CN207651795U - Coaxial packaging laser - Google Patents
Coaxial packaging laser Download PDFInfo
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- CN207651795U CN207651795U CN201721779419.7U CN201721779419U CN207651795U CN 207651795 U CN207651795 U CN 207651795U CN 201721779419 U CN201721779419 U CN 201721779419U CN 207651795 U CN207651795 U CN 207651795U
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- conductive strips
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- coaxial packaging
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Abstract
The utility model provides a kind of coaxial packaging laser, including tube socket, it is arranged in the pin set of tube socket and the heat sink gasket on tube socket, heat sink gasket has spaced and insulation the first conductive strips and the second conductive strips, it is electrically connected with chip of laser on first conductive strips, chip of laser is electrically connected with second, pin set includes the first signal pins and second signal foot, and the first conductive strips and the first signal pins are welded, and the second conductive strips are welded with second signal foot.Coaxial packaging laser provided by the utility model, by the way that the first conductive strips and the second conductive strips that are electrically connected with chip of laser are arranged, realize the impedance matching with modulator, and by the way that the first conductive strips and the first signal pins welding, the second conductive strips and second signal foot welding is arranged, signal Insertion Loss is reduced, ensures the rate bandwidth of 25Gbps.
Description
Technical field
The utility model belongs to field of laser device technology, is to be related to a kind of coaxial packaging laser more specifically.
Background technology
With the rapid development of 5G network communications, the requirement to network bandwidth is higher and higher.5G network antennas unit is to base
It stands between unit using the mode of fiber optic communication, ensures the rate bandwidth of 25Gbps with this.The laser of 25Gbps at present
Device mostly uses butterfly to encapsulate, and package dimension is larger, and cost is higher.In order to reduce the package dimension and cost of laser, need to adopt
With coaxial packaging laser, but the Insertion Loss between the circuit and pin in coaxial packaging laser is larger, it is difficult to reach 5G nets
The required bandwidth of network.
Utility model content
The purpose of this utility model is to provide a kind of coaxial packaging lasers, existing in the prior art coaxial to solve
The Insertion Loss between circuit and pin in encapsulated laser is larger and the technical issues of be unable to reach 5G networks required bandwidth.
To achieve the above object, the technical solution adopted in the utility model is：A kind of coaxial packaging laser is provided, including
Tube socket, the pin set for being arranged in the tube socket and the heat sink gasket on the tube socket, the heat sink gasket have mutual
The first conductive strips and the second conductive strips of interval and insulation are electrically connected with chip of laser on first conductive strips, described to swash
Light device chip is electrically connected with described second, the pin set include the first signal pins and second signal foot, described first
Conductive strips are welded with first signal pins, and second conductive strips are welded with the second signal foot.
Further, first conductive strips are mutually welded with first signal pins by golden tinol, and described second leads
Electric band is mutually welded with the second signal foot by golden tinol.
Further, the heat sink gasket includes insulating substrate, and the insulating substrate is with the front being oppositely arranged and instead
Face, first conductive strips and second conductive strips plating are set on the front of the insulating substrate, the reverse side of the insulating substrate
Plating is equipped with conductive layer.
Further, the conductive layer is equipped with the first solder layer, and radiating block, the radiating block are additionally provided on the tube socket
It is welded with first solder layer.
Further, first conductive strips are equipped with the second solder layer, the chip of laser and second solder
Layer welding.
Further, first conductive strips and second conductive strips are Gold plated Layer, first conductive strips and institute
The thickness range for stating the second conductive strips is 0.45 μm to 0.75 μm.
Further, the width range of first conductive strips and second conductive strips is 0.6mm to 0.7mm.
Further, between the chip of laser and second conductive strips be equipped with spun gold, the chip of laser and
Second conductive strips are electrically connected by gold ball bonding.
Further, further include the detector chip faced with the chip of laser, the pin set further includes connecing
Lower margin and two monitoring feet, the both ends of the detector chip are electrically connected with two monitoring feet respectively.
Further, gasket is equipped between the detector chip and the tube socket, the gasket is towards the detector
Chip-side is equipped with articulamentum, and the detector chip is electrically connected with the articulamentum.
The advantageous effect of coaxial packaging laser provided by the utility model is：Compared with prior art, this practicality is new
Type coaxial packaging laser is realized and is adjusted by the way that the first conductive strips and the second conductive strips that are electrically connected with chip of laser are arranged
The impedance matching of device processed, and by the way that the first conductive strips and the first signal pins welding, the second conductive strips and second signal foot weldering is arranged
It connects, reduces signal Insertion Loss, ensure the rate bandwidth of 25Gbps.
Description of the drawings
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this practicality is new
Some embodiments of type for those of ordinary skill in the art without having to pay creative labor, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is the three-dimensional structure diagram for the coaxial packaging laser that the utility model embodiment provides；
Fig. 2 is the part isometric structure chart for the coaxial packaging laser that the utility model embodiment provides；
Fig. 3 is the front view for the coaxial packaging laser that the utility model embodiment provides；
Fig. 4 is the vertical view for the coaxial packaging laser that the utility model embodiment provides；
Fig. 5 is the front view of heat sink gasket used by the utility model embodiment；
Fig. 6 is the side view of heat sink gasket used by the utility model embodiment.
Wherein, each reference numeral in figure：
1- tube sockets；2- pin sets；The first signal pins of 21-；22- second signal feet；23- grounding legs；24- monitors foot；3- is managed
Cap；31- glass sphere lens；4- is heat sink gasket；40- microstrip circuitries；The first conductive strips of 41-；The first vertical sections of 411-；412-
One horizontal segment；The second solder layers of 4121-；The second conductive strips of 42-；The second vertical sections of 421-；The second horizontal segments of 422-；43- insulate
Substrate；44- conductive layers；The first solder layers of 45-；5- chip of laser；6- radiating blocks；7- detector chips；8- gaskets；81- connects
Connect layer；9- gold tinols；11- spun golds；12- detector spun golds.
Specific implementation mode
In order to make technical problem to be solved in the utility model, technical solution and advantageous effect be more clearly understood, with
Lower combination accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
It applies example to be only used to explain the utility model, is not used to limit the utility model.
It should be noted that when element is referred to as " being fixed on " or " being set to " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on ... shown in the drawings or position are closed
System, is merely for convenience of describing the present invention and simplifying the description, does not indicate or imply the indicated device or element is necessary
With specific orientation, with specific azimuth configuration and operation, therefore should not be understood as limiting the present invention.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more this feature.The meaning of " plurality " is two or two in the description of the present invention,
More than, unless otherwise specifically defined.
Also referring to Fig. 2 to Fig. 4, now coaxial packaging laser provided by the utility model is illustrated.This is coaxial
Encapsulated laser, including tube socket 1, pin set 2 and heat sink gasket 4.Pin set 2 is arranged in tube socket 1, and pin set 2 includes first
Signal pins 21 and second signal foot 22.Heat sink gasket 4 is set on tube socket 1, and specially heat sink gasket 4 is fixed on the side of tube socket 1.
There are the first conductive strips 41 and the second conductive strips 42, the first conductive strips 41 and the second conductive strips 42 are spaced on heat sink gasket 4
And mutually insulated.Chip of laser 5, specially the first conductive strips 41 and chip of laser 5 are electrically connected on first conductive strips 41
It is welded to each other, and the first conductive strips 41 are mutually welded with the first signal pins 21, the first conductive strips 41 are equivalent to the chip of laser 5
Cathode；Chip of laser 5 is electrically connected with the second conductive strips 42 simultaneously, and the second conductive strips 42 are welded with 22 phase of second signal foot, the
Two conductive strips 42 are equivalent to the cathode of the chip of laser 5.By making the first conductive strips 41 mutually be welded with the first signal pins 21,
Two conductive strips 42 weld the Insertion Loss for reducing transmission signal with 22 phase of second signal foot, improve the reliable of the coaxial packaging laser
Property, while improving the transmission bandwidth of the coaxial packaging laser.Specifically, the first conductive strips 41 and the second conductive strips 42 are common
The microstrip circuitry 40 for forming the coaxial packaging laser realizes the impedance matching with modulator by the microstrip circuitry 40.
Coaxial packaging laser provided by the utility model, compared with prior art, the utility model coaxial packaging laser
Device realizes the resistance with modulator by the way that the first conductive strips 41 and the second conductive strips 42 that are electrically connected with chip of laser 5 are arranged
Anti- matching, and welded with second signal foot 22 by the way that the first conductive strips 41 and the welding of the first signal pins 21, the second conductive strips 42 are arranged
It connects, reduces signal Insertion Loss, ensure the rate bandwidth of 25Gbps.
Further, Fig. 2 and Fig. 3 is please referred to, one kind as coaxial packaging laser provided by the utility model is specific
Embodiment, the first conductive strips 41 and the first signal pins 21 are mutually welded by golden tinol 9, the second conductive strips 42 and second signal
Foot 22 is welded by 9 phase of golden tinol.Specifically, it is led using golden tinol 9 and by the welding manner of Sn/Au eutectic by first
Electric band 41 and the first signal pins 21 are welded to each other, using golden tinol 9 and conductive by second by the welding manner of Sn/Au eutectic
Band 42 and second signal foot 22 are welded to each other.The welding manner intensity of Sn/Au eutectic is higher, and brazing temperature is moderate, and is being brazed
Scaling powder is not necessarily in journey, it is easy to operate.
Further, Fig. 5 and Fig. 6 is please referred to, one kind as coaxial packaging laser provided by the utility model is specific
Embodiment, heat sink gasket 4 include insulating substrate 43, and insulating substrate 43 has the obverse and reverse being oppositely arranged.Optionally, absolutely
Edge substrate 43 is ceramic insulation substrate, more specifically, insulating substrate 43 is made of insulating materials such as aluminium nitride.Insulating substrate 43
Thermal coefficient is more than or equal to 170W/m.k.The thickness of insulating substrate 43 is in 0.1mm between 0.3mm.First conductive strips 41
With the plating of the second conductive strips 42 set on the front of insulating substrate 43, the reverse side plating of insulating substrate 43 is equipped with conductive layer 44.First is conductive
Band 41 and the second conductive strips 42 interval are set on insulating substrate 43, make 42 mutually insulated of the first conductive strips 41 and the second conductive strips.
The shape of conductive layer 44 is adapted with the shape of insulating substrate 43.
Further, referring to Fig. 6, a kind of specific embodiment party as coaxial packaging laser provided by the utility model
Formula, microstrip circuitry 40 can be Gold plated Layer, i.e. the first conductive strips 41 and the second conductive strips 42 are Gold plated Layer.Microstrip circuitry 40
Thickness range is 0.45 μm to 0.75 μm.Optionally, when microstrip circuitry 40 is plating titanium layer, the thickness model of microstrip circuitry 40
Enclose is 0.048 μm to 0.072 μm；When microstrip circuitry 40 is plating platinum layer, the thickness range of microstrip circuitry 40 is 0.15 μm
To 0.25 μm.The thickness range of microstrip circuitry 40 is related with its material, micro- in above-mentioned corresponding material and thickness section
Working efficiency higher with line circuit 40, and then the efficiency of transmission of the coaxial packaging laser can be improved.Microstrip circuitry 40
Material and thickness are not construed as limiting herein, can be selected with actual demand as the case may be.When conductive layer 44 is Gold plated Layer, conductive layer
44 thickness range is 0.45 μm to 0.75 μm；When conductive layer 44 is plating titanium layer, the thickness range of conductive layer 44 be 0.048 μm extremely
0.072μm；When conductive layer 44 is plating platinum layer, the thickness range of conductive layer 44 is 0.15 μm to 0.25 μm.The thickness of conductive layer 44
Range is related with its material, in above-mentioned corresponding material and thickness section, the efficiency of transmission of the coaxial packaging laser compared with
It is high.
Further, referring to Fig. 5, a kind of specific embodiment party as coaxial packaging laser provided by the utility model
The width of formula, the first conductive strips 41 is W1, and width range is 0.6mm to 0.7mm, and the width of the second conductive strips 42 is W2,
Width range is 0.6mm to 0.7mm, and in the width range, the working efficiency of the first conductive strips 41 and the second conductive strips 42 is more
Height is higher to the efficiency of transmission of the coaxial packaging laser.Specifically, the first conductive strips 41 include the be mutually connected vertically
The outside of the junction of one vertical section 411 and first horizontal segment 412, the first vertical section 411 and first horizontal segment 412 is equipped with
The inside of the junction of angle, the first vertical section 411 and first horizontal segment 412 is equipped with fillet, and the size of chamfering and fillet is herein not
It is construed as limiting.The width range of first vertical section 411 and first horizontal segment 412 is 0.6mm to 0.7mm, the first vertical section 411 and the
The length of one horizontal segment 412 is not construed as limiting herein.Second conductive strips 42 include the second vertical section 421 for being mutually connected vertically and the
The outside of the junction of two horizontal segments 422, the second vertical section 421 and the second horizontal segment 422 is equipped with chamfering, the second vertical section 421
It is equipped with fillet with the inside of the junction of the second horizontal segment 422, the size of chamfering and fillet is not construed as limiting herein.Second vertical section
421 and second horizontal segment 422 width range be 0.6mm to 0.7mm, the length of the second vertical section 421 and the second horizontal segment 422
It is not construed as limiting herein.
Further, Fig. 2 and Fig. 6 is please referred to, one kind as coaxial packaging laser provided by the utility model is specific
Embodiment, conductive layer 44 are equipped with the first solder layer 45, radiating block 6, radiating block 6 and the first solder layer are additionally provided on tube socket 1
45 phases are welded, and the setting of radiating block 6 is convenient for fixed heat sink gasket 4.Specifically, the first solder layer 45 is golden tin solder, and is coated
In on conductive layer 44, heat sink gasket 4 and radiating block 6 are welded to each other by the welding manner of golden tin crystals.
Further, referring to Fig. 5, a kind of specific embodiment party as coaxial packaging laser provided by the utility model
Formula, the first conductive strips 41 are equipped with the second solder layer 4121, and chip of laser 5 and the second solder layer 4121 weld, the second solder
The setting one of layer 4121 is easy for fixed laser chip 5, and two are easy for being electrically connected with chip of laser 5.Specifically, the second weldering
The bed of material 4121 is golden tin solder, and coated on the first conductive strips 41, by the welding manner of golden tin crystals by chip of laser 5
It is welded to each other with heat sink gasket 4.
Further, Fig. 2 and Fig. 3 is please referred to, one kind as coaxial packaging laser provided by the utility model is specific
Embodiment, is equipped with spun gold 11 between chip of laser 5 and the second conductive strips 42, chip of laser 5 and the second conductive strips 42 are logical
Crossing gold ball bonding technique makes the two be electrically connected.Gold ball bonding technique is the main welding of micro component circuit connection inside optical device
Mode, spun gold 11 generates high current under instant high-voltage makes 11 fuse itself of spun gold, and forms gold goal at the both ends of spun gold 11,
The gold goal at both ends is welded with chip of laser 5 and the second conductive strips 42 respectively, forms chip of laser 5 and the second conductive strips 42
Electrical connection.Make the first signal pins 21, the first conductive strips 41, chip of laser 5, the second conductive strips 42 and by gold ball bonding
Binary signal foot 22 forms access.
Further, please see Fig. 2 to Fig. 4, specific as one kind of coaxial packaging laser provided by the utility model
Embodiment, the coaxial packaging laser further include detector chip 7, and detector chip 7 is faced with chip of laser 5, are visited
The underface that device chip 7 is located at chip of laser 5 is surveyed, detector chip 7 is used for the working condition of monitoring laser chip 5.Together
When, pin set 2 further includes grounding leg 23 and two monitoring feet 24, and the both ends of detector chip 7 are electric with two monitoring feet 24 respectively
Connection.Optionally, the both ends of detector chip 7 are respectively equipped with detector spun gold 12, and detector is realized by gold ball bonding technique
Electrical connection between chip 7 and monitoring foot 24.
Further, please see Fig. 2 to Fig. 4, specific as one kind of coaxial packaging laser provided by the utility model
Embodiment, is equipped with gasket 8 between detector chip 7 and tube socket 1, gasket 8 can adjust detector chip 7 and chip of laser 5
The distance between, gasket 8 is chosen as ceramic gasket 8.Specifically, positioning chamber is offered on tube socket 1, gasket 8 is fixed on positioning chamber
Interior, the bottom surface of positioning chamber can be inclined so that gasket 8 and detector chip 7 are horizontal by predetermined angle incline.8 court of gasket
It is equipped with articulamentum 81 to 7 side of detector chip, detector chip 7 is electrically connected with articulamentum 81.Optionally, articulamentum 81 is to lead
Detector chip 7 is fixed on gasket 8 by electric elargol by way of conductive silver glue die bond.Optionally, articulamentum 81 and one
It is equipped with detector spun gold 12 between monitoring foot 24, detector spun gold 12 is equipped between detector chip 7 and another monitoring foot 24,
Electrical connection and the detector chip 7 and another of articulamentum 81 and one of monitoring foot 24 are realized by gold ball bonding technique
The electrical connection of a monitoring foot 24.
Further, referring to Fig. 1, a kind of specific embodiment party as coaxial packaging laser provided by the utility model
Formula, the coaxial packaging laser further include the pipe cap 3 being covered on tube socket 1.Optionally, pipe cap 3 and tube socket 1 pass through electric resistance welding phase
Mutually welding.Pipe cap 3 has glass sphere lens 31, and the optical signal that can send out laser, which converges at, carries out signal transmission in optical fiber.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
All any modification, equivalent and improvement etc., should be included in the utility model made by within the spirit and principle of utility model
Protection domain within.
Claims (10)
1. coaxial packaging laser, it is characterised in that：Including tube socket, it is arranged in the pin set of the tube socket and set on described
Heat sink gasket on tube socket, the heat sink gasket has spaced and insulation the first conductive strips and the second conductive strips, described
Chip of laser is electrically connected on first conductive strips, the chip of laser is electrically connected with described second, the pin
Group includes the first signal pins and second signal foot, and first conductive strips are welded with first signal pins, and described second is conductive
Band is welded with the second signal foot.
2. coaxial packaging laser as described in claim 1, it is characterised in that：First conductive strips and first signal
Foot is mutually welded by golden tinol, and second conductive strips are mutually welded with the second signal foot by golden tinol.
3. coaxial packaging laser as described in claim 1, it is characterised in that：The heat sink gasket includes insulating substrate, institute
Stating insulating substrate, there is the obverse and reverse being oppositely arranged, first conductive strips and second conductive strips plating to be set to described exhausted
The reverse side plating in the front of edge substrate, the insulating substrate is equipped with conductive layer.
4. coaxial packaging laser as claimed in claim 3, it is characterised in that：The conductive layer is equipped with the first solder layer,
Radiating block is additionally provided on the tube socket, the radiating block is welded with first solder layer.
5. coaxial packaging laser as described in claim 1, it is characterised in that：First conductive strips are equipped with the second solder
Layer, the chip of laser are welded with second solder layer.
6. coaxial packaging laser as described in any one in claim 1-5, it is characterised in that：First conductive strips and described
Second conductive strips are Gold plated Layer, and the thickness range of first conductive strips and second conductive strips is 0.45 μm to 0.75 μ
m。
7. coaxial packaging laser as described in any one in claim 1-5, it is characterised in that：First conductive strips and described
The width range of second conductive strips is 0.6mm to 0.7mm.
8. coaxial packaging laser as described in any one in claim 1-5, it is characterised in that：The chip of laser and described
Spun gold is equipped between second conductive strips, the chip of laser and second conductive strips are electrically connected by gold ball bonding.
9. coaxial packaging laser as described in any one in claim 1-5, it is characterised in that：Further include and the laser core
The detector chip that piece faces, the pin set further include grounding leg and two monitoring feet, the both ends of the detector chip
It is electrically connected respectively with two monitoring feet.
10. coaxial packaging laser as claimed in claim 9, it is characterised in that：The detector chip and the tube socket it
Between be equipped with gasket, the gasket is equipped with articulamentum, the detector chip and the connection towards the detector chip side
Layer electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721779419.7U CN207651795U (en) | 2017-12-19 | 2017-12-19 | Coaxial packaging laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721779419.7U CN207651795U (en) | 2017-12-19 | 2017-12-19 | Coaxial packaging laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207651795U true CN207651795U (en) | 2018-07-24 |
Family
ID=62877588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721779419.7U Active CN207651795U (en) | 2017-12-19 | 2017-12-19 | Coaxial packaging laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207651795U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108075350A (en) * | 2017-12-19 | 2018-05-25 | 深圳市东飞凌科技有限公司 | Coaxial packaging laser |
| CN109633830A (en) * | 2018-11-12 | 2019-04-16 | 武汉电信器件有限公司 | A kind of light emission component and its packaging method |
-
2017
- 2017-12-19 CN CN201721779419.7U patent/CN207651795U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108075350A (en) * | 2017-12-19 | 2018-05-25 | 深圳市东飞凌科技有限公司 | Coaxial packaging laser |
| CN109633830A (en) * | 2018-11-12 | 2019-04-16 | 武汉电信器件有限公司 | A kind of light emission component and its packaging method |
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