CN114966999B

CN114966999B - Optical transceiver packaging structure and photoelectric equipment

Info

Publication number: CN114966999B
Application number: CN202110216766.3A
Authority: CN
Inventors: 沈禹; 黄利新; 王强
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2021-02-26
Filing date: 2021-02-26
Publication date: 2023-12-08
Anticipated expiration: 2041-02-26
Also published as: CN114966999A

Abstract

The embodiment of the application discloses an optical transceiver packaging structure and photoelectric equipment. The optical receiving and transmitting packaging structure comprises a circuit board, an optical transmitting assembly and an optical receiving piece, wherein the optical transmitting assembly comprises an optical transmitting piece, a driving piece and a bonding wire, the optical transmitting piece is fixed on the circuit board in a patch mode, the driving piece is electrically connected with the circuit board, and the driving piece is used for driving the optical transmitting piece to transmit optical signals through the bonding wire; the light receiving element is used for receiving the light signal. In this embodiment, the optical transmitting element in the optical transceiver packaging structure is fixed on the circuit board by adopting a patch manner, so that high signal transmission of the optical transceiver packaging structure is improved, and thus, electrical performance of the optical transceiver packaging structure is improved.

Description

Optical transceiver packaging structure and photoelectric equipment

Technical Field

The embodiment of the application relates to the technical field of optical communication, in particular to an optical transceiver packaging structure and photoelectric equipment.

Background

An optoelectronic device generally refers to a network device that transmits over an optical fiber medium to modulate and demodulate an optical signal into other protocol signals. The optical transceiver packaging structure is used as an important component of the photoelectric equipment, and influences the signal transmission efficiency of the photoelectric equipment. In the conventional art, an optical transceiver package structure includes a circuit board, an optical transmitting member, and an optical receiving member. However, the optical transmitting element is fixed on the circuit board by adopting a coaxial packaging mode, which affects the electrical performance of the optical transceiver packaging structure.

Disclosure of Invention

The embodiment of the application provides an optical transceiver packaging structure and photoelectric equipment comprising the same. The light emitting part in the light receiving and transmitting packaging structure is fixed on the circuit board in a patch mode, so that the electric performance of the light receiving and transmitting packaging structure is improved.

In a first aspect, the present application provides an optical transceiver package structure. The optical transceiver packaging structure comprises a circuit board, an optical transmitting assembly and an optical receiving piece. The circuit board is used for transmitting the electric signals. The light emitting assembly includes a light emitting member, a driving member, and a bonding wire. The light emitting part is fixed on the circuit board in a mounting mode. It will be appreciated that the light emitting element is secured to the circuit board by means of a patch. The light emitting element may be directly attached to the circuit board, or may be indirectly attached to the circuit board through an intermediate structure, which is not limited in the present application. In the present application, description will be made taking an example in which the light emitting element is indirectly attached to the circuit board. The light emitting member is used for emitting light signals. The light emitting member may be, but is not limited to, a Laser Diode (LD).

The driving piece is electrically connected with the circuit board and is used for driving the light emitting piece to emit light signals. The driver may be, but is not limited to, a laser diode driver (laser diode driver, LDD) or a driver chip (driver). The bonding wire is electrically connected between the driving piece and the light emitting piece. One end of the bonding wire is fixed on the light emitting element, and the other end of the bonding wire is fixed on the driving element, so that the driving element drives the light emitting element to emit light signals. The light receiving element is used for receiving the light signal. The light receiving element may be, but is not limited to, a Photodiode (PD).

In this embodiment, the light emitting element is fixed on the circuit board by adopting a patch manner, so that when the light emitting element adopts coaxial packaging, the bandwidth of the coaxial base limits the bandwidth of the whole optical transceiver packaging structure link, thereby being beneficial to improving the high signal transmission of the optical transceiver packaging structure and improving the electrical performance of the optical transceiver packaging structure. Meanwhile, the light emitting part is fixed on the circuit board in a patch mode, so that the light emitting part is convenient and quick, a coaxial base is not required to be additionally arranged, and miniaturization of the light receiving and transmitting packaging structure is facilitated.

In one possible implementation, the light emitting assembly further includes a base, the base being secured to the circuit board. The light emitting part is attached to the base. The base adopts metal material, can dispel the heat for the light emitting part that is fixed in on the base, improves the reliability of light receiving and dispatching packaging structure. The base may be fixed to the circuit board by soldering or bonding, which is not limited in the present application. Exemplary, the base is made of aluminum, and can be connected with copper sheets or embedded copper on the circuit board, so that the heat dissipation area is increased, and the heat dissipation performance of the base is improved.

In this embodiment, the light emitting part is indirectly attached to the circuit board through the base, so that when the light emitting part is directly attached to the circuit board, the circuit board is deformed due to the fact that the expansion coefficients of different materials in the circuit board are different due to the change of temperature, and the position of the light emitting part is changed, and therefore the reliability of the light receiving and transmitting packaging structure is improved. In other embodiments, the light emitting element may be directly attached to the surface of the circuit board, that is, there is no base between the light emitting element and the circuit board, which is not limited by the present application.

In one possible implementation, the driving member is mounted to the circuit board. Illustratively, the driving member is mounted to the base such that the driving member is indirectly mounted to the circuit board. It will be appreciated that the light emitting member and the driving member are both fixed to the base.

In this embodiment, the light emitting element and the driving element are both fixed in the light receiving and transmitting package structure, that is, the light emitting element and the driving element are packaged together, so that the distance between the light emitting element and the driving element is reduced, the link mismatch is reduced, the quality of signal transmission between the light emitting element and the driving element is improved, and the performance of the light emitting element is improved. In the present embodiment, description will be made taking an example in which the light emitting element and the driving element are both fixed to the base. In other embodiments, the light emitting member and the driving member may be directly fixed to the circuit board.

Meanwhile, in this embodiment, the light emitting element and the driving element are both fixed on the circuit board by adopting the patch manner, and the light emitting element and the driving element can be directly connected, so that matching elements, such as a resistor and a capacitor, between the electrical connection of the light emitting element and the driving element are reduced, and no intermediate matching element is required, thereby simplifying the wiring arrangement of the bonding wires and being beneficial to high signal transmission of the optical transceiver packaging structure. In other embodiments, the light emitting element and the driving element can also be directly electrically connected through the flexible circuit board. The application is not limited to the manner in which the light emitting member and the driving member are electrically connected.

In a possible implementation, the light emitting member and the driving member are fixed to the same side of the base. Illustratively, the light emitting member and the driving member are attached to a surface of the base away from the circuit board.

In this embodiment, the light emitting element and the driving element are fixed on the same side of the base, so that the distance between the light emitting element and the driving element is reduced, and the length of the bonding wire is reduced, thereby reducing link mismatch, improving the high-speed signal quality of the light receiving and transmitting packaging structure, and reducing the interference of the light emitting packaging structure to the action hot spot (wireless fidelity, WIFI) of the main board.

In a possible implementation, the side of the driving member facing away from the base is flush with the side of the light emitting member facing away from the base. The bonding pad of the driving member is positioned at one side of the driving member away from the base, and the bonding pad of the light emitting member is also positioned at one side of the light emitting member away from the base. One end of the bonding wire is welded on the bonding pad of the driving piece, and the other end of the bonding wire is welded on the bonding pad of the driving piece, so that the light emitting piece and the driving piece are electrically connected.

In this embodiment, one side of the driving piece facing away from the base flushes with one side of the light emitting piece facing away from the base, so that the extending direction of the main body portion of the bonding wire is parallel to the direction of the circuit board, the distance between the driving piece and the light emitting piece of the bonding wire is short, the inclination of the bonding wire caused by the fact that the height of the driving piece is not flush with the height of the light emitting piece is avoided, the length of the bonding wire is further reduced, and therefore link mismatch is further reduced, and the high-speed signal quality of the light receiving and transmitting packaging structure is further improved.

In a possible implementation, the light emitting assembly further comprises an auxiliary stage. The auxiliary table is arranged on the base, and the light emitting piece is fixed on one surface of the auxiliary table far away from the circuit board. The auxiliary stage may be, but is not limited to, one or more of a tungsten stage, a copper stage, a heat sink, a circuit board, or a substrate. The present application is not limited to the specific materials or structures of the auxiliary table, and can be designed according to actual requirements by those skilled in the art.

In one possible implementation, the optical transceiver package structure further includes a flexible circuit board. The flexible circuit board is made of flexible materials and can be bent and deformed. The flexible circuit board is electrically connected between the driving piece and the circuit board.

In this embodiment, the driving element is fixed on the circuit board by adopting the mode of the patch, so that the bonding pad of the driving element is directly leaked relative to the circuit board, and the driving element and the circuit board directly pass through the flexible circuit board to realize signal transmission, thereby being beneficial to simplifying the wiring on the circuit board and being beneficial to high signal transmission of the optical transceiver packaging structure.

In one possible implementation, a base includes a base and a housing. The light emitting part is fixed on the base, and the shell is fixed relative to the base. Illustratively, a stepped structure is provided on a side of the housing adjacent the base, the stepped structure being mounted to the base. The shell is provided with a containing groove. At least part of the light receiving element is accommodated in the accommodating groove, and the light receiving element seals the opening of the accommodating groove. It is understood that the portion of the light receiving element for receiving the light signal is embedded in the housing. The light receiving element seals the opening of the accommodating groove so that the light receiving element is in sealing connection with the shell.

In this embodiment, the light receiving member is partially received in the receiving groove, and the light receiving member seals the opening of the receiving groove, so that the tightness of the light receiving assembly is improved, and the problem of poor air tightness when the light receiving member is fixed to the circuit board in a mounting manner is avoided.

Illustratively, the light receiving member is embedded within the housing in the form of a coaxial package (transistor outline, TO), a butterfly package, or a BOX. The present application is not limited to a specific manner in which the light receiving element is embedded in the housing, and those skilled in the art can design the light receiving element according to actual needs.

In one possible implementation, the housing includes first and second sides disposed opposite each other. The first side edge is close to the light emitting element relative to the second side edge. The first side is provided with a light-passing hole. The light through hole is used for the light signal that the light emitting part launched to pass. The second side is provided with a mounting hole. The optical transceiver package structure further comprises an optical fiber. The optical fiber is coupled with the light emitting element. The optical fiber is arranged in the mounting hole, the opening of the mounting hole is blocked, and the optical fiber accommodated in the mounting hole is opposite to the light transmission hole.

In the embodiment of the application, the optical fiber is fixed on one side of the shell far away from the light emitting piece, and the optical fiber and the light receiving piece are respectively positioned on two adjacent sides of the shell. The optical fiber is embedded in the mounting hole on the second side, and the opening of the mounting hole is plugged by the optical fiber, so that the optical fiber is in sealed connection with the shell, and the air tightness of the optical transceiver packaging structure is improved.

In one possible implementation, the housing further includes a third side, the third side is located between the first side and the second side, and the third side is located on a side of the housing away from the circuit board. The light receiving element is embedded in the third side edge.

In the embodiment of the application, the light receiving element is embedded in the third side, the optical fiber is embedded in the second side, the light emitting element is positioned on one side of the first side far away from the second side, and the light receiving element, the optical fiber and the light emitting element are respectively positioned on three different sides of the shell, so that the light path design of the light receiving and transmitting packaging structure is facilitated to be simplified.

In one possible implementation, the optical transceiver package structure further includes a lens and an optical splitter. The lens is used for converging the optical signals emitted by the optical emitter. The lens is located between the light emitting member and the light receiving member. In the embodiment of the application, the lens is fixed on the base, is positioned on the outer side of the shell and is fixed on the base in an adhesive mode. In other embodiments, the lens may also be embedded inside the housing. For example, the lens and the optical path structure (such as the beam splitter) inside the housing are integrally formed by using a polymer material, which is not limited by the present application.

The beam splitter is positioned on a side of the lens remote from the light emitting member. The beam splitter is disposed opposite to the lens and opposite to the light receiving element. The optical splitter employs wavelength division multiplexing (wave division multiplexing, WDM). The beam splitter may pass light from the light emitting assembly (i.e., emanating from the light emitting member) and advance toward the optical fiber; meanwhile, the beam splitter reflects light from the optical fiber to the light receiving element.

In this embodiment, the light emitting element emits an optical signal under the drive of the driving element, and the optical signal is converged through the optical splitter under the action of the lens and transmitted to the optical fiber; the incident optical signal from the optical fiber is reflected by the optical splitter and transmitted along the optical path to the optical receiving element, which modulates the received optical signal into an electrical signal for transmission.

In one possible implementation, the beam splitter includes a light-transmissive filter, an anti-reflection film, and an anti-reflection film. The antireflection film and the antireflection film are respectively positioned on two surfaces of the light-absorbing film which are arranged in opposite directions. The antireflection film is positioned on one surface of the optical filter corresponding to the light emitting piece, so that reflected light of the incident light on the upper surface and the lower surface of the antireflection film is eliminated, the reflected light energy is reduced, and the transmitted light energy is relatively increased. The reflection enhancing film is positioned on one surface of the optical filter corresponding to the optical fiber, the principle of the reflection enhancing film is opposite to that of the reflection enhancing film, and the light reflected from the front surface and the rear surface of the film is enhanced, so that the transmitted light is required to be weakened by energy conservation, and the transmitted light energy is small and the reflected light energy is strong.

In one possible implementation manner, the optical transceiver packaging structure further includes a detecting element. The detection piece is used for monitoring the optical signal emitted by the light emitting piece. The detecting member is used for monitoring the power or intensity of the optical signal emitted by the light emitting member. The detection member may be, but is not limited to, a monitoring laser diode (monitor photodiode, MPD).

In the embodiment of the application, the detection part can detect the optical signal emitted by the optical emission part in real time, so that the optical transceiver packaging structure can adjust the optical signal emitted by the optical emission part driven by the driving part in real time, and the signal transmission accuracy of the optical transceiver packaging structure is improved.

In one possible implementation manner, the optical transceiver packaging structure further comprises a beam splitter. The light splitting sheet is arranged opposite to the detection piece so as to reflect the light signals emitted by the light emitting piece to the detection piece. Illustratively, the light splitting sheet is located on a side of the lens remote from the light emitting member and is disposed opposite the lens. The light splitting sheet is placed in a degree. The light-splitting sheet is capable of allowing light emitted from the light-emitting element to pass therethrough so that the light of the light-emitting element is incident on the optical fiber; the light splitting sheet can reflect the light of the light emitting assembly to the detecting member so that the detecting member can monitor the light signal emitted by the light emitting member.

In this embodiment, the light signal emitted by the light emitting element emits the light signal to the detecting element through the light splitting sheet, so that the detecting element can acquire the light signal emitted by the light emitting element. In the present embodiment, description is made taking an example in which both the spectroscopic sheet and the detection element are located outside the case. In other embodiments, the light splitting sheet and the detecting element can be accommodated inside the housing, which is not limited in the present application. Alternatively, in other embodiments, the optical transceiver package structure may not include the light splitting sheet and the detecting element.

In one possible implementation manner, the base includes a first side and a third side connected to the first side, and the first side is provided with a light hole. The light receiving element is embedded in the third side edge.

The base is also provided with a step surface, the orientation of the step surface is the same as that of the third side edge, and the step surface is connected with the first side edge. The light emitting piece is attached to the step surface and is arranged opposite to the light through hole.

In this embodiment, the light emitting element and the light receiving element are both fixed on the base, so that assembly errors when the light emitting element and the light receiving element are fixed on different structural members are avoided, and coupling efficiency of the light emitting element and the light receiving element is improved, thereby being beneficial to improving transmission performance of the light receiving and transmitting packaging structure.

In one possible implementation, the base includes a housing and a mounting table disposed in spaced apart relation. The shell and the mounting table are both fixed on the circuit board. The light emitting member and the light driving member are both fixed to the housing. The driving piece is installed on the installation surface of the installation table. The mounting surface is oriented in the same direction as the stepped surface. It will be appreciated that the stepped surface is located on the surface of the housing. The driving member and the light emitting member are located on the same side of the circuit board.

In this embodiment, the light emitting member is fixed to the housing, and the driving member is fixed to the mount, that is, the light emitting member and the driving member are respectively fixed to different structures. The orientation of the mounting surface is the same as the orientation of the step surface, so that the length of a bonding wire electrically connected between the driving piece and the light emitting piece is reduced, and the high-speed signal quality of the light receiving and transmitting packaging structure is improved. In other embodiments, the driving member may be directly fixed to the housing, that is, the housing is integrally formed with the mounting table, which is not limited by the present application.

In a possible implementation, the base is further provided with a second side. The second side is set up with first side opposite to each other, and the second side is equipped with the mounting hole. The optical transceiver package structure further comprises an optical fiber. The optical fiber is coupled with the light emitting element. The optical fiber is arranged in the mounting hole, the opening of the mounting hole is blocked, and the optical fiber accommodated in the mounting hole is opposite to the light transmission hole. It can be understood that the part of the optical fiber structure is embedded in the mounting hole on the second side, and the optical fiber seals the opening of the mounting hole, so that the optical fiber is in sealed connection with the shell, and the air tightness of the optical transceiver packaging structure is improved.

In this embodiment, the light emitting element, the optical fiber and the light receiving element are all fixed on the housing, so that assembly errors caused when the light emitting element and the optical fiber are fixed on different structural members are avoided, and coupling efficiency of the light emitting element and the optical fiber is improved, thereby being beneficial to improving transmission performance of the light receiving and transmitting packaging structure.

In one possible implementation, the optical transceiver package structure further includes a lens and an optical splitter. The lens is fixed on the stepped surface and is arranged opposite to the light emitting piece. The beam splitter is positioned at one side of the lens away from the light emitting piece, and the beam splitter is fixed in the shell. The optical splitter employs wavelength division multiplexing (wave division multiplexing, WDM).

In this embodiment, the lens is fixed on the stepped surface of the housing, that is, the lens is located at the outer side of the housing, and can be fixed on the outer surface of the housing by bonding, so that the process of assembling the lens is simplified.

In one possible implementation, the optical transceiver package structure further includes a lens and an optical splitter. The lens and the beam splitter are both fixed in the shell, and the lens is used for converging the optical signals emitted by the optical emission part. The beam splitter is positioned at one side of the lens far away from the light emitting piece, and the beam splitter and the lens are integrally formed. The lens and the beam splitter are integrally formed into an optical path structure. The light path structure is fixed in the inside of the shell and is exposed relative to the side edge of the shell.

In the embodiment, the lens and the beam splitter are fixed in the shell, the lens and the beam splitter are integrally formed, and the lens and the beam splitter are integrally fixed in the shell as a whole, so that the light path in the shell is integrated, the shell does not need to be provided with a structure for bearing the beam splitter, and the design of the internal structure of the shell is simplified; meanwhile, the light path integration inside the shell is also beneficial to improving the light path coupling efficiency of the light receiving and transmitting packaging structure.

In a second aspect, the present application also provides an optoelectronic device. The optoelectronic device comprises a housing and the optical transceiver packaging structure according to the first aspect. The optical transceiver packaging structure is arranged on the shell.

In this embodiment, the light emitting element in the optoelectronic device is fixed on the circuit board by adopting the patch mode, so that when the light emitting element adopts the coaxial package, the bandwidth of the coaxial base limits the bandwidth of the whole optical transceiver packaging structure link, thereby being beneficial to improving the high signal transmission of the optical transceiver packaging structure, improving the electrical performance of the optical transceiver packaging structure, and further improving the electrical performance of the optoelectronic device.

In a possible implementation manner, the optoelectronic device further includes a main board. The circuit board is fixed on the main board. The manner in which the circuit board is mounted on the motherboard is not limited to the present application, for example: surface mount technology (surface mounted technology, SMT), wave soldering (cartridge), or crimping.

In this embodiment, the optical transmitting assembly is electrically connected to the motherboard through the circuit board, so as to realize transmission of signals between the optical transceiver packaging structure and the motherboard, so as to cooperate with the optical transceiver packaging structure to realize a communication function.

In one possible implementation, the motherboard is integrally formed with the circuit board. It will be appreciated that the light emitting and receiving assemblies may also be mounted directly to the motherboard. The circuit board in the optical transceiver packaging structure belongs to a part of the main board. In the embodiment, the circuit board and the main board in the optical transceiver packaging structure are integrally formed, so that the material cost is saved, and the assembling procedure of the photoelectric equipment is simplified. The integrated structure of the circuit board and the motherboard can be designed by a person skilled in the art according to actual requirements.

Drawings

FIG. 1 is a schematic view of an optoelectronic device according to the present application;

FIG. 2 is a top view of a portion of the structure of the photovoltaic apparatus of FIG. 1;

FIG. 3 is a schematic structural diagram of the optical transceiver package structure shown in FIG. 1 in a first embodiment;

FIG. 4 is a schematic view of a portion of the optical transceiver package structure shown in FIG. 3;

FIG. 5 is a side view of the structure shown in FIG. 4;

FIG. 6 is a schematic partial cross-sectional view of the structure shown in FIG. 3;

FIG. 7 is a schematic diagram of an optical path of the optical transceiver package structure shown in FIG. 3;

FIG. 8 is a schematic view of the housing of FIG. 3;

FIG. 9 is a schematic view of the structure of FIG. 8 at another angle;

fig. 10 is a schematic view of a part of the optical transceiver package structure shown in fig. 1 in a second embodiment;

FIG. 11 is a schematic view of an optical path of the optical transceiver package structure shown in FIG. 10;

fig. 12 is a schematic view of an optical path of the optical transceiver package structure shown in fig. 1 in a third embodiment;

fig. 13 is a schematic view of a part of the optical transceiver package structure shown in fig. 1 in a fourth embodiment;

fig. 14 is a schematic view of a part of the optical transceiver package structure shown in fig. 1 in a fifth embodiment;

fig. 15 is a partially exploded view of the optical transceiver package of fig. 14.

Detailed Description

Embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an optoelectronic device 100 according to the present application. The optoelectronic device 100 includes a housing 101 and an optical transceiver package 102. The optical transceiver package 102 is mounted on the housing 101. The housing 101 is used to protect the optical transceiver package 102 inside. In fig. 1, the shape, position, size, etc. of the casing 101 and the optoelectronic device 100 are merely examples, and the present application is not limited thereto.

The optoelectronic device 100 may be an optical network terminal (optical network terminal, ONT) or an optical line terminal (optical line terminal, OLT), etc. In the embodiment of the present application, description is made taking the optoelectronic device 100 as an optical network terminal as an example. An optical network terminal is also called an optical modem or optical modem, and refers to a network device that transmits an optical signal through an optical fiber medium and modulates and demodulates the optical signal into other protocol signals. The optical network terminal is used as relay transmission equipment of large local area network, metropolitan area network and wide area network, and is different from an optical fiber transceiver, and the optical fiber transceiver only receives light and emits light and does not involve protocol conversion.

As shown in fig. 1, the optoelectronic device 100 further includes a motherboard 103. The optical transceiver package 102 is fixed to the motherboard 103. The optical transceiver packaging structure 102 is electrically connected to the motherboard 103, so as to cooperate with the optical transceiver packaging structure 102 to realize a communication function. Those skilled in the art can design the shape, kind, etc. of the motherboard 103 according to actual needs, and the present application is not limited thereto. Illustratively, the optical transceiver packaging structure 102 may directly take power from the motherboard 103, so as to form an integrated power supply for the optical transceiver packaging structure 102 and the motherboard 103, which is beneficial to simplifying the circuit design of the optoelectronic device 100. In other embodiments, the optical transceiver package 102 may also be powered by other ways, which is not limited by the present application.

Referring to fig. 2 and 3 together, fig. 2 is a top view of a portion of the structure of the optoelectronic device 100 shown in fig. 1; fig. 3 is a schematic structural diagram of the optical transceiver package structure 102 shown in fig. 1 in the first embodiment. Wherein the housing 101 is not illustrated in fig. 2.

The optical transceiver package structure 102 includes a circuit board 11, a light emitting component 12, and a light receiving component 13. The circuit board 11 is electrically connected to the motherboard 103, and is used for transmitting electrical signals. The light emitting element 12 and the light receiving element 13 are each fixed to the circuit board 11. In the present application, the fixation includes direct fixation and indirect fixation. It will be appreciated that intermediate structural members may be provided between the light emitting assembly 12 and the circuit board 11 to indirectly secure the light emitting assembly 12 to the circuit board 11; alternatively, no other structural member may be provided between the light emitting element 12 and the circuit board 11, and the light emitting element 12 may be directly fixed to the circuit board 11.

The light emitting component 12 is electrically connected to the motherboard 103 through the circuit board 11, so as to realize signal transmission. As shown in fig. 2, the circuit board 11 is fixed to the main board 103. That is, the circuit board 11 and the main board 103 are different structural members. The circuit board 11 is electrically connected to the motherboard 103, so as to realize signal transmission with the motherboard 103.

In the present embodiment, description is made taking an example in which the circuit board 11 is mounted on the main board 103. The manner in which the circuit board 11 is mounted on the motherboard 103 is not limited to the present application, and examples thereof include: surface mount technology (surface mounted technology, SMT), wave soldering (cartridge), or crimping.

In other embodiments, the motherboard 103 and the circuit board 11 may be integrally formed. That is, in other embodiments, the light emitting module 12 and the light receiving module 13 may be directly mounted to the main board 103. Those skilled in the art can design the structure of the circuit board 11 according to actual requirements. It can be appreciated that the circuit board 11 in the optical transceiver package 102 may be spliced with the motherboard 103, or may be a part of the motherboard 103. In this embodiment, the circuit board 11 and the motherboard 103 in the optical transceiver package structure 102 are integrally formed, so that the material cost is saved, and the assembling process of the optoelectronic device is simplified.

Wherein the light emitting assembly 12 is configured to emit light signals. The light receiving assembly 13 is for receiving an optical signal. In some embodiments, the optical transceiver packaging structure 102 further includes an optical fiber 14. The optical fiber 14 is capable of receiving an optical signal and emitting an optical signal. The optical transmitting assembly 12 modulates the electrical signal into an optical signal, the optical signal transmitted by the optical transmitting assembly 12 is transmitted to the optical fiber 14, the optical signal transmitted by the optical fiber 14 is transmitted to the optical receiving assembly 13, and the optical receiving assembly 13 receives the optical signal and modulates the optical signal into the electrical signal for transmission, so that signal transmission is realized.

With continued reference to fig. 3, the light emitting assembly 12 includes a base 121 and a light emitting member 122. The base 121 is fixed to the circuit board 11. The light emitting member 122 is mounted on the circuit board 11. Illustratively, the light emitting member 122 is adhered to a surface of the base 121. It will be appreciated that the light emitting element 122 is fixed to the circuit board 11 by means of a patch. The light emitting member 122 is for emitting an optical signal. The light emitting member 122 may be, but is not limited to, a Laser Diode (LD).

In this embodiment, the light emitting element 122 is fixed on the circuit board 11 by adopting a patch manner, so that when the light emitting element 122 adopts a coaxial package, the bandwidth of the coaxial base limits the bandwidth of the link of the whole light receiving and transmitting package structure 102, thereby being beneficial to improving the high signal transmission of the light receiving and transmitting package structure 102 and improving the electrical performance of the light receiving and transmitting package structure 102. Meanwhile, the light emitting element 122 is fixed on the circuit board 11 by adopting a patch mode, which is convenient and quick, and a coaxial base is not required to be additionally arranged, thereby being beneficial to miniaturization of the light receiving and transmitting packaging structure 102.

In some embodiments, the base 121 is made of a metal material, so that heat dissipation can be performed for the light emitting element 122 fixed on the base 121, and reliability of the light receiving and transmitting package structure 102 is improved. The base 121 may be fixed to the circuit board 11 by soldering or bonding, which is not limited in the present application. Illustratively, the base 121 is made of aluminum, and the base 121 can be connected with copper sheets or embedded copper on the circuit board 11, so that the heat dissipation area is increased, and the heat dissipation performance of the base 121 is improved. Meanwhile, the base 121 is electrically connected with the circuit board 11, so that a shielding effect can be achieved, the design of a shielding cover is simplified, and miniaturization of the optical transceiver packaging structure 102 is facilitated.

In the present embodiment, the light emitting element 122 is indirectly attached to the circuit board 11 through the base 121, so that when the light emitting element 122 is directly attached to the circuit board 11, the circuit board is prevented from being deformed due to the large internal stress generated by different expansion coefficients of different materials in the circuit board 11 due to the temperature change, and the position of the light emitting element 122 is changed, thereby improving the reliability of the light receiving and transmitting package structure 102. In other embodiments, the light emitting element 122 may be directly attached to the surface of the circuit board 11, that is, the base 121 is not disposed between the light emitting element 122 and the circuit board 11, which is not limited by the present application.

Referring to fig. 3 and fig. 4 together, fig. 4 is a schematic view of a portion of the optical transceiver package 102 shown in fig. 3. The light emitting assembly 12 further includes a driver 123 and a bonding wire 125. The driving member 123 is attached to the surface of the base 121. The driving member 123 is electrically connected to the light emitting member 122, and is used for driving the light emitting member 122 to emit light signals. The bonding wire 125 is electrically connected between the light emitting element 122 and the driving element 123. One end of the bonding wire 125 is fixed to the light emitting member 122, and the other end is fixed to the driving member 123, so that the driving member 123 drives the light emitting member 122 to emit the light signal. In fig. 4, the shape of the bonding wire 125 is merely an example, and the present application is not limited thereto.

The driver 123 may be, but is not limited to, a laser diode driver (laser diode driver, LDD). The driving element 123 may be a driving chip (driver), and mainly couples the dc bias current of the laser diode with the high-frequency modulation current to provide the modulated driving current for the laser diode. Meanwhile, the driving chip can amplify an input signal and control direct-current bias current and high-frequency modulation current so that the laser diode is in an optimal working state. Those skilled in the art can select the kinds of the light emitting member 122 and the corresponding driving member 123 according to actual needs, and the present application is not limited thereto.

In the prior art, the light emitting element and the driving element are respectively positioned in the light receiving and transmitting packaging structure and the main board, and the distance between the light emitting element and the driving element is larger, so that the wiring between the light emitting element and the driving element is long. However, as the optical communication rate is higher, the parasitic inductance, the parasitic capacitance, the impedance mismatch and the like of the long high-frequency signal wiring are easy to generate, so that the quality of the high-frequency signal is affected, the operation bandwidths of the driving part and the optical emitting part are reduced, and the performance of the optical emitting device is affected.

In the present embodiment, the light emitting element 122 and the driving element 123 are both fixed in the light receiving and transmitting package structure 102, that is, the light emitting element 122 and the driving element 123 are packaged together, so that the distance between the light emitting element 122 and the driving element 123 is reduced, the link mismatch is reduced, and the quality of signal transmission between the light emitting element 122 and the driving element 123 is improved, thereby improving the performance of the light emitting element 122. In the present embodiment, the light emitting element 122 and the driving element 123 are each fixed to the base 121. In other embodiments, the light emitting member 122 and the driving member 123 may be directly fixed to the circuit board 11.

Meanwhile, in the present embodiment, the light emitting element 122 and the driving element 123 are fixed on the circuit board 11 by adopting the patch manner, and the light emitting element 122 and the driving element 123 can be directly connected, so that the matching elements, such as a resistor and a capacitor, between the electrical connection of the light emitting element 122 and the driving element 123 are reduced, and no intermediate matching element is required, thereby simplifying the wiring arrangement of the bonding wires 125 and being beneficial to high signal transmission of the optical transceiver packaging structure 102. In other embodiments, the light emitting element 122 and the driving element 123 can also be directly electrically connected through the flexible circuit board 124. The manner in which the light emitting member 122 and the driving member 123 are electrically connected is not limited by the present application.

As shown in fig. 4, in some embodiments, the light emitting member 122 and the driving member 123 are fixed to the same side of the base 121. Illustratively, the light emitting member 122 and the driving member 123 are attached to a surface of the base 121 remote from the circuit board 11. In other embodiments, the light emitting member 122 and the driving member 123 can be fixed to other sides of the base 121, which is not limited in this regard.

In this embodiment, the light emitting element 122 and the driving element 123 are fixed on the same side of the base 121, so that the distance between the light emitting element 122 and the driving element 123 is reduced, and the length of the bonding wire 125 is reduced, thereby reducing the link mismatch, not only improving the high-speed signal quality of the light receiving and transmitting package structure 102, but also reducing the interference of the light emitting package structure on the action hot spots (wireless fidelity, WIFI) of the motherboard 103.

Referring to fig. 4 and 5 together, fig. 5 is a side view of the structure shown in fig. 4. In some embodiments, the side of the driving member 123 facing away from the base 121 is flush with the side of the light emitting member 122 facing away from the base 121. The bonding pads of the driving member 123 are located at a side of the driving member 123 facing away from the base 121, and the bonding pads of the light emitting member 122 are also located at a side of the light emitting member 122 facing away from the base 121. One end of the bonding wire 125 is welded to the pad of the driving member 123, and the other end is welded to the pad of the driving member 123, so as to realize electrical connection between the light emitting member 122 and the driving member 123. As shown in fig. 5, an exemplary side of the driving member 123 facing away from the base 121 is flush with a side of the light emitting member 122 facing away from the base 121 such that a major portion of the bonding wire 125 is parallel to the circuit board 11.

In this embodiment, one side of the driving member 123 facing away from the base 121 is flush with one side of the light emitting member 122 facing away from the base 121, so that the extending direction of the main body portion of the bonding wire 125 is parallel to the surface of the circuit board 11, the distance between the driving member 123 and the light emitting member 122 of the bonding wire 125 is short, and the inclination of the bonding wire 125 caused by the non-flush height of the driving member 123 and the height of the light emitting member 122 is avoided, so that the length of the bonding wire 125 is further reduced, the link mismatch is reduced, and the high-speed signal quality of the optical transceiver packaging structure 102 is further improved.

In other embodiments, the side of the driving member 123 facing away from the circuit board 11 and the side of the light emitting member 122 facing away from the circuit board 11 may not be flush, which is not limited by the present application. Those skilled in the art can adjust the heights of the driving member 123 and the light emitting member 122 according to actual requirements to ensure that the length of the bonding wire 125 is the shortest.

Illustratively, the light emitting assembly 12 further includes an auxiliary stage 126. The auxiliary stage 126 is mounted on the base 121, and the light emitting member 122 is fixed to a side of the auxiliary stage 126 remote from the circuit board 11. The auxiliary stage 126 may be, but is not limited to, one or more of a tungsten stage, a copper stage, a heat sink, a circuit board, or a substrate. The present application is not limited to the specific materials or structures of the auxiliary table 126, and those skilled in the art can design the same according to actual requirements.

In the present embodiment, an auxiliary stand 126 is provided under the light emitting member 122 to ensure that the height of the light emitting member 122 is flush with the height of the driving member 123, so that the side of the driving member 123 facing away from the circuit board 11 is flush with the side of the light emitting member 122 facing away from the circuit board 11.

With continued reference to fig. 3 and 4, in some embodiments, the light emitting assembly 12 further includes a flexible circuit board 124. The flexible circuit board 124 is made of flexible material and can be bent and deformed. The flexible circuit board 124 is electrically connected between the circuit board 11 and the driving member 123. Illustratively, one end of the flexible circuit board 124 is bonded to the base 121, and the driving member 123 is soldered to a side of the flexible circuit board 124 remote from the base 121. The connection mode of the flexible circuit board 124, the driving member 123 and the circuit board 11 is not limited in the present application, and those skilled in the art can design the connection mode according to actual requirements.

In this embodiment, the driving member 123 is fixed on the circuit board 11 by adopting a patch manner, so that the bonding pad of the driving member 123 directly leaks out relative to the circuit board 11, and the driving member 123 and the circuit board 11 directly realize signal transmission through the flexible circuit board 124, which is not only beneficial to simplifying the wiring on the circuit board 11, but also beneficial to high signal transmission of the optical transceiver packaging structure 102. In other embodiments, the driving member 123 and the circuit board 11 may be electrically connected in other manners, which is not limited by the present application. For example, the circuit board 11 is provided with a trace electrically connected to the driving member 123.

Referring to fig. 3 and 6 together, fig. 6 is a schematic partial cross-sectional view of the structure shown in fig. 3. The light receiving assembly 13 includes a light receiving member 132. The light receiving element 132 is used for receiving the light signal. The light receiving part 132 may be, but not limited to, a Photodiode (PD). The base 121 includes a base 141 and a case 131. The base 141 and the housing are attached to the circuit board 11, and the housing 131 is fixed relative to the base 141. The light emitting member 122 and the driving member 123 are fixed to the base 141, and the light receiving member 132 fixes the housing 131. Wherein the base 141 and the housing 131 are different structural members. Illustratively, the housing 131 has a stepped structure on a side thereof adjacent to the base 141, and the stepped structure is fixed to the base 141.

In this embodiment, the base 121 includes a base 141 and a housing 131, the base 141 is used for carrying the light emitting element 122 and the driving element 123, and the housing 131 is used for carrying the light receiving element 132, so as to facilitate assembly of the light receiving and transmitting package structure 102. In other embodiments, the base 141 and the housing 131 can be integrally formed, that is, the light emitting member 122 and the light receiving member 132 are fixed to the same structural member, which is not limited by the present application.

In some embodiments, housing 131 is provided with a receiving slot 1310. At least a part of the light receiving element 132 is accommodated in the accommodating groove 1310, and the light receiving element 132 closes the opening of the accommodating groove 1310. As shown in fig. 6, the receiving end of the light receiving member 132 is illustratively received in the receiving groove 1310. It is understood that the portion of the light receiving member 132 for receiving the light signal is embedded in the housing 131. The light receiving member 132 blocks the opening of the receiving groove 1310 so that the light receiving member 132 is hermetically connected with the case 131.

In the present embodiment, a part of the light receiving element 132 is accommodated in the accommodating groove 1310, and the light receiving element 132 seals the opening of the accommodating groove 1310, so as to improve the tightness of the light receiving assembly 13, and avoid the problem of poor air tightness when the light receiving element 132 is fixed to the circuit board 11 by a mounting method.

Illustratively, the light receiving member 132 is embedded within the housing 131 in the form of a coaxial package (transistor outline, TO), a butterfly package, or a BOX. The present application is not limited to a specific manner in which the light receiving member 132 is embedded in the housing 131, and those skilled in the art can design the same according to actual requirements.

In the present embodiment, the light receiving member 132 is fixed to the housing 131 by means of a coaxial package, a butterfly package or a BOX, so that the sealing connection between the light receiving member 132 and the housing 131 is effectively improved, thereby improving the sealing performance of the light receiving assembly 13.

As shown in fig. 6, in the present embodiment, the light emitting member 124 is described as being located outside the case 131. In other embodiments, the light emitting member 124 can also be accommodated in the housing 131, which is not limited by the present application. The light emitting member 124 is accommodated in the interior of the housing 131, so that the light emitting member 124 is prevented from being exposed to the outside, and the housing 131 can protect the light emitting member 124.

In some embodiments, the optical transceiver packaging structure 102 further includes a lens 15. The lens 15 is fixed to the base 121 and disposed opposite to the light emitting member 122. The lens 15 is used to collect the optical signals emitted from the optical emitter 122. The present application is not limited to the material used for the lens 15, and those skilled in the art can design the lens according to actual requirements. Illustratively, the lens 15 is made of glass or a resin material. The lens 15 is located between the light receiving element 132 and the light emitting element 12.

In the present embodiment, the lens 15 is fixed to the base 121, the lens 15 is located outside the case 131, and is fixed to the base 121 by adhesion. In other embodiments, the lens 15 may also be embedded inside the housing 131. For example, the lens 15 and the optical path structure (such as the beam splitter) inside the housing 131 are integrally formed using a polymer material, which is not limited by the present application. It can be appreciated that the main optical path structure of the optical transceiver package structure 102 may be a conventional adhesive lens 15, or may be embedded in the housing 131.

Referring to fig. 6 and fig. 7 together, fig. 7 is a schematic optical path diagram of the optical transceiver package 102 shown in fig. 3. In some embodiments, the optical transceiver package 102 further includes an optical splitter 16. The spectroscope 16 is housed in the case 131. The optical splitter 16 employs a wavelength division multiplexing technique (wave division multiplexing, WDM). The beam splitter 16 may pass through the optical axis connecting the light emitting element 12 and the optical fiber 14, or may bend the optical axis connecting the light receiving element 132 and the optical fiber 14 at a substantially right angle. Specifically, the beam splitter 16 may pass light from the light emitting assembly 12 (i.e., emitted from the light emitting member 122) and advance toward the optical fiber 14; meanwhile, the beam splitter 16 reflects light from the optical fiber 14 to the light receiving element 132. Wherein the former light from the light emitting assembly 12 is at a different wavelength than the latter light from the optical fiber 14. The beam splitter 16 can also block the light of the optical fiber 14 from passing through the beam splitter 16, so as to prevent the light of the optical fiber 14 from entering the light emitting element 122, thereby improving the reliability of the optical transceiver package structure 102.

In the present embodiment, the light emitting member 122 emits an optical signal under the driving of the driving member 123, and the optical signal is converged through the optical splitter 16 under the action of the lens 15 and transmitted to the optical fiber 14; and an incident optical signal from the optical fiber 14 is reflected by the optical splitter 16 and transmitted to the light receiving element 132 along the optical path, and the light receiving element 132 modulates the received optical signal into an electrical signal for transmission.

Illustratively, the beamsplitter 16 includes a 45 degree filter, an anti-reflection film, and an anti-reflection film. The antireflection film and the antireflection film are respectively positioned on two surfaces of the 45-degree optical filter which are arranged in opposite directions. The antireflection film is located on one side of the optical filter corresponding to the light emitting element 122, so that the reflected light of the incident light on the upper and lower surfaces of the antireflection film is cancelled, and the reflected light energy is reduced, and the transmitted light energy is relatively increased. The reflection enhancing film is positioned on one side of the optical filter corresponding to the optical fiber 14, and the principle of the reflection enhancing film is opposite to that of the reflection enhancing film, so that the transmitted light must be weakened by the energy conservation, and the transmitted light energy is small and the reflected light energy is strong.

In some embodiments, the housing 131 is internally provided with a step structure or an inclined plane for carrying the optical splitter 16, so that the optical transceiver packaging structure 102 does not need to be additionally provided with a bracket for fixing the optical splitter 16, which is beneficial to miniaturization of the optical transceiver packaging structure 102. Illustratively, the beam splitter 16 is bonded to a beveled or stepped surface within the housing 131.

In some embodiments, the optical transceiver package structure further includes an O-degree filter (not illustrated in the figures). The O-degree filter is located between the beam splitter 16 and the light receiving element 132. In this embodiment, the 0-degree filter is used to filter the optical signal incident on the optical receiver 132, so as to improve the signal transmission performance of the optical transceiver package 102.

In some embodiments, the optical transceiver packaging structure 102 further includes an optical isolator (not illustrated). The optical isolator is located between the light emitting element 122 and the optical splitter 16, and can pass light emitted from the light emitting element 12 and traveling toward the optical fiber 14, so as to prevent light in the optical fiber 14 from entering the light emitting element 12, thereby improving the reliability of the optical transceiver package 102.

In some embodiments, the optical transceiver packaging structure 102 further includes an optical filter. The optical filter is disposed in parallel with the circuit board 11 for filtering the optical signal entering the light receiving element 132.

Referring to fig. 3 and 8, fig. 8 is a schematic structural view of the housing 131 shown in fig. 3. In some embodiments, housing 131 includes oppositely disposed first side 1311 and second side 1312. The first side 1311 is adjacent to the light emitting assembly 12 opposite the second side 1312. The first side 1311 is adjacent to the light emitting member 122 and the second side 1312 is adjacent to the optical fiber 14. First side 1311 is provided with light pass-through hole 1301. The light-transmitting hole 1301 is used for the light signal emitted by the light-emitting component 12 to pass through, and the optical fiber 14 is disposed opposite to the light-transmitting hole 1301. The optical fiber 14 is located at a side of the housing 131 remote from the light emitting element 122.

In the embodiment of the application, the optical fiber 14 is fixed on one side of the housing 131 away from the light emitting member 122, and the optical fiber 14 and the light receiving member 132 are respectively located on two adjacent sides of the housing 131.

In some embodiments, the side of the housing 131 facing the base 141 is provided with a stepped surface 1314. The step surface 1314 is coupled to the first side 1311, and the step surface 1314 is mounted to the base 121. In the present embodiment, the side of the housing 131 facing the base 141 is provided with a step structure, which not only limits the installation position of the housing 131 relative to the base 141, but also facilitates the miniaturization of the optical transceiver package structure 102.

Referring to fig. 3 and fig. 9 together, fig. 9 is a schematic view of the structure shown in fig. 8 at another angle. The second side 1312 is provided with mounting holes 1302. The optical fiber 14 is partially accommodated in the mounting hole 1302, the opening of the mounting hole 1302 is blocked, and the optical fiber 14 accommodated in the mounting hole 1302 is disposed opposite to the light transmission hole 1301. Illustratively, the pigtail structure in the optical fiber 14 is received in the mounting hole 1302.

In this embodiment, a part of the structure of the optical fiber 14 is embedded in the mounting hole 1302 of the second side 1312, and the optical fiber 14 seals the opening of the mounting hole 1302, so that the optical fiber 14 is hermetically connected with the housing 131, and the air tightness of the optical transceiver packaging structure 102 is improved. In other embodiments, the optical fiber 14 can be fixed to the housing 131 in other manners, and the present application is not limited to the manner in which the optical fiber 14 is fixed to the housing 131. Those skilled in the art can design the manner and position of fixing the optical fiber 14 to the housing 131 according to actual requirements.

Wherein the housing 131 further includes a third side 1313. The third side 1313 is located between the first side 1311 and the second side 1312, and the third side is located on a side of the housing 131 away from the circuit board 11. The light receiving element 132 is embedded in the third side 1313. Illustratively, the first side 1311 and the second side 1312 are each perpendicular to the third side 1313.

In the embodiment of the application, the light receiving element 132 is embedded in the third side 1313, the optical fiber 14 is embedded in the second side 1312, the light emitting element 122 is located on one side of the first side 1311 away from the second side 1312, and the light receiving element 132, the optical fiber 14 and the light emitting element 122 are respectively located on three different sides of the housing 131, which is beneficial to simplifying the optical path design of the optical transceiver packaging structure 102.

In some embodiments, the optical fiber 14 is in active coupling connection with the light emitting member 122. The optical fiber 14 is actively coupled to the light receiving element 132. The optical fiber 14 is actively coupled with the emitting element and the light receiving element 132 respectively, so that the signal transmission performance of the optical transceiver packaging structure 102 is improved. For example, after the light emitting assembly 12 and the housing 131 are fixed on the circuit board 11, the driving member 123 drives the light emitting member 122 to emit light signals, and adjusts the position of the pigtail in the optical fiber 14 according to the light signals received by the optical fiber 14; after the optical fiber 14 and the light emitting member 122 are coupled to the optimal positions, the positions of the optical fibers 14 are fixed using laser welding. After the optical fiber 14 is fixed to the housing 131, the light receiving element 132 is actively coupled to the optical fiber 14, the position of the light receiving element 132 is adjusted in the three-dimensional direction, and after the light receiving element 132 is coupled to the optimal position, the light receiving element 132 is fixed by dispensing. Illustratively, the light receiving member 132 and/or the optical fiber 14 are fixed to the housing 131 by using a black glue, so as to avoid interference of light outside the light receiving and transmitting package structure 102 and improve reliability of the light receiving and transmitting package structure 102.

With continued reference to fig. 10 and 11, fig. 10 is a schematic diagram illustrating a portion of the optical transceiver package 102 shown in fig. 1 in a second embodiment; fig. 11 is a schematic optical path diagram of the optical transceiver package 102 shown in fig. 10.

The following mainly describes the differences between the present embodiment and the first embodiment, and most of the same contents of the present embodiment and the first embodiment are not described in detail. For example, the optical transceiver package structure 102 includes a circuit board 11, a light emitting element 122, a light receiving element (not illustrated in the drawing), and a housing. The light emitting element 122 is fixed to the circuit board 11 by means of mounting. The housing is fixed to the circuit board 11, and a part of the structure of the light receiving element is embedded in the housing. Illustratively, the light receiving member is packaged coaxially with the housing or in a butterfly package.

In some embodiments, the optical transceiver packaging structure 102 further includes a detecting element 17. The detecting member 17 is used for monitoring the optical signal emitted from the light emitting element 12. For example, the detecting member 17 is used for monitoring the power or intensity of the optical signal emitted from the light emitting member 122, and the like. The sensing element 17 may be, but is not limited to, a monitoring laser diode (monitor photodiode, MPD).

In the embodiment of the present application, the detecting element 17 can detect the optical signal emitted by the optical emitting element 122 in real time, so that the optical transceiver packaging structure 102 can adjust the optical signal emitted by the optical emitting element 122 driven by the driving element 123 in real time, which is beneficial to improving the accuracy of signal transmission of the optical transceiver packaging structure 102.

In some embodiments, the optical transceiver package 102 further includes a beam splitter 18. The light-splitting sheet 18 is disposed opposite to the detecting member 17 to reflect the light signal emitted from the light-emitting member 122 to the detecting member 17. Illustratively, the beam splitter 18 is located on a side of the lens 15 remote from the light emitter 122 and is disposed opposite the lens 15. The beam splitter 18 is placed at 45 degrees. The light splitting sheet 18 is capable of allowing light emitted from the light emitting element 122 to pass therethrough so that the light of the light emitting assembly 12 is incident on the optical fiber; the light splitting sheet 18 can also reflect the light of the light emitting assembly 12 to the detecting member 17, so that the detecting member 17 monitors the light signal emitted by the light emitting member 122. One skilled in the art can design the transmission ratio of the light splitting sheet 18 according to actual requirements to realize the percentage of the light signal distributed from the light splitting sheet 18 to the detecting member 17.

In the present embodiment, the light signal emitted from the light emitting element 122 is emitted to the detecting element 17 through the light splitting sheet 18, so that the detecting element 17 can acquire the light signal emitted from the light emitting element 122. In the present embodiment, the light splitting sheet 18 and the detecting element 17 are each positioned outside the case 131. In other embodiments, the spectroscopic plate 18 and the detecting member 17 may be housed inside the case 131, which is not limited to this application. Alternatively, in other embodiments, the optical transceiver package 102 may not include the beam splitter 18 and the detector 17.

In other embodiments, as shown in fig. 12, the optical signal emitted by the optical emitting element 122 may also be directly emitted to the detecting element 17. That is, in other embodiments, the optical transceiver package 102 does not include the beam splitter 18. It is to be understood that the present application is not limited to the manner in which the detecting member 17 detects the optical signal emitted by the light emitting member 122, and those skilled in the art can design this according to actual requirements.

Referring to fig. 13, fig. 13 is a schematic diagram illustrating a part of the optical transceiver package 102 shown in fig. 1 in a fourth embodiment. The optical transceiver package structure 102 shown in this embodiment can be combined with any one of the optical transceiver package structures 102 in fig. 3 to 12.

The following mainly describes differences between the present embodiment and the foregoing embodiments, and most of the same contents of the present embodiment and the foregoing embodiments are not repeated. For example, the optical transceiver package structure 102 includes a circuit board 11, a light emitting element 122, a light receiving element 132, and a housing 131. The light emitting element 122 is fixed to the circuit board 11 by means of mounting. The housing 131 is fixed to the circuit board 11, and a part of the structure of the light receiving member 132 is embedded in the housing 131. Illustratively, the light receiving member 132 is packaged coaxially with the housing 131 or in a butterfly package.

As shown in fig. 13, the base 121 is fixed to the circuit board 11. The chassis 121 includes a first side 1211, a second side 1212, and a third side 1213. The first side 1211 is disposed opposite the second side 1212, and the third side 1213 is disposed between the first side 1211 and the second side 1212. The first side 1211 is adjacent to the light emitting element 122 and the second side 1212 is adjacent to the optical fiber 14. The light receiving element 132 is embedded in the third side 1213. The first side 1211 is provided with a light-passing hole 1301. The light-transmitting hole 1301 is used for the light signal emitted by the light-emitting component 12 to pass through, and the optical fiber 14 is disposed opposite to the light-transmitting hole 1301. The optical fiber 14 is located on the side of the base 121 remote from the light emitting member 122. As shown in fig. 13, the third side 1213 is illustratively oriented the same as the circuit board 11. In other embodiments, the third side 1213 can also be connected to the circuit board 11, which is not limited in this regard.

In this embodiment, the base 121 is also provided with a stepped surface 1215. The step surface 1215 is connected to the first side 1211, and the step surface 1215 is oriented in the same direction as the third side 1213. The light emitting member 122 is attached to the step surface 1215 and is disposed opposite to the light passing hole 1301. It will be appreciated that the light emitting member 122, the optical fiber 14, and the light receiving member 132 are all fixed to the base 121.

In this embodiment, the light emitting element 122, the optical fiber 14 and the light receiving element 132 are all fixed on the base 121, so that assembly errors caused when the light emitting element 122 and the optical fiber 14 are fixed on different structural members are avoided, and coupling efficiency of the light emitting element 122 and the optical fiber 14 is improved, thereby being beneficial to improving transmission performance of the optical transceiver packaging structure 102.

In some embodiments, the base 121 includes a housing 131 and a mounting table 18 that are spaced apart. The housing 131 and the mount 18 are both fixed to the circuit board 11. The driver 123 is mounted to the mounting surface 180 of the mounting table 18. The mounting face 180 is oriented in the same direction as the stepped face. It will be appreciated that the driver 123 and the light emitter 122 are located on the same side of the circuit board. Wherein the first side 1211, the second side 1212, the third side 1213, and the stepped surface 1215 all belong to the case 131. It is understood that the light emitting member 122 and the light receiving member 132 are fixed to the housing 131.

In the present embodiment, the light emitting member 122 and the light receiving member 132 are fixed to the housing 131, and the driving member 123 is fixed to the mount 18, that is, the light emitting member 122 and the driving member 123 are respectively fixed to different structures. The orientation of the mounting surface 180 is the same as the orientation of the step surface 1215, which is advantageous for reducing the length of the bonding wire 125 electrically connected between the driving member 123 and the light emitting member 122, thereby improving the high-speed signal quality of the optical transceiver packaging structure 102. In other embodiments, the driving member 123 may be directly fixed to the housing 131, that is, the housing 131 and the mounting table 18 are integrally formed, which is not limited by the present application.

In some embodiments, the optical transceiver package 102 further includes an auxiliary mesa 126, the auxiliary mesa 126 being secured to the stepped surface 1215. The light emitting member 122 is mounted on the auxiliary stage 126.

In this embodiment, the auxiliary stand 126 is arranged under the light emitting element 122, which not only can be used for dissipating heat of the light emitting element 122, but also is beneficial to ensuring that the light emitting element 122 is flush with the driving element 123 to reduce the length of the bonding wire 125, thereby reducing the link mismatch, improving the high-speed signal quality of the light receiving and transmitting package structure 102, and reducing the interference of the light emitting package structure on the signals of the motherboard 103.

In some embodiments, the side of the driving member 123 facing away from the circuit board 11 is flush with the side of the light emitting member 122 facing away from the circuit board 11. The bonding pads of the driving member 123 are located at a side of the driving member 123 facing away from the circuit board 11, and the bonding pads of the light emitting member 122 are also located at a side of the light emitting member 122 facing away from the circuit board 11. One end of the bonding wire 125 is welded to the pad of the driving member 123, and the other end is welded to the pad of the driving member 123, so as to realize electrical connection between the light emitting member 122 and the driving member 123.

In this embodiment, one side of the driving member 123 facing away from the circuit board 11 is flush with one side of the light emitting member 122 facing away from the circuit board 11, so that the extending direction of the main body portion of the bonding wire 125 is parallel to the surface of the circuit board 11, the distance between the driving member 123 and the light emitting member 122 of the bonding wire 125 is shorter, and the bonding wire 125 is prevented from being inclined due to the fact that the height of the driving member 123 is not flush with the height of the light emitting member 122, so that the length of the bonding wire 125 is further reduced, link mismatch is further reduced, and the high-speed signal quality of the optical transceiver packaging structure 102 is further improved.

As shown in fig. 13, in some embodiments, the optical transceiver package 102 further includes a lens 15 and a beam splitter 16. The lens 15 is fixed to the stepped surface 1215 and is disposed opposite the light emitting member 122. The beam splitter 16 is located at a side of the lens 15 away from the light emitting member 122, and the beam splitter 16 is fixed inside the base 121. The beam splitter 16 is located at a side of the lens 15 away from the light emitting element 122, and the beam splitter 16 is integrally formed with the lens 15. The optical splitter 16 employs a wavelength division multiplexing technique (wave division multiplexing, WDM). The beam splitter 16 may pass light emitted from the light emitting element 122 and advance toward the optical fiber 14; meanwhile, the beam splitter 16 reflects light from the optical fiber 14 to the light receiving element 132. Wherein the former light from the light emitting assembly 12 is at a different wavelength than the latter light from the optical fiber 14.

In the present embodiment, the lens 15 is fixed to the step surface 1215 of the base 121, that is, the lens 15 is located at the outer side of the base 121, and may be fixed to the outer surface of the base 121 by an adhesive manner, so that the assembling process of the lens 15 is simplified.

With continued reference to fig. 14 and 15, fig. 14 is a schematic view of a portion of the optical transceiver package 102 shown in fig. 1 in a fifth embodiment; fig. 15 is a partially exploded view of the optical transceiver package 102 shown in fig. 14.

The following mainly describes the differences between the present embodiment and the fourth embodiment, and most of the same contents of the present embodiment and the fourth embodiment are not described in detail. For example, the optical transceiver package structure 102 includes a circuit board 11, a light emitting element 122, a light receiving element 132, and a base 121. The base 121 is fixed to the circuit board 11, and the light emitting member 122 and the light receiving member 132 are fixed to the base 121. The light emitting element 122 is fixed to the base 121 by a mounting method. A part of the structure of the light receiving member 132 is embedded in the base 121. Illustratively, the light receiving member 132 is packaged coaxially with the base 121 or in a butterfly package.

In this embodiment, the optical transceiver package 102 further includes a lens 15 and a beam splitter 16. The lens 15 and the beam splitter 16 are fixed to the inside of the base 121. The lens 15 is exposed to the base 121 for converging the optical signal emitted from the optical emitter 122. Wherein the lens 15 and the beam splitter 16 are integrally formed from a polymeric material. The lens 15 and the beam splitter 16 are integrally formed into an optical path structure 19. The light path structure 19 is fixed inside the base 121 and is exposed opposite to the side of the base 121. The actual shape and position of the lens 15, the beam splitter 16 or the optical path structure 19 shown in fig. 15 are only examples, and those skilled in the art can design this according to the actual requirements, and the present application is designed for this.

In this embodiment, the lens 15 and the beam splitter 16 are fixed in the base 121, and the lens 15 and the beam splitter 16 are integrally formed, and the lens 15 and the beam splitter 16 are integrally fixed in the base 121, so that the optical path in the base 121 is integrated, the base 121 does not need to be provided with a structure for bearing the beam splitter 16, and the design of the internal structure of the base 121 is simplified; meanwhile, the optical path integration inside the base 121 is also beneficial to improving the optical path coupling efficiency of the optical transceiver packaging structure 102.

In this embodiment, the optical transceiver package structure 102 may be assembled by, but not limited to: after fixing the light emitting element 122 to the auxiliary stage 126, the auxiliary stage 126 is fixed to the stepped surface 1215 of the base 121, and the integrally formed lens 15 and the spectroscope 16 are bonded to the inside of the base 121; the optical fiber 14 is fixed on the base 121 by adopting a glue or laser welding mode, the optical transmitting element 122 and the optical fiber 14 are coupled, the optical receiving element 132 is coupled, and the optical receiving element 132 is fixed on the base 121 by adopting black glue; finally, the auxiliary stand 126 is bonded or soldered to the circuit board 11.

The present application is not limited to the above embodiments, and any person skilled in the art can easily think about the changes or substitutions within the technical scope of the present application, and the changes or substitutions are intended to be covered by the scope of the present application; embodiments of the application and features of the embodiments may be combined with each other without conflict. Therefore, the protection scope of the application is subject to the protection scope of the claims.

Claims

1. An optical transceiver package structure, comprising:

a circuit board;

the light emitting assembly comprises a base, a light emitting part, a driving part and a bonding wire, wherein the base is fixed on the circuit board, the base is made of metal materials, the light emitting part is attached to the base, the driving part is electrically connected with the circuit board, the driving part and the light emitting part are fixed on the same side of the base, and the driving part is used for driving the light emitting part to emit light signals through the bonding wire;

a light receiving member for receiving an optical signal;

the base comprises a base and a shell, the light emitting piece and the driving piece are both fixed on the base, the shell is fixed relative to the base, and the light receiving piece is fixed on the shell;

the optical transceiver packaging structure further comprises a lens and an optical splitter, wherein the lens is used for converging optical signals emitted by the optical emitting piece, the lens is located between the optical emitting piece and the optical receiving piece, and the optical splitter is located at one side, away from the optical emitting piece, of the lens.

2. The optical transceiver of claim 1, wherein a side of the driving member facing away from the base is flush with a side of the light emitting member facing away from the base.

3. The optical transceiver package structure of claim 1, further comprising a flexible circuit board electrically connected between the driver and the circuit board.

4. The optical transceiver package structure of claim 2, further comprising a flexible circuit board electrically connected between the driver and the circuit board.

5. The light-receiving and packaging structure according to any one of claims 1 to 4, wherein the housing is provided with a receiving groove, at least a part of the structure of the light-receiving element is received in the receiving groove, and the light-receiving element seals an opening of the receiving groove.

6. The optical transceiver packaging structure of claim 5, wherein the housing comprises a first side and a second side which are arranged opposite to each other, the first side is close to the light emitting element relative to the second side, the first side is provided with a light through hole, the light through hole is used for allowing the light signal emitted by the light emitting element to pass through, and the second side is provided with a mounting hole;

the optical transceiver packaging structure further comprises an optical fiber, the optical fiber is coupled with the light emitting part, a part of the optical fiber is accommodated in the mounting hole, the opening of the mounting hole is blocked, and the optical fiber accommodated in the mounting hole is opposite to the light passing hole.

7. The optical transceiver of claim 6, wherein the housing further comprises a third side, the third side is located between the first side and the second side, the third side is located at a side of the housing away from the circuit board, and the light receiving element is embedded in the third side.

8. The optical transceiver package of claim 5, wherein the beam splitter is disposed opposite the lens and opposite the light receiving element.

9. The optical transceiver package structure of claim 5, further comprising a detecting element for monitoring the optical signal emitted by the optical emitting element.

10. An optical transceiver package structure, comprising:

a circuit board;

A light receiving member for receiving an optical signal;

the base comprises a shell and a mounting table which are arranged at intervals, the shell and the mounting table are both fixed on the circuit board, the light emitting piece and the light receiving piece are both fixed on the shell, and the driving piece is fixed on the mounting table;

11. The optical transceiver of claim 10, wherein a side of the driving member facing away from the base is flush with a side of the light emitting member facing away from the base.

12. The optical transceiver package structure of claim 10, further comprising a flexible circuit board electrically connected between the driver and the circuit board.

13. The optical transceiver package structure of claim 11, further comprising a flexible circuit board electrically connected between the driver and the circuit board.

14. The optical transceiver packaging structure of any one of claims 10-13, wherein the base comprises a first side and a third side connected to the first side, the first side is provided with a light through hole, and the light receiving element is embedded in the third side;

the base is also provided with a step surface, the orientation of the step surface is the same as that of the third side edge, the step surface is connected with the first side edge, and the light emitting piece is attached to the step surface and is opposite to the light through hole.

15. The optical transceiver module of claim 14, wherein the driving member is mounted on a mounting surface of the mounting base, and the mounting surface is oriented in the same direction as the step surface.

16. The optical transceiver packaging structure of claim 14, wherein the base is further provided with a second side edge, the second side edge is opposite to the first side edge, and the second side edge is provided with a mounting hole; the optical transceiver packaging structure further comprises an optical fiber, the optical fiber is coupled with the light emitting part, a part of the optical fiber is accommodated in the mounting hole, the opening of the mounting hole is blocked, and the optical fiber accommodated in the mounting hole is opposite to the light passing hole.

17. The optical transceiver package of claim 14, wherein the lens is fixed to the stepped surface and is disposed opposite the light emitting element; the beam splitter is fixed in the inside of base.

18. The optical transceiver of claim 14, wherein the lens and the beam splitter are both fixed inside the base, and the beam splitter is integrally formed with the lens.

19. An optoelectronic device comprising a housing and the optical transceiver package of any one of claims 1 to 18, the optical transceiver package being mounted to the housing.

20. The optoelectronic device of claim 19, further comprising a motherboard to which the circuit board is secured; or, the main board and the circuit board are integrally formed.