CN207303078U - Long-life diode - Google Patents
Long-life diode Download PDFInfo
- Publication number
- CN207303078U CN207303078U CN201721194641.0U CN201721194641U CN207303078U CN 207303078 U CN207303078 U CN 207303078U CN 201721194641 U CN201721194641 U CN 201721194641U CN 207303078 U CN207303078 U CN 207303078U
- Authority
- CN
- China
- Prior art keywords
- encapsulating structure
- heat
- radiating groove
- chip
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 claims abstract description 16
- 238000003466 welding Methods 0.000 claims abstract description 10
- 239000000919 ceramic Substances 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 11
- 229920000647 polyepoxide Polymers 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
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- Led Device Packages (AREA)
Abstract
Diode field is the utility model is related to, more particularly to long-life diode, including chip, is connected to the pin at chip both ends, the encapsulating structure being packaged in outside chip and pin, the pin at the chip both ends is stretched out outside encapsulating structure；The pin includes the welding section inside encapsulating structure and the terminal section outside encapsulating structure, and terminal section is more than the longitudinal length of encapsulating structure for the length of flat and terminal section；The radiating groove of the welding section of several connection pins is offered inside the encapsulating structure, encapsulating structure surface corresponds to radiating groove and forms several heat emission holes, and the radiating groove is connected away from one end of welding section with heat emission hole；The chip exterior is equipped with thermally conductive sheet, and metal heat-conducting bar, metal heat-conducting bar one end connection thermally conductive sheet are equipped with encapsulating structure, and the other end reaches encapsulating structure outer surface.The utility model is simple in structure, production cost is low, good heat dissipation effect, service life length.
Description
Technical field
Diode field is the utility model is related to, more particularly to long-life diode.
Background technology
Diode is also known as crystal diode, in addition, the also vacuum electronic diode of early stage；It is a kind of with unidirectional biography
The electronic device of electrical conduction current.There are two lead terminals of a chip inside semiconductor diode, this electronic device is according to outer
Alive direction, possesses the transducing of unidirectional current.In general, surface mounting crystal diode is one by p-type semiconductor and n
Type semiconductor sinters the p-n junction interface to be formed.Space charge layer is formed in the both sides at its interface, forms built-in field.When additional
Voltage be equal to zero when, due to the concentration difference of p-n junction both sides carrier cause dissufion current and by built-in field caused by drift about electricity
Flow equal and be in electric equilibrium state, this is also the diode characteristic under normality.
The diode of the prior art, due to the limitation of own power and volume, its caloric value is big, but heat dissipation effect is poor, makes
Easily damaged during, service life is short, so as to causing rectifying output circuit to break down.
In order to extend the service life of diode, heat dissipation design need to be often added, existing diode is often at lead outlet end
Heat sink is drawn, fin ends are inserted in epoxy resin, and such a heat dissipation design heat dissipation effect is general, and is unfavorable for diode and exists
Installation on panel.Or increase the heat dissipation that extra radiator realizes diode for diode, but this will cause diode whole
Body is complicated, production cost is high.
Utility model content
To solve the above problems, the utility model provide it is a kind of it is simple in structure, production cost is low, good heat dissipation effect, use
The long-life diode of long lifespan.
Technical solution is used by the utility model：Long-life diode, including chip, it is connected to drawing for chip both ends
Foot, the encapsulating structure being packaged in outside chip and pin, the pin at the chip both ends are stretched out outside encapsulating structure；The envelope
The radiating groove of several connection pins is offered inside assembling structure, encapsulating structure surface corresponds to radiating groove and forms several heat dissipations
Hole, the radiating groove are connected away from one end of pin with heat emission hole；The chip exterior is equipped with thermally conductive sheet, in encapsulating structure
Equipped with metal heat-conducting bar, metal heat-conducting bar one end connection thermally conductive sheet, the other end reaches encapsulating structure outer surface；The encapsulating structure
Include heat-conducting layer, epoxy resin layer and ceramic shell layer successively from inside to outside, radiating groove and metal heat-conducting bar sequentially pass through heat conduction
Layer, epoxy resin layer and ceramic shell layer.
To being further improved to for above-mentioned technical proposal, the radiating groove is in wavy.
To being further improved to for above-mentioned technical proposal, several heat emission holes uniformly divide in a ring along the axial direction of encapsulating structure
Cloth.
To being further improved to for above-mentioned technical proposal, the diameter of the heat emission hole is more than the diameter of radiating groove.
To being further improved to for above-mentioned technical proposal, Heat Conduction Material is provided with the radiating groove.
The beneficial effects of the utility model are：
1st, on the one hand, pin includes the welding section inside encapsulating structure and the terminal section outside encapsulating structure,
The length of the terminal section is more than the longitudinal length of encapsulating structure, and the area that diode is exposed to extraneous part is big, increases two
Pole pipe and extraneous contact area, accelerate heat dissipation, avoid the chip in diode from being burnt out since temperature is excessive, extend two poles
The service life of pipe.Second aspect, the heat emission hole on welding section one end connection encapsulating structure surface equipped with one end connection pin
Radiating groove, the heat produced in the pin course of work are delivered to the heat emission hole on encapsulating structure surface by radiating groove, then by dissipating
Hot hole is delivered in external environment, prevents diode internal heat from assembling.The third aspect, the heat of chip are transferred to through thermally conductive sheet
Metal heat-conducting bar inside encapsulating structure, then be transferred to outside encapsulating structure, further prevent diode internal heat from assembling；The
Four aspects, encapsulating structure include heat-conducting layer, epoxy resin layer and ceramic shell layer, radiating groove and metal heat-conducting successively from inside to outside
Bar sequentially passes through heat-conducting layer, epoxy resin layer and ceramic shell layer, and ceramic shell is good with high temperature resistant, conductivity of heat and electrical insulating property
The advantages of, encapsulating structure not only has the function of insulation protection, also has the function of heat conduction and heat radiation, further increases the utility model
Radiating efficiency.5th aspect, the utility model are not required to set extra radiator structure, simple in structure and do not increase diode
The heat produced in production cost, chip and the pin course of work can be directly conducted to outside encapsulating structure, and equipped with multiple
Heat conduction and heat radiation mechanism, good heat dissipation effect, be conducive to extend diode service life.
2nd, radiating groove is in wavy and increases heat dissipation area, further increase the radiating efficiency of the utility model.
3rd, several heat emission holes are uniformly distributed in a ring along the axial direction of encapsulating structure so that the heat inside diode can be
Even to shed, fluctuation of service caused by preventing diode local temperature excessive, is further conducive to improve diode service life
And job stability.
4th, the diameter of heat emission hole is more than the diameter of radiating groove, it is ensured that flows through the heat energy Quick diffusing of radiating groove to extraneous ring
Border, further increases the radiating efficiency of diode.
5th, Heat Conduction Material is provided with radiating groove, improves heat transfer efficiency, accelerates heat transfer, further increases two poles
The radiating efficiency of pipe.
Brief description of the drawings
Fig. 1 is the external structure schematic diagram of the utility model；
Fig. 2 is the internal structure schematic diagram of the utility model.
Embodiment
The utility model is further described below in conjunction with attached drawing.
It is respectively the external structure schematic diagram and internal structure schematic diagram of the utility model as shown in Fig. 1~Fig. 2.
Long-life diode 100, including chip 110, be connected to the pin 120 at 110 both ends of chip, be packaged in chip 110
With the encapsulating structure 130 outside pin 120, the pin 120 at 110 both ends of chip is stretched out outside encapsulating structure 130；Pin
120 include the welding section 121 inside encapsulating structure 130 and the terminal section 122 outside encapsulating structure 130, terminal section
122 are more than the longitudinal length of encapsulating structure 130 for the length of flat and terminal section 122.Opened inside the encapsulating structure 130
The radiating groove 131 of welding section 121 equipped with several connection pins 120,130 surface of encapsulating structure corresponds to radiating groove 131 and is molded
There are several heat emission holes 132, the radiating groove 131 is connected away from one end of pin 120 with heat emission hole 132；The chip 110
External rings are equipped with thermally conductive sheet 140, and metal heat-conducting bar 133, the connection heat conduction of 133 one end of metal heat-conducting bar are equipped with encapsulating structure 130
Piece 140, the other end reach 130 outer surface of encapsulating structure；The encapsulating structure 130 from inside to outside successively include heat-conducting layer 130a,
Epoxy resin layer 130b and ceramic shell layer 130c, radiating groove 131 and metal heat-conducting bar 133 sequentially pass through heat-conducting layer 130a, ring
Oxygen tree lipid layer 130b and ceramic shell layer 130c.
Radiating groove 131 is in wavy, increases heat dissipation area, further increases the radiating efficiency of the utility model.
Several heat emission holes 132 are uniformly distributed in a ring along the axial direction of encapsulating structure 130 so that inside diode 100
Heat can uniformly shed, fluctuation of service caused by preventing 100 local temperature of diode excessive, further be conducive to improve two poles
100 service life of pipe and job stability.
The diameter of heat emission hole 132 is more than the diameter of radiating groove 131, it is ensured that flows through the heat energy Quick diffusing of radiating groove 131
To external environment, the radiating efficiency of diode 100 is further increased.
Heat Conduction Material is provided with radiating groove 131, improves heat transfer efficiency, accelerates heat transfer, further increases two
The radiating efficiency of pole pipe 100.
On the one hand, the radiating groove of the heat emission hole 132 equipped with one end 120 one end of connection pin 130 surface of connection encapsulating structure
131, the heat produced in 120 course of work of pin is delivered to the heat emission hole 132 on 130 surface of encapsulating structure by radiating groove 131,
It is delivered to again by heat emission hole 132 in external environment, prevents 100 internal heat of diode from assembling；Second aspect, chip 110
Heat is transferred to the metal heat-conducting bar 133 inside encapsulating structure 130 through thermally conductive sheet 140, then is transferred to outside encapsulating structure 130,
Further prevent 100 internal heat of diode from assembling；The third aspect, encapsulating structure 130 include heat-conducting layer successively from inside to outside
130a, epoxy resin layer 130b and ceramic shell layer 130c, radiating groove 131 and metal heat-conducting bar 133 sequentially pass through heat-conducting layer
130a, epoxy resin layer 130b and ceramic shell layer 130c, encapsulating structure 130 not only have the function of insulation protection, also have and lead
Hot heat sinking function, further increases the radiating efficiency of the utility model.Fourth aspect, the utility model are not required to set additionally
Radiator structure, production cost that is simple in structure and not increasing diode 100, produces in 120 course of work of chip 110 and pin
Heat can be directly conducted to outside encapsulating structure 130, and is equipped with multiple heat conduction and heat radiation mechanism, and good heat dissipation effect, is conducive to prolong
The service life of long diode 100.
The operation principle of the utility model is：
In 100 course of work of diode, electric current flows through the heat of chip 110 and pin 120 and generation, on the one hand, can be straight
Heat-conducting layer 130a, the epoxy resin layer 130b and ceramic shell layer 130c for connecing encapsulated structure 130 are transferred to outside, second party
Face, heat emission hole 132 is transferred to through the Heat Conduction Material in radiating groove 131, then is transferred to outside, the third aspect, through 140 He of thermally conductive sheet
Metal heat-conducting bar 133 is transferred to outside, and the heat transfer form inside diode 100 is more, by heat conduction and heat dissipation, can in time by
Heat transfer to outside, good heat dissipation effect, service life is grown.
Embodiment described above only expresses the several embodiments of the utility model, its description is more specific and detailed,
But it should not be interpreted as limiting the scope of the present invention.It should be pointed out that for the common of this area
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (5)
1. long-life diode, it is characterised in that：Including chip, it is connected to the pin at chip both ends, is packaged in chip and pin
Exterior encapsulating structure, the pin at the chip both ends are stretched out outside encapsulating structure；The pin includes being located at encapsulating structure
Internal welding section and the terminal section outside encapsulating structure, terminal section are more than encapsulation for the length of flat and terminal section
The longitudinal length of structure；The radiating groove of the welding section of several connection pins, encapsulating structure are offered inside the encapsulating structure
Surface corresponds to radiating groove and forms several heat emission holes, and the radiating groove is connected away from one end of welding section with heat emission hole；Institute
State chip exterior and be equipped with thermally conductive sheet, metal heat-conducting bar is equipped with encapsulating structure, connection thermally conductive sheet in metal heat-conducting bar one end is another
End reaches encapsulating structure outer surface；The encapsulating structure includes heat-conducting layer, epoxy resin layer and ceramic shell successively from inside to outside
Layer, radiating groove and metal heat-conducting bar sequentially pass through heat-conducting layer, epoxy resin layer and ceramic shell layer.
2. long-life diode according to claim 1, it is characterised in that：The radiating groove is in wavy.
3. long-life diode according to claim 2, it is characterised in that：Axial direction of several heat emission holes along encapsulating structure
It is uniformly distributed in a ring.
4. long-life diode according to claim 3, it is characterised in that：The diameter of the heat emission hole is more than radiating groove
Diameter.
5. long-life diode according to claim 4, it is characterised in that：Heat Conduction Material is provided with the radiating groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721194641.0U CN207303078U (en) | 2017-09-18 | 2017-09-18 | Long-life diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721194641.0U CN207303078U (en) | 2017-09-18 | 2017-09-18 | Long-life diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207303078U true CN207303078U (en) | 2018-05-01 |
Family
ID=62441741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721194641.0U Expired - Fee Related CN207303078U (en) | 2017-09-18 | 2017-09-18 | Long-life diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207303078U (en) |
-
2017
- 2017-09-18 CN CN201721194641.0U patent/CN207303078U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 523000 Dongguan, Guangdong, Songshan Lake high tech Industrial Development Zone, New Town Road, 5, hung Ho, 7 A, Long Yi Zhi Valley, A701 Patentee after: DONGGUAN NANJING ELECTRONICS LTD. Address before: 523000 Yi Hongrong high tech Industrial Park, No. 7, Chi Ling Industrial Road, Houjie Town, Dongguan, Guangdong. Patentee before: DONGGUAN NANJING ELECTRONICS LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180501 |