CN206848527U - A kind of vertical-cavity surface-emitting optical device based on flexible PCB - Google Patents
A kind of vertical-cavity surface-emitting optical device based on flexible PCB Download PDFInfo
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- CN206848527U CN206848527U CN201720402744.5U CN201720402744U CN206848527U CN 206848527 U CN206848527 U CN 206848527U CN 201720402744 U CN201720402744 U CN 201720402744U CN 206848527 U CN206848527 U CN 206848527U
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Abstract
The utility model discloses a kind of vertical-cavity surface-emitting optical device based on flexible PCB, including：Optical devices, for optical signal to be coupled in optical fiber；Optics adaptive device, for by the externally connected optical fiber of the Optical devices；Wherein described optics adaptive device is encapsulated using resin material, and inside is provided with one and is used to accommodate the Optical devices cavity；And circuit arrangement, for converting the electrical signal to the optical signal；Wherein described circuit arrangement is disposed with the metal supporting layer of high thermal conductivity, the flexible circuit board layer for transmitting high speed signal, hard circuit board layer, high thermal conductivity ceramic interlayer and vertical-cavity surface-emitting chip from top to bottom；The optics adaptive device by adhering with epoxy resin on the flexible PCB, so as to form a sealing space for accommodating the Optical devices and play insulating effect.Optical device of the present utility model has that high frequency performance is good, technological requirement is low and the advantages of perfect heat-dissipating.
Description
Technical field
It the utility model is related to communication technical field, more particularly to a kind of vertical-cavity surface-emitting light based on flexible PCB
Device.
Background technology
The optical device that early stage is used for vertical-cavity surface-emitting is in the majority with transistor packing forms, and this packaging technology is convenient, but
High frequency performance is not good enough, and thermal diffusivity is bad, is limited by pin area occupied, and it is few can to design the area utilized.
Patent CN102422193 discloses a kind of optical module of the Optical devices with ceramic package, make use of ceramics
Encapsulation substitution transistor encapsulation, can effectively solve high-frequency signal and interior optical component, circuit and high-frequency signal distribution problem.
The patent mainly uses ceramic substituted metal material, using multi-layer ceramics by lens and fiber coupling, using close on ceramics
Seal ring and metal device.Using multi-layer ceramics, physical size change is done on the ceramics of upper strata, component can be relatively easy to put
Put, use high speed circuit in lower circuit, electric signal is preferably transmitted.Welded, utilized using metal cover in addition
Ceramic insulation characteristic is electrically insulated.However, using multi-layer ceramics material in technique it is complex, similar device is all small-sized
Device, the Three-dimension process required precision to ceramic material are higher.
Utility model content
For vertical-cavity surface-emitting in the prior art optics high frequency performance is poor, poor radiation, ceramic substrate process
The defects of complicated, the utility model provide that a kind of high frequency performance is good, technological requirement is low and perfect heat-dissipating based on flexible circuit
The vertical-cavity surface-emitting optical device of plate.
The technical scheme that the utility model proposes with regard to above-mentioned technical problem is as follows：
On the one hand, there is provided a kind of vertical-cavity surface-emitting optical device based on flexible PCB, including：
Optical devices, for optical signal to be coupled in optical fiber；
Optics adaptive device, for by the externally connected optical fiber of the Optical devices；Wherein described optics adaptive device is adopted
Encapsulated with resin material, inside is provided with one and is used to accommodate the Optical devices cavity；And
Circuit arrangement, for converting the electrical signal to the optical signal；Wherein described circuit arrangement is set successively from top to bottom
It is equipped with the metal supporting layer of high thermal conductivity, the flexible circuit board layer for transmitting high speed signal, hard circuit board layer, high thermal conductivity pottery
Porcelain transition zone and vertical-cavity surface-emitting chip；The optics adaptive device is by adhering with epoxy resin in the flexible PCB
On, so as to form a sealing space for accommodating the Optical devices and play insulating effect.
Preferably, the Optical devices include：The support chip of light filter plate, condenser lens and the condenser lens.
Preferably, the cavity of the optics adaptive device includes the first cavity with the first internal diameter and with the
Second cavity of two internal diameters；First cavity connects with second cavity and first cavity is located at second cavity
Top.
Preferably, the smooth filter plate is arranged on the top of first cavity, the support chip of the condenser lens
The top of second cavity is arranged on, the condenser lens is supported on the support chip.
Preferably, the support chip of the condenser lens is arranged on the top of second cavity, the condenser lens
It is supported on the support chip；The smooth filter plate is connected to the lower section of the support chip and just relative with the condenser lens.
Preferably, the circuit arrangement also includes spun gold lead, for the vertical-cavity surface-emitting chip to be connected into institute
State flexible PCB.
Preferably, the circuit arrangement also includes spun gold lead, for the vertical-cavity surface-emitting chip to be connected into institute
State on high thermal conductivity ceramic interlayer, then the high thermal conductivity ceramic interlayer is connected on the flexible PCB.
Preferably, thermal conducting path, the thermal conducting path are offered on the flexible circuit board layer and the hard circuit board layer
In be filled with thermal conductive metallic material.
Preferably, the high thermal conductivity metal supporting layer is Nian Jie with the flexible circuit board layer by epoxy resin, described
The support chip of light filter plate and the condenser lens is bonded in the chamber of the optics adaptive device by epoxy resin
In vivo.
Preferably, the vertical-cavity surface-emitting chip is bonded on the high thermal conductivity transition zone by heat conduction elargol, institute
High thermal conductivity transition zone is stated to be bonded on the hard circuit board layer by heat conduction elargol.
Implement the utility model embodiment, have the advantages that：Flexible PCB and hardboard circuit are comparative maturities
High speed transmission of signals technique, be adapted to high-volume process, good process repeatability, technique controlling difficulty is relatively low, using this scheme
The technological requirement coaxially processed to the pin of transistor base can be reduced, reduces parasitism of the signal between pin between shell
Loss, reduce the complicated requirement such as gold-plated to transistor base large area.
In addition, transistor base, typically using the material that can be used as support, its thermal conductivity is far below use described herein
Metal supporting layer, therefore the performance of chip cooling can be improved.
Moreover for use aluminium oxide ceramics is as supporting plate, ceramics have the characteristics of preferable in HFS, but
It is to use multi-layer ceramics co-firing technology cost costly, is subsequently connected to other circuit boards and is also required to flexible PCB as letter
Number transmission uses, therefore technical solutions of the utility model can reduce product complexity, reduce technological requirement and cost.
Alumina material thermal conductivity itself is not high, is adapted to the not high product of product power requirement, can also using sintering process
Reduce material thermal conductivity, for the strict product of power consumption requirements do not have too many advantage, and the application use heat conduction
Hole is conducted heat and highly heat-conductive material does support and can handle this problem well.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, is not paying the premise of creative work
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the knot for the vertical-cavity surface-emitting optical device based on flexible PCB that the utility model first embodiment provides
Structure schematic diagram；
Fig. 2 is the knot for the vertical-cavity surface-emitting optical device based on flexible PCB that the utility model second embodiment provides
Structure schematic diagram.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the premise of creative work
Lower obtained every other embodiment, belong to the scope of the utility model protection.
A kind of vertical-cavity surface-emitting optical device based on flexible PCB is present embodiments provided, referring to Fig. 1 and 2, the light
Device includes：
Optical devices, for optical signal to be coupled in optical fiber；
Optics adaptive device, for by the externally connected optical fiber of Optical devices；Wherein optics adaptive device uses resinous wood
Material encapsulation, inside are provided with one and are used to accommodate Optical devices cavity；And
Circuit arrangement, for converting the electrical signal to optical signal；Wherein circuit arrangement is disposed with height and led from top to bottom
The metal supporting layer of heating rate, the flexible circuit board layer for transmitting high speed signal, hard circuit board layer, high thermal conductivity ceramic interlayer
And vertical-cavity surface-emitting chip；Optics adaptive device by adhering with epoxy resin on flexible PCB, so as to form one
Accommodate the sealing space of Optical devices and play insulating effect.
The optical device is integrally realized produces optical signal by vertical-cavity surface-emitting chip, makes light incident by lens and filter plate
To optical fiber, the transmission of electric signal is realized by flexible PCB and hard circuit board.
Flexible PCB, upper strata hard circuit board, ceramic interlayer need root in the pin of specific product in actual circuit
Definition design HW High Way layout.Flexible PCB and hard circuit board plate, metal supporting layer and ceramic interlayer are used for making
For the integrated support of vertical-cavity surface-emitting chip, and provide the pad of spun gold wire bonding, for chip and flexible PCB it
Between signal connection.
Specifically, Optical devices include：The support of light filter plate 102/202, condenser lens 104/204 and condenser lens
Piece 103/203.
The cavity of optics adaptive device 101/201 is including the first cavity with the first internal diameter and with the second internal diameter
Second cavity.First cavity connects with the second cavity and the first cavity is located at the top of the second cavity.As illustrated in fig. 1 and 2, first
The internal diameter of cavity is less than the internal diameter of the second cavity, so there is a platform in the place that the first cavity and the second cavity connect
Face.
In one embodiment of the present utility model, as shown in figure 1, light filter plate 102 is arranged on the top of the first cavity,
Weaken the light power of chip 105, to ensure human eye laser safety.The support chip 103 of condenser lens 104 is arranged on the second cavity
Top, the table top being close between the first cavity and the second cavity.Condenser lens 103 is supported on support chip 104.Light filter plate
102 and the support chip 103 of condenser lens 104 be bonded in by epoxy resin in the cavity of optics adaptive device 101.
In another embodiment of the present utility model, as shown in Fig. 2 the support chip 203 of condenser lens 204 is arranged on
The top of two cavitys, the table top being close between the first cavity and the second cavity.Condenser lens 204 is supported on support chip 203.Light
Filter plate 202 is connected to the lower section of support chip 203 and, the light power of decrease chip 205 just relative with condenser lens 204, with
Ensure human eye laser safety.The support chip 203 of light filter plate 202 and condenser lens 204 is bonded in optics by epoxy resin and fitted
In cavity with device 201.Production efficiency can be improved by adopting the structure.
Specifically, as illustrated in fig. 1 and 2, circuit board 108/208 includes the flexible PCB of lower floor and the hard circuit with upper strata
Plate, in production, they are just bonded together, and high-speed electrical signals path is designed on flexible PCB and carries out signal transmission, hard circuit
Pad is done on plate, chip and circuit board are connected using spun gold welding procedure.High thermal conductivity metal supporting layer 109/209, such as copper or
Person's aluminium is be bonded with circuit board 108/208 by epoxy resin.The thermal conducting path 107/ of well in advance on circuit board 108/208
207, and thermal conductive metallic material is filled, such as copper or silver.High thermal conductivity ceramic interlayer 106/206 is used for the height for adjusting chip
Degree, adjust focal position and do circuit transition use.High thermal conductivity ceramic interlayer 106/206 can use high heat conduction aluminium nitride
Ceramics or aluminium oxide ceramics, are bonded in by heat conduction elargol in the heat dissipation region of circuit board 108/208.Vertical-cavity surface-emitting core
Piece 105/205 is bonded on high thermal conductivity ceramic interlayer 106/206 by heat conduction elargol.
In one embodiment of the present utility model, circuit arrangement also includes spun gold lead 110, for realizing vertical cavity surface
Signal connection between transmitting chip 105 and circuit board 108, the signal in particular between chip 105 and hard circuit board layer connect
Connect.
In another embodiment of the present utility model, circuit arrangement also includes spun gold lead 110, for by vertical cavity surface
Transmitting chip 105 is connected on high thermal conductivity ceramic interlayer 106, then high thermal conductivity ceramic interlayer 106 is connected into flexibility
On circuit board.Such connected mode is advantageous to optimize the high frequency characteristics of optical device.
In the utility model, optics adaptive device 101/201 is the optics adapter interface of standard, and material is plastic tree
Fat, major function are connecting contact pin adapter, there is provided accurate optical fiber resetting.Optics adaptive device 101/201 is bonded light
Filter plate 102/202 by active coupling technique with chip 105/205 with after condenser lens 104/204, being coupled, being coupled to
Optics adaptive device 101/201 and circuit board 108/208 are fixed with epoxy resin during the optical power value needed, sealing is formed and connects
Connect.
Specifically, in the utility model, vertical-cavity surface-emitting chip is bonded in high thermal conductivity transition by heat conduction elargol
On layer, high thermal conductivity transition zone is bonded on hard circuit board layer by heat conduction elargol.
Above disclosed is only a kind of the utility model preferred embodiment, can not limit this practicality with this certainly
New interest field, one of ordinary skill in the art will appreciate that all or part of flow of above-described embodiment is realized, and according to
The equivalent variations that the utility model claims are made, still fall within the scope that utility model is covered.
Claims (10)
- A kind of 1. vertical-cavity surface-emitting optical device based on flexible PCB, it is characterised in that including：Optical devices, for optical signal to be coupled in optical fiber；Optics adaptive device, for by the externally connected optical fiber of the Optical devices；Wherein described optics adaptive device is using tree Fat material package, inside are provided with one and are used to accommodate the Optical devices cavity；AndCircuit arrangement, for converting the electrical signal to the optical signal；Wherein described circuit arrangement is disposed with from top to bottom The metal supporting layer of high thermal conductivity, the flexible circuit board layer for transmitting high speed signal, hard circuit board layer, high thermal conductivity ceramics mistake Cross layer and vertical-cavity surface-emitting chip；The optics adaptive device by adhering with epoxy resin on the flexible PCB, So as to form a sealing space for accommodating the Optical devices and play insulating effect.
- 2. the vertical-cavity surface-emitting optical device according to claim 1 based on flexible PCB, it is characterised in that the light Learning device includes：The support chip of light filter plate, condenser lens and the condenser lens.
- 3. the vertical-cavity surface-emitting optical device according to claim 2 based on flexible PCB, it is characterised in that the light Learning the cavity of adaptive device includes the first cavity with the first internal diameter and the second cavity with the second internal diameter；It is described First cavity connects with second cavity and first cavity is located at the top of second cavity.
- 4. the vertical-cavity surface-emitting optical device according to claim 3 based on flexible PCB, it is characterised in that the light Filter plate is arranged on the top of first cavity, and the support chip of the condenser lens is arranged on the top of second cavity Portion, the condenser lens are supported on the support chip.
- 5. the vertical-cavity surface-emitting optical device according to claim 3 based on flexible PCB, it is characterised in that described poly- The support chip of focus lens is arranged on the top of second cavity, and the condenser lens is supported on the support chip；Institute State light filter plate and be connected to the lower section of the support chip and just relative with the condenser lens.
- 6. the vertical-cavity surface-emitting optical device according to claim 1 based on flexible PCB, it is characterised in that the electricity Road device also includes spun gold lead, for the vertical-cavity surface-emitting chip to be connected into the flexible PCB.
- 7. the vertical-cavity surface-emitting optical device according to claim 1 based on flexible PCB, it is characterised in that the electricity Road device also includes spun gold lead, for the vertical-cavity surface-emitting chip to be connected into the high thermal conductivity ceramic interlayer On, then the high thermal conductivity ceramic interlayer is connected on the flexible PCB.
- 8. the vertical-cavity surface-emitting optical device according to claim 1 based on flexible PCB, it is characterised in that described soft Thermal conducting path is offered on property board layer and the hard circuit board layer, thermal conductive metallic material is filled with the thermal conducting path.
- 9. the vertical-cavity surface-emitting optical device according to claim 3 based on flexible PCB, it is characterised in that the height Thermal conductivity metal supporting layer is Nian Jie with the flexible circuit board layer by epoxy resin, the smooth filter plate and the condenser lens The support chip be bonded in by epoxy resin in the cavity of the optics adaptive device.
- 10. the vertical-cavity surface-emitting optical device according to claim 1 based on flexible PCB, it is characterised in that described Vertical-cavity surface-emitting chip is bonded on the high thermal conductivity transition zone by heat conduction elargol, and the high thermal conductivity transition zone passes through Heat conduction elargol is bonded on the hard circuit board layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720402744.5U CN206848527U (en) | 2017-04-17 | 2017-04-17 | A kind of vertical-cavity surface-emitting optical device based on flexible PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720402744.5U CN206848527U (en) | 2017-04-17 | 2017-04-17 | A kind of vertical-cavity surface-emitting optical device based on flexible PCB |
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| CN206848527U true CN206848527U (en) | 2018-01-05 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106908916A (en) * | 2017-04-17 | 2017-06-30 | 武汉盛为芯科技股份有限公司 | A kind of vertical-cavity surface-emitting optical device based on flexible PCB |
| CN110456463A (en) * | 2018-05-07 | 2019-11-15 | 福州高意通讯有限公司 | A kind of adjustable receiver of miniaturization light |
| CN111142200A (en) * | 2019-12-09 | 2020-05-12 | 北京航天时代光电科技有限公司 | Gold wire bonding structure based on multichannel digital light receiving and transmitting module |
-
2017
- 2017-04-17 CN CN201720402744.5U patent/CN206848527U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106908916A (en) * | 2017-04-17 | 2017-06-30 | 武汉盛为芯科技股份有限公司 | A kind of vertical-cavity surface-emitting optical device based on flexible PCB |
| CN110456463A (en) * | 2018-05-07 | 2019-11-15 | 福州高意通讯有限公司 | A kind of adjustable receiver of miniaturization light |
| CN111142200A (en) * | 2019-12-09 | 2020-05-12 | 北京航天时代光电科技有限公司 | Gold wire bonding structure based on multichannel digital light receiving and transmitting module |
| CN111142200B (en) * | 2019-12-09 | 2021-10-01 | 北京航天时代光电科技有限公司 | Gold wire bonding structure based on multichannel digital light receiving and transmitting module |
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