CN103323921B - A kind of parallel transmission optical device of highly dense type - Google Patents
A kind of parallel transmission optical device of highly dense type Download PDFInfo
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- CN103323921B CN103323921B CN201310248240.9A CN201310248240A CN103323921B CN 103323921 B CN103323921 B CN 103323921B CN 201310248240 A CN201310248240 A CN 201310248240A CN 103323921 B CN103323921 B CN 103323921B
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Abstract
The present invention discloses a kind of parallel transmission optical device of highly dense type, is applicable to plug-type optical device and the CXP active optical cable (AOC) of the CXP packing forms in current data communication applications.Comprise: launch pcb board, reception pcb board, multichannel transmitting chip, multipath reception chip, launch driving chip, receive amplification chip, multichannel lens arra, seal cover board and connection line, described multichannel lens arra and seal cover board are two; It is characterized in that: described parallel transmission optical device also comprises switching array fibre jumper assemblies; The present invention be a kind of placement accuracy that effectively can reduce multichannel transmitting chip and multipath reception chip require thus reduce encapsulation difficulty, simultaneously can effective address signal cross-interference issue and device heat dissipation problem, the parallel transmission optical device of highly dense type that makes device performance more stable.
Description
Technical field
The present invention relates to a kind of parallel transmission optical device of highly dense type, be applicable to plug-type optical device and the CXP active optical cable (AOC) of the CXP packing forms in current data communication applications.Specifically, a kind of parallel transmission optical device of applicable CXP packing forms is related to.
Background technology
At present, 12*10G CXP parallel transmission optical module in data communication applications, primary structure is such, by two pieces of pcb boards, bottom plate is expelling plate, top plate is dash receiver, and two-ply is connected by soft board, and below soft board, mount a metallic heat radiating plate, relative position on soft board mounts successively multichannel transmitting chip, multipath reception chip, launch driving chip and receive amplification chip, and adopting the mode of gold wire bonding to carry out gold thread connection to these chips, realizing electrical connection.Then the array lens of 24 passages is adopted to carry out fine registration with multichannel transmitting chip and multipath reception chip respectively, after aligning, adopt epoxide-resin glue to fix the array lens of 24 passages, and then load onto positioning guide column, be used for realizing docking with external standard MPO optical patchcord.Finally load onto seal cover board, realize the object of device sealing.
But, larger technology difficulty is there is in said structure in implementation procedure, specifically in order to make the array lens of 24 passages accurately aim at multichannel transmitting chip and multipath reception chip respectively, meet high-precision alignment requirements with regard to the mounting position between inevitable requirement this multichannel transmitting chip and multipath reception chip, otherwise the lens arra of 24 passages is difficult to realize and these two groups of multichannel chips aiming at one by one.At present in order to meet the chip attachment requirement of high progress in this, usually needing to drop into high-precision chip mounter, relying on the mode of magnification at high multiple image identification or the mode of high power contraposition template to aim at.
Simultaneously, also there is the problem of the mutual crosstalk of certain signal in said structure, due to these 4 chips: i.e. multichannel transmitting chip, multipath reception chip, transmitting driving chip and reception amplification chip, all install concentratedly on same soft board, the wiring of high speed electrical signals line is concentrated, to transmit and signal cross-talk between Received signal strength affects comparatively large, the performance of device can be affected.
And said structure also exists certain heat dissipation problem, due to these 4 chips: i.e. multichannel transmitting chip, multipath reception chip, transmitting driving chip and reception amplification chip, all install concentratedly on same soft board, heat dissipation problem is also one of design bottleneck.
Summary of the invention
Object of the present invention is exactly the shortcoming and defect overcoming prior art, propose a kind of placement accuracy that effectively can reduce multichannel transmitting chip and multipath reception chip require thus reduce encapsulation difficulty, simultaneously can effective address signal cross-interference issue and device heat dissipation problem, the parallel transmission optical device of highly dense type that makes device performance more stable.
The technical solution adopted in the present invention is: a kind of parallel transmission optical device of highly dense type, comprise: launch pcb board, reception pcb board, multichannel transmitting chip, multipath reception chip, launch driving chip, receive amplification chip, multichannel lens arra, seal cover board and connection line, described multichannel lens arra and seal cover board are two; It is characterized in that: described parallel transmission optical device also comprises switching array fibre jumper assemblies;
Described switching array fibre jumper assemblies comprises: the standard MPO lock pin of the standard MPO lock pin of multicore, ribbon fiber, twice core number and positioning guide column, the standard MPO lock pin of described multicore is two, described ribbon fiber is two groups, and described positioning guide column is two; The standard MPO lock pin of described twice core number is connected with the standard MPO lock pin of described two multicores respectively by described two groups of ribbon fibers, positioning guide column described in two being installed in the standard MPO lock pin of described twice core number, using for aiming to locate with external standard MPO optical patchcord;
Described transmitting pcb board realizes being electrically connected by described connection line with described reception pcb board;
Described multichannel transmitting chip and transmitting driving chip are mounted on described transmitting pcb board, are electrically connected between described multichannel transmitting chip and transmitting driving chip by spun gold; Multichannel lens arra described in one of them is aimed at described multichannel transmitting chip and is fixedly connected with;
Described multipath reception chip and reception amplification chip are mounted on described reception pcb board, are electrically connected between described multipath reception chip and reception amplification chip by spun gold; Multichannel lens arra wherein described in another is aimed at described multipath reception chip and is fixedly connected with;
The standard MPO lock pin of the multicore described in one of them carries out aiming at being fixedly connected with the multichannel lens arra in described transmitting pcb board, and is sealed with the seal cover board described in one of them;
The standard MPO lock pin of the multicore wherein described in another carries out aiming at being fixedly connected with the multichannel lens arra in described reception pcb board, and is sealed with the seal cover board wherein described in another.
As preferably, described multichannel transmitting chip and launch driving chip and be mounted on described transmitting pcb board, installation site is principle according to described multichannel transmitting chip and the reasonable line arrangement of launching driving chip, determines described installation site flexibly; Described multipath reception chip and reception amplification chip are mounted on described reception pcb board, and installation site is principle according to the reasonable line arrangement of described multipath reception chip and reception amplification chip, determines described installation site flexibly.
As preferably, the multichannel lens arra described in described one of them is aimed at described multichannel transmitting chip and is fixedly connected with, and described being fixedly connected as adopts epoxide-resin glue to be fixed connection.
As preferably, the described multichannel lens arra wherein described in another is aimed at described multipath reception chip and is fixedly connected with, and described being fixedly connected as adopts epoxide-resin glue to be fixed connection.
As preferably, the standard MPO lock pin of described multicore carries out aiming at being fixedly connected with described multichannel lens arra, and the pilot hole of the standard MPO lock pin of described multicore and the guidepost of described multichannel lens arra are counterpart, inserts and is light path alignment; Described being fixedly connected as adopts epoxide-resin glue to be fixed connection.
As preferably, in described transmitting pcb board and described reception pcb board, the mutual alignment relation of each chip, according to device inside space size flexible topology, can be able to align, also can misplace, described transmitting pcb board and described reception pcb board are furnished with rational circuit design.
As preferably, described connection line, can adopt soft ribbons connection line, and metal also can be adopted to arrange pin connection line.
As preferably, the length of two groups of described ribbon fibers can be equally long, also can one group longer, another group is shorter, its length difference determined by the relative position difference of described multichannel transmitting chip and multipath reception chip respectively.
As preferably, described transmitting pcb board is made up of a PCB hardboard, the first soft board and the 2nd PCB hardboard, and a described PCB hardboard is connected by the first described soft board with the 2nd PCB hardboard.
As preferably, described reception pcb board is made up of the 3rd PCB hardboard, the second soft board and the 4th PCB hardboard, and the 3rd described PCB hardboard is connected by the second described soft board with the 4th PCB hardboard.
As preferably, described parallel transmission optical device also comprises array cable assembly, described array cable assembly comprises: the standard MPO lock pin of the optical fiber ribbon cable of one section of twice core number or circular optical cable, fixed card, multicore and ribbon fiber, the standard MPO lock pin of described multicore is four, described ribbon fiber is four groups, the described optical fiber ribbon cable of twice core number or the left end of circular optical cable are connected with the standard MPO lock pin of two multicores in described four respectively by two groups of ribbon fibers in described four groups, the described optical fiber ribbon cable of twice core number or the right-hand member of circular optical cable are connected with the standard MPO lock pin of two other multicore in described four respectively by the other two groups of ribbon fibers in described four groups, optical fiber ribbon cable or the circular optical cable connecting place of described ribbon fiber and described twice core number are fixed by described fixed card.
The present invention, relative to prior art, has the following advantages and good effect:
1. by multichannel transmitting chip, launch driving chip and multipath reception chip, receive this two groups of chip of amplification chip and be installed on respectively on two pieces of different pcb boards, effectively can improve radiating effect, make heat dissipation problem no longer become design bottleneck;
2. by multichannel transmitting chip, launch driving chip and multipath reception chip, receive this two groups of chip of amplification chip and be installed on two pieces of different pcb boards respectively, expelling plate and dash receiver are kept apart preferably, the signal cross-talk between launching and receiving can be effectively reduced;
3. by multichannel transmitting chip, launch driving chip and multipath reception chip, receive this two groups of chip of amplification chip and be installed on respectively on two pieces of different pcb boards, make encapsulated space relatively more flexible, no longer stick to compact layout;
4. by multichannel transmitting chip, launch driving chip and multipath reception chip, receive this two groups of chip of amplification chip and be installed on respectively on two pieces of different pcb boards, the placement accuracy requirement of chip can be reduced, without the need to this two groups of chip of fine registration, improve paster work efficiency;
5. switching array fibre jumper assemblies is applied to light path coupling and is connected, the stability of light path can be improved, and reduce the technology difficulty of light path coupling;
6., using the light mouth of one end (the standard MPO lock pin of twice core number) of switching array fibre jumper assemblies as module, this is for being flexible coupling, and Absorbable organic halogens realizes the plug function with standard MPO wire jumper;
7. this structure is applied in the structure of CXP optical device, because performance accuracy requires to decrease in manufacturing process, the processing of this optical device can be made more simple and easy to do, the rate and effective raising manufactures a finished product.
Accompanying drawing explanation
Fig. 1: switching array fibre jumper assemblies structural drawing of the present invention.
Fig. 2: first embodiment of the present invention structural drawing.
Fig. 3: second embodiment of the present invention structural drawing.
Fig. 4: third embodiment of the present invention structural drawing.
Fig. 5: fourth embodiment of the present invention structural drawing.
Fig. 6: array cable assembly structural drawing of the present invention.
Fig. 7: fifth embodiment of the present invention structural drawing.
Embodiment
The technical program is further described below in conjunction with reference to accompanying drawing, the example of described embodiment is shown in the drawings, wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish, but this description is only for explaining the present invention, and can not be interpreted as limitation of the present invention.
First embodiment:
Ask for an interview Fig. 1, Fig. 2, the technical scheme that this first embodiment adopts is: a kind of parallel transmission optical device of highly dense type, comprising: launch pcb board 101, receive pcb board 102, multichannel transmitting chip
103, multipath reception chip 104, transmitting driving chip 105, reception amplification chip 106, multichannel lens arra 107, seal cover board 108, connection line 109, switching array fibre jumper assemblies; Multichannel lens arra 107 and seal cover board 108 are two; Switching array fibre jumper assemblies comprises: the standard MPO lock pin 203 of the standard MPO lock pin 201 of multicore, ribbon fiber 202, twice core number and positioning guide column 204, the standard MPO lock pin 201 of multicore is two, ribbon fiber 202 is two groups, and positioning guide column 204 is two; The standard MPO lock pin 203 of twice core number is connected with the standard MPO lock pin 201 of two multicores respectively by two groups of ribbon fibers 202, two positioning guide column 204 being installed in the standard MPO lock pin 203 of twice core number, using for aiming to locate with external standard MPO optical patchcord; Launch pcb board 101 to realize being electrically connected by connection line 109 with reception pcb board 102; Multichannel transmitting chip 103 and transmitting driving chip 105 are mounted on to be launched on pcb board 101, and installation site is principle according to the reasonable line arrangement of multichannel transmitting chip 103 and transmitting driving chip 105, determines installation site flexibly; Be electrically connected by spun gold between multichannel transmitting chip 103 and transmitting driving chip 105; One of them multichannel lens arra 107 is aimed at multichannel transmitting chip 103 and is adopted epoxide-resin glue to be fixed and is connected; Multipath reception chip 104 and reception amplification chip 106 are mounted on and receive on pcb board 102, and installation site is principle according to the reasonable line arrangement of multipath reception chip 104 and reception amplification chip 106, determines installation site flexibly; Be electrically connected by spun gold between multipath reception chip 104 and reception amplification chip 106; Wherein another multichannel lens arra 107 is aimed at multipath reception chip 104 and is adopted epoxide-resin glue to be fixed and is connected; The standard MPO lock pin 201 of one of them multicore carries out aiming at the multichannel lens arra 107 launched in pcb board 101 and adopts epoxide-resin glue to be fixed and is connected, the pilot hole of the standard MPO lock pin 201 of multicore and the guidepost of multichannel lens arra 107 are counterpart, insert and are light path alignment; And sealed with one of them seal cover board 108; Wherein the standard MPO lock pin 201 of another multicore carries out aiming at the multichannel lens arra 107 received in pcb board 102 and adopts epoxide-resin glue to be fixed and is connected, the pilot hole of the standard MPO lock pin 201 of multicore and the guidepost of multichannel lens arra 107 are counterpart, insert and are light path alignment; And sealed with wherein another seal cover board 108.
Wherein connection line 109, can adopt soft ribbons connection line, and metal also can be adopted to arrange pin connection line.
Wherein, launch pcb board 101 and the mutual alignment relation receiving each chip in pcb board 102, according to device inside space size flexible topology, can align, also can misplace; Launch pcb board 101 and receive on pcb board 102 and be furnished with rational circuit design.The length of two groups of ribbon fibers 202 can be equally long, also can one group longer, another group is shorter, its length difference determined by the relative position difference of multichannel transmitting chip 103 with multipath reception chip 104 respectively.
Second embodiment:
Ask for an interview Fig. 1, Fig. 3, the technical scheme that this second embodiment adopts and the technical scheme that the first embodiment adopts, unique difference is, launch pcb board 101 to be made up of PCB hardboard 1011, first soft board 1012 and the 2nd PCB hardboard 1013, a PCB hardboard 1011 is connected by the first soft board 1012 with the 2nd PCB hardboard 1013.Multichannel transmitting chip 103 and transmitting driving chip 105 are mounted on the 2nd PCB hardboard 1013, are electrically connected between multichannel transmitting chip 103 and transmitting driving chip 105 by spun gold.
All the other structures and the first embodiment just the same, device space can be made so to be more conducive to layout.
3rd embodiment:
Ask for an interview Fig. 1, Fig. 4, the technical scheme that this 3rd embodiment adopts and the technical scheme that the first embodiment adopts, unique difference is, receive pcb board 102 to be made up of the 3rd PCB hardboard 1021, second soft board 1022 and the 4th PCB hardboard 1023, the 3rd PCB hardboard 1021 is connected by the second soft board 1022 with the 4th PCB hardboard 1023; Multipath reception chip 104 and reception amplification chip 106 are mounted on the 4th PCB hardboard 1023, are electrically connected between multipath reception chip 104 and reception amplification chip 106 by spun gold.
All the other structures and the first embodiment just the same, device space can be made so to be more conducive to layout.
4th embodiment:
Ask for an interview Fig. 1, Fig. 5, the technical scheme that this 4th embodiment adopts and the technical scheme that the first embodiment adopts, difference has two places:
One: launch pcb board 101 and be made up of PCB hardboard 1011, first soft board 1012 and the 2nd PCB hardboard 1013, a PCB hardboard 1011 is connected by the first soft board 1012 with the 2nd PCB hardboard 1013.Multichannel transmitting chip 103 and transmitting driving chip 105 are mounted on the 2nd PCB hardboard 1013, are electrically connected between multichannel transmitting chip 103 and transmitting driving chip 105 by spun gold;
Its two: receive pcb board 102 be made up of the 3rd PCB hardboard 1021, second soft board 1022 and the 4th PCB hardboard 1023, the 3rd PCB hardboard 1021 is connected by the second soft board 1022 with the 4th PCB hardboard 1023; Multipath reception chip 104 and reception amplification chip 106 are mounted on the 4th PCB hardboard 1023, are electrically connected between multipath reception chip 104 and reception amplification chip 106 by spun gold.
All the other structures and the first embodiment just the same, device space can be made so to be more conducive to layout.
5th embodiment:
Ask for an interview Fig. 6, Fig. 7, the technical scheme that this first embodiment adopts and the technical scheme that second and third embodiment adopts, be distinguished as: switching array fibre jumper assemblies is replaced by array cable assembly, and array cable assembly comprises: the standard MPO lock pin 201 of the optical fiber ribbon cable of one section of twice core number or circular optical cable 401, fixed card 402, multicore and ribbon fiber 202; The standard MPO lock pin 201 of multicore is four, ribbon fiber 202 is four groups, the optical fiber ribbon cable of twice core number or the left end of circular optical cable 401 are connected respectively by the standard MPO lock pin 201 of group ribbon fiber of two in four groups 202 with the multicore of two in four, the optical fiber ribbon cable of twice core number or the right-hand member of circular optical cable 401 are connected with the standard MPO lock pin 201 of two other multicore in four respectively by the other two groups of ribbon fibers 202 in four groups, and optical fiber ribbon cable or circular optical cable 401 connecting place of ribbon fiber 202 and twice core number are fixed by fixed card 402.
The optical fiber ribbon cable of twice core number or the two ends, left and right of circular optical cable 401 are connected with the parallel transmission optical device of embodiment three and the parallel transmission optical device of embodiment two respectively respectively by the standard MPO lock pin 201 of multicore, form a new parallel transmission optical device.
All the other structures and second and third embodiment just the same.
In the present embodiment, optical fiber ribbon cable or the circular optical cable of what the optical fiber ribbon cable of twice core number or circular optical cable 401 adopted is 24 cores, the standard MPO lock pin of what the standard MPO lock pin 201 of multicore adopted is 12 cores.
Certainly, also can be according to actual needs, two pieces parallel transmission optical device is selected arbitrarily in the parallel transmission optical device of embodiment one, embodiment two, embodiment three or embodiment four, be connected with the optical fiber ribbon cable of twice core number or the two ends, left and right of circular optical cable 401, form a new parallel transmission optical device.
These are only preferred embodiment of the present invention, be not intended to limit protection scope of the present invention, therefore, all any amendments done within the spirit and principles in the present invention, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. the parallel transmission optical device of a highly dense type, comprise: launch pcb board (101), reception pcb board (102), multichannel transmitting chip (103), multipath reception chip (104), launch driving chip (105), receive amplification chip (106), multichannel lens arra (107), seal cover board (108) and connection line (109), described multichannel lens arra (107) and seal cover board (108) are two; It is characterized in that: described parallel transmission optical device also comprises switching array fibre jumper assemblies;
Described switching array fibre jumper assemblies comprises: the standard MPO lock pin (203) of the standard MPO lock pin (201) of multicore, ribbon fiber (202), twice core number and positioning guide column (204), the standard MPO lock pin (201) of described multicore is two, described ribbon fiber (202) is two groups, and described positioning guide column (204) is two; The standard MPO lock pin (203) of described twice core number is connected with the standard MPO lock pin (201) of described two multicores respectively by described two groups of ribbon fibers (202), positioning guide column (204) described in two being installed in the standard MPO lock pin (203) of described twice core number, using for aiming to locate with external standard MPO optical patchcord;
Described transmitting pcb board (101) realizes being electrically connected by described connection line (109) with described reception pcb board (102);
Described multichannel transmitting chip (103) and transmitting driving chip (105) are mounted on described transmitting pcb board (101), are electrically connected between described multichannel transmitting chip (103) and transmitting driving chip (105) by spun gold; Multichannel lens arra (107) described in one of them is aimed at described multichannel transmitting chip (103) and is fixedly connected with;
Described multipath reception chip (104) and reception amplification chip (106) are mounted on described reception pcb board (102), are electrically connected between described multipath reception chip (104) and reception amplification chip (106) by spun gold; Multichannel lens arra (107) wherein described in another is aimed at described multipath reception chip (104) and is fixedly connected with;
The standard MPO lock pin (201) of the multicore described in one of them carries out aiming at being fixedly connected with the multichannel lens arra (107) in described transmitting pcb board (101), and is sealed with the seal cover board (108) described in one of them;
The standard MPO lock pin (201) of the multicore wherein described in another carries out aiming at being fixedly connected with the multichannel lens arra (107) in described reception pcb board (102), and is sealed with the seal cover board (108) wherein described in another.
2. the parallel transmission optical device of highly dense type according to claim 1, it is characterized in that: described multichannel transmitting chip (103) and transmitting driving chip (105) are mounted on described transmitting pcb board (101), installation site is principle according to the reasonable line arrangement of described multichannel transmitting chip (103) and transmitting driving chip (105), determines described installation site flexibly; Described multipath reception chip (104) and reception amplification chip (106) are mounted on described reception pcb board (102), installation site is principle according to the reasonable line arrangement of described multipath reception chip (104) and reception amplification chip (106), determines described installation site flexibly.
3. the parallel transmission optical device of highly dense type according to claim 1, it is characterized in that: the multichannel lens arra (107) described in described one of them is aimed at described multichannel transmitting chip (103) and is fixedly connected with, described being fixedly connected as adopts epoxide-resin glue to be fixed connection.
4. the parallel transmission optical device of highly dense type according to claim 1, it is characterized in that: the described multichannel lens arra (107) wherein described in another is aimed at described multipath reception chip (104) and is fixedly connected with, described being fixedly connected as adopts epoxide-resin glue to be fixed connection.
5. the parallel transmission optical device of highly dense type according to claim 1, it is characterized in that: the standard MPO lock pin (201) of described multicore carries out aiming at being fixedly connected with described multichannel lens arra (107), the pilot hole of the standard MPO lock pin (201) of described multicore and the guidepost of described multichannel lens arra (107) are counterpart, insert and are light path alignment; Described being fixedly connected as adopts epoxide-resin glue to be fixed connection.
6. the parallel transmission optical device of highly dense type according to claim 1, it is characterized in that: the mutual alignment relation of each chip in described transmitting pcb board (101) and described reception pcb board (102), can according to device inside space size flexible topology, can align, also can misplace, described transmitting pcb board (101) and described reception pcb board (102) are furnished with rational circuit design.
7. the parallel transmission optical device of highly dense type according to claim 1, it is characterized in that: the length of two groups of described ribbon fibers (202) can be equally long, also can one group longer, another group is shorter, its length difference determined by the relative position difference of described multichannel transmitting chip (103) with multipath reception chip (104) respectively.
8. the parallel transmission optical device of highly dense type according to claim 1, it is characterized in that: described transmitting pcb board (101) is made up of a PCB hardboard (1011), the first soft board (1012) and the 2nd PCB hardboard (1013), a described PCB hardboard (1011) is connected by described the first soft board (1012) with the 2nd PCB hardboard (1013).
9. the parallel transmission optical device of highly dense type according to claim 1, it is characterized in that: described reception pcb board (102) is made up of the 3rd PCB hardboard (1021), the second soft board (1022) and the 4th PCB hardboard (1023), the 3rd described PCB hardboard (1021) is connected by described the second soft board (1022) with the 4th PCB hardboard (1023).
10. the parallel transmission optical device of highly dense type according to claim 1, is characterized in that: described parallel transmission optical device also comprises array cable assembly, described array cable assembly comprises: the standard MPO lock pin (201) of the optical fiber ribbon cable of one section of twice core number or circular optical cable (401), fixed card (402), multicore and ribbon fiber (202), the standard MPO lock pin (201) of described multicore is four, described ribbon fiber (202) is four groups, the optical fiber ribbon cable of described twice core number or the left end of circular optical cable (401) are connected with the standard MPO lock pin (201) of two multicores in described four respectively by two groups of ribbon fibers (202) in described four groups, the optical fiber ribbon cable of described twice core number or the right-hand member of circular optical cable (401) are connected with the standard MPO lock pin (201) of two other multicore in described four respectively by the other two groups of ribbon fibers (202) in described four groups, optical fiber ribbon cable or circular optical cable (401) connecting place of described ribbon fiber (202) and described twice core number are fixed by described fixed card (402).
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| CN104537194B (en) * | 2015-01-22 | 2017-11-10 | 广东威创视讯科技股份有限公司 | A kind of PCB design method |
| JP2017090657A (en) * | 2015-11-10 | 2017-05-25 | ヒロセ電機株式会社 | Connector with optical fiber cable |
| CN105425350B (en) * | 2015-12-02 | 2018-05-04 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN105929494B (en) * | 2016-06-30 | 2018-06-19 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| TWI636288B (en) * | 2017-11-02 | 2018-09-21 | 建毅科技股份有限公司 | Flexible board optical line device |
| CN107861201B (en) * | 2017-12-05 | 2019-11-05 | 青岛海信宽带多媒体技术有限公司 | A kind of optical secondary module and optical module |
| CN110007410A (en) * | 2019-05-06 | 2019-07-12 | 西南科技大学 | Parallel optical module light channel structure based on PCB hardboard and soft board |
| CN111443436B (en) * | 2020-03-19 | 2021-10-26 | 武汉华工正源光子技术有限公司 | Receiving and transmitting integrated optical assembly based on COB coupling technology |
| CN114966999B (en) * | 2021-02-26 | 2023-12-08 | 华为技术有限公司 | Optical transceiver packaging structure and photoelectric equipment |
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