CN108075350A - Coaxial packaging laser - Google Patents
Coaxial packaging laser Download PDFInfo
- Publication number
- CN108075350A CN108075350A CN201711372539.XA CN201711372539A CN108075350A CN 108075350 A CN108075350 A CN 108075350A CN 201711372539 A CN201711372539 A CN 201711372539A CN 108075350 A CN108075350 A CN 108075350A
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- Prior art keywords
- conductive strips
- laser
- chip
- coaxial packaging
- conductive
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 47
- 238000009413 insulation Methods 0.000 claims abstract description 5
- 239000010931 gold Substances 0.000 claims description 27
- 229910052737 gold Inorganic materials 0.000 claims description 24
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 23
- 229910000679 solder Inorganic materials 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 19
- 238000012544 monitoring process Methods 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 8
- 238000003466 welding Methods 0.000 abstract description 13
- 238000003780 insertion Methods 0.000 abstract description 6
- 230000037431 insertion Effects 0.000 abstract description 6
- 239000000463 material Substances 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
Abstract
The present invention provides a kind of coaxial packaging lasers, including tube socket, it is arranged in the pin set of tube socket and the heat sink gasket on tube socket, heat sink gasket has spaced and insulation the first conductive strips and the second conductive strips, chip of laser is electrically connected on first conductive strips, chip of laser is electrically connected with second, pin set includes the first signal pins and secondary signal foot, and the first conductive strips and the first signal pins are welded, and the second conductive strips are welded with secondary signal foot.Coaxial packaging laser provided by the invention, by setting the first conductive strips and the second conductive strips that are electrically connected with chip of laser, realize the impedance matching with modulator, and by the way that the first conductive strips and the first signal pins welding, the second conductive strips and secondary signal foot is set to weld, signal Insertion Loss is reduced, ensures the rate bandwidth of 25Gbps.
Description
Technical field
The invention belongs to field of laser device technology, are to be related to a kind of coaxial packaging laser more specifically.
Background technology
With the rapid development of 5G network communications, the requirement to network bandwidth is higher and higher.5G network antennas unit is to base
It stands between unit using the mode of fiber optic communication, ensures the rate bandwidth of 25Gbps with this.The laser of 25Gbps at present
Device is mostly encapsulated using butterfly, and package dimension is larger, and cost is higher.In order to reduce the package dimension of laser and cost, need to adopt
With coaxial packaging laser, but the Insertion Loss between the circuit and pin in coaxial packaging laser is larger, it is difficult to reach 5G nets
The required bandwidth of network.
The content of the invention
It is an object of the invention to provide a kind of coaxial packaging laser, to solve coaxial packaging in the prior art
The Insertion Loss between circuit and pin in laser is larger and the technical issues of be unable to reach 5G networks required bandwidth.
To achieve the above object, the technical solution adopted by the present invention is：A kind of coaxial packaging laser is provided, including pipe
Seat is arranged in the pin set of the tube socket and the heat sink gasket on the tube socket, and the heat sink gasket has mutual
Every and insulation the first conductive strips and the second conductive strips, be electrically connected with chip of laser, the laser on first conductive strips
Device chip is electrically connected with described second, and the pin set includes the first signal pins and secondary signal foot, and described first leads
Electric band is welded with first signal pins, and second conductive strips are welded with the secondary signal foot.
Further, first conductive strips are mutually welded with first signal pins by golden tinol, and described second leads
Electric band is mutually welded with the secondary signal foot by golden tinol.
Further, the heat sink gasket includes insulated substrate, and the insulated substrate is with the front being oppositely arranged and instead
Face, first conductive strips and second conductive strips plating are arranged on the front of the insulated substrate, the reverse side of the insulated substrate
Plating is equipped with conductive layer.
Further, the conductive layer is equipped with the first solder layer, and radiating block, the radiating block are additionally provided on the tube socket
It is welded with first solder layer.
Further, first conductive strips are equipped with the second solder layer, the chip of laser and second solder
Layer welding.
Further, first conductive strips and second conductive strips are Gold plated Layer, first conductive strips and institute
The thickness range for stating the second conductive strips is 0.45 μm to 0.75 μm.
Further, the width range of first conductive strips and second conductive strips is 0.6mm to 0.7mm.
Further, between the chip of laser and second conductive strips be equipped with spun gold, the chip of laser and
Second conductive strips are electrically connected by gold ball bonding.
Further, the detector chip faced with the chip of laser is further included, the pin set, which further includes, to be connect
Lower margin and two monitoring feet, the both ends of the detector chip are electrically connected respectively with two monitoring feet.
Further, gasket is equipped between the detector chip and the tube socket, the gasket is towards the detector
Chip-side is equipped with articulamentum, and the detector chip is electrically connected with the articulamentum.
The advantageous effect of coaxial packaging laser provided by the invention is：Compared with prior art, the same axle envelope of the present invention
Dress laser realizes the resistance with modulator by setting the first conductive strips and the second conductive strips that are electrically connected with chip of laser
Anti- matching, and by the way that the first conductive strips and the first signal pins welding, the second conductive strips and secondary signal foot is set to weld, reduce
Signal Insertion Loss ensures the rate bandwidth of 25Gbps.
Description of the drawings
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description be only the present invention some
Embodiment, for those of ordinary skill in the art, without having to pay creative labor, can also be according to these
Attached drawing obtains other attached drawings.
Fig. 1 is the three-dimensional structure diagram of coaxial packaging laser provided in an embodiment of the present invention；
Fig. 2 is the part isometric structure chart of coaxial packaging laser provided in an embodiment of the present invention；
Fig. 3 is the front view of coaxial packaging laser provided in an embodiment of the present invention；
Fig. 4 is the top view of coaxial packaging laser provided in an embodiment of the present invention；
Fig. 5 be the embodiment of the present invention used by heat sink gasket front view；
Fig. 6 be the embodiment of the present invention used by heat sink gasket side view.
Wherein, each reference numeral in figure：
1- tube sockets；2- pin sets；The first signal pins of 21-；22- secondary signal feet；23- grounding legs；24- monitors foot；3- is managed
Cap；31- glass sphere lens；4- is heat sink gasket；40- microstrip circuitries；The first conductive strips of 41-；The first vertical sections of 411-；412-
One horizontal segment；The second solder layers of 4121-；The second conductive strips of 42-；The second vertical sections of 421-；The second horizontal segments of 422-；43- insulate
Substrate；44- conductive layers；The first solder layers of 45-；5- chip of laser；6- radiating blocks；7- detector chips；8- gaskets；81- connects
Connect layer；9- gold tinols；11- spun golds；12- detector spun golds.
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
It should be noted that when element is referred to as " being fixed on " or " being arranged at " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instructions such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System is for only for ease of the description present invention and simplifies description rather than instruction or imply that signified device or element must have
Specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the present invention, " multiple " are meant that two or more,
Unless otherwise specifically defined.
Also referring to Fig. 2 to Fig. 4, now coaxial packaging laser provided by the invention is illustrated.The coaxial packaging
Laser, including tube socket 1, pin set 2 and heat sink gasket 4.Pin set 2 is arranged in tube socket 1, and pin set 2 includes the first signal
Foot 21 and secondary signal foot 22.Heat sink gasket 4 is arranged on tube socket 1, is specially the one side that heat sink gasket 4 is fixed on tube socket 1.It is heat sink
There is the first conductive strips 41 and the second conductive strips 42,42 spaced and phase of the first conductive strips 41 and the second conductive strips on gasket 4
Mutually insulation.Chip of laser 5 is electrically connected on first conductive strips 41, is specially that the first conductive strips 41 and chip of laser 5 are mutual
Welding, and the first conductive strips 41 are mutually welded with the first signal pins 21, the first conductive strips 41 are equivalent to the negative of the chip of laser 5
Pole；Chip of laser 5 is electrically connected with the second conductive strips 42 simultaneously, and the second conductive strips 42 are welded with 22 phase of secondary signal foot, and second
Conductive strips 42 are equivalent to the cathode of the chip of laser 5.By the way that the first conductive strips 41 is made mutually to be welded with the first signal pins 21, second
Conductive strips 42 weld the Insertion Loss for reducing transmission signal with 22 phase of secondary signal foot, improve the reliable of the coaxial packaging laser
Property, while improve the transmission bandwidth of the coaxial packaging laser.Specifically, the first conductive strips 41 and the second conductive strips 42 are common
The microstrip circuitry 40 of the coaxial packaging laser is formed, the impedance matching with modulator is realized by the microstrip circuitry 40.
Coaxial packaging laser provided by the invention, compared with prior art, coaxial packaging laser of the present invention is by setting
The first conductive strips 41 and the second conductive strips 42 being electrically connected with chip of laser 5 are put, realize the impedance matching with modulator, and
By setting, the first conductive strips 41 are welded with the first signal pins 21, the second conductive strips 42 are welded with secondary signal foot 22, are reduced
Signal Insertion Loss ensures the rate bandwidth of 25Gbps.
Further, Fig. 2 and Fig. 3 is referred to, a kind of specific implementation as coaxial packaging laser provided by the invention
Mode, the first conductive strips 41 and the first signal pins 21 are mutually welded by golden tinol 9, the second conductive strips 42 and secondary signal foot 22
It is welded by golden 9 phase of tinol.Specifically, using golden tinol 9 and the welding manner of Sn/Au eutectic is passed through by the first conductive strips
41 and first signal pins 21 be welded to each other, using golden tinol 9 and pass through the welding manner of Sn/Au eutectic by the second conductive strips 42
It is welded to each other with secondary signal foot 22.The welding manner intensity of Sn/Au eutectic is higher, and brazing temperature is moderate, and in brazing process
It is easy to operate without scaling powder.
Further, Fig. 5 and Fig. 6 is referred to, a kind of specific implementation as coaxial packaging laser provided by the invention
Mode, heat sink gasket 4 include insulated substrate 43, and insulated substrate 43 has the obverse and reverse being oppositely arranged.Optionally, insulate base
Plate 43 is ceramic insulation substrate, more specifically, insulated substrate 43 is made of insulating materials such as aluminium nitride.The heat conduction of insulated substrate 43
Coefficient is more than or equal to 170W/m.k.The thickness of insulated substrate 43 is in 0.1mm between 0.3mm.First conductive strips 41 and
The plating of two conductive strips 42 is equipped with conductive layer 44 arranged on the front of insulated substrate 43, the reverse side plating of insulated substrate 43.First conductive strips 41
It is arranged on the second conductive strips 42 interval on insulated substrate 43, makes 42 mutually insulated of the first conductive strips 41 and the second conductive strips.It is conductive
The shape of layer 44 is adapted with the shape of insulated substrate 43.
Further, referring to Fig. 6, a kind of specific embodiment as coaxial packaging laser provided by the invention,
Microstrip circuitry 40 can be Gold plated Layer, i.e. the first conductive strips 41 and the second conductive strips 42 are Gold plated Layer.The thickness of microstrip circuitry 40
It is 0.45 μm to 0.75 μm to spend scope.Optionally, when microstrip circuitry 40 is plates titanium layer, the thickness range of microstrip circuitry 40
For 0.048 μm to 0.072 μm；When microstrip circuitry 40 for plating platinum layer when, the thickness range of microstrip circuitry 40 for 0.15 μm extremely
0.25μm.The thickness range of microstrip circuitry 40 is related with its material, in above-mentioned corresponding material and thickness section, micro-strip
The work efficiency higher of line circuit 40, and then the efficiency of transmission of the coaxial packaging laser can be improved.The material of microstrip circuitry 40
Material and thickness are not construed as limiting herein, can be selected as the case may be with actual demand.When conductive layer 44 is Gold plated Layer, conductive layer 44
Thickness range be 0.45 μm to 0.75 μm；Conductive layer 44 for plating titanium layer when, the thickness range of conductive layer 44 for 0.048 μm extremely
0.072μm；When conductive layer 44 is plates platinum layer, the thickness range of conductive layer 44 is 0.15 μm to 0.25 μm.The thickness of conductive layer 44
Scope is related with its material, in above-mentioned corresponding material and thickness section, the efficiency of transmission of the coaxial packaging laser compared with
It is high.
Further, referring to Fig. 5, a kind of specific embodiment as coaxial packaging laser provided by the invention,
The width of first conductive strips 41 is W1, and width range is 0.6mm to 0.7mm, and the width of the second conductive strips 42 is W2, width
Scope is 0.6mm to 0.7mm, in the width range, the work efficiency higher of the first conductive strips 41 and the second conductive strips 42, from
And the efficiency of transmission of the coaxial packaging laser is higher.Specifically, it is perpendicular to include be mutually connected vertically first for the first conductive strips 41
The outside of the junction of straight section 411 and first horizontal segment 412, the first vertical section 411 and first horizontal segment 412 is equipped with chamfering, the
The inside of the junction of one vertical section 411 and first horizontal segment 412 is equipped with fillet, and the size of chamfering and fillet does not limit herein
It is fixed.The width range of first vertical section 411 and first horizontal segment 412 is 0.6mm to 0.7mm, the first vertical section 411 and the first water
The length of flat section 412 is not construed as limiting herein.Second conductive strips 42 include the second vertical section 421 being mutually connected vertically and the second water
The outside of the junction of flat section 422, the second vertical section 421 and the second horizontal segment 422 is equipped with chamfering, the second vertical section 421 and the
The inside of the junction of two horizontal segments 422 is equipped with fillet, and the size of chamfering and fillet is not construed as limiting herein.Second vertical section 421
Be 0.6mm to 0.7mm with the width range of the second horizontal segment 422, the length of the second vertical section 421 and the second horizontal segment 422 this
Place is not construed as limiting.
Further, Fig. 2 and Fig. 6 is referred to, a kind of specific implementation as coaxial packaging laser provided by the invention
Mode, conductive layer 44 are equipped with the first solder layer 45, radiating block 6, radiating block 6 and 45 phase of the first solder layer are additionally provided on tube socket 1
Welding, the setting of radiating block 6 is convenient for fixed heat sink gasket 4.Specifically, the first solder layer 45 is golden tin solder, and is coated on and leads
In electric layer 44, heat sink gasket 4 and radiating block 6 are welded to each other by the welding manner of golden tin crystals.
Further, referring to Fig. 5, a kind of specific embodiment as coaxial packaging laser provided by the invention,
First conductive strips 41 are equipped with the second solder layer 4121, and chip of laser 5 is welded with the second solder layer 4121, the second solder layer
4121 setting one is easy for fixed laser chip 5, and two are easy for being electrically connected with chip of laser 5.Specifically, the second solder
Layer 4121 is golden tin solder, and coated on the first conductive strips 41, by the welding manner of golden tin crystals by 5 He of chip of laser
Heat sink gasket 4 is welded to each other.
Further, Fig. 2 and Fig. 3 is referred to, a kind of specific implementation as coaxial packaging laser provided by the invention
Mode, spun gold 11 is equipped between 5 and second conductive strips 42 of chip of laser, and 5 and second conductive strips 42 of chip of laser pass through gold
Ball-bonding process is electrically connected the two.Gold ball bonding technique is the main welding side of micro component circuit connection inside optical device
Formula, spun gold 11 generates high current under instant high-voltage makes 11 fuse itself of spun gold, and gold goal is formed at the both ends of spun gold 11, and two
The gold goal at end welds respectively with 5 and second conductive strips 42 of chip of laser, forms the electricity of 5 and second conductive strips 42 of chip of laser
Connection.First signal pins 21, the first conductive strips 41, chip of laser 5, the second conductive strips 42 and second are made by gold ball bonding
Signal pins 22 form access.
Further, Fig. 2 to Fig. 4 is referred to, a kind of specific implementation as coaxial packaging laser provided by the invention
Mode, the coaxial packaging laser further include detector chip 7, and detector chip 7 is faced with chip of laser 5, detector
Chip 7 is located at the underface of chip of laser 5, and detector chip 7 is used for the working condition of monitoring laser chip 5.Meanwhile draw
Foot group 2 further includes grounding leg 23 and two monitoring feet 24, and the both ends of detector chip 7 are electrically connected respectively with two monitoring feet 24.
Optionally, the both ends of detector chip 7 are respectively equipped with detector spun gold 12, and detector chip 7 is realized by gold ball bonding technique
Electrical connection between monitoring foot 24.
Further, Fig. 2 to Fig. 4 is referred to, a kind of specific implementation as coaxial packaging laser provided by the invention
Mode, is equipped with gasket 8 between detector chip 7 and tube socket 1, gasket 8 can adjust between detector chip 7 and chip of laser 5
Distance, gasket 8 is chosen as ceramic gasket 8.Specifically, positioning chamber is offered on tube socket 1, gasket 8 is fixed in positioning chamber, fixed
The bottom surface of position chamber can be inclined so that gasket 8 and detector chip 7 are horizontal by predetermined angle incline.Gasket 8 is towards detection
7 one side of device chip is equipped with articulamentum 81, and detector chip 7 is electrically connected with articulamentum 81.Optionally, articulamentum 81 is conductive silver
Detector chip 7 is fixed on gasket 8 by glue by way of conductive silver glue die bond.Optionally, articulamentum 81 and a monitoring
Detector spun gold 12 is equipped between foot 24, detector spun gold 12 is equipped between detector chip 7 and another monitoring foot 24, passes through
Gold ball bonding technique realizes articulamentum 81 and one of electrical connection for monitoring foot 24 and detector chip 7 and another prison
Control the electrical connection of foot 24.
Further, referring to Fig. 1, a kind of specific embodiment as coaxial packaging laser provided by the invention,
The coaxial packaging laser further includes the pipe cap 3 being covered on tube socket 1.Optionally, pipe cap 3 and tube socket 1 are mutual by electric resistance welding
Welding.Pipe cap 3 has glass sphere lens 31, and the optical signal that can send laser, which converges at, carries out signal transmission in optical fiber.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should all be included in the protection scope of the present invention.
Claims (10)
1. coaxial packaging laser, it is characterised in that：Including tube socket, it is arranged in the pin set of the tube socket and arranged on described
Heat sink gasket on tube socket, the heat sink gasket has spaced and insulation the first conductive strips and the second conductive strips, described
Chip of laser is electrically connected on first conductive strips, the chip of laser is electrically connected with described second, the pin
Group includes the first signal pins and secondary signal foot, and first conductive strips are welded with first signal pins, and described second is conductive
Band is welded with the secondary signal foot.
2. coaxial packaging laser as described in claim 1, it is characterised in that：First conductive strips and first signal
Foot is mutually welded by golden tinol, and second conductive strips are mutually welded with the secondary signal foot by golden tinol.
3. coaxial packaging laser as described in claim 1, it is characterised in that：The heat sink gasket includes insulated substrate, institute
Stating insulated substrate has the obverse and reverse being oppositely arranged, and first conductive strips and second conductive strips plating are arranged on described exhausted
The front of edge substrate, the reverse side plating of the insulated substrate are equipped with conductive layer.
4. coaxial packaging laser as claimed in claim 3, it is characterised in that：The conductive layer is equipped with the first solder layer,
Radiating block is additionally provided on the tube socket, the radiating block is welded with first solder layer.
5. coaxial packaging laser as described in claim 1, it is characterised in that：First conductive strips are equipped with the second solder
Layer, the chip of laser are welded with second solder layer.
6. such as claim 1-5 any one of them coaxial packaging lasers, it is characterised in that：First conductive strips and described
Second conductive strips are Gold plated Layer, and the thickness range of first conductive strips and second conductive strips is 0.45 μm to 0.75 μ
m。
7. such as claim 1-5 any one of them coaxial packaging lasers, it is characterised in that：First conductive strips and described
The width range of second conductive strips is 0.6mm to 0.7mm.
8. such as claim 1-5 any one of them coaxial packaging lasers, it is characterised in that：The chip of laser and described
Spun gold is equipped between second conductive strips, the chip of laser and second conductive strips are electrically connected by gold ball bonding.
9. such as claim 1-5 any one of them coaxial packaging lasers, it is characterised in that：It further includes and the laser core
The detector chip that piece faces, the pin set further include grounding leg and two monitoring feet, the both ends of the detector chip
It is electrically connected respectively with two monitoring feet.
10. coaxial packaging laser as claimed in claim 9, it is characterised in that：The detector chip and the tube socket it
Between be equipped with gasket, the gasket is equipped with articulamentum, the detector chip and the connection towards the detector chip one side
Layer electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711372539.XA CN108075350A (en) | 2017-12-19 | 2017-12-19 | Coaxial packaging laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711372539.XA CN108075350A (en) | 2017-12-19 | 2017-12-19 | Coaxial packaging laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108075350A true CN108075350A (en) | 2018-05-25 |
Family
ID=62158940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711372539.XA Pending CN108075350A (en) | 2017-12-19 | 2017-12-19 | Coaxial packaging laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108075350A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2020021912A (en) * | 2018-08-03 | 2020-02-06 | 日本ルメンタム株式会社 | Optical subassembly and optical module |
| JP2020021911A (en) * | 2018-08-03 | 2020-02-06 | 日本ルメンタム株式会社 | Optical subassembly and optical module |
| CN111786256A (en) * | 2020-08-26 | 2020-10-16 | 广东瑞谷光网通信股份有限公司 | TO-can packaging structure of light emitting laser and packaging method thereof |
| CN112838468A (en) * | 2021-01-04 | 2021-05-25 | 武汉光迅科技股份有限公司 | TO packaging structure |
| CN113764971A (en) * | 2021-06-30 | 2021-12-07 | 武汉敏芯半导体股份有限公司 | Electric absorption modulation laser refrigeration packaging structure |
| CN114142335A (en) * | 2020-09-03 | 2022-03-04 | 肖特股份有限公司 | Connector for electronic component |
| CN114545569A (en) * | 2020-11-27 | 2022-05-27 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2022111034A1 (en) * | 2020-11-27 | 2022-06-02 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| JP2020021912A (en) * | 2018-08-03 | 2020-02-06 | 日本ルメンタム株式会社 | Optical subassembly and optical module |
| JP2020021911A (en) * | 2018-08-03 | 2020-02-06 | 日本ルメンタム株式会社 | Optical subassembly and optical module |
| JP7245620B2 (en) | 2018-08-03 | 2023-03-24 | 日本ルメンタム株式会社 | Optical subassemblies and optical modules |
| JP7249745B2 (en) | 2018-08-03 | 2023-03-31 | 日本ルメンタム株式会社 | Optical subassemblies and optical modules |
| CN111786256A (en) * | 2020-08-26 | 2020-10-16 | 广东瑞谷光网通信股份有限公司 | TO-can packaging structure of light emitting laser and packaging method thereof |
| CN111786256B (en) * | 2020-08-26 | 2021-10-29 | 广东瑞谷光网通信股份有限公司 | TO-can packaging structure of light emitting laser and packaging method thereof |
| CN114142335A (en) * | 2020-09-03 | 2022-03-04 | 肖特股份有限公司 | Connector for electronic component |
| CN114545569A (en) * | 2020-11-27 | 2022-05-27 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2022111034A1 (en) * | 2020-11-27 | 2022-06-02 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112838468A (en) * | 2021-01-04 | 2021-05-25 | 武汉光迅科技股份有限公司 | TO packaging structure |
| CN113764971A (en) * | 2021-06-30 | 2021-12-07 | 武汉敏芯半导体股份有限公司 | Electric absorption modulation laser refrigeration packaging structure |
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