CN106908916A - A kind of vertical-cavity surface-emitting optical device based on flexible PCB - Google Patents
A kind of vertical-cavity surface-emitting optical device based on flexible PCB Download PDFInfo
- Publication number
- CN106908916A CN106908916A CN201710249522.9A CN201710249522A CN106908916A CN 106908916 A CN106908916 A CN 106908916A CN 201710249522 A CN201710249522 A CN 201710249522A CN 106908916 A CN106908916 A CN 106908916A
- Authority
- CN
- China
- Prior art keywords
- cavity
- vertical
- flexible pcb
- cavity surface
- emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
- G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4272—Cooling with mounting substrates of high thermal conductivity
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of vertical-cavity surface-emitting optical device based on flexible PCB, including：Optical devices, for optical signal to be coupled in optical fiber；Optics adaptive device, for by the externally connected optical fiber of the Optical devices；Wherein described optics adaptive device is encapsulated using resin material, and inside is provided with one to be used to accommodate the Optical devices cavity；And circuit arrangement, for converting the electrical signal to the optical signal；Wherein described circuit arrangement is disposed with metal supporting layer, the flexible circuit board layer for transmitting high speed signal, hard circuit board layer, high thermal conductivity ceramic interlayer and the vertical-cavity surface-emitting chip of high thermal conductivity from top to bottom；The optics adaptive device passes through adhering with epoxy resin on the flexible PCB, so as to form a sealing space for accommodating the Optical devices and play insulating effect.Optical device of the invention has the advantages that high frequency performance is good, technological requirement is low and perfect heat-dissipating.
Description
Technical field
The present invention relates to communication technical field, more particularly to a kind of vertical-cavity surface-emitting light device based on flexible PCB
Part.
Background technology
The optical device that early stage is used for vertical-cavity surface-emitting is in the majority with transistor packing forms, and this packaging technology is convenient, but
High frequency performance is not good enough, and thermal diffusivity is bad, is limited by pin area occupied, can design the area for utilizing few.
Patent CN102422193 discloses a kind of optical module of the Optical devices with ceramic package, make use of ceramics
Encapsulation substitution transistor encapsulation, can effectively solve high-frequency signal and interior optical component, circuit and high-frequency signal distribution problem.
The patent, using multi-layer ceramics by lens and fiber coupling, is used close mainly using ceramic substituted metal material on ceramics
Seal ring and metal device.Using multi-layer ceramics, physical size change is done on the ceramics of upper strata, component can be relatively easy to put
Put, high speed circuit is used in lower circuit, electric signal is preferably transmitted.Welded using crown cap in addition, utilized
Ceramic insulation characteristic is electrically insulated.However, complex in technique using multi-layer ceramics material, similar device is all small-sized
Device, the Three-dimension process required precision to ceramic material is higher.
The content of the invention
For vertical-cavity surface-emitting in the prior art optics high frequency performance is poor, poor radiation, ceramic substrate process
Complicated defect, the present invention provides that a kind of high frequency performance is good, technological requirement is low and perfect heat-dissipating based on flexible PCB
Vertical-cavity surface-emitting optical device.
The technical scheme that the present invention is proposed with regard to above-mentioned technical problem is as follows：
On the one hand, there is provided a kind of vertical-cavity surface-emitting optical device based on flexible PCB, including：
Optical devices, for optical signal to be coupled in optical fiber；
Optics adaptive device, for by the externally connected optical fiber of the Optical devices；Wherein described optics adaptive device is adopted
Encapsulated with resin material, inside is provided with one to be used to accommodate the Optical devices cavity；And
Circuit arrangement, for converting the electrical signal to the optical signal；Wherein described circuit arrangement sets successively from top to bottom
It is equipped with metal supporting layer, the flexible circuit board layer for transmitting high speed signal, hard circuit board layer, the high thermal conductivity pottery of high thermal conductivity
Porcelain transition zone and vertical-cavity surface-emitting chip；The optics adaptive device is by adhering with epoxy resin in the flexible PCB
On, so as to form a sealing space for accommodating the Optical devices and play insulating effect.
Preferably, the Optical devices include：The support chip of light filter plate, condenser lens and the condenser lens.
Preferably, the cavity of the optics adaptive device includes the first cavity with the first internal diameter and with the
Second cavity of two internal diameters；First cavity is connected with second cavity and first cavity is located at second cavity
Top.
Preferably, the smooth filter plate is arranged on the top of first cavity, the support chip of the condenser lens
The top of second cavity is arranged on, the condenser lens is supported on the support chip.
Preferably, the support chip of the condenser lens is arranged on the top of second cavity, the condenser lens
It is supported on the support chip；The smooth filter plate is connected to the lower section of the support chip and just relative with the condenser lens.
Preferably, the circuit arrangement also includes spun gold lead, for the vertical-cavity surface-emitting chip to be connected into institute
State flexible PCB.
Preferably, the circuit arrangement also includes spun gold lead, for the vertical-cavity surface-emitting chip to be connected into institute
State on high thermal conductivity ceramic interlayer, then the high thermal conductivity ceramic interlayer is connected on the flexible PCB.
Preferably, thermal conducting path, the thermal conducting path are offered on the flexible circuit board layer and hard circuit board layer
In be filled with thermal conductive metallic material.
Preferably, the high thermal conductivity metal supporting layer is Nian Jie with the flexible circuit board layer by epoxy resin, described
The support chip of light filter plate and the condenser lens is by epoxy bond in the chamber of the optics adaptive device
In vivo.
Preferably, the vertical-cavity surface-emitting chip is bonded on the high thermal conductivity transition zone by heat conduction elargol, institute
High thermal conductivity transition zone is stated to be bonded on the hard circuit board layer by heat conduction elargol.
Implement the embodiment of the present invention, have the advantages that：Flexible PCB and hardboard circuit are the height of comparative maturity
Fast signal transmission technique, is adapted to high-volume and processes, and good process repeatability, technique controlling difficulty is relatively low, uses this scheme can be with
The technological requirement coaxially processed to the pin of transistor base is reduced, parasitic damage of the signal between pin between shell is reduced
Consumption, reduces the complicated requirement such as gold-plated to transistor base large area.
In addition, transistor base is typically using the material that can be used as support, its thermal conductivity is far below use described herein
Metal supporting layer, therefore the performance of chip cooling can be improved.
Moreover, it is ceramic the characteristics of HFS has preferable for using aluminium oxide ceramics as supporting plate, but
It is costly, to be subsequently connected to other circuit boards using multi-layer ceramics co-firing technology cost to be also required to flexible PCB as letter
Number transmission is used, therefore technical solution of the present invention can reduce product complexity, reduces technological requirement and cost.
Thermal conductivity is not high in itself for alumina material, is adapted to product power requirement product not high, can also using sintering process
Reduce material thermal conductivity, for the strict product of power consumption requirements do not have too many advantage, and the application use heat conduction
Hole is conducted heat and highly heat-conductive material does support and can well process this problem.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is that the structure of the vertical-cavity surface-emitting optical device based on flexible PCB that first embodiment of the invention is provided is shown
It is intended to；
Fig. 2 is that the structure of the vertical-cavity surface-emitting optical device based on flexible PCB that second embodiment of the invention is provided is shown
It is intended to.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art obtained on the premise of creative work is not made it is all its
His embodiment, belongs to the scope of protection of the invention.
Present embodiments provide a kind of vertical-cavity surface-emitting optical device based on flexible PCB, referring to Fig. 1 and 2, the light
Device includes：
Optical devices, for optical signal to be coupled in optical fiber；
Optics adaptive device, for by the externally connected optical fiber of Optical devices；Wherein optics adaptive device uses resinous wood
Material encapsulation, inside is provided with one to be used to accommodate Optical devices cavity；And
Circuit arrangement, for converting the electrical signal to optical signal；Wherein circuit arrangement is disposed with height and leads from top to bottom
The metal supporting layer of heating rate, the flexible circuit board layer for transmitting high speed signal, hard circuit board layer, high thermal conductivity ceramic interlayer
And vertical-cavity surface-emitting chip；Optics adaptive device passes through adhering with epoxy resin on flexible PCB, so as to form one
Accommodate the sealing space of Optical devices and play insulating effect.
The optical device is integrally realized producing optical signal by vertical-cavity surface-emitting chip, makes light incident by lens and filter plate
To optical fiber, the transmission of electric signal is realized by flexible PCB and hard circuit board.
Flexible PCB, upper strata hard circuit board, ceramic interlayer need root in the pin of specific product in side circuit
Definition design HW High Way layout.Flexible PCB and hard circuit board plate, metal supporting layer and ceramic interlayer are used for making
Be the integrated support of vertical-cavity surface-emitting chip, and the pad of spun gold wire bonding be provided, for chip and flexible PCB it
Between signal connection.
Specifically, Optical devices include：The support of light filter plate 102/202, condenser lens 104/204 and condenser lens
Piece 103/203.
The cavity of optics adaptive device 101/201 includes first cavity with the first internal diameter and with the second internal diameter
Second cavity.First cavity is connected with the second cavity and the first cavity is located at the top of the second cavity.As illustrated in fig. 1 and 2, first
Less than the internal diameter of the second cavity, the place for so being connected in the first cavity and the second cavity there is a platform to the internal diameter of cavity
Face.
In one embodiment of the invention, as shown in figure 1, light filter plate 102 is arranged on the top of the first cavity, weaken
The light power of chip 105, to ensure human eye laser safety.The support chip 103 of condenser lens 104 is arranged on the top of the second cavity
Portion, is close to the table top between the first cavity and the second cavity.Condenser lens 103 is supported on support chip 104.Light filter plate 102
With the support chip 103 of condenser lens 104 by epoxy bond in the cavity of optics adaptive device 101.
In another embodiment of the present invention, as shown in Fig. 2 the support chip 203 of condenser lens 204 is arranged on the second chamber
The top of body, is close to the table top between the first cavity and the second cavity.Condenser lens 204 is supported on support chip 203.Light is filtered
Piece 202 is connected to the lower section of support chip 203 and, the light power of decrease chip 205 just relative with condenser lens 204, to ensure
Human eye laser safety.The support chip 203 of light filter plate 202 and condenser lens 204 is adapted in optics by epoxy bond and filled
Put in 201 cavity.Adopting the structure can be with improve production efficiency.
Specifically, as illustrated in fig. 1 and 2, circuit board 108/208 includes the flexible PCB and the hard circuit with upper strata of lower floor
Plate, in production, they just bond together, and high-speed electrical signals path is designed on flexible PCB carries out signal transmission, hard circuit
Pad is done on plate, chip and circuit board are connected using spun gold welding procedure.High thermal conductivity metal supporting layer 109/209, such as copper or
Person's aluminium is be bonded with circuit board 108/208 by epoxy resin.The thermal conducting path 107/ of well in advance on circuit board 108/208
207, and fill thermal conductive metallic material, such as copper or silver.High thermal conductivity ceramic interlayer 106/206 is used to adjust the height of chip
Degree, adjustment focal position and do circuit transition and use.High thermal conductivity ceramic interlayer 106/206 can use high heat conduction aluminium nitride
Ceramics or aluminium oxide ceramics, are bonded in the heat dissipation region of circuit board 108/208 by heat conduction elargol.Vertical-cavity surface-emitting core
Piece 105/205 is bonded on high thermal conductivity ceramic interlayer 106/206 by heat conduction elargol.
In one embodiment of the invention, circuit arrangement also includes spun gold lead 110, for realizing vertical-cavity surface-emitting
Signal connection between signal connection between chip 105 and circuit board 108, in particular chip 105 and hard circuit board layer.
In another embodiment of the present invention, circuit arrangement also includes spun gold lead 110, for by vertical-cavity surface-emitting
Chip 105 is connected on high thermal conductivity ceramic interlayer 106, then high thermal conductivity ceramic interlayer 106 is connected into flexible circuit
On plate.Such connected mode is conducive to optimizing the high frequency characteristics of optical device.
In the present invention, optics adaptive device 101/201 is the optics adapter interface of standard, and material is plastic resin,
Major function is connecting contact pin adapter, there is provided accurate optical fiber resetting.The bonding light filtering of optics adaptive device 101/201
After piece 102/202 and condenser lens 104/204, coupled with chip 105/205 by active coupling technique, be coupled to needs
Optical power value when fix optics adaptive device 101/201 and circuit board 108/208 with epoxy resin, formation is tightly connected.
Specifically, in the present invention, vertical-cavity surface-emitting chip is bonded on high thermal conductivity transition zone by heat conduction elargol,
High thermal conductivity transition zone is bonded on hard circuit board layer by heat conduction elargol.
Above disclosed is only a kind of preferred embodiment of the invention, can not limit the power of the present invention with this certainly
Sharp scope, one of ordinary skill in the art will appreciate that realizing all or part of flow of above-described embodiment, and weighs according to the present invention
Profit requires made equivalent variations, still falls within the covered scope of invention.
Claims (10)
1. a kind of vertical-cavity surface-emitting optical device based on flexible PCB, it is characterised in that including：
Optical devices, for optical signal to be coupled in optical fiber；
Optics adaptive device, for by the externally connected optical fiber of the Optical devices；Wherein described optics adaptive device is using tree
Fat material package, inside is provided with one to be used to accommodate the Optical devices cavity；And
Circuit arrangement, for converting the electrical signal to the optical signal；Wherein described circuit arrangement is disposed with from top to bottom
The metal supporting layer of high thermal conductivity, the flexible circuit board layer for transmitting high speed signal, hard circuit board layer, high thermal conductivity ceramics mistake
Cross layer and vertical-cavity surface-emitting chip；The optics adaptive device by adhering with epoxy resin on the flexible PCB,
So as to form a sealing space for accommodating the Optical devices and play insulating effect.
2. the vertical-cavity surface-emitting optical device based on flexible PCB according to claim 1, it is characterised in that the light
Learning device includes：The support chip of light filter plate, condenser lens and the condenser lens.
3. the vertical-cavity surface-emitting optical device based on flexible PCB according to claim 2, it is characterised in that the light
The cavity for learning adaptive device includes the first cavity with the first internal diameter and the second cavity with the second internal diameter；It is described
First cavity is connected with second cavity and first cavity is located at the top of second cavity.
4. the vertical-cavity surface-emitting optical device based on flexible PCB according to claim 3, it is characterised in that the light
Filter plate is arranged on the top of first cavity, and the support chip of the condenser lens is arranged on the top of second cavity
Portion, the condenser lens is supported on the support chip.
5. the vertical-cavity surface-emitting optical device based on flexible PCB according to claim 3, it is characterised in that described poly-
The support chip of focus lens is arranged on the top of second cavity, and the condenser lens is supported on the support chip；Institute
State light filter plate and be connected to the lower section of the support chip and just relative with the condenser lens.
6. the vertical-cavity surface-emitting optical device based on flexible PCB according to claim 1, it is characterised in that the electricity
Road device also includes spun gold lead, for the vertical-cavity surface-emitting chip to be connected into the flexible PCB.
7. the vertical-cavity surface-emitting optical device based on flexible PCB according to claim 1, it is characterised in that the electricity
Road device also includes spun gold lead, for the vertical-cavity surface-emitting chip to be connected into the high thermal conductivity ceramic interlayer
On, then the high thermal conductivity ceramic interlayer is connected on the flexible PCB.
8. the vertical-cavity surface-emitting optical device based on flexible PCB according to claim 1, it is characterised in that described soft
Property board layer and the hard circuit board layer on offer thermal conducting path, in the thermal conducting path be filled with thermal conductive metallic material.
9. the vertical-cavity surface-emitting optical device based on flexible PCB according to claim 3, it is characterised in that the height
Thermal conductivity metal supporting layer is Nian Jie with the flexible circuit board layer by epoxy resin, the smooth filter plate and the condenser lens
The support chip by epoxy bond in the cavity of the optics adaptive device.
10. the vertical-cavity surface-emitting optical device based on flexible PCB according to claim 1, it is characterised in that described
Vertical-cavity surface-emitting chip is bonded on the high thermal conductivity transition zone by heat conduction elargol, and the high thermal conductivity transition zone passes through
Heat conduction elargol is bonded on the hard circuit board layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710249522.9A CN106908916A (en) | 2017-04-17 | 2017-04-17 | A kind of vertical-cavity surface-emitting optical device based on flexible PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710249522.9A CN106908916A (en) | 2017-04-17 | 2017-04-17 | A kind of vertical-cavity surface-emitting optical device based on flexible PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106908916A true CN106908916A (en) | 2017-06-30 |
Family
ID=59210584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710249522.9A Pending CN106908916A (en) | 2017-04-17 | 2017-04-17 | A kind of vertical-cavity surface-emitting optical device based on flexible PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106908916A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107741618A (en) * | 2017-10-31 | 2018-02-27 | 武汉电信器件有限公司 | A kind of high speed DML emitting modules |
| CN108107514A (en) * | 2017-12-14 | 2018-06-01 | 武汉电信器件有限公司 | A kind of shell structure for box packaging optical devices |
| CN109116485A (en) * | 2018-11-02 | 2019-01-01 | 青岛海信宽带多媒体技术有限公司 | A kind of light-receiving secondary module and optical module |
| CN112147745A (en) * | 2020-09-30 | 2020-12-29 | 广东瑞谷光网通信股份有限公司 | Plastic structure adapter of light emitting assembly and manufacturing process thereof |
| CN114755767A (en) * | 2021-01-08 | 2022-07-15 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1235679A (en) * | 1996-09-02 | 1999-11-17 | 西门子公司 | Optoelectric transmission and/or reception module and production thereof |
| US20070147745A1 (en) * | 2005-12-07 | 2007-06-28 | Sumitomo Electric Industries, Ltd. | Optical subassembly installing thermistor therein |
| CN102422193A (en) * | 2009-05-12 | 2012-04-18 | 住友电气工业株式会社 | Optical subassembly with optical device having ceramic pacakge |
| CN202524652U (en) * | 2012-04-10 | 2012-11-07 | 孙井斌 | Combined circuit board with high heat conductivity |
| CN103502862A (en) * | 2010-12-24 | 2014-01-08 | 株式会社自动网络技术研究所 | Optical connector |
| CN104793300A (en) * | 2015-04-30 | 2015-07-22 | 东南大学 | Optical module assembly with inner heat dispassion channel and composite heat dispassion structure thereof |
| CN105572820A (en) * | 2016-02-02 | 2016-05-11 | 山东科技大学 | Optical sub assembly and preparation method thereof |
| CN205792875U (en) * | 2016-03-12 | 2016-12-07 | 宁波舜宇光电信息有限公司 | Camera module and photosensory assembly thereof |
| CN206848527U (en) * | 2017-04-17 | 2018-01-05 | 武汉盛为芯科技有限公司 | A kind of vertical-cavity surface-emitting optical device based on flexible PCB |
-
2017
- 2017-04-17 CN CN201710249522.9A patent/CN106908916A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1235679A (en) * | 1996-09-02 | 1999-11-17 | 西门子公司 | Optoelectric transmission and/or reception module and production thereof |
| US20070147745A1 (en) * | 2005-12-07 | 2007-06-28 | Sumitomo Electric Industries, Ltd. | Optical subassembly installing thermistor therein |
| CN102422193A (en) * | 2009-05-12 | 2012-04-18 | 住友电气工业株式会社 | Optical subassembly with optical device having ceramic pacakge |
| CN103502862A (en) * | 2010-12-24 | 2014-01-08 | 株式会社自动网络技术研究所 | Optical connector |
| CN202524652U (en) * | 2012-04-10 | 2012-11-07 | 孙井斌 | Combined circuit board with high heat conductivity |
| CN104793300A (en) * | 2015-04-30 | 2015-07-22 | 东南大学 | Optical module assembly with inner heat dispassion channel and composite heat dispassion structure thereof |
| CN105572820A (en) * | 2016-02-02 | 2016-05-11 | 山东科技大学 | Optical sub assembly and preparation method thereof |
| CN205792875U (en) * | 2016-03-12 | 2016-12-07 | 宁波舜宇光电信息有限公司 | Camera module and photosensory assembly thereof |
| CN206848527U (en) * | 2017-04-17 | 2018-01-05 | 武汉盛为芯科技有限公司 | A kind of vertical-cavity surface-emitting optical device based on flexible PCB |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107741618A (en) * | 2017-10-31 | 2018-02-27 | 武汉电信器件有限公司 | A kind of high speed DML emitting modules |
| CN107741618B (en) * | 2017-10-31 | 2019-02-12 | 武汉电信器件有限公司 | A kind of high speed DML emitting module |
| WO2019085232A1 (en) * | 2017-10-31 | 2019-05-09 | 武汉电信器件有限公司 | High-speed dml emitter assembly |
| CN108107514A (en) * | 2017-12-14 | 2018-06-01 | 武汉电信器件有限公司 | A kind of shell structure for box packaging optical devices |
| CN109116485A (en) * | 2018-11-02 | 2019-01-01 | 青岛海信宽带多媒体技术有限公司 | A kind of light-receiving secondary module and optical module |
| CN112147745A (en) * | 2020-09-30 | 2020-12-29 | 广东瑞谷光网通信股份有限公司 | Plastic structure adapter of light emitting assembly and manufacturing process thereof |
| CN114755767A (en) * | 2021-01-08 | 2022-07-15 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN114755767B (en) * | 2021-01-08 | 2023-05-05 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106908916A (en) | A kind of vertical-cavity surface-emitting optical device based on flexible PCB | |
| TWI220542B (en) | Semiconductor device | |
| CN100590779C (en) | Surface mount multi-channel optocoupler | |
| CN100445784C (en) | Compact optical sub-assembly with ceramic package | |
| US9256038B2 (en) | Optical modules | |
| CN202423821U (en) | High speed packaging structure of laser diode | |
| US8705906B2 (en) | Photoelectric conversion module | |
| US20050269591A1 (en) | Low thermal resistance light emitting diode | |
| CN206848527U (en) | A kind of vertical-cavity surface-emitting optical device based on flexible PCB | |
| US8288183B2 (en) | Method of manufacturing an optically coupled device | |
| CN102160197A (en) | Optoelectronic device submount | |
| JP2004253456A (en) | Lsi package with interface module, and its packaging method | |
| CN108988120A (en) | The laser and optical module of coaxial packaging | |
| JP6733534B2 (en) | Semiconductor device and manufacturing method thereof | |
| CN107452815A (en) | The optical device and optical module of a kind of coaxial packaging | |
| EP2859394A1 (en) | Tsv substrate with mirror and its application in high-speed optoelectronic packaging | |
| CN104795380A (en) | Three-dimensional packaging structure | |
| CN104051286A (en) | Package Structure and Methods of Forming Same | |
| CN106549299A (en) | A kind of subcarrier encapsulating structure for directly modulation chip of laser | |
| CN104465555A (en) | Semiconductor package and manufacturing method thereof | |
| EP4362079A1 (en) | Chip packaging structure and preparation method therefor, and electronic device | |
| CN207651795U (en) | Coaxial packaging laser | |
| JP2006114737A (en) | Optical semiconductor equipment and manufacturing method thereof | |
| CN111416269B (en) | Light emitting device | |
| JP2004253534A (en) | Photoelectric transformation module for optical communication |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 430223, room 103-2, floor 2, Wuhan Putian science and Technology Park, No. 20, University Road, East Lake New Technology Development Zone, Hubei, Wuhan, China Applicant after: Wuhan Sheng core technology Co., Ltd. Address before: 430223, room 103-2, floor 2, Wuhan Putian science and Technology Park, No. 20, University Road, East Lake New Technology Development Zone, Hubei, Wuhan, China Applicant before: Wuhan Sheng core Polytron Technologies Inc |
|
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170630 |