CN114353953B - Dewar cold head for rapid refrigeration and infrared detector Dewar assembly - Google Patents
Dewar cold head for rapid refrigeration and infrared detector Dewar assembly Download PDFInfo
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- CN114353953B CN114353953B CN202210038939.1A CN202210038939A CN114353953B CN 114353953 B CN114353953 B CN 114353953B CN 202210038939 A CN202210038939 A CN 202210038939A CN 114353953 B CN114353953 B CN 114353953B
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 17
- 239000000919 ceramic Substances 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 52
- 238000009434 installation Methods 0.000 claims abstract description 15
- 230000003044 adaptive effect Effects 0.000 claims abstract description 9
- 239000010409 thin film Substances 0.000 claims abstract description 9
- 238000001465 metallisation Methods 0.000 claims abstract description 4
- 230000003287 optical effect Effects 0.000 claims abstract description 4
- 238000001816 cooling Methods 0.000 claims description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 239000010703 silicon Substances 0.000 claims description 9
- 229910001374 Invar Inorganic materials 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000004026 adhesive bonding Methods 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 229910000833 kovar Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 3
- 239000000956 alloy Substances 0.000 claims 3
- 230000004044 response Effects 0.000 abstract description 7
- 230000008646 thermal stress Effects 0.000 abstract 1
- 230000002035 prolonged effect Effects 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
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- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
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Abstract
The invention provides a Dewar cold head and an infrared detector Dewar component for rapid refrigeration, wherein the Dewar cold head for rapid refrigeration comprises a cold finger cylinder, a cold table, a ceramic substrate, a temperature sensor, a detector chip set, a cold screen and a low-temperature optical filter, wherein the bottom surface of the ceramic substrate is arranged on the cold table, the top surface of the ceramic substrate is subjected to thin film circuit metallization, a first installation through hole which is adaptive to the shape and the size of the temperature sensor and a second installation through hole which is adaptive to the shape and the size of the detector chip set are formed in the ceramic substrate, the second installation through hole is communicated with the first installation through hole, and a notch which is adaptive to the installation of the cold screen is cut on the non-bonding side of the ceramic substrate. The Dewar cold head can realize rapid refrigeration, can reduce the thermal stress of a detector chip set, and has the advantages of short refrigeration and working response time, small heat loss and long service life of an infrared detector Dewar component adopting the Dewar cold head.
Description
Technical Field
The invention relates to a Dewar cold head and an infrared detector Dewar component for rapid refrigeration, and belongs to the technical field of refrigeration infrared detectors.
Background
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
At present, the refrigeration infrared detector mainly comprises a Dewar, a detector chip set and a refrigerator, wherein the Dewar provides a vacuum working environment for a Dewar cold head, the refrigerator provides cold energy for the Dewar cold head structure through the Dewar, the Dewar cold head is a laminated structure of a cold finger cylinder, a cold table, a ceramic substrate, the detector chip set and a cold screen, all the structures are bonded through corresponding bonding adhesives, and the following problems exist in the structural form:
1. because the refrigerator provides cold energy to be transmitted to the detector chip set when the detector works, the heat resistance of the refrigerator to the detector chip set is increased by the cold table, the ceramic substrate and each adhesive layer, the refrigerating time and the working response time of the detector are increased, and the heat loss of the assembly is increased by the cold table, the ceramic substrate and the adhesive;
2. the thermal expansion coefficients of the ceramic substrate and the detector chip set are large in difference, the thermal expansion cannot be matched, and the stress of the ceramic substrate on the detector chip set is large, so that the performance of the detector chip set is reduced;
3. glue deflation is a main reason for influencing the vacuum life of the detector, and each layer of glue deflation can lead to the reduction of the service life of the detector;
4. the traditional packaging technology is that two temperature sensors are bonded on a ceramic substrate, one is used for measuring temperature, the other is used for controlling temperature, and the two temperature sensors increase the refrigerating time and the working response time of the detector;
5. the traditional packaging technology is characterized in that the cold screen is adhered to the ceramic substrate, cold energy is conducted to the cold screen through the cold table and the ceramic substrate, and the cold energy transmission efficiency is low.
It should be noted that the foregoing description of the technical background is only for the purpose of facilitating a clear and complete description of the technical solutions of the present specification and for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background section of the present description.
Disclosure of Invention
The invention aims to solve the technical problems of the prior art, and provides a Dewar cold head and an infrared detector Dewar assembly for rapid refrigeration.
The scheme is realized by the following technical measures: a Dewar cold head for quick refrigeration comprises a cold finger cylinder, a cold table, a ceramic substrate, a temperature sensor, a detector chip set, a cold screen and a low-temperature optical filter, wherein the bottom surface of the ceramic substrate is arranged on the cold table, the top surface of the ceramic substrate is subjected to thin-film circuit metallization, a first installation through hole which is adaptive to the shape and the size of the temperature sensor and a second installation through hole which is adaptive to the shape and the size of the detector chip set are formed in the ceramic substrate, the second installation through hole is communicated with the first installation through hole, and a notch which is adaptive to the installation of the cold screen is cut on the non-bonding side of the ceramic substrate.
Preferably, the packaging method is as follows:
s1: the bottom surface of the ceramic substrate and the upper end of the cooling table are adhered and fixed through adhesive bonding;
s2: the temperature sensor and the detector chip set are respectively arranged in the first mounting through hole and the second mounting through hole, and the temperature sensor and the detector chip set are fixedly adhered to the upper end face of the cooling table through adhesive bonding;
s3: after the adhesive is solidified, respectively bonding the detector chip set and the temperature sensor with the metallized area of the thin film circuit on the ceramic substrate;
s4: placing the bonding end at the lower end of the cold screen at the notch on the ceramic substrate and fixing the bonding end with the cold screen bonding area of the cold table through bonding adhesive;
s5: and bonding the low-temperature optical filter at the upper opening of the cold screen.
Preferably, the first mounting through hole is formed on the non-bonding side of the second mounting through hole.
Preferably, the cooling table is of a stepped cylinder structure, the cooling table is welded with the cold finger cylinder in an airtight manner, and a groove is formed in the end face of the cooling table, which is welded with the cold finger cylinder.
Preferably, the cold stage is made of silicon carbide or aluminum nitride.
Preferably, the cold stage is made of 4J36 invar, 4J29 kovar, 4J32 super invar or Mo metal molybdenum.
The invention also provides an infrared detector Dewar assembly which comprises the Dewar cold head for rapid refrigeration.
The invention has the beneficial effects that:
1. according to the invention, the groove is formed in the end face of the cold table welded with the cold finger cylinder, so that the lower end face of the cold table is thinned, the first mounting through hole, the second mounting through hole and the notch adapting to the mounting of the cold screen are formed in the ceramic substrate, the volumes of the cold table and the ceramic substrate are reduced compared with the prior art, the distance between the cold quantity and the chip is shorter, the loss of cold quantity is less, the total heat loss of the Dewar cold head is reduced, the heat transfer resistance of the Dewar cold head is reduced, and the refrigerating time is reduced, so that the working response time of the infrared detector is effectively accelerated;
2. in the invention, the temperature sensor, the detector chip set and the cold screen are directly fixed with the cold table through the bonding glue, so that compared with the prior art, a layer of bonding glue and part of ceramics are reduced, the thermal load of the Dewar cold head is also reduced, the influence of the residual gas of the bonding glue on the vacuum life of the detector is effectively reduced, and the service life of the detector is prolonged;
3. according to the invention, the ceramic substrate is processed, so that the detector chip set is directly bonded with the cooling table with the thermal expansion coefficient being more similar, the stress influence of the ceramic substrate on the detector chip set is reduced, and the possibility of increasing blind pixels of the detector chip set is reduced;
4. according to the invention, the cold screen is directly bonded and fixed with the cold table through processing the ceramic substrate, so that the loss of cold energy is reduced, the cooling rate of the cold screen and the minimum temperature of the cold screen are accelerated, the influence of background noise generated by the cold screen on the performance of a chip is reduced, and the response time of the infrared detector is prolonged;
5. in the invention, the temperature sensor and the detector chip set are adhered to the same platform (cold table), so that the monitored temperature is more accurate;
6. in the invention, by combining the temperature measuring and temperature controlling functions of the temperature sensor into one temperature sensor, one part is reduced, and the thermal mass is reduced.
It can be seen that the present invention has outstanding substantial features and significant advances over the prior art, as well as the benefits of its implementation.
Drawings
Fig. 1 is a schematic cross-sectional view of a dewar cold head for rapid cooling according to the present invention.
Fig. 2 is a schematic top view of a ceramic substrate.
In the figure, a 1-ceramic substrate, a 2-temperature sensor, a 3-detector chip set, a 4-cold screen, a 5-notch, a 6-cold stage, a 7-cold finger cylinder, an 8-groove, a 9-mounting through hole I, a 10-mounting through hole II, a 11-bonding wire, a 12-film circuit metallized area and a 13-low-temperature filter.
Detailed Description
In order to clearly illustrate the technical characteristics of the present solution, the present solution is described below by means of specific embodiments and with reference to the accompanying drawings.
A Dewar cold head for rapid refrigeration is shown as comprising a cold finger cylinder 7, a cold stage 6, a ceramic substrate 1, a temperature sensor 2, a detector chip set 3, a cold screen 4 and a low temperature filter 13. The cooling table 6 is made of composite ceramic materials, and preferably the cooling table 6 is made of silicon carbide or aluminum nitride. The cold stage 6 may also be made of a metallic material, preferably the cold stage 6 is made of 4J36 invar, 4J29 kovar, 4J32 super invar or Mo metal molybdenum. The cold table 6 is of a stepped cylinder structure, the cold table 6 and the cold finger cylinder 7 are welded in an airtight manner, a groove 8 is formed in the end face of the cold table 6, which is welded with the cold finger cylinder 7, the lower end face of the cold table 6 can be thinned by the groove 8, the distance from the cold quantity to the detector chip set 3 is enabled to be shorter, the loss of the cold quantity is less, and the heat transfer resistance of the Dewar cold head is reduced.
The detector chip set 3 consists of a silicon circuit and a detector chip, wherein the silicon circuit is arranged below the detector chip and is connected with the detector chip through reverse welding, the silicon circuit and the cold table 6 are fixed through bonding glue, and the thermal expansion coefficient of the silicon circuit at low temperature (80 k) is 1.15x10 -6 The cold stage 6 is made of silicon carbide, aluminum nitride, 4J36 invar, 4J29 kovar, 4J32 super invar or Mo metal molybdenum, which has a thermal expansion coefficient more similar to that of silicon, so that the detector chip set 3 can be reduced from being subjected to larger stress during operation.
The bottom surface of the ceramic substrate 1 is mounted on the cooling table 6, and the top surface is metallized by a thin film circuit, wherein the metallized thin film circuit is formed by performing pattern metallization on the surface of the ceramic substrate 1 by using the technologies such as semiconductor thin film vacuum evaporation, electroplating, photoetching and the like, so that the ceramic substrate 1 has the function of electric connection. A first mounting through hole 9 which is adapted to the shape and the size of the temperature sensor 2 and a second mounting through hole 10 which is adapted to the shape and the size of the detector chip set 3 are formed on the ceramic substrate 1, wherein the shape and the size of the first mounting through hole 9 are set according to the shape and the size of the temperature sensor 2, for example, the first mounting through hole 9 is a square hole with the size of 0.7mm multiplied by 0.7 mm. The shape and size of the second mounting via 10 are set according to the shape and size of the detector chip set 3, for example, the second mounting via 10 is a rectangular hole of 12mm×10 mm. The second mounting through hole 10 is communicated with the first mounting through hole 9, and the first mounting through hole 9 is formed in the non-bonding side of the second mounting through hole 10.
A notch 5 adapted to the mounting of the cold screen 4 is cut in the non-bonded side of the ceramic substrate 1. After the notch 5 is formed in the ceramic substrate 1, the bonding end at the lower end of the cold screen 4 can be directly bonded and fixed with the cold table 6, so that the loss of cold quantity is reduced, the cooling rate of the cold screen 4 and the lowest temperature of the cold screen 4 are accelerated, the influence of background noise generated by the cold screen 4 on the performance of the detector chip set 3 is reduced, and the response time of the infrared detector is prolonged.
The packaging method of the Dewar cold head for rapid refrigeration comprises the following steps:
s1: the bottom surface of the ceramic substrate 1 and the upper end of the cooling table 6 are adhered and fixed by adhesive bonding;
s2: the temperature sensor 2 and the detector chip set 3 are respectively arranged in a first mounting through hole 9 and a second mounting through hole 10, and the temperature sensor 2 and the detector chip set 3 are fixed with the upper end face of the cold table 6 through bonding glue; therefore, the detector chip set 3 is directly bonded with the cold table 6 with the thermal expansion coefficient being more similar, the stress influence of the ceramic substrate 1 on the detector chip set 3 is reduced, the condition that blind pixels of the detector chip set 3 fail is reduced, the temperature sensor 2 and the detector chip set 3 are bonded on the same platform (the cold table 6), and the monitored temperature is more accurate;
s3: after the adhesive is solidified, the detector chip set 3 and the temperature sensor 2 are respectively bonded with the metallized area 12 of the thin film circuit on the ceramic substrate 1;
s4: placing the bonding end of the lower end of the cold screen 4 at the notch 5 on the ceramic substrate 1 and bonding and fixing the bonding end of the cold screen with the bonding area of the cold screen of the cold stand 6 through bonding glue;
s5: a low temperature filter 13 is adhered to the upper opening of the cold screen 4.
The invention also provides an infrared detector Dewar assembly which comprises the Dewar cold head for rapid refrigeration.
The infrared detector is applied to the environment with ultra-high vibration and ultra-high acceleration, such as missile or aerospace, so that the reliability requirement of the infrared detector is higher than that of an infrared detector used on the ground, and particularly, the bonding wire with long length and large span cannot meet the use requirement under the high-strength environment.
In the infrared detector Dewar component, the detector chip set 3 is firstly subjected to wire bonding with the ceramic substrate 1, then the electrical signals of the detector chip set 3 are led out through the combination of the ceramic substrates 1 and Du Wajian, the span of the bonding wire 11 is small, the length of the bonding wire is short, the swing amplitude of the bonding wire 11 along with vibration is greatly reduced, the possibility of failure of the infrared detector caused by the phenomenon that the bonding wires 11 swing and touch each other to generate a short circuit is reduced, meanwhile, the swing amplitude of the bonding wire 11 is reduced, the reliability in application is greatly improved, and the problem that the detector chip set is attached to a cold table without the ceramic substrate, the electrical signals of the detector chip set 3 are directly led out to Du Washang, so that the bonding wire is long in length, cannot bear ultrahigh-strength vibration and acceleration impact in missile flight, is easy to break or collision short circuit in missile flight causes the infrared detector to lose response, task failure is extremely easy to cause, and the harm is extremely great is avoided.
The technical features not described in the present invention may be implemented by the prior art, and are not described herein. The present invention is not limited to the above-described embodiments, and variations, modifications, additions, or substitutions within the spirit and scope of the present invention will be within the scope of the present invention by those of ordinary skill in the art.
Claims (4)
1. The utility model provides a Dewar cold head for quick refrigeration, it includes cold finger cylinder, cold platform, ceramic substrate, temperature sensor, detector chipset, cold screen and low temperature light filter, characterized by: the bottom surface of the ceramic substrate is arranged on the cooling table, the top surface of the ceramic substrate is subjected to thin film circuit metallization, a first installation through hole which is adaptive to the shape and the size of the temperature sensor and a second installation through hole which is adaptive to the shape and the size of the detector chip set are formed in the ceramic substrate, the second installation through hole is communicated with the first installation through hole, and a notch which is adaptive to the installation of the cold screen is cut on the non-bonding side of the ceramic substrate; the detector chip set consists of a silicon circuit and a detector chip, wherein the silicon circuit is arranged below the detector chip and is connected with the detector chip through reverse welding, the silicon circuit and the cold table are fixed through bonding glue, and the thermal expansion coefficient of the silicon circuit at low temperature is 1.15 multiplied by 10 -6 The cold table is made of silicon carbide or aluminum nitride, or made of 4J36 invar alloy, 4J29 kovar alloy, 4J32 super invar alloy or Mo metal molybdenum;
the packaging method of the Dewar cold head for rapid refrigeration comprises the following steps:
s1: the bottom surface of the ceramic substrate and the upper end of the cooling table are adhered and fixed through adhesive bonding;
s2: the temperature sensor and the detector chip set are respectively arranged in the first mounting through hole and the second mounting through hole, and the temperature sensor and the detector chip set are fixedly adhered to the upper end face of the cooling table through adhesive bonding;
s3: after the adhesive is solidified, bonding the detector chip set and the temperature sensor with the metallized area of the thin film circuit on the ceramic substrate respectively: the detector chip group is firstly subjected to wire bonding with the ceramic substrate, and then is combined with Du Wajian through the ceramic substrate, so that an electric signal of the detector chip group is led out;
s4: placing the bonding end at the lower end of the cold screen at the notch on the ceramic substrate and fixing the bonding end with the cold screen bonding area of the cold table through bonding adhesive;
s5: and bonding the low-temperature optical filter at the upper opening of the cold screen.
2. The dewar cold head for rapid cooling according to claim 1, characterized in that: the first mounting through hole is formed in the non-bonding side of the second mounting through hole.
3. The dewar cold head for rapid cooling according to claim 2, characterized in that: the cooling table is of a step cylinder structure, the cooling table is welded with the cold finger cylinder in an airtight mode, and a groove is formed in the end face of the cooling table, which is welded with the cold finger cylinder, of the cooling table.
4. An infrared detector dewar assembly characterized by: a dewar cold head for rapid cooling according to any one of claims 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210038939.1A CN114353953B (en) | 2022-01-13 | 2022-01-13 | Dewar cold head for rapid refrigeration and infrared detector Dewar assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210038939.1A CN114353953B (en) | 2022-01-13 | 2022-01-13 | Dewar cold head for rapid refrigeration and infrared detector Dewar assembly |
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| CN114353953A CN114353953A (en) | 2022-04-15 |
| CN114353953B true CN114353953B (en) | 2024-04-12 |
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| CN116164846A (en) * | 2023-04-23 | 2023-05-26 | 山西创芯光电科技有限公司 | Packaging structure and packaging method for Dewar cold head of infrared detector |
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| CN114353953A (en) | 2022-04-15 |
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