CN201407516Y - Light emitting diode reflect ring and combined structure with base plate thereof - Google Patents
Light emitting diode reflect ring and combined structure with base plate thereof Download PDFInfo
- Publication number
- CN201407516Y CN201407516Y CN2009200674329U CN200920067432U CN201407516Y CN 201407516 Y CN201407516 Y CN 201407516Y CN 2009200674329 U CN2009200674329 U CN 2009200674329U CN 200920067432 U CN200920067432 U CN 200920067432U CN 201407516 Y CN201407516 Y CN 201407516Y
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- substrate
- reflection
- tore
- ring
- combined structure
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Abstract
The utility model relates to a light emitting diode reflect ring and a combined structure between the reflect ring and a base plate; wherein the surface of the base plate is provided with pins connected with a printed circuit board, the upper end of the base plate is provided with a diode chip, and a reflect ring is provided on the periphery of the diode chip. The utility model is characterized inthat the base plate and the reflect ring are made from ceramic, the ceramic base plate and the ceramic reflect ring are attached by the adhesive containing oxide silicon, to adapt to the operating temperature of high power light emitting diode, therefore, the base plate and the reflect ring can keep stable combination under high temperature without separation.
Description
[technical field]
The utility model is relevant a kind of light emitting diode, the substrate and the tore of reflection that are meant light emitting diode especially are ceramic materials, bond with the oxidation silicon composition bond that closes with high-temperature stability, with in response to the High Power LED operating temperature, and tore of reflection inside is the conical surface or sphere, has preferable reflection characteristic.
[background technology]
Along with the production of integrated circuits development of technology, the design and fabrication of electronic component continues the trend development towards granular.For in response to IC process technique microminiaturization and the compact trend of electronic communication product, electronic component be attached on the printed circuit board (PCB) technology also by plug-in type be evolved into surface adhesive type (Surface MountDevice, SMD).
Common light emitting diode construction, as shown in Figure 1, be to be arranged on the substrate made from BT resin (Bismaleimide Triazine Resin) 12 with LED wafer (chip or die) 11, the electrode of diode wafer (chip or die) 11 links with the Copper Foil 14 of the external electric binding that sets in advance on lead (bonding wire) 13 and the substrate, tore of reflection 15 is set around the diode wafer 11, with resin 16 diode wafer 11 and lead 13 is encapsulated again at last.Its advantage is the encapsulation that can be applicable to a large amount of LED wafers on producing, and production cost is low; But its shortcoming then is a resin is not good Heat Conduction Material, and the high heat that wafer 11 is produced must rely on Copper Foil 14 and distribute, and the packaged type that this electrical path and heat dissipation channel are integrated also is not suitable for the diode wafer of high-power light emitting.
In order to improve above-mentioned shortcoming, the enterprise that has has proposed substrate and reflecting plate are used as the encapsulating structure of the High Power LED wafer of radiating groove (heat sink).
Please refer to shown in the accompanying drawing 2, it mainly is to utilize the surface of a metal substrate 21 to be pre-formed the conduit 22 that can be electrically connected, the central authorities of metal substrate 21 are provided with diode wafer 23, the upper end of metal substrate 21 is provided with the tore of reflection 24 that central authorities have the duct again, and medium pore canal 241 tops of tore of reflection 24 are provided with an optical frames cover 25 again and constitute.
Said metal substrates 21 and tore of reflection 24 are to use the metal material that has the high temperature conduction but be electrically insulated.Because metal substrate 21 and tore of reflection 24 all are metal materials, only can use the close binding agent of low-temperature resins or character to bond mutually between them.When the operating temperature of light emitting diode was more and more higher, binding agents such as low-temperature resins were easily because of being gone bad by Gao Re, and caking property reduces relatively, causes separating of substrate and tore of reflection, causes the damage of wafer.In addition, as shown in the figure, common tore of reflection 24, its central interior duct 241 is upright tubular, the reflecting effect of static reflex face is poor, has also hindered anaclasis and heat radiation.
[utility model content]
The purpose of this utility model is to overcome the prior art deficiency, proposed a kind of LED reflection ring with and with the combined structure of substrate, make substrate and tore of reflection when high temperature, can keep firm combination, unlikely separation in response to the operating temperature of High Power LED.
In order to achieve the above object, the utility model is to constitute like this:
This LED reflection ring with and with the combined structure of substrate, comprising: a substrate, is located at tore of reflection, that the substrate top coats in the form of a ring and is located at the optical lens that the LED wafer and of substrate upper end face is located at the tore of reflection upper end; Use the high temp glass gluing that contains oxidation silicon composition to close between described tore of reflection and substrate.
Above-mentioned be used for the LED reflection ring with and with the combined structure of substrate, described tore of reflection is a ceramic material.
Above-mentioned be used for the LED reflection ring with and with the combined structure of substrate, described tore of reflection is except the binding site of ground and substrate, other surfaces are the metal levels that are coated with silver or gold.
Above-mentioned be used for the LED reflection ring with and with the combined structure of substrate, the inner surface of described tore of reflection is the non-vertical surface of the sphere or the conical surface.
Above-mentioned be used for the LED reflection ring with and with the combined structure of substrate, described substrate is a ceramic substrate.
Above-mentioned be used for the LED reflection ring with and with the combined structure of substrate, described substrate is aluminum oxide substrate or aluminium nitride substrate.
Above-mentioned be used for the LED reflection ring with and with the combined structure of substrate, the inside of described tore of reflection is provided with centre gangway, this centre gangway is the straight tube passage.
This LED reflection ring with and with the combined structure of substrate, come operating temperature with the bond bonding that contains oxidation silicon composition between its substrate and tore of reflection in response to High Power LED, make substrate and tore of reflection when high temperature, can keep firm combination.And tore of reflection inside is the conical surface or sphere, can increase the reflection function of light emitting diode, reduces gathering of heat energy, promotes thermal diffusivity.
[description of drawings]
Fig. 1 is the encapsulating structure profile of common light emitting diode.
Fig. 2 is the encapsulating structure profile of another common light emitting diode.
Fig. 3 is an encapsulating structure profile of the present utility model.
Fig. 4 is another embodiment profile of the utility model.
Fig. 5 is another enforcement illustration of the utility model tore of reflection.
Label among the figure is respectively: 11. LED wafers, 12. substrates, 13. leads, 14. Copper Foils, 15. tores of reflection, 16. resins, 21. metal substrates, 22. conduits, 23. diode wafers, 24. tores of reflection, 241. medium pore canals, 25. optical frames covers, 3. substrates, 4. tores of reflection, 41. metal levels, 42. spheres, 43. conical surfaces, 5. LED wafers, 6. optical lenses, 7. bonds, 8. tores of reflection, 81. straight tube passages
[specific embodiment]
Now with embodiment the utility model is described in conjunction with the accompanying drawings.
The utility model LED reflection ring with and with the combined structure of substrate, as shown in Figure 3, this light emitting diode comprises: the LED wafer 5 and that the tore of reflection 4, that an aluminum oxide substrate 3, is located at aluminum oxide substrate 3 tops is located at the substrate upper end face is located at the optical lens 6 of tore of reflection upper end.
As shown in the figure, tore of reflection 4 is ceramic materials such as aluminium oxide, is bond 7 (as the high temp glass glue) combinations that contain oxidation silicon composition with resistant to elevated temperatures between itself and aluminum oxide substrate 3, whereby can be in response to the hot environment of High Power LED.
As shown in the figure, above-mentioned tore of reflection 4, except the binding site of bottom surface and substrate 3, other surfaces are metal levels 41 such as lining silver, gold, its inner surface is a sphere 42, can increase the reflecting properties of light emitting diode.
Please refer to shown in the accompanying drawing 4, this tore of reflection 4, its inner surface can be again the conical surface 43 non-vertical surfaces.
By above-mentioned formation,, can use bonds such as high temp glass glue bonding with high-temperature stability because substrate 3 and tore of reflection 4 are the combinations of aluminium oxide ceramics material.
The inner surface of penetration ring 4 changes the sphere or the conical surface into, can increase the irradiant reflection performance of light emitting diode, reduces gathering of heat energy, promotes thermal diffusivity.
Accompanying drawing 5 are the utility model LED reflection rings with and with the combined structure of substrate, another embodiment of its tore of reflection, as shown in the figure, because tore of reflection 8 is ceramic materials, can make directly that its central interior passage is a straight tube passage 81, directly cutting can be bonded on the substrate and use, and need not again the tore of reflection inwall to be carried out secondary operations.
The above is the preferable specific embodiment of the utility model, according to the change that conception of the present utility model is done, and the function that is produced, if do not exceed specification and diagram institute covering scope yet, all should be in scope of the present utility model.
Claims (7)
- A LED reflection ring with and with the combined structure of substrate, this light emitting diode comprises: a substrate, is located at the tore of reflection, that coats in the form of a ring above the substrate and is located at the optical lens that the LED wafer and of substrate upper end face is located at the tore of reflection upper end; It is characterized in that: be to use the high temp glass gluing to close between described tore of reflection and the substrate.
- 2. LED reflection ring as claimed in claim 1 with and with the combined structure of substrate, wherein tore of reflection is a ceramic material.
- 3. LED reflection ring as claimed in claim 1 or 2 with and with the combined structure of substrate, wherein tore of reflection is except the binding site of ground and substrate, other surfaces are the metal levels that are coated with silver or gold.
- 4. LED reflection ring as claimed in claim 1 or 2 with and with the combined structure of substrate, wherein the inner surface of tore of reflection is the non-vertical surface of the sphere or the conical surface.
- 5. LED reflection ring as claimed in claim 1 with and with the combined structure of substrate, wherein substrate is a ceramic substrate.
- 6. LED reflection ring as claimed in claim 1 with and with the combined structure of substrate, wherein substrate is aluminum oxide substrate or aluminium nitride substrate.
- 7. LED reflection ring as claimed in claim 2 with and with the combined structure of substrate, wherein the inside of tore of reflection is provided with centre gangway, this centre gangway is the straight tube passage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200674329U CN201407516Y (en) | 2009-01-23 | 2009-01-23 | Light emitting diode reflect ring and combined structure with base plate thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200674329U CN201407516Y (en) | 2009-01-23 | 2009-01-23 | Light emitting diode reflect ring and combined structure with base plate thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201407516Y true CN201407516Y (en) | 2010-02-17 |
Family
ID=41678450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200674329U Expired - Lifetime CN201407516Y (en) | 2009-01-23 | 2009-01-23 | Light emitting diode reflect ring and combined structure with base plate thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201407516Y (en) |
-
2009
- 2009-01-23 CN CN2009200674329U patent/CN201407516Y/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100217 |