CN102437245A - Optical transceiver component TO coaxial miniaturized packaging method - Google Patents
Optical transceiver component TO coaxial miniaturized packaging method Download PDFInfo
- Publication number
- CN102437245A CN102437245A CN2011104280722A CN201110428072A CN102437245A CN 102437245 A CN102437245 A CN 102437245A CN 2011104280722 A CN2011104280722 A CN 2011104280722A CN 201110428072 A CN201110428072 A CN 201110428072A CN 102437245 A CN102437245 A CN 102437245A
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- China
- Prior art keywords
- base
- heat sink
- welding
- coaxial
- carrying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to an optical transceiver component TO coaxial miniaturized packaging method for the field of semiconductor photoelectric devices. The method comprises the following steps: a, carrying out gold plating on the surface of a TO base made of an iron-nickel-cobalt alloy material, welding an aluminum nitride heat sink and a laser chip on the TO base by adopting a welding material of Au(80)Ge(20) alloy, and arranging a node for heat conduction on the TO base on which the aluminum nitride heat sink is welded; b. carrying out gold plating on the surface of the aluminum nitride heat sink by adopting a thin film sputtering technology; c. welding a backlight detector on the TO base; and d. carrying out golden wire welding, and connecting an external connecting wire of a connection chip. Performances and reliability of the method provided by the invention both meet using requirements, two beams of different wavelengths can be reflected through a beam splitter, and then enter an optical fiber through lens focus and coupling, so that the effect of transmitting two beams of light signals by virtue of one optical fiber is achieved, thus the volume is reduced, and the power consumption and the cost are lowered.
Description
Technical field
The present invention relates to a kind of coaxial miniaturization method for packing of transmitting-receiving optical device TO that is used for the semiconductor photoelectric device field.
Background technology
At present for the miniaturization of transmitting-receiving optical device require increasingly highly, the overall volume of SFP, SFF can't satisfy the requirement of miniaturization in the existing transmitting-receiving optical device.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of and can reduce the volume of photoelectric device, the coaxial miniaturization method for packing of transmitting-receiving optical device TO of reduction power consumption.
Method of the present invention is:
A. gold-plated to the TO susceptor surface of teleoseal material, adopt Au (80) Ge (20) solder to be welded on the TO base with chip of laser aluminium nitride is heat sink, welding the node that is provided for heat conduction on the heat sink TO base of aluminium nitride;
B. adopt thin film sputtering technology gold-plated to the aluminium nitride heat sink surface;
C. on the TO base, weld back light detector;
D. carry out the spun gold weldering, connect chip in succession and connect lead outward.
The coaxial miniaturization method for packing of transmitting-receiving optical device TO of the present invention; Its Performance And Reliability all satisfies instructions for use; It can be reflected in scioptics focusing with two bundle different wave lengths through light splitting piece and be coupled into optical fiber; Reach the effect of an Optical Fiber Transmission two-beam signal, thereby reduce volume, reduction power consumption and cost.
Embodiment
The method of the embodiment of the invention is:
A. gold-plated to the TO susceptor surface of teleoseal material, adopt Au (80) Ge (20) solder to be welded on the TO base with chip of laser aluminium nitride is heat sink, welding the node that is provided for heat conduction on the heat sink TO base of aluminium nitride;
B. adopt thin film sputtering technology gold-plated to the aluminium nitride heat sink surface;
C. on the TO base, weld back light detector;
D. carry out the spun gold weldering, connect chip in succession and connect lead outward.
Claims (1)
1. receive and dispatch the coaxial miniaturization method for packing of optical device TO for one kind, it is characterized in that:
A. gold-plated to the TO susceptor surface of teleoseal material, adopt Au (80) Ge (20) solder to be welded on the TO base with chip of laser aluminium nitride is heat sink, welding the node that is provided for heat conduction on the heat sink TO base of aluminium nitride;
B. adopt thin film sputtering technology gold-plated to the aluminium nitride heat sink surface;
C. on the TO base, weld back light detector;
D. carry out the spun gold weldering, connect chip in succession and connect lead outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104280722A CN102437245A (en) | 2011-12-20 | 2011-12-20 | Optical transceiver component TO coaxial miniaturized packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104280722A CN102437245A (en) | 2011-12-20 | 2011-12-20 | Optical transceiver component TO coaxial miniaturized packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102437245A true CN102437245A (en) | 2012-05-02 |
Family
ID=45985219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104280722A Pending CN102437245A (en) | 2011-12-20 | 2011-12-20 | Optical transceiver component TO coaxial miniaturized packaging method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102437245A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111702364A (en) * | 2020-06-09 | 2020-09-25 | 武汉电信器件有限公司 | Welding method of TO-CAN ceramic plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101447641A (en) * | 2007-11-29 | 2009-06-03 | 夏普株式会社 | Cap member and semiconductor device employing same |
| CN102005695A (en) * | 2010-10-25 | 2011-04-06 | 江苏飞格光电有限公司 | SLD (super radiation laser) TO-CAN coaxial miniaturized encapsulating method |
| CN102034899A (en) * | 2010-10-25 | 2011-04-27 | 江苏飞格光电有限公司 | TO-CAN coaxial miniaturization package method for BOSA |
| CN102034719A (en) * | 2010-10-25 | 2011-04-27 | 江苏飞格光电有限公司 | TO-CAN coaxial small-sized packaging method for PIN-FET high-sensitivity detector |
-
2011
- 2011-12-20 CN CN2011104280722A patent/CN102437245A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101447641A (en) * | 2007-11-29 | 2009-06-03 | 夏普株式会社 | Cap member and semiconductor device employing same |
| CN102005695A (en) * | 2010-10-25 | 2011-04-06 | 江苏飞格光电有限公司 | SLD (super radiation laser) TO-CAN coaxial miniaturized encapsulating method |
| CN102034899A (en) * | 2010-10-25 | 2011-04-27 | 江苏飞格光电有限公司 | TO-CAN coaxial miniaturization package method for BOSA |
| CN102034719A (en) * | 2010-10-25 | 2011-04-27 | 江苏飞格光电有限公司 | TO-CAN coaxial small-sized packaging method for PIN-FET high-sensitivity detector |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111702364A (en) * | 2020-06-09 | 2020-09-25 | 武汉电信器件有限公司 | Welding method of TO-CAN ceramic plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120502 |