by two parts.
For the first prism 104, as shown in Figure 7, comprise four working surfaces: the plane of incidence 126, exit facet 127 and two reflectings surface 128,129, wherein the plane of incidence 126 is parallel with exit facet 127, reflecting surface 128 is parallel with reflecting surface 129, and the angle between the plane of incidence 126 and reflecting surface 129 is 130, and the size of angle 130 and the plane of incidence 126 determines the displacement 131 of light path deviation in plane I.It is parallel with emergent light direction that the parallelogram sturcutre of the first prism determines incident light direction, as shown in Figure 8.
For the first contact pin collimating apparatus 101, as the light mouth of utilizing emitted light assembly (upward signal), this the first contact pin collimating apparatus 101 makes in advance, quasi-parallel light can be exported or receive quasi-parallel light, it is inner containing collimation lens, this collimation lens and first is launched collimation lens set 110 and is matched, and makes laser light path have high coupling efficiency.
For utilizing emitted light optical filter box, be assembled by the first glass carrier 106, first total reflection sheet 107 and the first bandpass filter array 108, as shown in Figure 9.First glass carrier 106 slant setting, the first glass carrier 106 can be solid type glass plate, also can be the glass plate with hollow.Utilizing emitted light optical filter box plays the effect of wavelength-division multiplex to the light signal that laser instrument is launched, and the light signal of detector reception is played to the effect of demultiplexing.First total reflection sheet 107 and the first bandpass filter array 108 are pasted onto the front and rear surfaces of the first glass carrier 106 respectively by accurate assembling, first total reflection sheet 107 occupies the area of the first glass carrier 106 front surface 3/4, residue 1/4 surface is transmitted light mouth, and transmitted light mouth place can add the glass sheet with anti-reflection film.First bandpass filter array 108 is that the bandpass filter parallel arranged placement of different operating wavelength forms, and bandpass filter centre wavelength is the multi-channel operation wavelength of CWDM or LWDM.
For laser signal, the directional light that the first chip of laser group 109 is sent by the first transmitting collimation lens set 110 enters in utilizing emitted light optical filter box through the first bandpass filter array 108, is launched light optical filter box afterwards multiplexing, as shown in Figure 10; For detector light signal, the directional light that the first contact pin collimating apparatus 101 exports enters in utilizing emitted light optical filter box light mouth, is launched light optical filter box demultiplexing afterwards, as shown in figure 11.In utilizing emitted light assembly, light signal is mainly propagated with the form of quasi-parallel light.The advantage of directional light is that propagation distance is long, and when assembling it in effective propagation distance, the responsiveness of converging light or coupling efficiency are relatively more consistent, can ensure the power of device four passages or the even of responsiveness.For laser signal, its paths schematic diagram as shown in figure 12.First chip of laser group 109 is the chip of laser of four different operating wavelength, and operation wavelength is λ 1, λ 2, λ 3 and λ 4 respectively.The backward light that chip of laser is launched is received by the first monitoring detector chipset 111, and the forward light of transmitting is nearly Gaussian beam, and after the first collimation launching collimation lens set 110, form quasi-parallel light, effective propagation distance of directional light can reach more than 20mm.The directional light that first chip of laser group 109 is sent by the first transmitting collimation lens set 110, propagates in the first glass carrier 106 through corresponding first bandpass filter array 108 afterwards.The effect of the first bandpass filter array 108 be to the light signal in specific narrow spectrum width through, and other light signals are reflected, as 1311nm bandpass filter, to the Transmission light of 1311 ± 8.5nm, and to the light reflection outside this passband, therefore 1271nm, 1291nm and 1331nm light wave can be reflected by optical filter.The grinding angle of two workplaces of the first glass carrier 106 is identical with the reflection angle of the first bandpass filter array 108, therefore can along original angular spread by the light reflected.For first via quasi-parallel light λ 1 through the light mouth transmission directly from the first glass carrier 106 after bandpass filter, all the other quasi-parallel light λ 2, λ 3 and λ 4 need the reflection by the first total reflection sheet 107 when propagating in the first glass carrier 106, reflect light on the bandpass filter of next passage, and reflect successively, finally arrive the defeated light-emitting window place outgoing of the first glass carrier 106.The directional light of outgoing is received by the first contact pin collimating apparatus 101, is transferred in link more afterwards by external wire jumper.
Wherein, the ceramic insertion core in the first contact pin collimating apparatus 101 can be single mode lock pin, also can be multimode lock pin; So Transmission Fibers can be single-mode fiber also can be multimode optical fiber.
As Figure 13 to Figure 21, described reception optical assembly comprises the second contact pin collimating apparatus 201, second Can 202, second electrical interface 203, second prism 204, second glass carrier 205, second total reflection sheet 206, second bandpass filter array 207, 45 ° of reflector plates 208, second detector chip group 209, second receives collimation lens set 210 and the second instrument bezel 211, wherein the second glass carrier 205, second total reflection sheet 206 and the second bandpass filter array 207 composition receive light optical filter box, described reception light optical filter box is positioned at described second Can 202, described second receives the top that collimation lens set 210 is located at described second detector chip group 209, described second instrument bezel 211 is positioned at the below that described second receives collimation lens set 210, and be coated on the outside of described second detector chip group 209, the top that described second receives collimation lens set 210 is located at by described 45 ° of reflector plates 208, the top of described 45 ° of reflector plates 208 is located at by described reception light optical filter box, described second prism 204 is arranged at above the light mouth of described reception light optical filter box, wherein, light mouth and described second prism 204 of described reception light optical filter box are coaxially arranged, described second contact pin collimating apparatus 201 is arranged at above the incident light mouth of described second prism 204, and be fixed on the upper end of described second Can 202, described second electrical interface 203 is fixed on the lower end of described second Can 202.
Each parts relative position as shown in figure 14, second contact pin collimating apparatus 201, second prism 204, receive light optical filter box and 45 ° of reflector plates 208 be centrally located in same Planar Mechanism, Planar Mechanism is parallel with the bottom surface of the second Can 202, second detector chip group 209, receive collimation lens 210 and 45 ° of reflector plates 208 be centrally located in same plane III, Planar Mechanism is vertical with plane III.In plane III, the second detector chip group 209 is four identical detector chips, and detector chip equidistantly distributes, or non-equidistance distribution, can suitable spacing according to the feature of light path.Second receives collimation lens set 210 comprises four reception collimation lenses, the reception collimation lens of each vertical placement spherical above each detector chip, second receiving below collimation lens set 210, the outside of the second detector chip group 209 pastes U-shaped second instrument bezel 211, as shown in figure 15.45 ° of reflector plates 208 are placed above reception collimation lens.
45 ° of reflector plates 208 at least can adopt the principle of work of two kinds, and first kind of way is 45 ° of face plated films, and the second way is the total reflection of prism inside surface.Second reception collimation lens set 210 composition form has and has two kinds at least, the first composition form is four independently collimation lens parallel arranged, the optical axis height of four lens is identical, lateral separation between optical axis can be finely tuned, the second composition form is the array lens of Mold Making or etching, namely a substrate has four lens elements, the height of the optical axis of four collimation lenses is identical with spacing.Second detector chip group 209 composition form has at least two kinds, and the first composition form is four independently detector chip parallel arranged, and by high precision die bonder attachment, the second composition form is the shaping detector array chip of chip technology.Second detector chip group 209 is placed in the back focus of the second reception collimation lens set 210.
In Planar Mechanism, arrange above 45 ° of reflector plates 208 and receive light optical filter box, receive each bandpass filter of light optical filter box and each receives collimation lens, detector chip one_to_one corresponding.Above the light mouth receiving light optical filter box, place the second prism 204, and the light mouth receiving light optical filter box with and the second prism 204 coaxially distribute.It is the second contact pin collimating apparatus 201 above the incident light mouth of the second prism 204, second contact pin collimating apparatus 201 and the second Can 202 are fixed by laser bonding, the afterbody of the second Can 202 leaves keyway, second electrical interface 203 is embedded in the keyway of the second Can 202, can add insulating material if desired between the second electrical interface 203 and the second Can 202.
In second detector chip group 209, the type of each detector chip has but is not limited to electrode coplanar type detector chip, electrode antarafacial type detector chip, electrode and light receiving surface coplanar type detector chip, electrode and light receiving surface antarafacial type detector chip, is with microlens type detector chip, SMT(surface to paste) type detector chip etc.
Second detector chip group 209 adopts crystal-bonding adhesive to solidify, and as elargol, golden tin solder etc., have high shear resistance, bonding force heat conduction is simultaneously good, crystal-bonding adhesive has good anti-steam characteristic simultaneously.Second detector chip group 209 surface adopts protectiveness passivating film, effectively can protect the impact of external environment.Second detector chip group 209, second instrument bezel 211 and the second inside receiving collimation lens set 210 are sealed and are filled with chip protecting glue 113; chip protecting glue 113 chooses that water absorptivity is little, adhesion is strong, the kind of high-low temperature resistant; optional type comprises index matching glue, epoxide-resin glue, silica gel etc.; adopt the sealing technology being similar to LED; there is high reliability, can protect IC, prevent steam.
For the second electrical interface 203, adopt the simple ceramic wafer of processing and soft ribbons assembling, the second electrical interface 203 after assembling and the second Can 202 adopt together with solder solidification, solder used is not limit: epoxide-resin glue, glass cement, silica gel, tin material, solder (as gold-tin alloy) etc., the mode of solidification is different according to solder difference, as heat curing, soldering, fine weldering etc., have that physical strength is high, an advantage such as Heat stability is good and low-permeable.Second electrical interface 203 part after assembling is positioned at the inside of the second Can 202, and another part is positioned at the outside of the second Can 202, as shown in Figure 13,14.The assembling mode of electrical interface has three kinds at least, first kind of way adopts assembles without the ceramic wafer 213 of layer gold pin and soft ribbons 214, soft ribbons 214 is adopted specific glue to be directly pasted onto on ceramic wafer 213, as shown in figure 17, in which, soft ribbons can flush with ceramic wafer, without the need to headspace; The second way adopts the ceramic wafer 215 of band layer gold pin and soft ribbons 216 to assemble, and ceramic wafer 215 is coated with layer gold 217, pin and the layer gold 217 of soft ribbons 216 are interconnected by soldering, and which needs headspace on ceramic wafer 215, as shown in figure 18; The third mode is double-deck soft ribbons structure, as shown in figure 19, namely on the basis of Figure 18, again one deck is superposed, first the ceramic wafer 218 of band layer gold pin and soft ribbons 219 are assembled, ceramic wafer 218 is coated with layer gold 220, pin and the layer gold 220 of soft ribbons 219 are interconnected by soldering, afterwards the ceramic wafer 221 of band layer gold pin and soft ribbons 222 are assembled, ceramic wafer 221 is coated with layer gold 223, pin and the layer gold 223 of soft ribbons 222 are interconnected by soldering, are finally fixed by insulating gel by two parts.
For the second prism 204, similar to the first prism 104, the structure according to receiving unit can change angle and size, with the skew of acquiring demand.For reception light optical filter box, identical with the principle of the utilizing emitted light optical filter box in emitting module, structure is similar, can change the size of optical filter, glass carrier and total reflection sheet according to the difference at optical filter interval.
In reception optical assembly, light signal is propagated with the form of quasi-parallel light equally.For descending detector signal, its paths schematic diagram as shown in Figure 20, Figure 21.Four road light signal λ 1 descending in light path, λ 2, λ 3 and λ 4 is input in device by the second contact pin collimating apparatus 201 with the form of quasi-parallel light, afterwards by the second prism 204 deviation, and enter in the light mouth of the second glass carrier 205, and propagate in the second glass carrier 205, wherein first via light signal λ 1 directly arrives 45 ° of reflector plates 208 through after first bandpass filter, being received collimation lens 210 by first after turnover 90 ° converges to detector chip, all the other light signals λ 2, λ 3 and λ 4 needs through the second total reflection sheet, the reflection of bandpass filter, 45 ° of reflector plates 208 are arrived after corresponding bandpass filter outgoing, detector chip is converged to by the reception collimation lens of correspondence by after turnover 90 °.
In order to reduce the return loss of detector, described second detector chip group 209 comprises four detection chip, can by detector chip slant setting each in the second detector chip group 209, and vergence direction can be any; But for the ease of attachment, the vergence direction of four detector chips is consistent with each other, angle of inclination be greater than 0 °, to be less than between 12 ° arbitrarily angled, also can not be obliquely installed; In addition, also the reflecting face of 45 ° of reflector plates 208 can be set as the unspecified angle between 37 ° ~ 53 °.
Ceramic insertion core in second contact pin collimating apparatus 201 can be single mode lock pin, also can be multimode lock pin; So Transmission Fibers can be single-mode fiber also can be multimode optical fiber.
In sum; the parallel transmitting-receiving subassembly of high reliability non-hermetically sealed encapsulation that the present invention proposes adopts the shell of machining, simple electrical interface and contact pin collimating apparatus; obviously can reduce the cost of assembly; reduce the volume of assembly; adopt chip protecting glue encapsulating chip surrounding environment simultaneously, adopt solder sealed electrical interface and shell; thus realize high reliability; light mouth adopts contact pin collimating apparatus in addition; the inner light path of optimization component; to ensure optics and electricity index, contribute to the miniaturization of device and module and integrated.The present invention can be applicable to CWDM, LWDM wavelength, can be packaged in the modules such as CFP, CFP2, CFP4, QSFP+, QSFP28.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the parallel transmitting-receiving subassembly of high reliability non-hermetically sealed encapsulation, is characterized in that, comprises utilizing emitted light assembly and receives optical assembly;
Described utilizing emitted light assembly comprises the first contact pin collimating apparatus, the first Can, the first electrical interface, the first prism, the first isolator, the first glass carrier, the first total reflection sheet, the first bandpass filter array, the first chip of laser group, the first transmitting collimation lens set, the first monitoring detector chipset and the first instrument bezel, wherein, described first glass carrier, described first total reflection sheet and described first bandpass filter array composition utilizing emitted light optical filter box, described utilizing emitted light optical filter box is located in described first Can;
Described first launches the top that collimation lens set is arranged at described first chip of laser group, and described first chip of laser group is positioned at the focus place that described first launches collimation lens set, described first monitoring detector chipset is arranged at the rear of described first chip of laser group, described first instrument bezel is fixed on the outside that described first launches collimation lens set, the first chip of laser group and the first monitoring detector chipset, and is positioned at the below of described utilizing emitted light optical filter box; Described first isolator is arranged at the top of the light mouth of described utilizing emitted light optical filter box, described first prism is arranged at the top of described first isolator, the light mouth of described utilizing emitted light optical filter box, the first isolator and the first prism coaxially distribute, described first contact pin collimating apparatus is arranged at above the emergent light mouth of described first prism, and being fixed on the upper end of described first Can, described first electrical interface is fixed on the lower end of described first Can;
Described reception optical assembly comprises the second contact pin collimating apparatus, the second Can, the second electrical interface, the second prism, the second glass carrier, the second total reflection sheet, the second bandpass filter array, 45 ° of reflector plates, the second detector chip groups, second reception collimation lens set and second instrument bezels, wherein the second glass carrier, the second total reflection sheet and the second bandpass filter array composition receive light optical filter box, and described reception light optical filter box is positioned at described second Can;
Described second receives the top that collimation lens is mounted on described second detector chip group, described second instrument bezel is positioned at the below that described second receives collimation lens set, and be coated on the outside of described second detector chip group, the top that described second receives collimation lens set is located at by described 45 ° of reflector plates, the top of described 45 ° of reflector plates is located at by described reception light optical filter box, described second prism is arranged at above the light mouth of described reception light optical filter box, wherein, light mouth and described second prism of described reception light optical filter box are coaxially arranged, described second contact pin collimating apparatus is arranged at above the incident light mouth of described second prism, and be fixed on the upper end of described second Can, described second electrical interface is fixed on the lower end of described second Can.
2. the parallel transmitting-receiving subassembly of high reliability non-hermetically sealed encapsulation as claimed in claim 1, it is characterized in that: described first contact pin collimating apparatus 1 is fixed by laser bonding with described first Can, the afterbody of described first Can leaves keyway, and described first electrical interface embeds in the keyway of described first Can.
3. the parallel transmitting-receiving subassembly of high reliability non-hermetically sealed encapsulation as claimed in claim 1 or 2, is characterized in that: described first electrical interface adopts ceramic wafer and soft ribbons assembling, is provided with insulating material between described first electrical interface and the first Can.
4. the parallel transmitting-receiving subassembly of high reliability non-hermetically sealed encapsulation as claimed in claim 1, is characterized in that: the inside envelope filling of described first instrument bezel and described second instrument bezel has chip protecting glue.
5. the parallel transmitting-receiving subassembly of high reliability non-hermetically sealed encapsulation as claimed in claim 1, it is characterized in that: described first total reflection sheet and the first bandpass filter array are pasted on the front and rear surfaces of described first glass carrier respectively, described first total reflection sheet accounts for the area of described first glass carrier front surface 3/4, the area of other 1/4 is transmitted light mouth, and the glass sheet with anti-reflection film is installed at described transmitted light mouth place.
6. the parallel transmitting-receiving subassembly of high reliability non-hermetically sealed encapsulation as claimed in claim 1, it is characterized in that: described first transmitting collimation lens set comprises the transmitting collimation lens of four aspherical types, described first chip of laser group comprises four chip of laser, described first monitoring detector chipset comprises four monitoring detector chips, wherein, the each vertical placement in below monitoring detector chip of each chip of laser, collimation lens is launched in each vertical placement one in top of each chip of laser.
7. the parallel transmitting-receiving subassembly of high reliability non-hermetically sealed encapsulation as claimed in claim 1, it is characterized in that: described second contact pin collimating apparatus and the second Can are fixed by laser bonding, the afterbody of described second Can leaves keyway, and described second electrical interface embeds in the keyway of described second Can.
8. the parallel transmitting-receiving subassembly of high reliability non-hermetically sealed encapsulation as described in claim 1 or 7, is characterized in that: be provided with insulating material between described second electrical interface and the second Can.
9. the parallel transmitting-receiving subassembly of high reliability non-hermetically sealed encapsulation as claimed in claim 1, it is characterized in that: described second detector chip group comprises four detection chip, four equal slant settings of detection chip, the vergence direction of four detector chips is consistent with each other, angle of inclination be greater than 0 °, to be less than between 12 ° arbitrarily angled.
10. the parallel transmitting-receiving subassembly of high reliability non-hermetically sealed encapsulation as claimed in claim 1, is characterized in that: the surface of described first chip of laser group and described second detector chip group all adopts anti-steam protection technique to protect.
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