CN207517724U - High heat conduction stamp-mounting-paper diode - Google Patents
High heat conduction stamp-mounting-paper diode Download PDFInfo
- Publication number
- CN207517724U CN207517724U CN201721194645.9U CN201721194645U CN207517724U CN 207517724 U CN207517724 U CN 207517724U CN 201721194645 U CN201721194645 U CN 201721194645U CN 207517724 U CN207517724 U CN 207517724U
- Authority
- CN
- China
- Prior art keywords
- heat
- encapsulating structure
- radiating groove
- chip
- conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 239000000463 material Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000009413 insulation Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 235000006508 Nelumbo nucifera Nutrition 0.000 description 1
- 240000002853 Nelumbo nucifera Species 0.000 description 1
- 235000006510 Nelumbo pentapetala Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model is related to diode field, more particularly to high heat conduction stamp-mounting-paper diode, including chip, the pin that is connected to chip both ends, the encapsulating structure being packaged in outside chip and pin, the pin at the chip both ends is stretched out outside encapsulating structure；The radiating groove of several connection pins is offered inside the encapsulating structure, encapsulating structure surface corresponds to radiating groove and forms several heat emission holes, and the radiating groove is connected away from one end of pin with heat emission hole；The chip exterior is equipped with thermally conductive sheet, and metal heat-conducting item, metal heat-conducting one end connection thermally conductive sheet are equipped in encapsulating structure, and the other end reaches encapsulating structure outer surface；The encapsulating structure includes heat-conducting layer, insulating layer and heat dissipating layer successively from inside to outside, and radiating groove and metal heat-conducting item sequentially pass through heat-conducting layer, insulating layer and heat dissipating layer.The utility model is simple in structure, production cost is low, good heat dissipation effect, service life are long.
Description
Technical field
The utility model is related to diode field, more particularly to high heat conduction stamp-mounting-paper diode.
Background technology
Stamp-mounting-paper diode is also known as crystal diode, abbreviation diode (diode), in addition, the also vacuum electronic two of early stage
Pole pipe；It is a kind of electronic device with unidirectional conduction electric current.There are one two leads of chip inside semiconductor diode
Terminal, this electronic device have the transducing of unidirectional current according to the direction of applied voltage.In general, surface mounting crystal two
Pole pipe is one and the p-n junction interface formed is sintered by p-type semiconductor and n-type semiconductor.Space electricity is formed in the both sides at its interface
Lotus layer, forms built-in field.When applied voltage is equal to zero, since the concentration difference of p-n junction both sides carrier causes dissufion current
It is equal with the drift current as caused by built-in field and in electric equilibrium state, this is also the diode characteristic under normality.
The stamp-mounting-paper diode of the prior art, due to the limitation of own power and volume, calorific value is big, but heat dissipation effect
Difference is easily damaged during use, and service life is short, breaks down so as to cause rectifying output circuit.
In order to extend the service life of diode, heat dissipation design need to be often added, existing diode is often at lead outlet end
Cooling fin is drawn, fin ends are inserted in epoxy resin, and such heat dissipation design heat dissipation effect is general, and is unfavorable for diode and exists
Installation on panel.Or increase the heat dissipation of additional radiator realization diode for diode, but this will cause diode whole
Body is complicated, production cost is high.
Utility model content
To solve the above problems, the utility model provide it is a kind of it is simple in structure, production cost is low, good heat dissipation effect, use
The high heat conduction stamp-mounting-paper diode of long lifespan.
Technical solution is used by the utility model：High heat conduction stamp-mounting-paper diode including chip, is connected to chip both ends
Pin, the encapsulating structure that is packaged in outside chip and pin, the pin at the chip both ends stretched out outside encapsulating structure；Institute
The radiating groove that several connection pins are offered inside encapsulating structure is stated, encapsulating structure surface corresponds to radiating groove and forms several
Heat emission hole, the radiating groove are connected away from one end of pin with heat emission hole；The chip exterior is equipped with thermally conductive sheet, encapsulation knot
Metal heat-conducting item, metal heat-conducting one end connection thermally conductive sheet are equipped in structure, the other end reaches encapsulating structure outer surface；The encapsulation
Structure includes heat-conducting layer, insulating layer and heat dissipating layer successively from inside to outside, and radiating groove and metal heat-conducting item sequentially pass through heat-conducting layer, absolutely
Edge layer and heat dissipating layer.
To being further improved as the radiating groove is in wavy for above-mentioned technical proposal.
To being further improved as several heat emission holes uniformly divide in a ring along the axial direction of encapsulating structure for above-mentioned technical proposal
Cloth.
To being further improved as the diameter of the heat emission hole is more than the diameter of radiating groove for above-mentioned technical proposal.
To being further improved to be provided with Heat Conduction Material in the radiating groove for above-mentioned technical proposal.
The beneficial effects of the utility model are：
1st, on the one hand, the radiating groove of the heat emission hole equipped with one end connection pin one end connection encapsulating structure surface, pin work
The heat for making to generate in the process is transmitted to the heat emission hole on encapsulating structure surface by radiating groove, then be transmitted to the external world by heat emission hole
In environment, prevent diode internal heat from assembling；Second aspect, the heat of chip are transferred to through thermally conductive sheet inside encapsulating structure
Metal heat-conducting item, then be transferred to outside encapsulating structure, diode internal heat is further prevented to assemble；The third aspect, encapsulation knot
Structure includes heat-conducting layer, insulating layer and heat dissipating layer successively from inside to outside, and radiating groove and metal heat-conducting item sequentially pass through heat-conducting layer, insulation
Layer and heat dissipating layer, encapsulating structure not only has the function of insulation protection, also has the function of heat conduction and heat radiation, further improves this practicality
Novel radiating efficiency.Fourth aspect, the utility model are not required to set additional radiator structure, simple in structure and do not increase by two poles
The heat generated in the production cost of pipe, chip and the pin course of work can be directly conducted to outside encapsulating structure, and be equipped with
Multiple heat conduction and heat radiation mechanism, good heat dissipation effect, be conducive to extend diode service life.
2nd, radiating groove is in wavy, increases heat dissipation area, further improves the radiating efficiency of the utility model.
3rd, several heat emission holes are uniformly distributed in a ring along the axial direction of encapsulating structure so that the heat inside diode can be
Even to shed, fluctuation of service caused by preventing diode local temperature excessively high is further conducive to improve diode service life
And job stability.
4th, the diameter of heat emission hole is more than the diameter of radiating groove, it is ensured that flows through the heat energy Quick diffusing of radiating groove to extraneous ring
Border further improves the radiating efficiency of diode.
5th, Heat Conduction Material is provided in radiating groove, improves heat transfer efficiency, accelerated heat transfer, further improve two poles
The radiating efficiency of pipe.
Description of the drawings
Fig. 1 is the stereogram of the utility model；
Fig. 2 is the structure diagram of the utility model.
Specific embodiment
The utility model is further described below in conjunction with attached drawing.
As shown in Fig. 1~Fig. 2, the respectively stereogram and structure diagram of the utility model.
High heat conduction stamp-mounting-paper diode 100 including chip 110, the pin 120 that is connected to 110 both ends of chip, is packaged in chip
110 and pin 120 outside encapsulating structure 130, the pin 120 at 110 both ends of chip stretched out outside encapsulating structure 130；
The radiating groove 131 of several connection pins 120 is offered inside the encapsulating structure 130,130 surface of encapsulating structure corresponds to heat dissipation
Slot 131 forms several heat emission holes 132, and the radiating groove 131 is connected away from one end of pin 120 with heat emission hole 132；Institute
110 external rings of chip are stated equipped with thermally conductive sheet 140, encapsulating structure 130 is interior to be equipped with metal heat-conducting item 133,133 one end of metal heat-conducting item
Thermally conductive sheet 140 is connected, the other end reaches 130 outer surface of encapsulating structure；The encapsulating structure 130 includes heat conduction successively from inside to outside
Layer 130a, insulating layer 130b and heat dissipating layer 130c, radiating groove 131 and metal heat-conducting item 133 sequentially pass through heat-conducting layer 130a, insulation
Layer 130b and heat dissipating layer 130c.
Radiating groove 131 is in wavy, increases heat dissipation area, further improves the radiating efficiency of the utility model.
Several heat emission holes 132 are uniformly distributed in a ring along the axial direction of encapsulating structure 130 so that inside diode 100
Heat can uniformly shed, fluctuation of service caused by preventing 100 local temperature of diode excessively high, further be conducive to improve two poles
100 service life of pipe and job stability.
The diameter of heat emission hole 132 is more than the diameter of radiating groove 131, it is ensured that flows through the heat energy Quick diffusing of radiating groove 131
To external environment, the radiating efficiency of diode 100 is further improved.
Heat Conduction Material is provided in radiating groove 131, improves heat transfer efficiency, accelerates heat transfer, further improves two
The radiating efficiency of pole pipe 100.
On the one hand, the radiating groove of the heat emission hole 132 equipped with one end 120 one end of connection pin 130 surface of connection encapsulating structure
131, the heat generated in 120 course of work of pin is transmitted to the heat emission hole 132 on 130 surface of encapsulating structure by radiating groove 131,
It is transmitted in external environment by heat emission hole 132 again, prevents 100 internal heat of diode from assembling；Second aspect, chip 110
Heat is transferred to the metal heat-conducting item 133 inside encapsulating structure 130 through thermally conductive sheet 140, then is transferred to outside encapsulating structure 130,
100 internal heat of diode is further prevented to assemble；The third aspect, encapsulating structure 130 include heat-conducting layer successively from inside to outside
130a, insulating layer 130b and heat dissipating layer 130c, radiating groove 131 and metal heat-conducting item 133 sequentially pass through heat-conducting layer 130a, insulating layer
130b and heat dissipating layer 130c, encapsulating structure 130 not only have the function of insulation protection, also have the function of heat conduction and heat radiation, further carry
The high radiating efficiency of the utility model.Fourth aspect, the utility model are not required to set additional radiator structure, it is simple in structure and
The production cost of diode 100 is not increased, the heat generated in 120 course of work of chip 110 and pin can be directly conducted to
Outside encapsulating structure 130, and equipped with multiple heat conduction and heat radiation mechanism, good heat dissipation effect, be conducive to extension diode 100 uses the longevity
Life.
The operation principle of the utility model is：
In 100 course of work of diode, electric current flows through chip 110 and pin 120 and the heat of generation, on the one hand, can be straight
The heat-conducting layer 130a, insulating layer 130b and heat dissipating layer 130c for connecing encapsulated structure 130 are transferred to outside, second aspect, through heat dissipation
Heat Conduction Material in slot 131 is transferred to heat emission hole 132, then is transferred to outside, the third aspect, through thermally conductive sheet 140 and metal heat-conducting
Item 133 is transferred to outside, and the heat transfer form inside diode 100 is more, can be in time by heat transfer by heat conduction and heat dissipation
To outside, good heat dissipation effect, service life is long.
Embodiment described above only expresses the several embodiments of the utility model, and description is more specific and detailed,
But it should not be interpreted as limiting the scope of the present invention.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (5)
1. high heat conduction stamp-mounting-paper diode, it is characterised in that：Including chip, the pin that is connected to chip both ends, be packaged in chip and
Encapsulating structure outside pin, the pin at the chip both ends are stretched out outside encapsulating structure；It is opened up inside the encapsulating structure
There is the radiating groove of several connection pins, encapsulating structure surface corresponds to radiating groove and forms several heat emission holes, the radiating groove
It is connected away from one end of pin with heat emission hole；The chip exterior is equipped with thermally conductive sheet, and metal heat-conducting is equipped in encapsulating structure
Item, metal heat-conducting one end connection thermally conductive sheet, the other end reach encapsulating structure outer surface；The encapsulating structure is from inside to outside successively
Including heat-conducting layer, insulating layer and heat dissipating layer, radiating groove and metal heat-conducting item sequentially pass through heat-conducting layer, insulating layer and heat dissipating layer.
2. high heat conduction stamp-mounting-paper diode according to claim 1, it is characterised in that：The radiating groove is in wavy.
3. high heat conduction stamp-mounting-paper diode according to claim 2, it is characterised in that：Several heat emission holes are along encapsulating structure
It is axial to be uniformly distributed in a ring.
4. high heat conduction stamp-mounting-paper diode according to claim 3, it is characterised in that：The diameter of the heat emission hole is more than heat dissipation
The diameter of slot.
5. high heat conduction stamp-mounting-paper diode according to claim 4, it is characterised in that：Heat conduction material is provided in the radiating groove
Material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721194645.9U CN207517724U (en) | 2017-09-18 | 2017-09-18 | High heat conduction stamp-mounting-paper diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721194645.9U CN207517724U (en) | 2017-09-18 | 2017-09-18 | High heat conduction stamp-mounting-paper diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207517724U true CN207517724U (en) | 2018-06-19 |
Family
ID=62533210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721194645.9U Expired - Fee Related CN207517724U (en) | 2017-09-18 | 2017-09-18 | High heat conduction stamp-mounting-paper diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207517724U (en) |
-
2017
- 2017-09-18 CN CN201721194645.9U patent/CN207517724U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204534496U (en) | A kind of LED heat abstractor utilizing waste heat | |
| CN109378380A (en) | A kind of Novel LED chip encapsulating structure | |
| WO2014161222A1 (en) | Junction box of photovoltaic power generation assembly | |
| CN207517724U (en) | High heat conduction stamp-mounting-paper diode | |
| Wang et al. | A cooling system with a fan for thermal management of high-power leds | |
| CN207303078U (en) | Long-life diode | |
| CN203671548U (en) | Aluminum profile for LED lamp outer shell | |
| CN207569554U (en) | A kind of LED heat dissipation lamp groups being conveniently replaceable | |
| CN102931319B (en) | A kind of manufacture method of high thermally conductive LED base plate for packaging | |
| CN201615379U (en) | High-efficiency heat dissipating LED lamp | |
| CN206572473U (en) | A kind of LED light bar of high-cooling property | |
| CN207939469U (en) | Photovoltaic junction box | |
| CN203323067U (en) | High-power LED heat dissipation structure | |
| CN207869062U (en) | low temperature photovoltaic junction box | |
| CN206846345U (en) | A kind of not exposed LED cylinder of electric wire | |
| CN207282485U (en) | High temperature resistance heavy-duty diode | |
| CN202091861U (en) | LED light emitting module using ceramic for heat dissipation | |
| CN205447576U (en) | Combined type LED lamp | |
| CN207648479U (en) | A kind of water-proof LED lamp | |
| CN207947280U (en) | Long-life fire-retardant diode | |
| CN207849317U (en) | A kind of radiator for LED light heat dissipation | |
| CN204118108U (en) | A kind of LED chip | |
| CN206929571U (en) | A kind of novel LED heat dissipation lamp | |
| CN201804909U (en) | Light emitting diode (LED) bracket structure | |
| CN206723887U (en) | A kind of LED electricity-saving lamps |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180619 |