CN102034719A - TO-CAN coaxial small-sized packaging method for PIN-FET high-sensitivity detector - Google Patents
TO-CAN coaxial small-sized packaging method for PIN-FET high-sensitivity detector Download PDFInfo
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- CN102034719A CN102034719A CN201010517904.3A CN201010517904A CN102034719A CN 102034719 A CN102034719 A CN 102034719A CN 201010517904 A CN201010517904 A CN 201010517904A CN 102034719 A CN102034719 A CN 102034719A
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Abstract
The invention relates to a method for manufacturing a semiconductor photoelectric device for an inertial navigation system, in particular to a TO-CAN coaxial small-sized packaging method for a PIN-FET high-sensitivity detector. The method comprises the following steps that: a, the surface of a TO-CAN base made of an iron, nickel and cobalt alloy material is gilded and a heat-conductive Case point is arranged on a TO-CAN base welded with a ceramic heat sink; b, the surface of the ceramic heat sink is gilded by a thin-film sputtering method, and the ceramic heat sink is welded on the TO-CAN base by epoxy resin solder; c, an integrated chip, a detector PD chip and a filter capacitor are welded on the TO-CAN base by the epoxy resin solder; and d, a connecting chip is connected with an external connecting lead by welding a gold wire. Three fragmented components of FET, PNP and NPN are integrated on a chip, so that the device small in size is conveniently packaged into a TO-CAN coaxial small-sized device, and has the advantages of small size and low power consumption compared with the device packaged by the traditional butterfly packaging method.
Description
Technical field
The present invention relates to be used for the semiconductor photoelectric device manufacturing of inertial navigation system, specifically is the coaxial miniaturization method for packing of a kind of PIN-FET highly-sensitive detector TO-CAN.
Background technology
At present, more and more higher for the inertial navigation optic fiber gyroscope to the requirement of miniaturization, and existing photoelectric device can't satisfy the instructions for use of the overall volume miniaturization of optic fiber gyroscope.
Summary of the invention
The present invention wants the technical solution problem to be, provides a kind of and can reduce the volume of photoelectric device, the coaxial miniaturization method for packing of PIN-FET highly-sensitive detector TO-CAN of reduction power consumption.
Method of the present invention is:
A. gold-plated to the TO-CAN susceptor surface of teleoseal material, welding the Case point that is provided for heat conduction on the TO-CAN base of ceramic heat sink;
B. adopt thin film sputtering technology to the ceramic heat sink surface gold-plating; Adopt the epoxy resin scolder that ceramic heat sink is welded on the TO-CAN base;
C. adopt the conductive epoxy resin scolder to be welded on the TO-CAN base integrated chip, detector PD chip, filter capacitor;
D. carry out the spun gold weldering, connect chip in succession and connect lead outward.
Method of the present invention has satisfied the requirement of Performance And Reliability simultaneously, its realize miniaturization the most key the discrete component on the ceramic circuit board to be integrated in one be on the integrated chip of substrate with the GaAs with exactlying, the excessive problem of volume of solution discrete component.Because FET, PNP, these three discrete components and parts of NPN are integrated on the chip, thereby its volume urinates in being packaged into the coaxial miniaturization of TO-CAN, and it is little, low in energy consumption that traditional relatively butterfly encapsulates its volume.
Embodiment
The method of the embodiment of the invention is:
A. gold-plated to the TO-CAN susceptor surface of teleoseal material, welding the Case point that is provided for heat conduction on the TO-CAN base of ceramic heat sink;
B. adopt thin film sputtering technology to the ceramic heat sink surface gold-plating; Adopt the epoxy resin scolder that ceramic heat sink is welded on the TO-CAN base;
C. adopt the conductive epoxy resin scolder to be welded on the TO-CAN base integrated chip, detector PD chip, filter capacitor;
D. carry out the spun gold weldering, connect chip in succession and connect lead outward.
The device volume that inventive method of the present invention obtains is equivalent to 30% of traditional devices volume, thereby makes that the overall volume of inertial navigation optic fiber gyroscope is littler, is convenient to be equipped in more on the polytypic, and is low-cost simultaneously.
Claims (1)
1. coaxial miniaturization method for packing of PIN-FET highly-sensitive detector TO-CAN is characterized in that:
A. gold-plated to the TO-CAN susceptor surface of teleoseal material, welding the Case point that is provided for heat conduction on the TO-CAN base of ceramic heat sink;
B. adopt thin film sputtering technology to the ceramic heat sink surface gold-plating; Adopt the epoxy resin scolder that ceramic heat sink is welded on the TO-CAN base;
C. adopt the conductive epoxy resin scolder to be welded on the TO-CAN base integrated chip, detector PD chip, filter capacitor;
D. carry out the spun gold weldering, connect chip in succession and connect lead outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010517904A CN102034719B (en) | 2010-10-25 | 2010-10-25 | TO-CAN coaxial small-sized packaging method for PIN-FET high-sensitivity detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010517904A CN102034719B (en) | 2010-10-25 | 2010-10-25 | TO-CAN coaxial small-sized packaging method for PIN-FET high-sensitivity detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102034719A true CN102034719A (en) | 2011-04-27 |
| CN102034719B CN102034719B (en) | 2012-09-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010517904A Expired - Fee Related CN102034719B (en) | 2010-10-25 | 2010-10-25 | TO-CAN coaxial small-sized packaging method for PIN-FET high-sensitivity detector |
Country Status (1)
| Country | Link |
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| CN (1) | CN102034719B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102437245A (en) * | 2011-12-20 | 2012-05-02 | 江苏飞格光电有限公司 | Optical transceiver component TO coaxial miniaturized packaging method |
| CN102699623A (en) * | 2012-06-06 | 2012-10-03 | 滁州金科机械模具制造有限公司 | Sealing and bonding process of temperature controller power part |
| CN102780157A (en) * | 2012-07-06 | 2012-11-14 | 江苏飞格光电有限公司 | Chip patching system of semiconductor laser and patching method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1846466A (en) * | 2003-09-04 | 2006-10-11 | 菲尼萨公司 | Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly |
| CN101499461A (en) * | 2008-01-31 | 2009-08-05 | 前源科技股份有限公司 | Photoelectric element and optical sub-module employing the same |
-
2010
- 2010-10-25 CN CN201010517904A patent/CN102034719B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1846466A (en) * | 2003-09-04 | 2006-10-11 | 菲尼萨公司 | Laser monitoring and control in a transmitter optical subassembly having a ceramic feedthrough header assembly |
| CN101499461A (en) * | 2008-01-31 | 2009-08-05 | 前源科技股份有限公司 | Photoelectric element and optical sub-module employing the same |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102437245A (en) * | 2011-12-20 | 2012-05-02 | 江苏飞格光电有限公司 | Optical transceiver component TO coaxial miniaturized packaging method |
| CN102699623A (en) * | 2012-06-06 | 2012-10-03 | 滁州金科机械模具制造有限公司 | Sealing and bonding process of temperature controller power part |
| CN102699623B (en) * | 2012-06-06 | 2014-12-03 | 滁州金科机械模具制造有限公司 | Sealing and bonding process of temperature controller power part |
| CN102780157A (en) * | 2012-07-06 | 2012-11-14 | 江苏飞格光电有限公司 | Chip patching system of semiconductor laser and patching method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102034719B (en) | 2012-09-19 |
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| C14 | Grant of patent or utility model | ||
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Address after: 212009 Zhenjiang province Jiangsu city Zhenjiang district four South Dingmao Road No. 36 Patentee after: JIANGSU FIBER GRID Co.,Ltd. Address before: No. 1 Jinyang road 212006 in Zhenjiang province Jiangsu City Jingkou Industrial Park Patentee before: JIANGSU FIBER GRID Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120919 Termination date: 20211025 |
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| CF01 | Termination of patent right due to non-payment of annual fee |