CN206179845U - Composite films lead wire type metal dewar - Google Patents
Composite films lead wire type metal dewar Download PDFInfo
- Publication number
- CN206179845U CN206179845U CN201621198168.9U CN201621198168U CN206179845U CN 206179845 U CN206179845 U CN 206179845U CN 201621198168 U CN201621198168 U CN 201621198168U CN 206179845 U CN206179845 U CN 206179845U
- Authority
- CN
- China
- Prior art keywords
- inner tube
- thin film
- metal
- type metal
- laminated film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The utility model relates to a composite films lead wire type metal dewar, the shell of this metal dewar and inner tube are hollow structure, outside of tubes portion including the outer shell, vacuum production intermediate layer between the two, the surface of inner tube has arranged that insulating glass metal combined type film goes between, and the top of inner tube sets up the infrared detector chip, the film lead wire is realized the electricity with the infrared detector chip and is connected. The utility model discloses a metal dewar has heat transfer efficiency height, the cold characteristics such as little, vibration resistance height of decreasing, satisfy draw that line number is many, heat leakage is little, requirement such as miniaturation, gas tightness are good, be applicable to the encapsulation of multielement infrared detector chip.
Description
Technical field
This utility model belongs to Infrared Detectorss encapsulation technology field, more particularly to a kind of laminated film lead type metal Du
Watt, it is adaptable to the Dewar encapsulation of infrared detector chip.
Background technology
Infrared Detectorss are one of primary clusterings of infrared system, and it directly affects the overall performance of system.Micro metal
Dewar is one of important composition part of Infrared Detectorss, is mainly used in encapsulating infrared detector chip, is Infrared Detectorss core
Piece provides reliable and stable vacuum, low-temperature working environment.The effect of Dewar lead is the photosensitive first opto-electronic conversion letter of output detector
Number, it is distributed between Dewar shell and inner tube, and the number of lead is relevant with the quantity of photosensitive unit.Dewar lead is except directly carrying on a shoulder pole
Outside negative signal transmission, Dewar leakage heat is contributed also in the way of solid conductive heat.The form of Dewar lead determines that lead exists
Assembling mode in shell structure, its assembling quality will affect the vacuum-tightness of Dewar；Lead form also defines Dewar
External mounting relation.Therefore the lead of Dewar is the central issue that whole Dewar manufactures and designs.For encapsulating polynary infrared acquisition
It is many that the minitype Dewar of device should meet first number (contact conductor number), hot little, the requirement of miniaturization of leakage.
Utility model content
The purpose of this utility model is to provide a kind of laminated film lead type metal Dewar.
For achieving the above object, the technical solution adopted in the utility model is：
A kind of laminated film lead type metal Dewar, the shell 1 and inner tube 3 of the metal Dewar are hollow structure, described
Shell 1 is enclosed within outside inner tube 3, and vacuum interlayer is formed between the two；Insulating glass/metal is provided with the outer surface of said inner tube 3
Composite film lead 4, at the top of said inner tube 3 infrared detector chip 2, the thin film lead 4 and infrared acquisition are arranged
Device chip 2 realizes electrical connection.
Preferably, the thin film lead 4 is made up of insulating glass internal layer and metal lead wire thin film exterior layer.
Preferably, said inner tube 3, insulating glass internal layer and metal lead wire thin film exterior layer are structure as a whole.
Preferably, the metal lead wire thin film exterior layer is metal lead wire figure of the equal distribution in the outer surface of inner tube 3.
Preferably, the metal lead wire thin film exterior layer is endless metal cord array of the equal distribution in the outer surface of inner tube 3.
Preferably, the hollow structure inside said inner tube 3, is divided into from the bottom to top extra heavy pipe footpath section 31, the and of gradual change caliber section 32
Slim pipe diameter section 33.
Preferably, the thin film lead 4 is connected one to one with infrared detector chip 2 by tinsel 7, realizes being electrically connected
Connect.
Preferably, the bottom of said inner tube 3 carries metab, and insulation ceramic ring 5, institute are connected with the metab
The bottom for stating shell 1 is connected in insulation ceramic ring 5.
Preferably, the top of the shell 1 is provided with sealed window 6.
The beneficial effects of the utility model are：
1. the contact conductor of metal Dewar is insulating glass/metal composite formula thin film lead, and thin film lead is prepared in inner tube
Outer surface, and be integrated with inner tube, be conducive to the shock resistance of detector.
2. laminated film lead outer layer is that impedance is little, the metallic film that low grade fever is led, and conductive heat leakage is little, it is possible to decrease metal Dewar
Heat load, so as to improve detector low-temperature working performance.
3. thin film lead is capable of achieving in inner tube outer surface high-density array using three-dimensional laser lithographic technique, it is many so as to realize
Element chip is installed.
4. metal Dewar of the present utility model has heat transfer efficiency high, cold the features such as damage little, vibration resistance is high, meets pin count
Many, leakage heat is little, miniaturization, the air-tightness requirement such as good, it is adaptable to the encapsulation of multielement infrared detector chip.
Description of the drawings
Fig. 1 is a kind of schematic diagram of laminated film lead type metal Dewar described in embodiment.
Label declaration：1- shells, 2- infrared detector chips, 3- inner tubes, 4- thin film leads, 5- insulation ceramic rings, 6- sealings
Window, 7- tinsels, 31- extra heavy pipes footpath section, 32- gradual change caliber sections, 33- slim pipe diameter sections.
Specific embodiment
This utility model is described further with reference to the accompanying drawings and detailed description.It is emphasized that following
Illustrate what is be merely exemplary, rather than in order to limit scope of the present utility model and its application.
A kind of laminated film lead type metal Dewar of this utility model offer is provided, including it is shell 1, infrared
Detector chip 2, inner tube 3, thin film lead 4 and insulation ceramic ring 5.
Said inner tube 3 is the rotation body structure with base, its internal hollow structure, and extra heavy pipe footpath section is divided into from the bottom to top
31st, gradual change caliber section 32 and slim pipe diameter section 33；Inner tube 3 more than base, its external diameter is consistent change with internal diameter, and on top
End closure.
Thin film lead 4 is disposed with the outer surface of inner tube 3.The thin film lead 4 is thin using insulating glass/metal composite formula
Film pin configuration, is mixed into glaze slip by glass dust and mill addition first, and the outer surface for being coated in inner tube 3 is prepared in insulating glass
Layer, thickness is 50 μm；Again the outer surface in insulating glass internal layer prepares metallic film, and present embodiment adopts gold thin film, thickness
For 0.5 μm, then etched by three-dimensional laser and gold thin film is etched into into equal distribution in the annular lead wire row of the outer surface of inner tube 3
Battle array, obtains metal lead wire thin film exterior layer.The infrared detector chip 2 being pre-assembled is arranged on into the top middle portion of inner tube 3, and
Weldering is corresponded by spun gold and thin film lead 4 to connect, realize electrical connection, draw chip signal.
Insulation ceramic ring 5 is arranged on the metab 8 for being furnished with thin film lead 4, is connected into inner tube 3 by hot sealing
Integrally.
The shell 1 is cylindrical shape, and is provided with sealed window 6 on top.Shell 1 is enclosed within into the outside of inner tube 3, its bottom with
Insulation ceramic ring 5 makes to form vacuum interlayer between shell 1 and inner tube 3 by being sintered into one so as to realize sealing.
Claims (9)
1. a kind of laminated film lead type metal Dewar, it is characterised in that the shell (1) and inner tube (3) of the metal Dewar is
Hollow structure, the shell (1) is enclosed within inner tube (3) outside, and vacuum interlayer is formed between the two；In the appearance of said inner tube (3)
Face is provided with insulating glass/metal composite formula thin film lead (4), and at the top of said inner tube (3) infrared detector chip is arranged
(2), the thin film lead (4) is realized electrically connecting with infrared detector chip (2).
2. a kind of laminated film lead type metal Dewar according to claim 1, it is characterised in that the thin film lead (4)
It is made up of insulating glass internal layer and metal lead wire thin film exterior layer.
3. a kind of laminated film lead type metal Dewar according to claim 2, it is characterised in that said inner tube (3), insulation
Glass inner layer and metal lead wire thin film exterior layer are structure as a whole.
4. a kind of laminated film lead type metal Dewar according to Claims 2 or 3, it is characterised in that the metal lead wire
Thin film exterior layer is metal lead wire figure of the equal distribution in inner tube (3) outer surface.
5. a kind of laminated film lead type metal Dewar according to claim 4, it is characterised in that the metal lead wire thin film
Outer layer is endless metal cord array of the equal distribution in inner tube (3) outer surface.
6. a kind of laminated film lead type metal Dewar according to claim 1, it is characterised in that said inner tube (3) is internal
Hollow structure, extra heavy pipe footpath section (31), gradual change caliber section (32) and slim pipe diameter section (33) are divided into from the bottom to top.
7. a kind of laminated film lead type metal Dewar according to claim 1, it is characterised in that the thin film lead (4)
Connected one to one by tinsel (7) with infrared detector chip (2), realize electrical connection.
8. a kind of laminated film lead type metal Dewar according to claim 1, it is characterised in that the bottom of said inner tube (3)
Portion carries metab, and insulation ceramic ring (5) is connected with the metab, and the bottom of the shell (1) is connected to insulation
In ceramic ring (5).
9. a kind of laminated film lead type metal Dewar according to claim 1, it is characterised in that the top of the shell (1)
Portion is provided with sealed window (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621198168.9U CN206179845U (en) | 2016-11-04 | 2016-11-04 | Composite films lead wire type metal dewar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621198168.9U CN206179845U (en) | 2016-11-04 | 2016-11-04 | Composite films lead wire type metal dewar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206179845U true CN206179845U (en) | 2017-05-17 |
Family
ID=58681485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621198168.9U Active CN206179845U (en) | 2016-11-04 | 2016-11-04 | Composite films lead wire type metal dewar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206179845U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107340061A (en) * | 2017-05-31 | 2017-11-10 | 中国电子科技集团公司第十研究所 | A kind of infrared detector ice chest |
| CN110779628A (en) * | 2019-09-23 | 2020-02-11 | 北京空间机电研究所 | Large-area-array infrared focal plane Dewar cold finger supporting structure with high heat resistance and high rigidity |
| CN111928954A (en) * | 2020-07-27 | 2020-11-13 | 青岛凯瑞电子有限公司 | Miniature dewar of infrared detector |
| CN114353953A (en) * | 2022-01-13 | 2022-04-15 | 浙江珏芯微电子有限公司 | Dewar cold head for rapid refrigeration and infrared detector Dewar assembly |
-
2016
- 2016-11-04 CN CN201621198168.9U patent/CN206179845U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107340061A (en) * | 2017-05-31 | 2017-11-10 | 中国电子科技集团公司第十研究所 | A kind of infrared detector ice chest |
| CN110779628A (en) * | 2019-09-23 | 2020-02-11 | 北京空间机电研究所 | Large-area-array infrared focal plane Dewar cold finger supporting structure with high heat resistance and high rigidity |
| CN110779628B (en) * | 2019-09-23 | 2021-08-10 | 北京空间机电研究所 | Large-area-array infrared focal plane Dewar cold finger supporting structure with high heat resistance and high rigidity |
| CN111928954A (en) * | 2020-07-27 | 2020-11-13 | 青岛凯瑞电子有限公司 | Miniature dewar of infrared detector |
| CN114353953A (en) * | 2022-01-13 | 2022-04-15 | 浙江珏芯微电子有限公司 | Dewar cold head for rapid refrigeration and infrared detector Dewar assembly |
| CN114353953B (en) * | 2022-01-13 | 2024-04-12 | 浙江珏芯微电子有限公司 | Dewar cold head for rapid refrigeration and infrared detector Dewar assembly |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206179845U (en) | Composite films lead wire type metal dewar | |
| CN202720070U (en) | High-stability and rapid NTC temperature sensor | |
| CN201549505U (en) | Glass passivation packaging transient voltage suppression diode structure | |
| CN203148061U (en) | Flat plate collector with vacuum interlayer | |
| CN201772968U (en) | Sealing base of pressure sensor | |
| CN102931319B (en) | A kind of manufacture method of high thermally conductive LED base plate for packaging | |
| CN206060725U (en) | High current door drives the hermetically sealed integrated-circuit photoelectric bonder of output | |
| CN201838415U (en) | Coaxial duplex potentiometer | |
| CN206673936U (en) | A kind of epoxy packages high pressure photoelectrical coupler | |
| CN109521047B (en) | Transient hot wire method measuring device for two-phase flow heat conductivity coefficient | |
| CN204885820U (en) | Ceramic package butterfly pipe | |
| CN208720882U (en) | A kind of heat pipe of annular anti-gravity | |
| CN206490051U (en) | A kind of super large-scale ceramic package structure | |
| CN206222989U (en) | A kind of multiple branch circuit heat pipe based on double sintering shaping | |
| CN207925500U (en) | A kind of photodetector | |
| CN103236492B (en) | Be exclusively used in LED encapsulation structure and the method for packing of liquid illumination/decoration | |
| CN214043361U (en) | Transformer heat radiation structure | |
| CN206433207U (en) | A kind of novel electric heating pipe fitting | |
| CN201715906U (en) | Novel plate-type heat pipe | |
| CN204392742U (en) | There is the radiator of the nanometer heat-radiation coating bed of material | |
| CN218916650U (en) | Hydrogen explosion isolation pressure sensor | |
| CN205079468U (en) | Solar heat collector | |
| CN207517724U (en) | High heat conduction stamp-mounting-paper diode | |
| CN205488129U (en) | Anti -interference anticorrosive thick film hybrid integrated circuit | |
| CN207303078U (en) | Long-life diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190930 Address after: 101407 Beijing city Huairou District Yanqi Economic Development Zone Branch Hing Street No. 11 Patentee after: Research Institute of engineering and Technology Co., Ltd. Address before: 100088 Beijing city Xicheng District Xinjiekou Avenue No. 2 Patentee before: General Research Institute for Nonferrous Metals |
|
| TR01 | Transfer of patent right |