CN107452815A - The optical device and optical module of a kind of coaxial packaging - Google Patents
The optical device and optical module of a kind of coaxial packaging Download PDFInfo
- Publication number
- CN107452815A CN107452815A CN201710643386.1A CN201710643386A CN107452815A CN 107452815 A CN107452815 A CN 107452815A CN 201710643386 A CN201710643386 A CN 201710643386A CN 107452815 A CN107452815 A CN 107452815A
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- Prior art keywords
- optical device
- pin
- photoelectric cell
- pad
- coaxial packaging
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- 230000003287 optical effect Effects 0.000 title claims abstract description 74
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 52
- 239000000919 ceramic Substances 0.000 claims abstract description 68
- 239000000758 substrate Substances 0.000 claims description 21
- 239000011159 matrix material Substances 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000007769 metal material Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 230000010412 perfusion Effects 0.000 claims description 2
- 229910052573 porcelain Inorganic materials 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 22
- 238000005538 encapsulation Methods 0.000 abstract description 14
- 239000011521 glass Substances 0.000 abstract description 14
- 230000001939 inductive effect Effects 0.000 abstract description 4
- 230000003071 parasitic effect Effects 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 238000004891 communication Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000006121 base glass Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Abstract
The invention discloses a kind of optical device of coaxial packaging and optical module, the optical device of coaxial packaging includes pipe cap, photoelectric cell, pin and the multi-layer ceramics for electrically connecting photoelectric cell and pin, wherein：The one side of multi-layer ceramics has pad and photoelectric cell, photoelectric cell and pad electrical connection, and pin is fixedly installed on the another side of multi-layer ceramics, is provided with conductive via inside multi-layer ceramics, pin is electrically connected by conductive via with pad；Pipe cap is combined with multi-layer ceramics with packaged photoelectronic element, is packaged due to that need not introduce glass material, and then glass material can be avoided to encapsulate introduced high-frequency parasitic parameter；And pad reduces inductive effect, the high frequency performance of device is improved；Therefore, the optical device of above-mentioned coaxial packaging can improve the high-frequency work performance of the optical device after encapsulation.
Description
Technical field
The present invention relates to the optical device and optical module of communication technical field, more particularly to a kind of coaxial packaging.
Background technology
At present, in communication technical field, with data communication and the high speed development of network bandwidth, the work of sun adjuster part is fast
Rate requires more and more higher, and the encapsulating structure of sun adjuster part proposes higher requirement therewith.
The encapsulating structure of optical device be in order to avoid optical device under non-hermetically sealed environment due to oxygen, steam effect and lead
Failure is caused, to meet requirement of the optical device in use to reliability.Sun adjuster part carries out the common of level Hermetic Package at present
Form is that optical device is arranged in Can, by glass material by the metal pin and base of shell at fiber outlet
Metallic matrix between insulate and be packaged into together, then the metal pin of chip and base is connected by way of gold wire bonding
Connect, realize chip and the electrical connection outside base.As the most common and ripe form of current device encapsulation tube support, glass
The technique of encapsulation is simple, and cost is relatively low
But because the material of base matrix is metal, pass through between the metal pin of shell and the metallic matrix of base
Glass material insulate, and causes base and pin to form capacity effect on circuit, and because metal pin needs to stretch out metal
The glass surface of matrix so that the length of metal pin is longer, produces inductive effect therewith, under the high frequency performance for causing device
Drop.
Therefore, the high-frequency work performance of the optical device after encapsulation how is improved, it has also become those skilled in the art urgently solve
Technical problem certainly.
The content of the invention
The present invention provides a kind of optical device and optical module of coaxial packaging, and the optical device of the coaxial packaging can improve encapsulation
The high-frequency work performance of optical device afterwards.
To reach above-mentioned purpose, the present invention provides following technical scheme：
A kind of optical device of coaxial packaging, including pipe cap, photoelectric cell, pin and for electrically connect the photoelectric cell and
The ceramic substrate of pin, wherein：
The one side of the ceramic substrate has pad and the photoelectric cell, photoelectric cell and the pad electrical connection, institute
State and the pin is fixedly installed on the another side of ceramic substrate, be provided with conductive via inside the ceramic substrate, the pin leads to
Conductive via is crossed to electrically connect with the pad；
The pipe cap is combined with the ceramic substrate to encapsulate the photoelectric cell.
In the optical device of above-mentioned coaxial packaging, because pin is electrically connected by conductive via with pad, therefore pin can
By extraneous electric signal transmission to pad, and because photoelectric cell and pad electrically connect so that electric signal is transmitted to light by pad
Electric device, so photoelectric cell obtain it is electric to control photoelectric cell to act；And because pin is fixedly installed on ceramic substrate and weldering
On the relative face in face where disk and photoelectric cell, avoid pin and protrude ceramic substrate and produce the situation of inductance, and then avoid pair
Pin transmission signal performance has an impact；Because pin is electrically connected by pad with photoelectric cell, enter without introducing glass material
Row encapsulation, and then the introduced high-frequency parasitic parameter of glass material encapsulation can be avoided, and what pad protruded with respect to ceramic substrate
Height is smaller compared with prominent base in background technology is with the height for the metal pin being connected with chip, and then reduces inductance effect
Answer, improve the high frequency performance of device.Therefore, the optical device of above-mentioned coaxial packaging can improve the height of the optical device after encapsulation in fact
Frequency service behaviour.
In addition, present invention also offers a kind of optical module, including the coaxial packaging described in any technical scheme as described above
Optical device.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the optical device of coaxial packaging provided by the invention；
Fig. 2 is a kind of another structural representation of the optical device of coaxial packaging provided by the invention；
Fig. 3 is a kind of top view of the optical device of coaxial packaging provided by the invention；
Fig. 4 is a kind of another structural representation of the optical device of coaxial packaging provided by the invention；
Fig. 5 is the sectional view of multi-layer ceramics in a kind of optical device of coaxial packaging provided by the invention；
Fig. 6 is a kind of exploded perspective view of optical module provided by the invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other under the premise of creative work is not made
Embodiment, belong to the scope of protection of the invention.
As shown in Figure 1, Figure 2, shown in Fig. 3, Fig. 4 and Fig. 5, a kind of optical device of coaxial packaging, including pipe cap 5, photoelectric cell
4th, pin 2 and the multi-layer ceramics 1 for electrically connecting photoelectric cell 4 and pin 2, wherein：
The one side of multi-layer ceramics 1 has pad 3 and photoelectric cell 4, and photoelectric cell 4 and pad 3 electrically connect, multi-layer ceramics 1
Another side on pin 2 is fixedly installed, the inside of multi-layer ceramics 1 is provided with conductive via 6, and pin 2 passes through conductive via 6 and pad 3
Electrical connection；
Pipe cap 5 is combined with packaged photoelectronic element 4 with multi-layer ceramics 1.
Multi-layer ceramics is the main implementation of ceramic substrate, and multi-layer ceramics is to be stacked to be formed by more than two layers of ceramics,
Every layer of ceramic surface can set circuit, and multi-layer ceramics is on the basis of hardness reinforcement, it is possible to achieve between layers
Flexible circuit connection, and then the electrically connecting position of pin 2 can be flexibly set.
In the optical device of above-mentioned coaxial packaging, because pin 2 is electrically connected by conductive via 6 with pad 3, therefore pin 2
Can be by extraneous electric signal transmission to pad 3, and because photoelectric cell 4 and pad 3 electrically connect so that electric signal passes through pad 3
Transmit to photoelectric cell 4, and then photoelectric cell 4 must be electric to control photoelectric cell 4 to act, therefore, the light device of above-mentioned coaxial packaging
Part realizes the electrical connection of photoelectric cell 4 and external circuit, and pipe cap 5 combined with multi-layer ceramics 1 upper formation coaxial packaging with
Packaged photoelectronic element 4, it can ensure that its function is better achieved in optical device；And because pin 2 is fixedly installed on multi-layer ceramics 1
On the face relative with pad 3 and the place face of photoelectric cell 4 so that pin 2 is connected with multi-layer ceramics 1 and not prominent multi-layer ceramics
1, avoid pin 2 and protrude the situation of the generation inductance of multi-layer ceramics 1, and then avoid having an impact the transmission signal performance of pin 2,
And the not prominent multi-layer ceramics 1 of pin 2 adds the space that photoelectric cell 4 is placed on the surface of multi-layer ceramics 1, is easy to routing to handle；
Further, since pin 2 is electrically connected by pad 3 with photoelectric cell 4, it is packaged, and then can keeps away without introducing glass material
Exempt from glass material and encapsulate introduced high-frequency parasitic parameter, and in the height and background technology that the opposing layers of pad 3 ceramics 1 protrude
Prominent base reduces inductive effect and electricresistance effect with smaller compared with the height of the connected metal pin of chip, carries
The high frequency performance of device has been risen, and the size of pad 3 is much smaller than the size of glass material package pins in background technology, reduces
To the requirement of size in encapsulation process, the space availability ratio of base is improved, and then in the pipe of size identical with background technology
Seat is upper can to arrange multiple pads 3, realize the compatibility of multiple functional pins 2, so as to realize multifunctional light electric device 4 with outside
Electrical connection between more pins 2 in portion, meet the encapsulation requirement of complex devices.
Therefore, after the optical device of above-mentioned coaxial packaging can realize the compatibility of multiple functional pins 2 and improve encapsulation
The high-frequency work performance of optical device.
In a kind of preferred embodiment, the optical device of coaxial packaging also includes metallic matrix 7, pipe cap 5 and metallic matrix 7
It is fixedly connected, wherein：
Metallic matrix 7 is arranged in the one side of multi-layer ceramics 1 and positioned at the outside of multi-layer ceramics 1 and towards away from multilayer
The direction extension of ceramics 1；
Pad 3 and photoelectric cell 4 are arranged on multi-layer ceramics 1 towards on the end face of metallic matrix 7；
Conductive material is provided with conductive via 6, pin 2 and pad 3 are electrically connected by conductive material.
In the optical device of above-mentioned coaxial packaging, as shown in Figure 1, Figure 2, shown in Fig. 3, Fig. 4 and Fig. 5, because metallic matrix 7 is set
Put in the one side of multi-layer ceramics 1 and extend positioned at the outside of multi-layer ceramics 1 and towards away from the direction of multi-layer ceramics 1, weldering
Disk 3 and photoelectric cell 4 are arranged on multi-layer ceramics 1 towards on the end face of metallic matrix 7 so that pipe cap 5 is fixed with metallic matrix 7
After connection can photoelectric cell 4 be encapsulated in pipe cap 5, in the cavity that metallic matrix 7 and multi-layer ceramics are formed；And conductive via 6
It is interior provided with conductive material the pin 2 that is connected with conductive via 6 and pad 3 to be electrically connected, therefore extraneous electric signal is passed through into pin 2
Transmitting to pad 3, and because photoelectric cell 4 and pad 3 electrically connect so that electric signal is transmitted to photoelectric cell 4 by pad 3,
And then photoelectric cell 4 must be electric to control photoelectric cell 4 to act, therefore, the optical device of above-mentioned coaxial packaging realizes photoelectric cell 4
With the electrical connection of external circuit.
Conductive via 6 can be completely through multi-layer ceramics 1, as shown in figure 5, conductive via 6 partly can also run through and adopt
The form connected with wire, the form partly run through can change position of the external pin 2 on multi-layer ceramics 1, improve space
Utilization rate.
As shown in fig. 6, optical module includes upper shell 8, lower house 9, the optical device of above-mentioned coaxial packaging and circuit board 11, on
The pin 2 for stating the optical device of coaxial packaging is connected by flexible board 10 with circuit board 11, due to the light device in above-mentioned coaxial packaging
In part, pin 2 is electrically connected by pad 3 with photoelectric cell 4, is packaged without introducing glass material, and then can avoid glass
The introduced high-frequency parasitic parameter of glass material package, and due to state coaxial packaging optical device pin 2 by flexible board 10 with
Circuit board 11 connects, and enables to the high-frequency work better performances of optical module；And in the optical device of above-mentioned coaxial packaging, pad
The height that 3 opposing layers ceramics 1 protrude is compared with prominent base in background technology is with the height for the metal pin being connected with chip
It is smaller, and then reduce inductive effect and electricresistance effect, the high frequency performance of device is improved, it is preferable to ensure that optical module has
High-frequency work performance；Further, since the size of pad 3 is much smaller than the size of glass material package pins in background technology, reduce
Requirement in encapsulation process to size, the space availability ratio of base is improved, and then in size identical with background technology
Multiple pads 3 can be arranged on base, realize the compatibility of multiple functional pins 2, so as to realize multifunctional light electric device 4 with
Electrical connection between outside more pins 2, meets the encapsulation requirement of complex devices, therefore optical module can realize more function
It is required that.
Specifically, the conductive layer electrically connected with conductive via 6 is provided with one side of the multi-layer ceramics 1 away from pin 2, is being led
Ceramic insulation region is set in electric layer, and the conductive layer in ceramic insulation region forms the pad 3 electrically connected with photoelectric cell 4.
Conductive layer can be prepared by metal material, such as may be used also in multi-layer ceramics 1 towards gold-plated on the end face of metallic matrix 7
Can realize that the material of conduction is made by other, conductive layer prepares material can be according to the specific reality of the optical device of coaxial packaging
Border situation is selected.
In the optical device of above-mentioned coaxial packaging, because conductive layer electrically connects with conductive via 6, and with conductive via 6 with
Pin electrically connects, therefore pin 2 can be by extraneous electric signal transmission to conductive layer, and due to setting ceramic insulation area on conductive layer
Conductive layer in domain, ceramic insulation region forms the pad 3 electrically connected with photoelectric cell 4 so that electric signal transmits by pad 3
To photoelectric cell 4, and then photoelectric cell 4 must be electric to control photoelectric cell 4 to act, and therefore, the optical device of above-mentioned axle envelope dress is realized
The electrical connection of photoelectric cell 4 and external circuit.
More specifically, multi-layer ceramics 1 is coated with layer of metal material, pin 2 and multilayer pottery in the one side of metallic matrix 7
Porcelain 1 is fixedly connected by metal material.
Because metal material has preferable electric conductivity, one is coated with one side of the multi-layer ceramics 1 away from metallic matrix 7
Layer metal material, can be better achieved the electrical connection between pin 2 and multi-layer ceramics 1.
More specifically, metal material can be gold, the material of conducting function, metal material can also can be realized for other
It can be selected according to the specific actual conditions of the optical device of coaxial packaging.
In order to ensure the air-tightness of the optical device of coaxial packaging, a kind of preferred embodiment, conductive material is to irrigate simultaneously
The metal of solidification.
By the perfusion metal in conductive via 6, the metal encapsulating of conduction is formed, will not be to the optical device of coaxial packaging
Air-tightness impacts, and improves product yield.On the basis of the air-tightness of optical device of coaxial packaging is ensured, conductive material
The material of conducting function can be realized for other, conductive material can be according to the specific actual feelings of the optical device of coaxial packaging
Condition is selected.
Specifically, conductive layer is prepared by craft of gilding.
Pad can be one layer of gold of plating in the area defined of ceramic insulation region, can also can realize and lead for other
The material of Electricity Functional, material can be selected according to the specific actual conditions of the optical device of coaxial packaging.
In a kind of preferred embodiment, photoelectric cell 4 is electrically connected with pad 3 by bonding gold wire.
Bonding gold wire is the important materials of microelectronics industry, as connecting line between photoelectric cell 4 and lead frame.Above-mentioned
In the optical device of coaxial packaging, photoelectric cell 4 can be electrically connected with pad 3 by bonding gold wire, can also can by other
The material of conducting function is realized, material can be selected according to the specific actual conditions of the optical device of coaxial packaging.
In addition, present invention also offers a kind of optical module, including the coaxial packaging described in any technical scheme as described above
Optical device, because the optical device of above-mentioned coaxial packaging can realize the compatibility of multiple functional pins 2 and improve the light after encapsulation
The high-frequency work performance of device, therefore, there are the high-frequency work better performances of the optical module of the optical device of the coaxial packaging.
Obviously, those skilled in the art can carry out various changes and modification without departing from this hair to the embodiment of the present invention
Bright spirit and scope.So, if these modifications and variations of the present invention belong to the claims in the present invention and its equivalent technologies
Within the scope of, then the present invention is also intended to comprising including these changes and modification.
Claims (9)
1. a kind of optical device of coaxial packaging, it is characterised in that including pipe cap, photoelectric cell, pin and described for electrically connecting
The ceramic substrate of photoelectric cell and pin, wherein：
The one side of the ceramic substrate has pad and the photoelectric cell, photoelectric cell and the pad electrical connection, the pottery
The pin is fixedly installed on the another side of porcelain substrate, is provided with conductive via inside the ceramic substrate, the pin is by leading
Electric via electrically connects with the pad；
The pipe cap is combined with the ceramic substrate to encapsulate the photoelectric cell.
2. the optical device of coaxial packaging according to claim 1, it is characterised in that also including metallic matrix, the pipe cap
It is fixedly connected with the metallic matrix, wherein：
The metallic matrix is arranged in the one side of the ceramic substrate and positioned at the outside of the ceramic substrate and towards the back of the body
Direction from the ceramic substrate extends；
The pad and photoelectric cell are arranged on the ceramic substrate towards on the end face of metallic matrix；
Conductive material is provided with the conductive via, the pin and pad are electrically connected by the conductive material.
3. the optical device of coaxial packaging according to claim 2, it is characterised in that draw in the ceramic substrate away from described
The one side of pin is provided with the conductive layer electrically connected with the conductive via, and ceramic insulation region, institute are set on the conductive layer
State the conductive layer in ceramic insulation region and form the pad electrically connected with the photoelectric cell.
4. the optical device of coaxial packaging according to claim 3, it is characterised in that the ceramic substrate deviates from the metal
Layer of metal material is coated with the one side of matrix, the pin is fixedly connected with ceramic substrate by metal material.
5. the optical device of coaxial packaging according to claim 4, it is characterised in that the metal material is gold.
6. the optical device of coaxial packaging according to claim 2, it is characterised in that the conductive material is perfusion and solidifies
Metal.
7. the optical device of coaxial packaging according to claim 3, it is characterised in that the conductive layer is by craft of gilding system
It is standby.
8. the optical device of coaxial packaging according to claim 1, it is characterised in that the photoelectric cell leads to the pad
Cross bonding gold wire electrical connection.
9. a kind of optical module, it is characterised in that include the optical device of the coaxial packaging as described in claim any one of 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710643386.1A CN107452815A (en) | 2017-07-31 | 2017-07-31 | The optical device and optical module of a kind of coaxial packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710643386.1A CN107452815A (en) | 2017-07-31 | 2017-07-31 | The optical device and optical module of a kind of coaxial packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107452815A true CN107452815A (en) | 2017-12-08 |
Family
ID=60489968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710643386.1A Pending CN107452815A (en) | 2017-07-31 | 2017-07-31 | The optical device and optical module of a kind of coaxial packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107452815A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019154375A1 (en) * | 2018-02-11 | 2019-08-15 | 青岛海信宽带多媒体技术有限公司 | Optical sub-module and optical module |
| CN111865429A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Photoelectric receiver and manufacturing method thereof |
| CN112202046A (en) * | 2020-08-28 | 2021-01-08 | 武汉联特科技有限公司 | Novel TO packaging structure |
| CN112563339A (en) * | 2019-09-26 | 2021-03-26 | 日本剑桥光电有限公司 | Optical module |
| WO2023246019A1 (en) * | 2022-06-23 | 2023-12-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| CN202423821U (en) * | 2011-11-21 | 2012-09-05 | 武汉华工正源光子技术有限公司 | High speed packaging structure of laser diode |
| CN104124285A (en) * | 2014-07-17 | 2014-10-29 | 武汉电信器件有限公司 | High frequency photoelectric detector encapsulation base with multilayer ceramic pot-type encapsulation |
| CN105679746A (en) * | 2016-04-15 | 2016-06-15 | 东莞铭普光磁股份有限公司 | APD-TIA coaxial type photoelectric assembly |
-
2017
- 2017-07-31 CN CN201710643386.1A patent/CN107452815A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN202423821U (en) * | 2011-11-21 | 2012-09-05 | 武汉华工正源光子技术有限公司 | High speed packaging structure of laser diode |
| CN104124285A (en) * | 2014-07-17 | 2014-10-29 | 武汉电信器件有限公司 | High frequency photoelectric detector encapsulation base with multilayer ceramic pot-type encapsulation |
| CN105679746A (en) * | 2016-04-15 | 2016-06-15 | 东莞铭普光磁股份有限公司 | APD-TIA coaxial type photoelectric assembly |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019154375A1 (en) * | 2018-02-11 | 2019-08-15 | 青岛海信宽带多媒体技术有限公司 | Optical sub-module and optical module |
| CN111865429A (en) * | 2019-04-30 | 2020-10-30 | 深圳市聚飞光电股份有限公司 | Photoelectric receiver and manufacturing method thereof |
| CN112563339A (en) * | 2019-09-26 | 2021-03-26 | 日本剑桥光电有限公司 | Optical module |
| CN112563339B (en) * | 2019-09-26 | 2023-11-24 | 日本剑桥光电有限公司 | Optical module |
| CN112202046A (en) * | 2020-08-28 | 2021-01-08 | 武汉联特科技有限公司 | Novel TO packaging structure |
| CN112202046B (en) * | 2020-08-28 | 2022-06-28 | 武汉联特科技股份有限公司 | Novel TO packaging structure |
| WO2023246019A1 (en) * | 2022-06-23 | 2023-12-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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Application publication date: 20171208 |