CN215575798U

CN215575798U - Tube shell packaging assembly and light emitting module

Info

Publication number: CN215575798U
Application number: CN202120681271.3U
Authority: CN
Inventors: 柯健; 代一凡
Original assignee: Wuhan Yusheng Photoelectric Co ltd
Current assignee: Wuhan Yusheng Photoelectric Co ltd
Priority date: 2021-04-02
Filing date: 2021-04-02
Publication date: 2022-01-18
Anticipated expiration: 2031-04-02

Abstract

The utility model provides a tube shell packaging assembly and a light emitting module, wherein the tube shell packaging assembly comprises a tube shell, at least one pin and at least one glass cup, wherein the pin is arranged in the glass cup in a penetrating way and packaged together with the glass cup; the tube shell is provided with through holes the number of which is the same as that of the glass cups; each glass cup allows at least one pin to be placed, and each glass cup is placed in the through hole and packaged together with the tube shell. According to the tube shell packaging assembly, the pins are used for realizing the electrical communication between the inside and the outside of the tube shell, the excellent performance of an optical device using the tube shell packaging assembly is guaranteed, meanwhile, compared with the tube shell packaging assembly using a gold finger, the distance between the pins is large and can be adjusted according to requirements, the welding process difficulty in photoelectric interconnection is small, the glass packaging process is relatively simple and low in difficulty, the product consistency is high, the product quality is guaranteed, and in addition, the cost is also reduced.

Description

Tube shell packaging assembly and light emitting module

Technical Field

The utility model relates to the technical field of optical devices, in particular to a tube shell packaging assembly and a light emitting module.

Background

The high-speed optical device is the most important component and the most core part of the high-speed optical module, and the current annual use amount of the matched optical module reaches the magnitude of tens of millions. Under the wave of the 5G era, the usage of optical modules is continuously increasing with the continuous updating of upgraded communication technologies. The performance of the optical module is directly determined by the performance of the optical device, the construction cost of the optical module is directly influenced by the manufacturing cost of the optical device, and the cost of the optical device is more than 70% of the cost of the whole optical module. Under the condition that cloud computing, internet of things, internet, data storage and the like have entered into daily life of common people, it is obvious that great challenges are provided for the performance and cost of an optical module, and especially for optical devices which account for more than 70% of the cost of the optical module, the high requirements are provided for the design of the optical devices by ensuring the excellent performance of the devices and controlling the manufacturing cost of the optical devices. The optical-electrical interconnection of the multi-channel optical device may bring signal attenuation and impedance abrupt change to the whole link, resulting in poor performance of the optical device and thus the optical module.

The block diagram of the conventional multi-channel optical device is shown in fig. 1, where 100 represents a gold finger, 200 represents a package, 300 represents a backlight detection module, 400 represents a laser, 500 represents a beam splitting lens, 600 represents a multiplexer, 700 represents an optical isolator, 800 represents an optical collimating lens, and 900 represents a fiber adapter. From the design block diagram, here, the optoelectronic interconnections inside and outside the optical device are mainly realized by matching the optoelectronic transmission and impedance performance of the links inside and outside the package through the package assembly formed by the gold finger 100 and the package 200. The package assembly is generally configured as follows: the gold finger 100 uses multilayer ceramic as a packaging material, wherein the multilayer ceramic is metalized and then welded with a metal case by a solder to form a final case packaging assembly. The problem of impedance sudden change can be solved to this tube encapsulation subassembly, but, the interval demand of radio frequency performance pad on the golden finger 100 is at tens microns, and the interval requirement is smart and little, and this greatly increased golden finger 100 circuit design and manufacturing process's the degree of difficulty, the uniformity of product is relatively poor, is difficult to ensure product quality.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, it is desirable to provide a package assembly for a semiconductor package to solve or partially solve the above problems, and the technical solution of the present invention is as follows:

in one aspect, the present invention provides a package assembly including a package, at least one pin, and at least one glass, wherein:

the pins are arranged in the glass cup in a penetrating way and are packaged together with the glass cup;

the tube shell is provided with through holes the number of which is the same as that of the glass cups;

each glass cup allows at least one pin to be placed, and each glass cup is placed in the through hole and packaged together with the tube shell.

Furthermore, at least two steps are arranged on the tube shell, a plurality of through holes are arranged on each step, the same type of glass cups are placed in the through holes of the same step, and pins in the same type of glass cups are used for transmitting signals of the same frequency band.

Furthermore, the through holes of the same step are divided into a plurality of rows which are arranged in a staggered mode.

Further, the pipe shell is provided with at least one mounting groove.

In another aspect, the present invention provides a light emitting module, which includes the above-mentioned package assembly, and a semiconductor cooler, an optical path transmission assembly, a ceramic substrate, and a light emitting assembly disposed on the ceramic substrate, wherein:

a ceramic substrate is placed above the semiconductor refrigerator;

the output end of the light-emitting component is a light path transmission component which is used for generating emitted light and collimating the emitted light into parallel light to enter the light path transmission component;

the input end of the light path transmission component is a light emitting component and is used for synthesizing multi-channel emitted light of the light emitting component into one path of light and transmitting the light.

Based on the technical scheme, compared with the prior art, the utility model has the beneficial effects that:

the utility model provides a tube shell packaging assembly which comprises a tube shell, at least one pin and at least one glass cup, wherein the pin is arranged in the glass cup in a penetrating way and packaged together with the glass cup; the tube shell is provided with through holes the number of which is the same as that of the glass cups; each glass cup allows at least one pin to be placed, and each glass cup is placed in the through hole and packaged together with the tube shell. According to the tube shell packaging assembly, the pins and the glass cup are packaged together, the glass cup and the tube shell are packaged together, the electrical communication between the inside and the outside of the tube shell is realized through the pins, the excellent performance of an optical device using the tube shell packaging assembly is guaranteed, meanwhile, compared with the tube shell packaging assembly using a gold finger, the distance between the pins is large and can be adjusted according to requirements, the welding process difficulty during photoelectric interconnection is small, the glass packaging process is relatively simple, the difficulty is low, the product consistency is high, the product quality is guaranteed, and in addition, the cost is also reduced.

Drawings

FIG. 1 is a schematic diagram of a high-speed optical transmitter module according to the background of the utility model;

fig. 2 is a schematic cross-sectional view of a package assembly according to one embodiment of the present invention;

fig. 3 is a bottom view of a package assembly of the package of the present invention;

fig. 4 is a schematic structural diagram of a light emitting module according to a second embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

Example one

The present embodiment proposes a package assembly of a package, as shown in fig. 2, comprising a package 10, at least one pin 20, at least one glass 30, wherein:

each pin 20 is arranged in one glass cup 30 in a penetrating way and is packaged with the glass cup 30 through high-temperature sintering.

The envelope 10 is provided with the same number of through holes 11 as the number of glasses 30.

Each glass 30 allows for the placement of at least one pin 20, the glasses 30 being placed in the through holes and encapsulated with the package 10 by high temperature sintering. As shown in fig. 3, one pin 20 or two pins 20 are disposed in each glass 30, but the number of pins 20 disposed in each glass 30 can be set according to the requirement.

In some embodiments, in order to ensure high reliability and stability of electrical connection of the package assembly of the package, a high frequency signal and a low frequency signal are arranged in layers, and this embodiment proposes a scheme, specifically, at least two steps are arranged on the package 10, each step is provided with a plurality of through holes, the same type of glass 30 is placed in the through holes of the same step, and the pins 20 in the same type of glass 30 are used for transmitting signals of the same frequency band. In the present embodiment, two steps are taken as an example, as shown in fig. 2, the pin 20 for transmitting high frequency signals is disposed on the first step 12 near the bottom of the package 10, and the pin 20 for transmitting common low frequency signals is disposed on the second step 13 of the package 10, so that the high frequency signals and the low frequency signals are layered, the interference between the high frequency signals and the low frequency signals can be reduced, and the high reliability and stability of the electrical connection of the package assembly of the package can be ensured.

In the actual packaging process, a large number of glass cups 30 may need to be placed on the same step, in order to ensure the space between the adjacent pins 20 so as to facilitate the welding of the pins 20, as shown in fig. 3, the through holes of the same step may be arranged in a multi-row staggered manner, so that the space utilization rate is improved, the space between the adjacent pins 20 can be increased without increasing the width of the tube 10, the welding difficulty can be reduced, and the product yield and reliability are improved.

In some embodiments, in order to ensure that the light beam centers of the devices related to each optical path are located on the same plane and meet the requirement of optical path focal length coupling, the bottom of the commonly used package casing is a flat rectangular box structure, and generally, a gasket or a substrate with a corresponding height is set for each device according to the actual height requirement to ensure that the optical path is located on the same plane, by adopting the method, a plurality of gaskets need to be set, and the positioning and mounting processes of each gasket are adopted, so that the material types and the cost are increased, the processes are complicated, and the production efficiency is low. The position and the depth of each mounting groove are set according to the optical path requirements of the devices placed on the mounting grooves, so that the light beam centers of the related devices of each optical path are positioned on the same plane and meet the optical path focal length coupling requirement. Specifically, a first mounting groove for mounting the semiconductor refrigerator is provided at the bottom of the housing near the first step, and a mounting groove for mounting the isolator is provided at the bottom of the housing near the adapter. During actual production, the device can be directly arranged in the corresponding mounting groove, the positioning is simple, the gasket material cost and the gasket positioning and mounting process are saved, and the production efficiency is high

The tube encapsulation subassembly that this embodiment provided, pin 20 is in the same place with the encapsulation of glass cup 30, glass cup 30 is in the same place with the encapsulation of tube 10, realize the inside and outside electric intercommunication of tube 10 through pin 20, when having ensured the good performance of the optical device who uses this tube encapsulation subassembly, for the tube encapsulation subassembly that uses the golden finger, interval between pin 20 is very big and can be adjusted according to the demand, the welding process degree of difficulty during the photoelectricity interconnection is little, and glass encapsulation process is simple relatively, the degree of difficulty is low, the product uniformity is higher, thereby the product quality is ensured, in addition, the cost is also reduced.

Example two

The present embodiment provides a light emitting module, as shown in fig. 4, including the package-on-package assembly 1 of the first embodiment, the semiconductor cooler 2 mounted on the package, the optical transmission assembly 3, the ceramic substrate 4, and the light emitting assembly 5 disposed on the ceramic substrate 4, wherein:

a ceramic substrate 4 is placed over the semiconductor cooler 2.

The output end of the light emitting component 5 is the light path transmission component 3, which is used for generating the emitted light and collimating the emitted light into parallel light to enter the light path transmission component 3. The light-emitting component 5 comprises a plurality of lasers 51, a backlight detection module 52 and a beam splitting lens 53, wherein the plurality of lasers 51 are attached to the ceramic substrate 4 in a linear array at a certain interval, the light-emitting surface end of the lasers 51 is the beam splitting lens 53, and the backlight surface end is the backlight detection module 52; the beam splitting lens 53 is used for converging the light beam emitted by the laser 51 into collimated light to enter the optical path transmission component 3; the backlight detection module 52 is configured to receive the backlight generated by the laser 51 and detect a corresponding backlight current.

The input end of the optical path transmission component 3 is a light emitting component 5, and is used for synthesizing multi-channel emitted light of the light emitting component 5 into one path of light and transmitting the light. Specifically, the optical path transmission component 3 includes a multiplexer 31, an optical isolator 32, an optical collimating lens 33, and an optical fiber connector 34, where: the input end of the multiplexer 31 is a beam splitting lens 53, and the output end is an optical isolator 32, which is used for combining the multi-channel emitted light emitted by the laser 51 into one path; the optical isolator, the optical collimating lens 33 and the optical fiber connector 34 are sequentially arranged, and the light paths are located on the same straight line.

The semiconductor refrigerator 2, the multiplexer 31, the optical isolator 32, the optical collimating lens 33 and the optical fiber connector 34 are respectively arranged in each mounting groove of the tube shell, and the positions and the depths of the mounting grooves ensure that the light beam centers of the devices are positioned on the same plane and meet the coupling requirement of the focal length of the light path.

According to the light emitting module provided by the embodiment, the tube shell packaging assembly is packaged with the glass cup through the pins, the glass cup is packaged with the tube shell, and the inside and outside of the tube shell are electrically communicated through the pins, so that the excellent performance of an optical device using the tube shell packaging assembly is guaranteed, meanwhile, compared with the tube shell packaging assembly using a gold finger, the space between the pins is large and can be adjusted according to requirements, the welding process difficulty during photoelectric interconnection is small, the glass packaging process is relatively simple and low in difficulty, the product consistency is high, the product quality is guaranteed, and the cost is reduced; in addition, the installation grooves arranged on the tube shell ensure that the light beam centers of the related devices of each optical path are positioned on the same plane and meet the requirement of optical path focal length coupling, and during actual production, the devices can be directly arranged in the corresponding installation grooves, so that the positioning of each device is simple, the cost is saved, and the production efficiency is improved.

In some embodiments, the optical transmission module further includes a ceramic circuit substrate 6 mounted on the package, in order to improve the high-frequency performance of the optical transmission module, the laser 51 and the ceramic circuit substrate 6 can be connected by gold wires, the length of the transmission line is shortened, and the impedance of the link is better controlled, so as to improve the high-frequency performance; in addition, the ceramic circuit board 6 and a pin for transmitting a high-frequency signal are soldered by eutectic soldering. Eutectic refers to a phenomenon in which eutectic fusion occurs at a relatively low temperature in a eutectic solder. The basic properties of eutectic alloys are: two different metals can form eutectic alloy according to a certain proportion at the temperature far lower than the respective melting point, the eutectic alloy is directly changed from solid state to liquid state, the eutectic alloy does not pass through the plastic stage, one liquid state simultaneously generates two solid state equilibrium reactions, the melting temperature is called eutectic temperature, and the temperature is far lower than the melting point of any metal in the alloy. The eutectic welding has the advantages of high mechanical strength, small thermal resistance, good stability, high reliability and the like, and can ensure high-frequency performance.

In some embodiments, the light emitting module further comprises a PCBA board 7 placed on the package, the PCBA board 7 being connected with the pins. A PCB (printed Circuit board) is called a "printed Circuit board" and is made of an epoxy glass resin material, and a chip or other chip component is attached to the PCB. The PCBA board 7 may be understood as a finished circuit board, i.e. the PCB is empty and finished by SMT and DIP-board assembly processes before the PCBA board 7 is calculated.

In some embodiments, the backlight detection module 52 employs a large-light-sensitive-surface monitor photodiode, which can receive light over a larger area, and has higher sensitivity of backlight detection, thereby improving the performance of the light emitting module. By large photosurface is meant herein a photosurface size in the range of 50 x 100 μm to 70 x 150 μm.

In some embodiments, the beam splitting lens 53 and the optical collimating lens 33 employ low attenuation glass lenses. The low-attenuation glass lens can reduce the optical signal attenuation of the link and ensure the excellent performance of the optical transmission module.

In the foregoing detailed description, various features are grouped together in a single embodiment for the purpose of streamlining the disclosure. This method of disclosure is not to be interpreted as reflecting an intention that the claimed embodiments of the subject matter require more features than are expressly recited in each claim. Rather, as the following claims reflect, invention lies in less than all features of a single disclosed embodiment. Thus, the following claims are hereby expressly incorporated into the detailed description, with each claim standing on its own as a separate preferred embodiment of the utility model.

What has been described above includes examples of one or more embodiments. It is, of course, not possible to describe every conceivable combination of components or methodologies for purposes of describing the aforementioned embodiments, but one of ordinary skill in the art may recognize that many further combinations and permutations of various embodiments are possible. Accordingly, the embodiments described herein are intended to embrace all such alterations, modifications and variations that fall within the scope of the appended claims. Furthermore, to the extent that the term "includes" is used in either the detailed description or the claims, such term is intended to be inclusive in a manner similar to the term "comprising" as "comprising" is interpreted when employed as a transitional word in a claim. Furthermore, any use of the term "or" in the specification of the claims is intended to mean a "non-exclusive or".

Claims

1. A tube housing package assembly comprising a tube housing, at least one pin, at least one glass, wherein:

2. The package assembly of claim 1, wherein the package has at least two steps, each step has a plurality of through holes, the through holes of the same step are disposed with the same type of glass, and the pins in the same type of glass are used for transmitting signals of the same frequency band.

3. The package of claim 2 wherein the vias of the same step are staggered in a plurality of rows.

4. The package assembly of claim 1, wherein the package is provided with at least one mounting slot.

5. A light emitting module comprising the package assembly of any one of claims 1 to 4, and a semiconductor cooler, an optical path transmission assembly mounted on the package, a ceramic substrate, and a light emitting assembly disposed on the ceramic substrate, wherein:

a ceramic substrate is placed above the semiconductor refrigerator;

6. The optical transmit module of claim 5 wherein the optical transmission components comprise a multiplexer, an optical isolator, an optical collimating lens, a fiber optic connector, wherein:

the input end of the multiplexer is a light splitting lens, and the output end of the multiplexer is an optical isolator and is used for combining multi-channel emitted light emitted by the laser into one path;

the optical isolator, the optical collimating lens and the optical fiber connector are sequentially arranged, and the light paths are located on the same straight line.

7. The optical transmit module of claim 5, wherein the light emitting assembly comprises a plurality of lasers, a backlight detection module, and a beam splitting lens, wherein:

the plurality of lasers are attached to the ceramic substrate in a linear array mode at a certain interval, the light-emitting surface end of each laser is a light splitting lens, and the backlight surface end of each laser is a backlight detection module;

the beam splitting lens is used for converging light beams emitted by the laser into collimated light which enters the light path transmission component;

and the backlight detection module is used for receiving the backlight generated by the laser and detecting the corresponding backlight current.

8. The optical transmit module of claim 7, further comprising a ceramic circuit substrate mounted on the package, wherein the ceramic circuit substrate is connected to the laser by gold wire bonding, and wherein the ceramic circuit substrate is eutectic bonded to the lead for transmitting the high frequency signal.

9. The light emitting module of claim 7, wherein the backlight detecting module employs a large-light-sensitive-surface monitor photodiode.

10. An optical transmit module as claimed in claim 6 or 7, wherein the beam splitting lens and the optical collimating lens are low attenuation glass lenses.