CN110987196A - Infrared detector assembly - Google Patents
Infrared detector assembly Download PDFInfo
- Publication number
- CN110987196A CN110987196A CN201911315797.3A CN201911315797A CN110987196A CN 110987196 A CN110987196 A CN 110987196A CN 201911315797 A CN201911315797 A CN 201911315797A CN 110987196 A CN110987196 A CN 110987196A
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- cold
- metal
- detector chip
- screen
- finger cylinder
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- 239000002184 metal Substances 0.000 claims abstract description 36
- 230000003287 optical effect Effects 0.000 claims abstract description 26
- 239000003292 glue Substances 0.000 claims description 20
- 238000005219 brazing Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000005057 refrigeration Methods 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000919 ceramic Substances 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- NMFHJNAPXOMSRX-PUPDPRJKSA-N [(1r)-3-(3,4-dimethoxyphenyl)-1-[3-(2-morpholin-4-ylethoxy)phenyl]propyl] (2s)-1-[(2s)-2-(3,4,5-trimethoxyphenyl)butanoyl]piperidine-2-carboxylate Chemical compound C([C@@H](OC(=O)[C@@H]1CCCCN1C(=O)[C@@H](CC)C=1C=C(OC)C(OC)=C(OC)C=1)C=1C=C(OCCN2CCOCC2)C=CC=1)CC1=CC=C(OC)C(OC)=C1 NMFHJNAPXOMSRX-PUPDPRJKSA-N 0.000 description 9
- 238000001816 cooling Methods 0.000 description 7
- 239000012141 concentrate Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The invention provides an infrared detector assembly which comprises a cold finger cylinder, a metal cold disc, a detector chip, a cold screen support, a cold screen and an optical filter, wherein the metal cold disc blocks a top opening of the cold finger cylinder, the detector chip is positioned on the metal cold disc, the cold screen is supported on the cold finger cylinder through the cold screen support, the optical filter is arranged on the cold screen, the optical filter is arranged opposite to the detector chip, and the metal cold disc and the detector chip are positioned in a closed space formed by the cold screen, the optical filter and the cold screen support. The infrared detector assembly provided by the invention has no ceramic substrate, the size of the metal cold plate is smaller and more compact, and the thermal mass of the Dewar is smaller; the detector chip is directly attached to the metal cold plate, so that the cold energy is conducted more directly and more rapidly, and the detector chip can realize rapid refrigeration starting; the cold shield is arranged on the cold finger cylinder through the cold shield bracket, so that the backflow cold quantity generated by the throttling effect of the refrigerator is utilized to the maximum extent, and the heat exchange efficiency is improved.
Description
Technical Field
The invention relates to the field of refrigeration detectors, in particular to an infrared detector assembly.
Background
An Infrared Focal Plane detector (IRFPA) is a novel detector which is developed in the nineties of the twentieth century, integrates Infrared radiation detection, signal conversion and signal reading, has high sensitivity, good environmental adaptability and mature process, and is widely applied to military and civil fields such as aerospace, national defense, industry, medical imaging and the like.
Particularly, in the aspect of infrared guidance, better and faster infrared detection capability is required in order to better adapt to the future informatization electronic war environment, so that the requirement of quick refrigeration starting is provided for the refrigeration detector.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides an infrared detector assembly to achieve the effect of quick refrigeration.
The invention is realized by the following steps:
the invention provides an infrared detector assembly which comprises a cold finger cylinder, a metal cold disc, a detector chip, a cold screen support, a cold screen and an optical filter, wherein the metal cold disc blocks a top opening of the cold finger cylinder, the detector chip is positioned on the metal cold disc, the cold screen is supported on the cold finger cylinder through the cold screen support, the optical filter is arranged on the cold screen, the optical filter is arranged opposite to the detector chip, and the metal cold disc and the detector chip are positioned in a closed space formed by the cold screen, the optical filter and the cold screen support.
Preferably, the optical filter is positioned in the cold shield and is arranged close to the detector chip.
Preferably, the cold finger cylinder and the metal cold plate are connected through brazing.
Preferably, the detector chip is bonded to the metal cold plate by low-temperature glue.
Preferably, the outer surface of the cold finger cylinder supporting cold shield support is a conical surface.
Preferably, the cold shield support is bonded to the cold finger cylinder through high thermal conductive glue, and the cold shield is bonded to the cold shield support through high thermal conductive glue.
Preferably, the cold shield and the optical filter are bonded through low-temperature glue.
Preferably, the cold shield support is made of high heat conduction material.
The invention has the following beneficial effects:
1. the infrared detector assembly provided by the invention has no ceramic substrate, the size of the metal cold plate is smaller and more compact, and the thermal mass of the Dewar is smaller; the detector chip is directly attached to the metal cold plate, so that the cold energy is conducted more directly and more rapidly, and the detector chip can realize rapid refrigeration starting; the cold shield is arranged on the cold finger cylinder through the cold shield bracket, so that the backflow cold quantity generated by the throttling effect of the refrigerator is utilized to the maximum extent, and the heat exchange efficiency is improved.
2. The optical filter sinks to the surface of the chip and is inversely attached to the lowest stage light billows of the cold shield, so that the cooling time of the optical filter is shortened, and the thermal noise is better inhibited.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of an infrared detector assembly provided by an embodiment of the present invention;
fig. 2 is a cross-sectional view of an infrared detector assembly provided by an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-2, an embodiment of the present invention provides an infrared detector assembly, which includes a cold finger cylinder 2, a metal cold plate 6, a detector chip 4, a cold shield support 5, a cold shield 1, and an optical filter 3, where the metal cold plate 6 plugs a top opening of the cold finger cylinder 2, the cold finger cylinder 2 and the metal cold plate 6 are connected by brazing, the detector chip 4 is bonded to the metal cold plate 6 by a low temperature glue, the cold shield 1 is supported on the cold finger cylinder 2 by the cold shield support 5, the cold shield support 5 is made of a high thermal conductive material, the cold shield support 5 is bonded to the cold finger cylinder 2 by a high thermal conductive glue, the cold shield 1 is bonded to the cold shield support 5 by a high thermal conductive glue, an outer surface of the cold finger cylinder 2 supporting the cold shield support 5 is a conical surface, the optical filter 3 is mounted on the cold shield 1, and the cold shields 1 and 3 are bonded by a low temperature glue, the optical filter 3 is arranged right opposite to the detector chip 4, and the metal cold plate 6 and the detector chip 4 are positioned in a closed space formed by the cold screen 1, the optical filter 3 and the cold screen bracket 5. The optical filter 3 is positioned in the cold screen 1 and is arranged close to the detector chip 4, and the background noise above the detector chip 4 can be effectively suppressed by quickly cooling the optical filter 3.
The infrared detector component provided by the invention has no ceramic substrate, the size of the metal cold plate 6 is smaller and more compact, and the thermal mass of the Dewar is smaller; the detector chip 4 is directly attached to the metal cold plate 6, the cold energy is conducted more directly and more rapidly, and the detector chip 4 can realize rapid refrigeration starting; the cold shield 1 is arranged on the cold finger cylinder 2 through the cold shield bracket 5, so that the backflow cold energy generated by the throttling effect of the refrigerator is utilized to the maximum extent, and the heat exchange efficiency is improved; the optical filter 3 sinks to the surface of the chip and is inversely attached to the lowest stage light billows of the cold shield, so that the cooling time of the optical filter 3 is shortened, and the thermal noise is better inhibited.
In the invention, the infrared detector Dewar component cold head for rapid refrigeration comprises a metal cold plate 6, a cold screen 1, a cold screen bracket 5, an optical filter 3 and the like, an infrared detector chip 4 is directly attached to the metal cold plate 6 with high heat conduction material by adopting low-temperature glue with special proportion, and the cold energy of a refrigerator can be sufficiently and efficiently conducted to the detector chip 4, so that the chip is rapidly cooled. The cold shield 1 and the optical filter 3 are bonded through low-temperature glue to form a cold shield assembly, the cold shield assembly is fixedly mounted on the conical surface of the cold finger cylinder 2 through a cold shield support 5, and the two ends of the cold shield support 5 are bonded with the cold shield assembly and the cold finger cylinder 2 through bonding glue with good heat conductivity. This structure does not have ceramic substrate, only loads detector chip 4 on the cold dish, so the small and exquisite compactness that the size of metal cold dish 6 can be designed, thereby effectively reduced the thermal mass of dewar cold head, the limited cold volume that the refrigerator produced at first concentrates on making detector chip 4 cool down to the working temperature district fast, then through metal cold dish 6 and cold finger cylinder 2 backward flow recooling cold shield support 5, cold volume conducts to the cold shield subassembly through cold shield support 5, makes the cold shield subassembly cool down to detector working temperature district rapidly. The Dewar cold head is compact and reasonable in structure, skillfully utilizes the different working temperature area requirements of the detector chip 4 and the cold shield assembly, reasonably distributes limited cold quantity, can improve the heat exchange efficiency to the maximum extent and shorten the refrigeration time, and enables the detector chip to be cooled in a short time and to work normally.
The invention provides a detector chip packaging Dewar structure which is simple in structure, small in size and capable of rapidly refrigerating, wherein a cold shield 1 of a Dewar cold head is directly installed and fixed on a conical surface of a cold finger cylinder 2, so that a detector chip 4 can be cooled to a working temperature region in a very short time by efficiently utilizing backflow cold energy, and meanwhile, the Dewar structure has high reliability.
As shown in fig. 1, which is an overall schematic view of a dewar cold head of a cold shield support structure, a cold finger cylinder 2 and a metal cold plate 6 form a cold finger component by high temperature brazing, and the cold finger component is used as a cold platform carrier of a detector chip 4. Detector chip 4 directly bonds on small-size metal cold dish 6 through the low temperature glue of special ratio, and the cold volume of metal cold dish 6 can concentrate efficient conduction to detector chip 4, makes its rapid cooling to the operating temperature point, and cold shield support 5 bonds on cold finger cylinder 2 through high heat-conducting glue, and its position is in the below of metal cold dish 6, and cold shield 1 bonds through low temperature glue with light filter 3 and constitutes the cold shield subassembly, and the high heat-conducting glue of rethread bonds on cold shield support 5. The cold energy generated by the refrigerator is firstly quickly cooled on the metal cold plate 6 and then is conducted to the cold shield bracket 5 along the cold finger cylinder, the cold shield bracket 5 adopts a high heat conduction material, and the returned cold energy can be quickly transmitted to the cold shield 1 to cool the cold shield 1 so as to reduce the temperature of the cold shield to the temperature region where the detector chip 4 works. The optical filter 3 is inversely pasted on the cold screen 1 through low-temperature glue and is positioned on the upper surface of the detector chip 4, and the background noise above the detector chip 4 can be effectively inhibited through the rapid cooling of the optical filter 3. This cold shield supporting structure dewar cold head, furthest has utilized the limited cold volume that the refrigerator produced, improves cold volume utilization ratio, has realized in the very short time with dewar cold head cooling down cooling.
The working principle of the invention is similar to the heat conduction principle of a common Dewar cold head of the detector, the cold energy generated by the throttling effect of the refrigerator is used as the cold source of the Dewar cold head, and the cold energy is sequentially transmitted to the chip by the layer-by-layer structure of the Dewar cold head and provides a stable temperature field, so that the detector chip 4 can realize the normal low-temperature work. The invention has the advantages that the whole cold head can be rapidly cooled in a very short time to form a stable low-temperature field for providing a working platform for the chip, and the rapid refrigeration characteristic of the invention can play an important role in a plurality of application occasions.
The invention provides an infrared detector assembly for rapid refrigeration, which is simple in structure, can be rapidly cooled in a very short time, and is mainly suitable for an infrared guided weapon system for rapid refrigeration.
On the premise that the refrigerator assembly provides limited refrigerating capacity, the invention provides the Dewar cold head with the cold shield support structure through the research on a Dewar cold head heat transfer model, and the rapid refrigeration of the detector is realized.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (8)
1. An infrared detector assembly, comprising: including cold cylinder, the cold dish of indicating of metal, detector chip, cold screen support, cold screen and light filter, the cold open-top that indicates the cylinder of cold dish shutoff of metal, detector chip are located the cold dish of metal, the cold screen passes through the cold screen support and supports on cold cylinder of indicating, the light filter is installed on the cold screen, just the light filter is just setting up detector chip, the cold dish of metal and detector chip are located cold screen, light filter and cold screen support and enclose synthetic enclosure space.
2. The infrared detector assembly as set forth in claim 1, wherein: the optical filter is positioned in the cold screen and is close to the detector chip.
3. The infrared detector assembly as set forth in claim 1, wherein: the cold finger cylinder is connected with the metal cold plate through brazing.
4. The infrared detector assembly as set forth in claim 1, wherein: the detector chip is adhered to the metal cold plate through low-temperature glue.
5. The infrared detector assembly as set forth in claim 1, wherein: the outer surface of the cold finger cylinder supporting cold shield support is a conical surface.
6. The infrared detector assembly as set forth in claim 1, wherein: the cold shield support is bonded on the cold finger cylinder through high heat-conducting glue, and the cold shield is bonded on the cold shield support through the high heat-conducting glue.
7. The infrared detector assembly as set forth in claim 1, wherein: and the cold shield is bonded with the optical filter through low-temperature glue.
8. The infrared detector assembly as set forth in claim 1, wherein: the cold shield support is made of high heat conduction materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911315797.3A CN110987196A (en) | 2019-12-19 | 2019-12-19 | Infrared detector assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911315797.3A CN110987196A (en) | 2019-12-19 | 2019-12-19 | Infrared detector assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110987196A true CN110987196A (en) | 2020-04-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911315797.3A Pending CN110987196A (en) | 2019-12-19 | 2019-12-19 | Infrared detector assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110987196A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114353953A (en) * | 2022-01-13 | 2022-04-15 | 浙江珏芯微电子有限公司 | Dewar cold head for rapid refrigeration and infrared detector Dewar assembly |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203587126U (en) * | 2013-11-25 | 2014-05-07 | 中国电子科技集团公司第十一研究所 | Infrared detector |
| CN106342192B (en) * | 2012-01-05 | 2014-08-20 | 中国空空导弹研究院 | A kind of three chromakey detectors |
| CN104535193A (en) * | 2014-12-22 | 2015-04-22 | 中国电子科技集团公司第十一研究所 | Infrared focal plane detector component |
| CN106441401A (en) * | 2016-08-31 | 2017-02-22 | 武汉高芯科技有限公司 | Detachable integrated temperature changing testing Dewar and assembly thereof |
| CN207703339U (en) * | 2017-09-15 | 2018-08-07 | 武汉高芯科技有限公司 | Refrigeration mode Dewar component |
| CN209589250U (en) * | 2018-12-29 | 2019-11-05 | 武汉高德红外股份有限公司 | Refrigerated infrared detector and infrared equipment |
-
2019
- 2019-12-19 CN CN201911315797.3A patent/CN110987196A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106342192B (en) * | 2012-01-05 | 2014-08-20 | 中国空空导弹研究院 | A kind of three chromakey detectors |
| CN203587126U (en) * | 2013-11-25 | 2014-05-07 | 中国电子科技集团公司第十一研究所 | Infrared detector |
| CN104535193A (en) * | 2014-12-22 | 2015-04-22 | 中国电子科技集团公司第十一研究所 | Infrared focal plane detector component |
| CN106441401A (en) * | 2016-08-31 | 2017-02-22 | 武汉高芯科技有限公司 | Detachable integrated temperature changing testing Dewar and assembly thereof |
| CN207703339U (en) * | 2017-09-15 | 2018-08-07 | 武汉高芯科技有限公司 | Refrigeration mode Dewar component |
| CN209589250U (en) * | 2018-12-29 | 2019-11-05 | 武汉高德红外股份有限公司 | Refrigerated infrared detector and infrared equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114353953A (en) * | 2022-01-13 | 2022-04-15 | 浙江珏芯微电子有限公司 | Dewar cold head for rapid refrigeration and infrared detector Dewar assembly |
| CN114353953B (en) * | 2022-01-13 | 2024-04-12 | 浙江珏芯微电子有限公司 | Dewar cold head for rapid refrigeration and infrared detector Dewar assembly |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200410 |
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| RJ01 | Rejection of invention patent application after publication |