CN103149647A - Optical element encapsulation structure - Google Patents

Optical element encapsulation structure Download PDF

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Publication number
CN103149647A
CN103149647A CN2011104005072A CN201110400507A CN103149647A CN 103149647 A CN103149647 A CN 103149647A CN 2011104005072 A CN2011104005072 A CN 2011104005072A CN 201110400507 A CN201110400507 A CN 201110400507A CN 103149647 A CN103149647 A CN 103149647A
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CN
China
Prior art keywords
optical
module
optical module
reflecting surface
encapsulating structure
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Pending
Application number
CN2011104005072A
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Chinese (zh)
Inventor
吴开文
余泰成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhongshan Yunchuang Intellectual Property Service Co ltd
Scienbizip Consulting Shenzhen Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2011104005072A priority Critical patent/CN103149647A/en
Publication of CN103149647A publication Critical patent/CN103149647A/en
Pending legal-status Critical Current

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Abstract

The invention discloses an optical element encapsulation structure which comprises a substrate, an electronic module, an optical module and a transmission module. The electronic module, the optical module and the transmission module are arranged on the substrate in sequence at intervals. The electronic module is electrically connected with the optical module. The optical module is used for converting electro-optical signals. The transmission module is used for transmitting optical signals. The transmission module comprises an optical waveguide array and optical fibers. The optical waveguide array comprises a reflecting surface which is located above the optical module. After the optical signals transmitted by the optical module pass through the reflecting surface, the directions of the optical signals are changed, and the optical signals reach the optical fibers and are transmitted by the optical fibers. The optical module can receives the optical signals, with the directions changed, which is transmitted by the optical fibers and pass through the reflecting surface. The optical element encapsulation structure can achieve the transmission of the optical signals without alignment of a lens to an optical component. Alignment accuracy is improved.

Description

The optical element encapsulating structure
Technical field
The present invention relates to a kind of encapsulating structure, relate in particular to a kind of optical element encapsulating structure.
Background technology
In recent years, information communication has the development trend of high speed, high capacity.In general, in optical communication, electric signal need to be converted to light signal, send light signal with fiber optics, then the light signal that receives is converted to electric signal.Utilize optical element to carry out the conversion of electric signal and light signal.
Chip on board encapsulation (Chip on board, COB) is mainly taked in general optical element encapsulation.In the COB processing procedure, usually need to carry out coupling light with lens.After completing die bond (Die Bond), lens are covered align optical components.For reaching desired alignment precision, need to the spacing between lens is pre-designed, then be covered in the top of optical element.Yet when being covered with lens, the spacing of lens always is offset usually, can't accurately locate all optical elements.And along with the demand more and more higher to transmission quantity, will certainly increase the also column number of optical element, also increase the difficulty of whole processing procedure, thereby affected the yield of product.
Summary of the invention
In view of foregoing, be necessary the optical element encapsulating structure that provides a kind of alignment precision high.
A kind of optical element encapsulating structure, comprise substrate and successively the interval be installed in electronic module, optical module and transport module on substrate, this electronic module and this optical module are electrically connected, this optical module is used for the conversion photosignal, this transport module is used for transmitting optical signal, and this transport module comprises optical waveguide array and fiber optics.This optical waveguide array includes reflecting surface, and this reflecting surface is positioned at the top of this optical module, and the light signal that this optical module sends can arrive this fiber optics through this reflecting surface change direction and transmit; This optical module can receive this fiber optics and change through this reflecting surface the light signal that direction passes over.
Optical element encapsulating structure provided by the invention, this optical waveguide array is formed with reflecting surface, and the light signal that this optical module sends can arrive fiber optics and carry out long-distance transmissions after this reflecting surface changes direction.Equally, the light signal of fiber optics reception vertical optical module that arrives after the reflecting surface reflection.This encapsulating structure does not need to learn assembly with lens on light to be aimed at, even increase the also column number of optical module, also can not affect alignment precision.By the optical waveguide array communicating optical signals, simplified encapsulating structure and encapsulation procedure, alignment precision is high, has improved the yield of product.
Description of drawings
Fig. 1 is the sectional view of the encapsulating structure of embodiment of the present invention.
Fig. 2 is another sectional view of the encapsulating structure of embodiment of the present invention.
The main element symbol description
Encapsulating structure 100
Substrate 10
Substrate 11
Liner 13
The surface 131
Fixed bed 15
Electronic module 30
The first electronic component 31
The second electronic component 35
Optical module 50
Light-emitting component 51
Photo detector 53
Connecting line 60
Transport module 70
Fixing array 71
Optical waveguide array 73
The bottom surface 731
Reflecting surface 733
Transmission face 735
End face 737
Connector 75
Fiber optics 77
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
See also Fig. 1 and Fig. 2, the optical element encapsulating structure 100 of present embodiment is used for conversion and transmission light electric signal.Encapsulating structure 100 comprise substrate 10 and successively the interval be installed in electronic module 30, optical module 50 and transport module 70 on substrate 10.Electronic module 30 is electrically connected with optical module 50.
It is tabular that substrate 10 roughly is, and it is used for supporting fixedly electronic module 30, optical module 50 and transport module 70.Substrate 10 comprises substrate 11, liner 13, covers the fixed bed 15 that is formed on liner 13.Can lay circuit on substrate 11, to be used for driving and controlling electronic module 30 and optical module 50 work.Liner 13 is formed at the position of wanting packaging electronic module 30, optical module 50 and transport module 70 on substrate 11.Liner 13 is made by conductive gold attribute materials such as copper, nickel, gold, silver or alloys, and it can be formed on substrate 11 by welding.Liner 13 has the surface 131 that deviates from substrate 11.Electronic module 30 and optical module 50 can be connected to the surface 131 of liner 13 by routing, and are electrically connected to substrate 11 by liner 13.Fixed bed 15 is formed on liner 13 by the method for eutectic bond.The method is by all applying the thin film metal on surface 131 with electronic module 30, optical module 50 and transport module 70 on the one side of liner 13, stick on surface 131 more brilliant (Die bond), then heat by laser and realize eutectic bond.In present embodiment, film metal material is metallic tin.The fixed bed 15 that mode by eutectic bond forms is not easy the occurrence positions skew and produces the problem at knockdown angle.Be appreciated that fixed bed 15 also can be fixed by dripping glue formation adhesive layer.
Electronic module 30 is installed on fixed bed 15, is used for transmitting the reception electric signal.Electronic module 30 comprises that the first electronic component 31(that is set up in parallel sees also Fig. 1) and the second electronic component 35(see also Fig. 2).The first electronic component 31 is used for electrical signal transfer to optical module 50.In present embodiment, the first electronic component 31 is drive integrated circult plate (Integrated Circuit, IC); The second electronic component 35 is used for receiving the electric signal that optical module 50 passes over.In present embodiment, the second electronic component 35 is transimpedance amplifier (Trans-impedance Amplifer, TIA).
Optical module 50 nearby electron modules 30 are installed on fixed bed 15, and are electrically connected with electronic module 30.Optical module 50 comprises that light-emitting component 51(sees also Fig. 1) and photo detector 53(see also Fig. 2).Corresponding the first electronic component 31 of light-emitting component 51, the electric signal that is used for the first electronic component 31 is passed over is converted to light signal, and the light signal vertical substrate 11 that it sends is upwards.In present embodiment, light-emitting component 51 is vertical plane radial laser instrument (Vertical Cavity Surface Emitting Laser, VCSEL).Corresponding the second electronic component 35 of photo detector 53, the light signal that is used for transport module 70 is passed over is converted to electric signal.In present embodiment, photo detector 53 is photodiode (Photo Diode, PD).Light-emitting component 51 and photo detector 53 mode by routing (Wire-Bond) forms connecting line 60 and electronic module 30 is electrically connected.
Transport module 70 adjacent optical modules 50 also are installed on fixed bed 15 away from electronic module 30, are used for transmitting optical signal.Transport module 70 comprises fixedly array 71, optical waveguide array 73, connector 75 and fiber optics 77.Fixedly array 71 is installed on fixed bed 15, is used for fixed support optical waveguide array 73, connector 75 and fiber optics 77.Optical waveguide array 73 parallel substrates 11 are installed in fixedly on array 71, are used for transmitting optical signal.The cross section of optical waveguide array 73 is roughly at right angles trapezoidal.Optical waveguide array 73 comprises bottom surface 731, reflecting surface 733, transmission face 735 and end face 737.The contiguous fixedly array 71 in bottom surface 731 arranges, and light signal can 731 incidents or outgoing from the bottom surface.Reflecting surface 733, transmission face 735 are bent to form by bottom surface 731 two ends extensions.Reflecting surface 733 is used for changing the direction of light signal.Light signal can be from 735 incidents of transmission face or outgoing.In present embodiment, the angle that reflecting surface 733 and bottom surface are 731 equals 45 degree, and transmission face 735 equals 90 degree with the angle of bottom surface 731.End face 737 be arranged in parallel with bottom surface 731.Optical waveguide array 73 is provided with transmission face 735 1 ends and is fixed in this fixedly end of adjacent optical module 50 on array 71, and an end that is provided with reflecting surface 733 extends to optical module 50 tops.In present embodiment, optical waveguide array 73 is the semiconductor optical waveguide array.Connector 75 is fixed on fixing array 71 end away from optical module 50.Connector 75 1 end aligned transmissions faces 735, the other end is connected with fiber optics 77.In present embodiment, connector 75 is the joints of optical fibre.Fiber optics 77 is aimed at away from an end of optical waveguide array 73 with connector 75 and is connected, and is used for transmission and receiving optical signals.
When the needs transmission of signal, electrical signal transfer is to the first electronic component 31, and the first electronic component 31 is delivered to light-emitting component 51 again with electric signal.Light-emitting component 51 is converted to light signal with electric signal.Light-emitting component 51 sends light signal vertically upward.Light signal vertical incidence bottom surface 731, and arrive reflecting surface 733, change after reflection the light signal arrival transmission face 735 that direction becomes parallel substrate 11.Light signal penetrates from transmission face 735, enters connector 75 and enters fiber optics 77 again, namely can carry out long-distance transmissions.
When fiber optics 77 received light signal, light signal was transferred to optical waveguide array 73 through connector 75, then 731 outgoing are delivered to photo detector 53 from the bottom surface downwards to change perpendicular direction after reflecting surface 733 reflections.Photo detector 53 converts light signal to electric signal, passes to the second electronic component 35, i.e. the reception of settling signal.
The end that optical module encapsulating structure 100 provided by the invention, optical waveguide array 73 are positioned at optical module 50 tops is formed with reflecting surface 733.The light signal that light-emitting component 51 sends can be vertically upward, and after reflecting surface 733 reflections, the light signal that becomes parallel substrate 11 arrives fiber optics 77 and carries out long-distance transmissions.Equally, the light signal of fiber optics 77 vertical photo detector 53 that arrives after reflecting surface 733 reflections.Even increase the also column number of light-emitting component 51 and photo detector 53, also can not affect alignment precision.Transport module 70 does not need to aim at lens, and transmits photosignal by optical waveguide array 73, has simplified encapsulating structure and encapsulation procedure, and alignment precision is high, has improved the yield of product.In addition, fixed bed 15 forms by the mode of eutectic bond, is not easy the occurrence positions skew and produces the problem at knockdown angle.
Be appreciated that the fixedly array 71 in transport module 70 can omit, and namely directly directly is fixed at optical waveguide array 73 on substrate 10.
Be appreciated that the connector 75 in transport module 70 can omit, i.e. direct transmission face 735 with fiber optics 77 alignment light waveguide arrays 73.
Be appreciated that, optical waveguide array 73 is not limited only to right-angled trapezium, it needs to form reflecting surface 733, and reflecting surface 733 can be passed to the light signal direction change from optical module 50 fiber optics 77, or will be passed to optical module 50 from the light signal direction change of fiber optics 77.
In addition, those skilled in the art can also do other variation in spirit of the present invention, and certainly, the variation that these are done according to spirit of the present invention all should be included in the present invention's scope required for protection.

Claims (9)

1. optical element encapsulating structure, comprise substrate and successively the interval be installed in electronic module, optical module and transport module on substrate, this electronic module and this optical module are electrically connected, this optical module is used for the conversion photosignal, this transport module is used for transmitting optical signal, this transport module comprises optical waveguide array and fiber optics, it is characterized in that: this optical waveguide array includes reflecting surface, this reflecting surface is positioned at the top of this optical module, and the light signal that this optical module sends can arrive this fiber optics through this reflecting surface change direction and transmit; This optical module can receive this fiber optics and change through this reflecting surface the light signal that direction passes over.
2. encapsulating structure as claimed in claim 1, it is characterized in that: this transport module also comprises fixedly array, fixedly array is fixed on this substrate, the parallel substrate of this optical waveguide array is installed in this fixedly on array, this optical waveguide array also comprises the bottom surface, parallel this substrate in this bottom surface, light signal can be from this bottom surface incident or outgoing.
3. encapsulating structure as claimed in claim 2, it is characterized in that: this optical waveguide array is roughly at right angles trapezoidal, this optical waveguide array also comprises transmission face, this transmission face has this both sides of the edge, bottom surface extension to be bent to form with this reflecting surface, this transmission face equals 90 degree with the angle of this bottom surface, and this transmission is in the face of accurate this fiber optics.
4. encapsulating structure as claimed in claim 3 is characterized in that: the angle of this reflecting surface and this bottom surface equals 45 degree.
5. encapsulating structure as claimed in claim 4, it is characterized in that: this transport module also comprises connector, and this connector is between this optical waveguide array and this fiber optics, and this connector one end is aimed at this transmission face, and the other end is aimed at and is connected this fiber optics.
6. encapsulating structure as claimed in claim 1, it is characterized in that: this electronic module and this optical module are electrically connected by routing.
7. encapsulating structure as claimed in claim 6, it is characterized in that: comprise the first electronic component and the second electronic component that are set up in parallel on this electronic module, this first electronic component is used for to this optical module transmission of electric signals, this second electronic component is used for receiving the electric signal that this optical module transmits, this first electronic component and this optical module are electrically connected by routing, and this second electronic component and this optical module are electrically connected by routing.
8. encapsulating structure as claimed in claim 1, it is characterized in that: this substrate comprises liner and fixed bed, this fixed bed is used for optical module is fixed in this liner between this liner and this optical module.
9. encapsulating structure as claimed in claim 1, it is characterized in that: be set side by side with light-emitting component and photo detector on this optical module, this light-emitting component is used for transferring electric signal to light signal and is passed to this reflecting surface, and this photo detector is used for transferring this transport module to electric signal through the light signal that this reflecting surface passes over.
CN2011104005072A 2011-12-06 2011-12-06 Optical element encapsulation structure Pending CN103149647A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106199854A (en) * 2015-05-25 2016-12-07 源杰科技股份有限公司 Optical connection module
CN112114406A (en) * 2017-02-24 2020-12-22 利派克株式会社 Slim connector plug and active optical cable assembly using same
CN112698452A (en) * 2019-10-22 2021-04-23 上海信及光子集成技术有限公司 Optical waveguide chip probe and reflective vertical optical coupling structure based on same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006011046A (en) * 2004-06-25 2006-01-12 Sony Corp Optical waveguide and its optical waveguide module, and optical transmission mode
US20070183709A1 (en) * 2006-02-09 2007-08-09 Fujitsu Component Limited Optical waveguide member, optical waveguide assembly, and optical module
CN101206288A (en) * 2006-12-22 2008-06-25 富士施乐株式会社 Optoelectric composite wiring module and information processing apparatus
CN101421652A (en) * 2006-04-27 2009-04-29 欧姆龙株式会社 Optical transmission module
CN102184916A (en) * 2010-01-08 2011-09-14 住友电气工业株式会社 Optical module and manufacturing method of the module

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006011046A (en) * 2004-06-25 2006-01-12 Sony Corp Optical waveguide and its optical waveguide module, and optical transmission mode
US20070183709A1 (en) * 2006-02-09 2007-08-09 Fujitsu Component Limited Optical waveguide member, optical waveguide assembly, and optical module
CN101421652A (en) * 2006-04-27 2009-04-29 欧姆龙株式会社 Optical transmission module
CN101206288A (en) * 2006-12-22 2008-06-25 富士施乐株式会社 Optoelectric composite wiring module and information processing apparatus
CN102184916A (en) * 2010-01-08 2011-09-14 住友电气工业株式会社 Optical module and manufacturing method of the module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106199854A (en) * 2015-05-25 2016-12-07 源杰科技股份有限公司 Optical connection module
CN112114406A (en) * 2017-02-24 2020-12-22 利派克株式会社 Slim connector plug and active optical cable assembly using same
CN112114406B (en) * 2017-02-24 2023-01-10 利派克株式会社 Connector plug
CN112698452A (en) * 2019-10-22 2021-04-23 上海信及光子集成技术有限公司 Optical waveguide chip probe and reflective vertical optical coupling structure based on same

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Effective date of registration: 20160122

Address after: 528437 Guangdong province Zhongshan Torch Development Zone, Cheung Hing Road 6 No. 222 north wing trade building room

Applicant after: Zhongshan yunchuang Intellectual Property Service Co.,Ltd.

Address before: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor

Applicant before: SCIENBIZIP CONSULTING (SHEN ZHEN) Co.,Ltd.

Effective date of registration: 20160122

Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor

Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) Co.,Ltd.

Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two

Applicant before: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) Co.,Ltd.

Applicant before: HON HAI PRECISION INDUSTRY Co.,Ltd.

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Application publication date: 20130612

RJ01 Rejection of invention patent application after publication