CN102709266B - Surface mount packaging structure of semiconductor optical device and method for packaging surface mount packaging structure - Google Patents

Abstract

The invention relates to a semiconductor optical device surface mount packaging structure and a packaging method thereof. At least one semiconductor optical device and at least one transimpedance amplifier are arranged on a lead flexible board. The semiconductor optical device is connected to the transimpedance amplifier through a wire, and the two are bonded On the upper surface of the lead flexible board; the inner pins of the lead flexible board are connected to the transimpedance amplifier; the enclosure is erected on the upper surface of the lead flexible board, and forms a groove structure together with the lead flexible board, semiconductor optical devices, transimpedance amplifiers, The wires and the inner pins of the lead flexible board are located in the groove; the inside of the groove structure is filled with packaging materials, and the semiconductor optical device, transimpedance amplifier, wires and the inner pins of the lead flexible board are covered by the packaging material. A right-angle prism is installed in front of the light-emitting surface or the receiving surface of the semiconductor optical device to form a light path window, and the right-angle prism is fixed on the enclosure. Using surface mount technology and glue potting packaging technology, it has high integration, low mounting cost, and is conducive to expansion and integration as well as mass production.

Description

A semiconductor optical device surface mount packaging structure and packaging method thereof

technical field

The invention relates to a low-cost semiconductor optical device surface mount packaging structure and a packaging method using a lead flexible board as a carrier. the

Background technique

In today's information age, electronic products are flooding in all fields of society, and human's life style and production mode have undergone unprecedented changes. With the continuous evolution of electronic technology, more humanized and functional electronic products have emerged as the times require. In order to meet the miniaturization, low cost, high density and multifunctional requirements of electronic products, as far as chip packaging is concerned, multiple chips have appeared in one package, such as multi-chip (Mu1ti-chip-module) technology, stacking Chip (Stack Die) technology, etc. Therefore, how to realize a low-cost and high-density packaging structure has become an important research topic. the

Contents of the invention

The purpose of the present invention is to overcome the deficiencies in the prior art, and provide a novel low-cost semiconductor optical device surface mount package structure and a package method thereof. the

The purpose of the present invention is achieved through the following technical solutions:

A low-cost semiconductor optical device surface mount package structure, including a base plate, a lead flexible board, a semiconductor optical device and a transimpedance amplifier, wherein at least one semiconductor optical device and at least one transimpedance amplifier are arranged on the lead flexible board, and the semiconductor optical device passes through The wire is electrically connected to the transimpedance amplifier; it is characterized in that:

The semiconductor optical device and the transimpedance amplifier are bonded to the upper surface of the lead flexible board through conductive glue, and the lower surface of the lead flexible board is glued and fixed to the bottom plate;

The lead flexible board is provided with inner pins and outer pins, and the inner pins are electrically connected to the transimpedance amplifier through wires;

A surrounding board is erected on the upper surface of the lead flexible board, and the surrounding board and the lead flexible board together form a groove structure, wherein the surrounding board forms the side wall of the groove structure, and the lead flexible board between the surrounding boards forms the groove structure The bottom surface of the above-mentioned semiconductor optical device, transimpedance amplifier, wire and the inner pins of the lead flexible board are all located on the lead flexible board inside the groove structure;

The interior of the groove structure is filled with encapsulation material, and the inner pins of the semiconductor optical device, transimpedance amplifier, wire and lead flexible board are all covered by the encapsulation material;

A right-angle prism is installed in front of the light-emitting surface or the receiving surface of the semiconductor optical device to form a light path window, and the right-angle prism is fixed on the surrounding plate. the

Furthermore, in the above-mentioned low-cost semiconductor optical device surface mount packaging structure, the packaging material is silica gel. the

Further, the semiconductor optical device is a photosensitive device. the

Further, the semiconductor optical device is electrically connected to the transimpedance amplifier through wire bonding. the

Further, the said conductive glue is silver paste. the

Further, a semiconductor optical device or a plurality of arranged semiconductor optical devices are placed on the lead flexible board, a transimpedance amplifier or a plurality of arranged transimpedance amplifiers are placed on the lead flexible board, and the inner pins on the lead flexible board are connected to the The pads on the transimpedance amplifier are electrically connected. the

Further, the base plate is made of tungsten copper, and the wires are gold wires. the

The present invention also provides a packaging method for a low-cost semiconductor optical device surface mount packaging structure, which method includes the following processes:

(1) Connection of the package base: fix the lower surface of the lead flexible board to the base plate with an adhesive, and cure the adhesive;

(2) Surface mounting of optical devices: On the wire layout layer of the lead flexible board, combine the semiconductor optical device and the transimpedance amplifier through conductive adhesive bonding, and cure the conductive adhesive; then respectively attach the conductive optical device and the transimpedance amplifier Conduct wire bonding between the transimpedance amplifier and the inner pin of the lead flexible board to complete the wire connection between optical devices;

(3) Formation of packaging grooves: install a shroud on the lead flexible board of the base plate, so that the inner pins of the semiconductor optical device, transimpedance amplifier, wire and lead flexible board are all located within the shroud, Thus, a groove structure for packaging is formed, that is, the surrounding plates form the side walls of the groove structure, and the lead flexible board between the surrounding plates forms the bottom surface of the groove structure;

(4) Installation of the right-angle prism: the right-angle prism is fixed on the enclosure, so that the right-angle prism is positioned in front of the light-emitting surface or the receiving surface of the semiconductor optical device, forming a window for the input or output of light;

(5) Glue encapsulation: pour the encapsulation material between the enclosures, so that the encapsulation material evenly fills all the space of the optical path, and completely covers the above-mentioned semiconductor optical device, the wires on the surface of the semiconductor optical device, the transimpedance amplifier and Lead the inner pins of the flexible board, and then cure the encapsulation material. the

Further, the wires used in the above process are gold wires, the adhesive used is silver paste, the conductive adhesive is silver paste, and the packaging material used is silica gel. the

The outstanding substantive features and remarkable progress of the technical solution of the present invention are mainly reflected in:

The present invention utilizes surface mount technology and wire bonding technology, uses leaded soft board as carrier, and wire connects semiconductor optical device and transimpedance amplifier, which is beneficial to the transmission of high-frequency signals, and all operations are only performed on one surface of each structure. Stack operation, which can realize the arrangement and combination operation of multiple semiconductor devices, is simple and easy, and reduces the space requirements of packaged chips, reduces the volume, and has low requirements for packaging machines and low mounting costs, which is very conducive to expansion and integration and mass production. the

Description of drawings

Below in conjunction with accompanying drawing, technical solution of the present invention will be further described:

Fig. 1 is a structural schematic diagram of one side light input of the packaging structure of the present invention;

FIG. 2 is a schematic top view of the light input from one side of the packaging structure of the present invention. the

Detailed ways

As shown in Figure 1 and Figure 2, a low-cost semiconductor optical device surface mount package structure, including a base plate (not shown), lead flexible board 1, semiconductor optical device 5 and transimpedance amplifier (TIA) 4, lead flexible At least one semiconductor optical device 5 and at least one transimpedance amplifier 4 are arranged on the board 1. The semiconductor optical device 5 is a photosensitive component for receiving optical signals. There is also an electrical connection point on the upper surface for connecting with the transimpedance amplifier. The electrical connection of the semiconductor optical device 5 is electrically connected to the transimpedance amplifier 4 through a wire 6, and the wire is a gold wire; the lower surface of the semiconductor optical device 5 and the transimpedance amplifier 4 is bonded to the upper surface of the lead flexible board 1 by conductive adhesive The conductive adhesive is silver paste, and the lower surface of the lead flexible board 1 is bonded to the bottom plate. The material of the bottom plate is tungsten copper, which has a good thermal conductivity and can well diffuse the heat generated by the optical device to the outside. , and the thermal expansion rate is close to the thermal expansion rate of the optical device; the lead flexible board 1 is provided with an inner pin 2 and an outer pin 3, and the inner pin 2 is electrically connected to the transimpedance amplifier 4 through a wire, and the wire is a gold wire; the lead wire The upper surface of the flexible board 1 is erected with a surrounding board 7, and the surrounding board 7 and the lead flexible board 1 together form a groove structure, wherein the surrounding board 7 forms the side wall of the groove structure, and the lead flexible board 1 between the surrounding boards 7 forms a groove structure. The bottom surface of the groove structure, the inner pins of the above-mentioned semiconductor optical device, transimpedance amplifier, wire and lead flexible board are all located on the lead flexible board inside the groove structure; the rectangular prism 9 is fixed on the enclosure 7, It is located in front of the light emitting surface or the receiving surface of the semiconductor optical device 5, thereby forming a window of the optical path, and the optical signal can be transmitted from the outside; the inside of the groove structure is filled with packaging materials, and the semiconductor optical device 5, transimpedance The amplifier 4, the wires and the inner pins 2 of the lead flexible board are all covered by the packaging material 8, the packaging material 8 is silica gel, which has high light transmittance, high reliability and low stress, and matches the refractive index of the right-angle prism, so as to Reduce the reflection of light on different media surfaces and reduce the beam divergence angle. The material is liquid and curable at room temperature. the

Wherein, the semiconductor optical device 5 is electrically connected to the transimpedance amplifier 4 through wire bonding. A semiconductor optical device or a plurality of arranged semiconductor optical devices are placed on the lead flexible board 1, and a transimpedance amplifier or a plurality of arranged transimpedance amplifiers are placed on the lead flexible board, and the internal pins on the lead flexible board and the transimpedance amplifier The pads on the board are electrically connected. the

A packaging method for a low-cost semiconductor optical device surface mount packaging structure mainly includes the following processes:

(1) Connection of the package base: fix the lower surface of the lead flexible board 1 on the base plate through an adhesive, and cure the adhesive, which is silver paste;

(2) Surface mounting of optical devices: on the wire layout layer of the lead flexible board 1, combine the semiconductor optical device 5 and the transimpedance amplifier 4 through conductive adhesive bonding, and cure the conductive adhesive, which is silver paste; Wire bonding is performed to electrically connect the semiconductor optical device 5 and the transimpedance amplifier 4 respectively, and the wire is a gold wire; wire bonding is used to electrically connect the transimpedance amplifier 4 to the inner pin 2 of the lead flexible board , the wire is also a gold wire;

(3) Forming of the package groove: install the enclosure 7 above the lead flexible board 1, so that the semiconductor optical device 5, the transimpedance amplifier 4, the wires and the inner pins 2 of the lead flexible board are all located in the enclosure 7 Inside the board, a groove structure for packaging is thus formed, that is, the surrounding board 7 forms the side wall of the groove structure, and the lead flexible board 1 between the surrounding boards 7 forms the bottom surface of the groove structure;

(4) Installation of the right-angle prism: the right-angle prism 9 is fixed on the said enclosure 7, so that the right-angle prism 9 is positioned at the front of the light-emitting surface or the receiving surface of the semiconductor optical device 5, forming a window for the input or output of light;

(5) Glue encapsulation: pour encapsulation material 8 between the enclosures 7, so that encapsulation material 8 evenly fills all spaces of the optical path, and completely covers the above-mentioned semiconductor optical device 5, the wires on the surface of the semiconductor optical device, The transimpedance amplifier 4 and the inner pin 2 of the lead flexible board are then cured, and the packaging material is silica gel. the

In summary, the present invention utilizes surface mount technology and wire bonding technology, uses lead flexible board as the carrier, and wire connects semiconductor optical devices and transimpedance amplifiers, which is conducive to the transmission of high-frequency signals, and all operations are only performed in each structure. Stacking operations on one surface of the semiconductor device can realize the arrangement and combination operation of multiple semiconductor devices, which is simple and easy, and reduces the space requirements of packaged chips, reduces the volume, and has low requirements for packaging machines and low mounting costs. , very conducive to expansion and integration as well as mass production. the

It should be understood that: the above is only a preferred embodiment of the present invention, for those of ordinary skill in the art, without departing from the principle of the present invention, some improvements and modifications can also be made, these improvements and Retouching should also be regarded as the protection scope of the present invention. the

Claims (9)

1. an optical semiconductor surface mount package structure, comprise base plate, lead-in wire soft board, optical semiconductor and trans-impedance amplifier, wherein lead-in wire soft board arranges at least one optical semiconductor and at least one trans-impedance amplifier, optical semiconductor is electrically connected by wire and trans-impedance amplifier; It is characterized in that:

Described optical semiconductor and trans-impedance amplifier are bonded in the upper surface of lead-in wire soft board by conducting resinl, and lower surface and the base plate of lead-in wire soft board are adhesively fixed;

Described lead-in wire soft board is provided with interior pin and outer pin, and interior pin is electrically connected by wire and trans-impedance amplifier;

Described lead-in wire soft board upper surface erects coaming plate, this coaming plate forms a groove structure jointly with lead-in wire soft board, wherein coaming plate forms the sidewall of this groove structure, lead-in wire soft board between coaming plate forms the bottom surface of this groove structure, and the interior pin of above-mentioned optical semiconductor, trans-impedance amplifier, wire and lead-in wire soft board is all positioned on the lead-in wire soft board of this groove structure inside;

Described groove structure inside is filled with encapsulating material, and the interior pin all packed material institute of described optical semiconductor, trans-impedance amplifier, wire and lead-in wire soft board is coated;

Install right-angle prism in the light-emitting area of optical semiconductor or the front of receiving surface and form light path window, right-angle prism is fixed on coaming plate.

2. optical semiconductor surface mount package structure according to claim 1, is characterized in that: described encapsulating material is silica gel.

3. optical semiconductor surface mount package structure according to claim 1, is characterized in that: described optical semiconductor is sensitive component.

4. optical semiconductor surface mount package structure according to claim 1, is characterized in that: described optical semiconductor is electrically connected by wire bonding mode and trans-impedance amplifier.

5. optical semiconductor surface mount package structure according to claim 1, is characterized in that: conducting resinl is silver slurry.

6. optical semiconductor surface mount package structure according to claim 1, is characterized in that:

Described lead-in wire soft board is placed the optical semiconductor of an optical semiconductor or multiple arrangement, lead-in wire soft board is placed the trans-impedance amplifier of a trans-impedance amplifier or multiple arrangement, the interior pin on lead-in wire soft board and the pad on trans-impedance amplifier are electrically connected.

7. optical semiconductor surface mount package structure according to claim 1, is characterized in that: the material of described base plate is tungsten copper, and described wire is gold thread.

8. the method for packing of any one optical semiconductor surface mount package structure in claim 1-7, the method comprises following technique:

(1) connection of encapsulation base: the lower surface of lead-in wire soft board is fixed on base plate by adhesive, and cure adhesive;

(2) surface mount of optical device: on conductor layouts's layer of lead-in wire soft board, by conducting resinl bonding mode in conjunction with optical semiconductor and trans-impedance amplifier, and Curing conductive adhesive; Carry out wire bonding by between conductor optical device and trans-impedance amplifier, in trans-impedance amplifier and lead-in wire soft board between pin respectively again, connect with the wire completed between optical device;

(3) formation of groove is encapsulated: on described lead-in wire soft board, coaming plate is installed, the interior pin of described optical semiconductor, trans-impedance amplifier, wire and lead-in wire soft board is made all to be positioned within this coaming plate, form a kind of encapsulation groove structure thus, namely coaming plate forms the sidewall of this groove structure, and the lead-in wire soft board between coaming plate forms the bottom surface of this groove structure;

(4) installation of right-angle prism: be fixed on described coaming plate by right-angle prism, makes right-angle prism be positioned at the light-emitting area of optical semiconductor or the front of receiving surface, forms window, for input or the output of light;

(5) encapsulating encapsulation: pour into encapsulating material between described coaming plate, encapsulating material is allowed evenly to fill up having living space of light path, and complete packet is covered with the interior pin stating optical semiconductor, the wire in face, optical semiconductor place, trans-impedance amplifier and lead-in wire soft board, then solidifies this encapsulating material.

9. the method for packing of optical semiconductor surface mount package structure according to claim 8, is characterized in that: described wire is gold thread, and described adhesive is silver slurry, and described conducting resinl is silver slurry, and described encapsulating material is silica gel.