CN109844407A - Utilize the encapsulating structure of the wavelength-division multiplex array receiver module of stepped construction - Google Patents
Utilize the encapsulating structure of the wavelength-division multiplex array receiver module of stepped construction Download PDFInfo
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- CN109844407A CN109844407A CN201780064930.5A CN201780064930A CN109844407A CN 109844407 A CN109844407 A CN 109844407A CN 201780064930 A CN201780064930 A CN 201780064930A CN 109844407 A CN109844407 A CN 109844407A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29346—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by wave or beam interference
- G02B6/29361—Interference filters, e.g. multilayer coatings, thin film filters, dichroic splitters or mirrors based on multilayers, WDM filters
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T19/00—Manipulating 3D models or images for computer graphics
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T19/00—Manipulating 3D models or images for computer graphics
- G06T19/006—Mixed reality
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- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
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- General Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Theoretical Computer Science (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
Abstract
It the present invention relates to the use of the encapsulating structure of the wavelength-division multiplex array receiver module of stepped construction, relate more specifically to be not required to individually hermetically sealed, the encapsulating structure of compact dimensioning can be fabricated to, comprising: light receiver, for connecting the optical connector and optical receiver module that are located at optical link end；Received optical signal is separated into after the optical signal of each wavelength to reduce the loss of light and reducing the size of inverse multiplexing element, assembles and reflect by optical package portion；Preposition amplifier element portion, reception are transformed to electric signal after the optical signal that the optical package portion is reflected；Printed circuit board, for external circuit will to be transmitted to by the electric signal of the preposition amplifier element portion transformation；First silicon substrate assembles the constituent element in the optical package portion；And second silicon substrate, assemble the constituent element in the preposition amplifier element portion；Make to form stepped construction while its sealing by bonding is carried out by solder bonding between first silicon substrate and the two sides of the second silicon substrate.
Description
Technical field
It the present invention relates to the use of the encapsulating structure of the wavelength-division multiplex array receiver module of stepped construction.
More particularly, to the encapsulating structure of the wavelength-division multiplex array receiver module using stepped construction, the structure is not
Need individually it is hermetically sealed, optical receiver module construction packages can be structured as stepped construction and be fabricated to compact ruler
It is very little.
In addition, relating to the use of the encapsulating structure of the wavelength-division multiplex array receiver module of stepped construction, the structure is by falling
Bonding process is filled, upper and lower part silicon substrate aligned position is bonded, does not need to prepare the individual structure for monitoring in real time and assembling
At element, so that it may the inside of seal modules.
Also, the encapsulating structure for relating to the use of the wavelength-division multiplex array receiver module of stepped construction, in silicon substrate
Groove portion alignment and assembling each component, prevent external force cause constituent element damage and aligned condition deformation etc., Ke Yiti
High mechanicalness durability.
Background technique
The smart phone game based on augmented reality (AR) causes upsurge, this game in worldwide recently
Type also gradually diversely increase.But in order to drive augmented reality (AR) content, a considerable amount of data communications can be generated
Amount, causes excess load to system.Nevertheless, the method that can giocoso enjoy respective service relies on " optic communication " technology.
It is the communication hand for replacing existing electric signal and utilizing light as the optic communication for having one of wireless communication technique
Section is the technology that can be transmitted a large amount of data with hypervelocity un-interrupted.
As Internet penetration, internet average speed and broadband internet first internet power South Korea,
This is intended to the technology used of course, but is the cause to attract attention in the also insufficient country of the communications infrastructure.
There is the optical communication technique for reaching 10Gbps or more transmit capacity using an optical fiber by commercialization, has used recently
The optic communication of wavelength-division multiplex (WDM, WavelengthDivisionMultiplexing) mode, that is, will be passed in an optical fiber
Sending speed is that the optical signal of the mutually different wavelength of 10Gbps or 25Gbps is multiplexed, the data of transmission tens to 100Gbps,
Also, in order to realize more high transmission speed, exploitation is still continuing.
In the case where at most using the company, Large-Scale Interconnected net portal website of optical communication technique, run in large-scale data
The heart, in order to meet the transmission speed of several hundred Gps, data center is compactly connected with great scale.In order to improve in this data
The density of the optical communications module of the heart, the size for reducing optical communications module are critically important.
Existing technical literature discloses an example of this technology.
A kind of transmitting path expander is disclosed in following existing technical literatures characterized by comprising arrangement board, tool
There are setting unit, the first datum hole and the second datum hole, the setting unit is installed in setting position for optical element to be arranged in
On substrate, second datum hole and first datum hole are formed across the first interval；Optical fiber fixed block, be fixedly installed with
The optical element carries out the optical fiber of optic communication, has the first column for being inserted in first datum hole and is inserted in described second
Second column of datum hole；And shell, surround the optical fiber fixed block and the arrangement board；Second column is than described first
Column is inserted in second datum hole in the insertion more loose ground of first datum hole, and the setting position is located at by described
On first reference line of the first datum hole and second datum hole, with first reference line report to the leadship after accomplishing a task and from the first datum hole every
Second interval position, determined by being located at second reference line on opposite of second datum hole across first datum hole
It is fixed.
But the prior art as described above, the shell of high price is set to surround optical fiber fixed block and arrangement board, with
In the case where the structure of shell sealing, needs one by one to assemble a variety of optical element components one by one and pasted arrangement, so
There is the problem of complex procedures price rising.
Summary of the invention
Technical task
The present invention is proposed to solve the problems, such as described above, it is intended that providing a kind of utilize is laminated knot
The encapsulating structure of the wavelength-division multiplex array receiver module of structure, the structure do not need individually it is hermetically sealed, by optical receiver module
Encapsulating structure turns to stepped construction, reduces length, height and width, can be fabricated to compact dimensioning.
In addition, the present invention provides a kind of encapsulating structure of wavelength-division multiplex array receiver module using stepped construction, it should
Structure, by upper and lower part silicon substrate aligned position and bonding, does not need to prepare for real time monitoring and group by flip-chip bonded process
The individual constituent element of dress, can be with the inside of seal modules.
Also, the present invention provides a kind of encapsulating structure of wavelength-division multiplex array receiver module using stepped construction, should
Structure prevents external force from causing damage and the alignment shape of constituent element since each component is aligned and assembled in the slot of silicon substrate
State deformation etc., can be improved mechanicalness durability.
Problem solution
In order to achieve the object, the encapsulation of the wavelength-division multiplex array receiver module according to the present invention using stepped construction
Structure is characterised by comprising: optical link 110, for connecting the optical connector and light-receiving mould that are located at optical link end
Block；Optical package portion 120 will connect to reduce the loss of light and reducing the size of inverse multiplexing element from the optical link 110
The optical signal of receipts is separated into after the optical signal of each wavelength, and each optical signal of separation is assembled and reflected；Preposition amplifier element portion
130, reception is transformed to electric signal after the optical signal that the optical package portion 120 is reflected；Printed circuit board 140, being used for will
External circuit is transmitted to by the electric signal that the preposition amplifier element portion 130 converts；First silicon substrate 150, assembles the light
Learn the constituent element of encapsulation part 120；And second silicon substrate 160, assemble the constituent element in the preposition amplifier element portion 130；It will
It is bonded be bonded by solder 170 between first silicon substrate 150 and the two sides of the second silicon substrate 160 and makes the same of its sealing
When form stepped construction.
In addition, which is characterized in that the optical link 110, comprising: socket 111, with the light for being formed in optical link end
Fiber connector combines；Becket 112 is aligned light positioned at the inner space of the socket；Tubular shell 113 is located at described
Between socket and becket；And gradient-index lens 114 will enter positioned at the rear end side of the becket and the inside of socket
The dispersed light penetrated is transformed to directional light.
In addition, which is characterized in that the optical package portion 120 includes: glass blocks 121, is optical signal inverse multiplexing element；Nothing
Reflectance coating coating 122 is formed in the one side of the glass blocks, passes through optical signal；Reflectance coating coating 123 is formed in described
The one side of glass blocks, reflected light signal；Thin Film Filter 124 is being formed with the non reflecting film coating and reflectance coating coating
The another side of the glass blocks formed at certain intervals, pass through the wavelength of corresponding frequency band；Reflecting mirror 125, will be from institute
State Thin Film Filter separation and the directional light of horizontal divergence vertical transitions in downward direction；And array lens 126, it is located at the reflection
The directional light reflected from the reflecting mirror is transformed to converging light by the downside of mirror.
In addition, which is characterized in that the preposition amplifier element portion 130 includes: array photodetector 131, and detection is based on
The electric signal of the converging light of diverging；The preposition amplifier element 132 of array, the electric signal that will be detected from the array photodetector
Amplification output；The signal of amplification is transmitted to the printed circuit board 140 with metal sealing by via hole 133；And lead 134,
The array photodetector and the preposition amplifier element of array are connected, the preposition amplifier element of the array and via hole is connected and passes
The number of delivering letters.
In addition, which is characterized in that the non reflecting film coating 122 and reflectance coating coating 123 are formed in the glass blocks 121
One side, differentiation be formed as non reflecting film coating and reflectance coating coating, the non reflecting film coating is formed in the glass of light incidence
The presumptive area of glass block, the reflectance coating coating are formed in the region being formed with other than the region of the non reflecting film coating.
In addition, which is characterized in that first silicon substrate 150 is formed with the structure for assembling the optical package portion 120
At the groove portion of element, it is aligned and is bonded by flip-chip bond process.
In addition, which is characterized in that the array lens 126 are integrally formed at side corresponding with the Thin Film Filter 124
To reflecting mirror 125 one side or the reflecting mirror bottom surfaces.
In addition, which is characterized in that be formed on second silicon substrate 160 for assembling the preposition amplifier element portion
The constituent element of the groove portion of 130 constituent element, preposition amplifier element portion is bonded with defined pattern by automatic bonding process
For small chip bonding and wire bonding.
In addition, which is characterized in that first silicon substrate 150 and the second silicon substrate 160 form top by deep etching
Open groove portion 180 forms mounting groove 181 to place one chip in constituent element, described by dry etching process
The lower part side of groove portion forms via hole 133.
The effect of invention
As described above, the encapsulating structure of the wavelength-division multiplex array receiver module according to the present invention using stepped construction,
It in order to quickly connect various data, does not need individually hermetically sealed, optical receiver module encapsulating structure is turned into stepped construction, with
Just the scale of data center is big and optical fiber can be connected closely, and having can reduce length, height and width, is fabricated to compact
The effect of size.
In addition, upper and lower part silicon substrate is passed through flip-chip bonded technique aligned position and is bonded, do not need to prepare for real-time
The individual constituent element of monitoring and assembling, can be improved production efficiency, have the multiple chips being sealed in silicon substrate
Effect.
In addition, preventing the damage of the component parts because of external force with each component parts is arranged and installed in the slot of silicon substrate
Ordered state deformation etc. is injured, has the effect of greatly improving mechanicalness durability.
Detailed description of the invention
Fig. 1 is the encapsulating structure for indicating the wavelength-division multiplex array receiver module according to the present invention using stepped construction
The plan view and sectional view of stepped construction.
Fig. 2 is the encapsulating structure for indicating the wavelength-division multiplex array receiver module according to the present invention using stepped construction
The sectional view of the moving process of optical signal.
Fig. 3 is the encapsulating structure for indicating the wavelength-division multiplex array receiver module according to the present invention using stepped construction
The sectional view of the embodiment of array lens.
Fig. 4 is the encapsulation knot for illustrating the wavelength-division multiplex array receiver module according to the present invention using stepped construction
The figure of the assembling procedure of structure.
Fig. 5 is the encapsulating structure for indicating the wavelength-division multiplex array receiver module according to the present invention using stepped construction
The figure of the other embodiments of silicon substrate.
Fig. 6 is the figure for indicating the variation of the silicon substrate according to Fig. 5.
Specific embodiment
Term and word used in present specification and claims should not necessarily be limited by the meaning on usual or dictionary to solve
It releases, it, should based on applicant in order to illustrate that the invention of oneself can suitably define the principle of the concept of term with optimal method
It is construed to meet the meaning and concept of technical idea of the invention.
Therefore, structure shown in the embodiment and attached drawing recorded in this specification is only most preferred implementation of the invention
Example, does not represent whole technical ideas of the invention, it should be understood that in the presence of can replace the more of them at the time of the application proposes
The equivalent and variation of sample.
In the following, in order to protrude purport of the invention, statement is to unnecessary item in advance before being described with reference to
The known features that those of ordinary skill in the art can apparently add not are illustrated or are illustrated.
Fig. 1 is the encapsulating structure for indicating the wavelength-division multiplex array receiver module according to the present invention using stepped construction
The plan view and sectional view of stepped construction.
As shown in fig. 1, the encapsulating structure of the wavelength-division multiplex array receiver module according to the present invention using stepped construction
It include: optical link 110, optical package portion 120, preposition amplifier element portion 130, printed circuit board 140, the first silicon substrate
150 and second silicon substrate 160.
Receiving unit 110 includes: the socket 111 in conjunction with the optical fiber connector for being formed in optical link end；It is inserted positioned at described
The becket 112 of the inner space alignment light of seat；Columnar casing 113 between the socket and becket；And
Positioned at the rear end side of the becket and the inside of socket, incident dispersed light is transformed to the gradient-index lens of directional light
114。
At this moment, the becket 112, casing 113 and gradient-index lens 114 have each other in the inside of socket 111
Identical central axis.
Especially, the gradient-index lens for forming directional light can be replaced with the convex lens with appropriate focal length.
The optical link 110 with only by the existing receptacle portion that becket and casing are constituted compared with, be characterized in that chasing after
Add and insert gradient-index lens 114, gradient-index lens or convex lens have the function that dispersed light is transformed to directional light
Energy.
It can not needed individually about the focal position for being used to form perfect directional light using gradient-index lens 114
Active alignment in the case where, more perfect directional light can be formed.
In addition, gradient-index lens 114, which are used, does not need inside with columnar structured socket 111 and has phase
With columnar structured becket 112 be individually aligned process and be inserted into the structure for being installed on socket 111, can only with
Mechanicalness precision is fixed on accurate position.
Therefore, optical link 110 according to the present invention, can eliminate and be used in existing optical receiver module by using
It forms the aspherical convex lens of directional light and the complexity of active alignment mode bring assembling procedure and production qualification rate is low
The problem of, the active alignment mode measures light detection member to make the aspherical convex lens be located at accurate focal length on one side
The position that the photoelectric current of part finds aspherical convex lens on one side is fixed.
On the other hand, the optical package portion 120, will be from order to reduce the loss of light and reduce the size of inverse multiplexing element
The received optical signal of the optical link 110 is separated into after the optical signal of each wavelength, assembles and each light of reflection separation is believed
Number.
The optical package portion 120 includes: the glass blocks 121 as optical signal inverse multiplexing element；It is formed in the glass
The one side of block and the non reflecting film coating 122 for passing through optical signal；It is formed in the one side of the glass blocks and makes optical signal
The reflectance coating coating 123 of reflection；In the other side for the glass blocks for being formed with the non reflecting film coating and reflectance coating coating
The Thin Film Filter 124 that face forms at certain intervals and passes through the wavelength of corresponding frequency band；It will be from the Thin Film Filter point
From and the reflecting mirror 125 of the directional light of horizontal divergence vertical transitions in downward direction；And positioned at the reflecting mirror downside and make from
The directional light of the reflecting mirror reflection is transformed to the array lens 126 of converging light.
The non reflecting film coating 122 and reflectance coating coating 123 are formed in the one side of the glass blocks 121, distinguish shape
As non reflecting film coating and reflectance coating coating, the non reflecting film coating is formed in the presumptive area of the glass blocks of light input,
The reflectance coating coating is formed in the region except the region for being formed with the non reflecting film coating.
The non reflecting film coating 122 has will be by anti-by glass blocks 121 by the incident light of gradient-index lens 114
Penetrate the function of bring minimization of loss, reflectance coating coating 123 have will be reflected from the Thin Film Filter for being formed in opposite side and
The light of return is incident on the function of Thin Film Filter after reflecting again.
That is, the optical package portion 120 can be made by following process: in the glass with defined refractive index and thickness
One region processing non reflecting film coating 122 of glass block one side, the same face other region processing reflectance coating coating 123 it
Afterwards, it cuts after making it have scheduled size, it is flat with accurate angle grinding to be that its section is formed for the glass blocks 121 cut
The form of row quadrangle, multiple Thin Film Filters 124 of pre-production are successively pasted onto glass blocks be formed with coating portion
The corresponding another side of one side scheduled position.
The reflecting mirror 125 is the array light detection for the optical signal from Thin Film Filter 124 to be reflected into lower layer
The structure of element 131, (about 45 degree) are formed slopely at a certain angle, can be formed as being plated with the stick of reflectance coating in one side
The mirror form of form.
The array lens 126 are that the lens that the diverging light reflected in this way is transformed into converging light are integrated into a component
Made of, by the way that reflecting mirror 125 and array lens 126 are combined into one, it is possible to reduce unnecessary to stop long-pending and space.But
Being can be two separate parts by array lens portion and mirror part separation as needed.
Fig. 2 is the encapsulating structure for indicating the wavelength-division multiplex array receiver module according to the present invention using stepped construction
The sectional view of the moving process of optical signal；Fig. 3 is to indicate according to the present invention to connect using the wavelength-division multiplex array light of stepped construction
Receive the sectional view of the embodiment of the array lens of the encapsulating structure of module.
As seen in figures 2 and 3, the array lens 126 can be integrally formed at side corresponding with the Thin Film Filter 124
To reflecting mirror 125 one side or the reflecting mirror bottom surfaces.
It is unrelated with the sequence of the reflecting mirror 125 and array lens 126, according to the position of array lens 126, the first silicon substrate
The shape of plate 150 can change.
(a) in the case where, when array lens 126 are located at the lower part of reflecting mirror 125, in the first silicon substrate 150, in spite of
Through the slot required for placing array lens 126.
(b) it in the case where, when array lens 126 are located at the one side of reflecting mirror 125, is not needed in the first silicon substrate 150
For placing the slot of array lens 126, but the position of reflecting mirror 126 and array lens 126 may change.
On the other hand, the preposition amplifier element portion 130 includes: the array for detecting the electric signal of the converging light based on diverging
Photodetector 131；By the preposition amplifier element of array of the electric signal detected from the array photodetector amplification output
132；With metal sealing, the signal of amplification is transmitted to the via hole 133 of the printed circuit board 140；Connect the array light
Detecting element and the preposition amplifier element of array, connecting the preposition amplifier element of the array and preposition transmission groove makes drawing for signal flow
Line 134.
The array photodetector 131, which refers to, has the function of detecting the element that optical signal is transformed to electric signal, as
Representative has the avalanche photodide (APD) etc. of PIN photodiode (PIN-PD) or the enlarging function with optical signal.
The array photodetector 131 is formed in a semiconductor substrate by the way that multiple element is made into single component
On, have the advantages that the alignment of each photodetector is easy.
The preposition amplifier element 132 of array is amplified by the electric signal that will be transmitted from array photodetector 131, can choose
Signal is adjusted.
The signal of amplification is transmitted to printed circuit board 140 by the via hole 133, is at this moment being formed in the second silicon substrate
While 160 slot is sealed, metal can be filled up in via hole, to transmit electric signal.
The lead 134, which has, is electrically connected respectively to battle array for array photodetector 131 and the preposition amplifier element 132 of array
The function of preposition amplifier element 132 and via hole 133 is arranged, can be bonded by wire bonding (Wire Bonding) process.
Here, lead-in wire bonding process is the process in the attachment of electrodes lead of component etc., it is in the microballoon being heated
(Pellet) method that transient heating compresses after lead is put on.
On the other hand, it in the first silicon substrate 150 of the constituent element for assembling the optical package portion 120, places
Glass blocks 121, Thin Film Filter 124, reflecting mirror 125 and the array lens of the fixed constituent element as optical package portion 120
126, to form the groove portion (not shown) for carrying out aligned in position and fixation for placing each component, etching can be used
(Etching) method is processed.
First silicon substrate can form a certain size perforative slot in position corresponding with array lens, but
When communicating optical signals, the wavelength of light can by silicon, so with slot through whether it is unrelated.At this moment, pass through first silicon substrate
In the case where plate communicating optical signals, in order to minimize the loss of optical signal, areflexia can be plated on the surface of the first silicon substrate
Film.
Especially, by being formed with the first silicon substrate 150 of the groove portion of alignment and placement for each component, each structure
At array lens 126 in element by flip-chip bonded (Flip Chip Bonding) process alignment bonding, do not need to execute existing
Active alignment in technology only can carry out aligned in position with mechanicalness precision.
Existing optic communication letter module when assemble constituent element, every time assembling and while arranging each component require into
Row monitoring confirmation angle, therefore there is the problems such as productivity decline, price increase, but light is assembled by flip chip bonding process
When communication module, the dynamic real time monitoring of the angle for being directed at directional light is not needed.
In addition, do not need to prepare the individual constituent element for angular adjustment and installation in the case where reflecting mirror 125,
So reducing production process time and expense, production efficiency can be improved.
In addition, the structure because of external force can be prevented by arranging and placing each component parts in the slot of the first silicon substrate 150
Deformed at the damage of element and ordered state etc., the mechanical endurance in optical package portion 120 can also be improved.
On the other hand, the second silicon substrate 160 for assembling multiple constituent elements in the preposition amplifier element portion 130 is located at institute
State the lower part of the first silicon substrate 160, in order to formed multiple constituent elements for placing the preposition amplifier element portion respectively into
Row aligned in position and the groove portion of fixation (not shown) can use etching (Etching) method processing.
It is viscous with small chip bonding and wire bonding by automatic bonding process with defined pattern on second silicon substrate
Connect multiple constituent elements in preposition amplifier element portion.
Multiple constituent elements in preposition amplifier element portion are aligned and placed by the groove portion in second silicon substrate 160,
Damage and the ordered state deformation etc. of the component parts because of external force are prevented, the machinery that can also improve preposition amplifier element portion is durable
Property.
Especially, in order to assemble the second silicon substrate and the first silicon substrate, in the top two sides of the second silicon substrate, pass through weldering
Material 170 bonding and be bonded and constitute stepped construction, the integrated setting preposition amplifier element portion 130 on second silicon substrate
Multiple constituent elements, integrated setting optical package portion 120 on first silicon substrate.
As described above, pass through flip-chip process aligned position and be bonded first silicon substrate and the second silicon substrate, from
Optical receiver module encapsulating structure is just turned into stepped construction without individually hermetically sealed, reduces length, height and width,
It can be not only fabricated to compact dimensioning, the electricity on the second silicon substrate can be assembled in from outer protection with seal modules inside
Sub- chip.
Fig. 4 is the encapsulation knot for illustrating the wavelength-division multiplex array receiver module according to the present invention using stepped construction
The figure of the assembling procedure of structure.
As shown in figure 4, the encapsulating structure of the wavelength-division multiplex array receiver module according to the present invention using stepped construction,
If completing the integration in preposition amplifier element portion 130, the top of the second silicon substrate 160 is pasted by brazing metal 170, with
One silicon substrate 150 is adhesively fixed.At this moment, the first, second silicon substrate utilizes flip-chip bonded process, top and the bottom can be aligned solid
It is fixed.
Be sealed be because are as follows: optical package portion 120 with whether there is or not sealing is unrelated, be assembled with array photodetector 131 and
The sealing of second silicon substrate 160 of the preposition amplifier element 132 of array and the relationship of disqualification rate are most close.
Therefore, it is sealed by the outer periphery along first, second silicon substrate with brazing metal, it is not necessary to be put into individually
The encapsulation sealed in also there is sealing effect, it is possible to reduce volume there is price also to become just with the increase of qualification rate
Suitable effect.
Fig. 5 is the encapsulating structure for indicating the wavelength-division multiplex array receiver module according to the present invention using stepped construction
The figure of the other embodiments of silicon substrate；Fig. 6 is the figure for indicating the variation of the silicon substrate according to Fig. 5.
As shown in figure 5, first silicon substrate 150 and the second silicon substrate 160 pass through deep etching (deep grove
Etching the open groove portion 180 in top) is formed, placing groove 181 is formed by dry etching process, is constituted so as to be arranged
The chip of one of element can form via hole 133 in the lower part side of the groove portion.
Therefore, the type of the constituent element according to assembling on a silicon substrate and position, can be used via hole, such as Fig. 6 institute
Show, silicon substrate can also be used as lid.
On the other hand, material circumstance of the invention is only illustrated above with Fig. 1 to figure, due to can be in its technical scope
The interior design that can carry out multiplicity, is obvious the present invention is not limited to the composition of Fig. 1 to Fig. 6 and function.
In addition, the method that multiplexing is utilized for the multiple wavelength of first use in stepped construction according to the present invention, but
Be as needed, it is unrelated with structure, using independent structure or the structure of array form, therefore be not particularly limited.
Claims (9)
1. a kind of encapsulating structure of wavelength-division multiplex (WDM) array receiver module using laminated construction, which is characterized in that packet
It includes:
Optical link (110), for connecting the optical connector and optical receiver module that are located at optical link end；
It optical package portion (120) will be from the optical link to reduce the loss of light and reducing the size of inverse multiplexing element
(110) received optical signal is separated into after the optical signal of each wavelength, and each optical signal of separation is assembled and reflected；
Preposition amplifier element portion (130) receives the optical signal reflected from the optical package portion (120) and is transformed to telecommunications later
Number；
Printed circuit board (140), for external electrical will to be transmitted to by the electric signal of preposition amplifier element portion (130) transformation
Road；
First silicon substrate (150) assembles the constituent element of the optical package portion (120)；And
Second silicon substrate (160) assembles the constituent element of the preposition amplifier element portion (130)；
It is bonded solder (170) are passed through between first silicon substrate (150) and the two sides of the second silicon substrate (160)
Make to form stepped construction while its sealing.
2. utilizing the encapsulating structure of the wavelength-division multiplex array receiver module of laminated construction, feature as described in claim 1
It is,
The optical link (110) includes:
Socket (111), in conjunction with the optical fiber connector for being formed in optical link end；
Becket (112) is aligned light positioned at the inner space of the socket；
Tubular shell (113), between the socket and becket；And
Gradient-index lens (114) convert incident dispersed light positioned at the rear end side of the becket and the inside of socket
For directional light.
3. utilizing the encapsulating structure of the wavelength-division multiplex array receiver module of laminated construction, feature as described in claim 1
It is,
The optical package portion (120) includes:
Glass blocks (121) is optical signal inverse multiplexing element；
Non reflecting film coating (122), is formed in the one side of the glass blocks, passes through optical signal；
Reflectance coating coating (123), is formed in the one side of the glass blocks, reflected light signal；
Thin Film Filter (124), in the other side for the glass blocks for being formed with the non reflecting film coating and reflectance coating coating
Face is formed at certain intervals, passes through the wavelength of corresponding frequency band；
Reflecting mirror (125) will separate and the directional light of horizontal divergence vertical transitions in downward direction from the Thin Film Filter；And
The directional light reflected from the reflecting mirror is transformed to assemble by array lens (126) positioned at the downside of the reflecting mirror
Light.
4. utilizing the encapsulating structure of the wavelength-division multiplex array receiver module of laminated construction, feature as described in claim 1
It is,
The preposition amplifier element portion (130) includes:
Array photodetector (131) detects the electric signal of the converging light based on diverging；
The electric signal detected from the array photodetector is amplified and is exported by the preposition amplifier element of array (132)；
The signal of amplification is transmitted to the printed circuit board (140) with metal sealing by via hole (133)；And
Lead (134) connects the array photodetector and the preposition amplifier element of array, connects the preposition amplification member of the array
Part and via hole and transmit signal.
5. utilizing the encapsulating structure of the wavelength-division multiplex array receiver module of laminated construction, feature as claimed in claim 3
It is,
The non reflecting film coating (122) and reflectance coating coating (123) are formed in the one side of the glass blocks (121), distinguish
Be formed as non reflecting film coating and reflectance coating coating, the non reflecting film coating is formed in the fate of the glass blocks of light incidence
Domain, the reflectance coating coating are formed on the region other than the region of the non reflecting film coating.
6. utilizing the encapsulating structure of the wavelength-division multiplex array receiver module of laminated construction, feature as described in claim 1
It is,
It is formed with the groove portion of the constituent element for assembling the optical package portion (120) on first silicon substrate (150), leads to
Cross flip-chip bonded process alignment bonding.
7. utilizing the encapsulating structure of the wavelength-division multiplex array receiver module of laminated construction, feature as claimed in claim 3
It is,
The array lens (126) are integrally formed at the reflecting mirror (125) in direction corresponding with the Thin Film Filter (124)
The bottom surfaces of one side or the reflecting mirror.
8. utilizing the encapsulating structure of the wavelength-division multiplex array receiver module of laminated construction, feature as described in claim 1
It is,
The slot of the constituent element for assembling the preposition amplifier element portion (130) is formed on second silicon substrate (160)
Portion, the constituent element in preposition amplifier element portion are that small chip bonding and lead connect by automatic bonding process bonding with defined pattern
It closes.
9. utilizing the encapsulating structure of the wavelength-division multiplex array receiver module of laminated construction, feature as described in claim 1
It is,
First silicon substrate (150) and the second silicon substrate (160) form the groove portion (180) that top opens by deep etching,
Mounting groove (181) are formed to place the chip of one of constituent element, in the lower part side shape of the groove portion by dry etching process
At via hole (133).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2016-0136045 | 2016-10-19 | ||
| KR1020160136045A KR101968292B1 (en) | 2016-10-19 | 2016-10-19 | Package structure of wavelength multiplexing array optical receiving module using laminated structure |
| PCT/KR2017/007213 WO2018074704A1 (en) | 2016-10-19 | 2017-07-06 | Package structure using stacked structure for wavelength multiplexing array optical receiver module |
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| Publication Number | Publication Date |
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| CN109844407A true CN109844407A (en) | 2019-06-04 |
| CN109844407B CN109844407B (en) | 2021-01-29 |
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| CN201780064930.5A Active CN109844407B (en) | 2016-10-19 | 2017-07-06 | Packaging structure of wavelength division multiplexing array light receiving module using laminated structure |
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| Country | Link |
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| KR (1) | KR101968292B1 (en) |
| CN (1) | CN109844407B (en) |
| WO (1) | WO2018074704A1 (en) |
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| CN113759473B (en) * | 2020-06-05 | 2022-12-30 | 华为技术有限公司 | Transmitting-receiving optical assembly, electronic equipment and optical communication system |
| CN112003669B (en) * | 2020-07-23 | 2024-03-08 | 湖南恒凯通信息科技有限公司 | Novel dense wavelength division multiplexing component |
| CN114966999B (en) * | 2021-02-26 | 2023-12-08 | 华为技术有限公司 | Optical transceiver packaging structure and photoelectric equipment |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN109844407B (en) | 2021-01-29 |
| KR20180043124A (en) | 2018-04-27 |
| KR101968292B1 (en) | 2019-04-11 |
| WO2018074704A1 (en) | 2018-04-26 |
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