CN215266336U - Coaxial photodiode detector - Google Patents
Coaxial photodiode detector Download PDFInfo
- Publication number
- CN215266336U CN215266336U CN202121370409.4U CN202121370409U CN215266336U CN 215266336 U CN215266336 U CN 215266336U CN 202121370409 U CN202121370409 U CN 202121370409U CN 215266336 U CN215266336 U CN 215266336U
- Authority
- CN
- China
- Prior art keywords
- base
- heat sink
- coaxial
- light
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Light Receiving Elements (AREA)
Abstract
The utility model discloses a coaxial photodiode detector mainly solves current photodiode detector packaging form structure and has hardly satisfied needs, has the problem that bulky, integrated array assembly space utilization is low. The detector comprises a base, a heat sink base arranged at the center of the upper part of the base, a light-emitting diode chip fixed on the heat sink base, a diode pin which penetrates through the base and is fixedly connected with the base through a lead and the light-emitting diode chip, a pipe cap which is fixed on the base and used for hermetically packaging and protecting the internal structure of a device, and a lens which is arranged on the pipe cap and used for focusing received light signals. The device structure is packaged in a TO-33 2pin mode, so that the miniaturization of the device is realized, the installation and use space is greatly saved, and the device structure is different from the existing packaging of any other traditional process. And secondly, the device does not need shell grounding connection, one-time pin welding is reduced in the gold-plated base production process, the production efficiency is higher, raw materials are saved, and the environment is protected.
Description
Technical Field
The utility model belongs to the technical field of fiber communication, specifically speaking relates to a coaxial photodiode detector.
Background
The traditional coaxial PIN photodiode detector adopts a TO-46 3PIN TO package and couple received optical signals, and is applied TO the fields of CATV and optical fiber instruments and meters. With the development of the 5G technology and the advance of the 5G forward semi-passive scheme networking, the layout of machine room equipment needs low power consumption and high space utilization rate, and the miniaturization trend of the optical power monitoring module is continuously developed, so that the structure of an optical device needs to be further miniaturized, and the array packaging is convenient to realize, so that the use space is saved. At the moment, the traditional coaxial photodiode detector packaging structure is difficult to meet the requirements, and the problems of large volume and low utilization rate of an integrated array assembling space exist.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a coaxial photodiode detector mainly solves current photodiode detector encapsulation form structure and has hardly satisfied needs, has the problem that bulky, integrated array assembly space utilization is low.
In order to achieve the above object, the utility model adopts the following technical scheme:
a coaxial photodiode detector comprises a base, a heat sink base arranged at the center of the upper part of the base, a light emitting diode chip fixed on the heat sink base, a diode pin penetrating through the base and fixed with the base through a lead and connected with the light emitting diode chip, a pipe cap fixed on the base and used for hermetically packaging and protecting the internal structure of a device, a lens arranged on the pipe cap and used for focusing a received light signal to the light emitting diode chip, a shell arranged outside the pipe cap and the base, and a Tap light splitter connected through the shell.
Preferably, the heat sink substrate is an aluminum oxide heat sink.
Preferably, the joint of the lens and the tube cap is filled with airtight solder.
Preferably, the light emitting diode chip is bonded on the heat sink substrate through a gold wire.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses to carry the aluminium oxide heat sink carrier subsides of gilding heat conduction layer and adorn in the 2pin feet of T033On the base seat, the LED chip is adhered to the alumina heat sink carrier, and the electric signal link is completed through gold wire lead bonding and then usedThe small ball lens tube cap is packaged and welded on the TO33 base through a capacitance energy storage welding process, and air tightness and miniaturization packaging are completed. The volume of the finished product of the device is only one third of the space of the traditional TO46 packaged detector, so that the mounting space inside the module is greatly saved, and meanwhile, raw materials are saved.
Drawings
Fig. 1 is a schematic sectional view of the present invention.
Fig. 2 is a schematic structural diagram of the present invention after removing the outer shell.
Fig. 3 is a schematic view of the overall structure of the present invention.
Wherein, the names corresponding to the reference numbers are:
the LED light source comprises a base 1, a heat sink base 2, a light emitting diode chip 3, a diode pin 4, a tube cap 5, a lens 6, an airtight solder 7, a gold wire lead 8, a shell 9 and a Tap light splitter 10.
Detailed Description
The present invention will be further described with reference to the following description and examples, which include but are not limited to the following examples.
Examples
As shown in figures 1-3, the utility model discloses a coaxial photodiode detector, including the 2pin feet of T033A base 1, an alumina heat sink carrier carrying gold-plated heat and electricity conducting layer is attached on the base 1, and a light emitting diode chip is attached on the aluminaOn the heat sink base 2, electric signal linkage is completed by gold wire lead 8 bonding, and thenThe small ball lens tube cap 5 is packaged and welded on the TO33 base 1 through a capacitance energy storage welding process, and air tightness and miniaturization packaging are completed. A diode pin 4 which penetrates through the base 1, is fixed with the base 1 and is connected with the light-emitting diode chip 3 through a lead is arranged below the base, and a lens 6 on the tube cap 5 is used for focusing a received light signal on the light-emitting diode chip 3. A shell 9 is arranged outside the pipe cap 5 and the base 1, and a Tap light splitter 10 is connected with the shell 9.
In order to make the whole detector more gas-tight, the joint of the lens 6 and the cap 5 is filled with a gas-tight solder 7.
The whole detector is packaged in a TO-33 2pin mode, so that the miniaturization of a device is realized, the installation and use space is greatly saved, and the device is different from any existing package in other traditional processes. And secondly, the device does not need shell grounding connection, one-time pin welding is reduced in the production process, the production efficiency is higher, raw materials are saved, and the environment is protected. Therefore, compared with the prior art, the utility model has the substantive characteristics and progress.
The above embodiment is only one of the preferred embodiments of the present invention, and should not be used to limit the protection scope of the present invention, but all the insubstantial changes or modifications made in the spirit and the idea of the main design of the present invention, the technical problems solved by the embodiment are still consistent with the present invention, and all should be included in the protection scope of the present invention.
Claims (4)
1. The coaxial photodiode detector is characterized by comprising a base (1), a heat sink base (2) arranged at the center of the upper part of the base (1), a light-emitting diode chip (3) fixed on the heat sink base (2), a diode pin (4) which penetrates through the base (1) and is fixed with the base (1) and connected with the light-emitting diode chip (3) through a lead, a pipe cap (5) which is fixed on the base (1) and used for hermetically packaging and protecting the internal structure of a device, a lens (6) which is arranged on the pipe cap (5) and used for focusing a received light signal on the light-emitting diode chip (3), a shell (9) which is arranged outside the pipe cap (5) and the base (1), and a Tap light splitter (10) which is connected through the shell (9).
2. A coaxial photodiode detector according to claim 1, characterized in that the heat sink base (2) is an alumina heat sink.
3. A coaxial photodiode probe according to claim 2, characterized in that the joint of the lens (6) and the cap (5) is filled with a gas-tight solder (7).
4. A coaxial photodiode detector according to claim 3, characterized in that the led chip (3) is bonded to the heat sink base (2) by gold wire bonding (8).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121370409.4U CN215266336U (en) | 2021-06-18 | 2021-06-18 | Coaxial photodiode detector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121370409.4U CN215266336U (en) | 2021-06-18 | 2021-06-18 | Coaxial photodiode detector |
Publications (1)
Publication Number | Publication Date |
---|---|
CN215266336U true CN215266336U (en) | 2021-12-21 |
Family
ID=79480995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202121370409.4U Active CN215266336U (en) | 2021-06-18 | 2021-06-18 | Coaxial photodiode detector |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN215266336U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114497330A (en) * | 2022-04-18 | 2022-05-13 | 至芯半导体(杭州)有限公司 | TO ultraviolet device packaging structure |
-
2021
- 2021-06-18 CN CN202121370409.4U patent/CN215266336U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114497330A (en) * | 2022-04-18 | 2022-05-13 | 至芯半导体(杭州)有限公司 | TO ultraviolet device packaging structure |
CN114497330B (en) * | 2022-04-18 | 2022-07-12 | 至芯半导体(杭州)有限公司 | TO ultraviolet device packaging structure |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN206378622U (en) | A kind of coaxial packaging optic communication device | |
CN100590779C (en) | Surface mount multi-channel optocoupler | |
CN211603627U (en) | Optical module | |
CN203660271U (en) | 10G micro high-speed laser emitter | |
CN201936040U (en) | Cooling coaxial package light emission tube core | |
CN101872760A (en) | Photoelectric conversion module | |
CN215266336U (en) | Coaxial photodiode detector | |
CN206179845U (en) | Composite films lead wire type metal dewar | |
CN202172395U (en) | Ultra-thin leadless light MOS relay | |
CN107452815A (en) | The optical device and optical module of a kind of coaxial packaging | |
CN102456770A (en) | Package structure of concentrated photovoltaic cell | |
CN201707474U (en) | Coaxial light emission tube core with cooling function | |
CN102569431B (en) | Photoelectric chip assembly and packaging method | |
CN108873190A (en) | A kind of integrated opto-electronic receiver module and its production technology containing low-noise amplifier | |
CN202474024U (en) | High-power LED packaging structure | |
CN102709265B (en) | Inexpensive surface mount packaging structure of semiconductor optical device and method for packaging inexpensive surface mount packaging structure | |
CN113671639A (en) | Optical module structure and manufacturing method thereof | |
US20120113630A1 (en) | Led energy-saving lamp | |
CN104377542A (en) | Pin type packaging structure and method for semiconductor laser | |
CN202736973U (en) | Three-dimensional cladded and packaged LED chip | |
CN102709266B (en) | Surface mount packaging structure of semiconductor optical device and method for packaging surface mount packaging structure | |
US8778704B1 (en) | Solar powered IC chip | |
CN210928141U (en) | High-efficient radiating circuit board | |
CN209607757U (en) | A kind of infrared light-emitting diode of glassy metal capsule micropackaging type | |
CN104319337A (en) | Substrate-free LED device and manufacturing method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |