CN114353953A - Dewar cold head for rapid refrigeration and infrared detector Dewar assembly - Google Patents
Dewar cold head for rapid refrigeration and infrared detector Dewar assembly Download PDFInfo
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- CN114353953A CN114353953A CN202210038939.1A CN202210038939A CN114353953A CN 114353953 A CN114353953 A CN 114353953A CN 202210038939 A CN202210038939 A CN 202210038939A CN 114353953 A CN114353953 A CN 114353953A
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 19
- 239000000919 ceramic Substances 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000010409 thin film Substances 0.000 claims abstract description 10
- 230000003044 adaptive effect Effects 0.000 claims abstract description 8
- 238000001465 metallisation Methods 0.000 claims abstract description 8
- 230000003287 optical effect Effects 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 12
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 9
- 229910001374 Invar Inorganic materials 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 229910000833 kovar Inorganic materials 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 230000008646 thermal stress Effects 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
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Abstract
The invention provides a Dewar cold head for rapid refrigeration and an infrared detector Dewar component, wherein the Dewar cold head for rapid refrigeration comprises a cold finger cylinder, a cold stage, a ceramic substrate, a temperature sensor, a detector chip set, a cold shield and a low-temperature optical filter, wherein the bottom surface of the ceramic substrate is arranged on the cold stage, the top surface of the ceramic substrate is subjected to thin-film circuit metallization, the ceramic substrate is provided with a first mounting through hole and a second mounting through hole, the first mounting through hole is adaptive to the shape and the size of the temperature sensor, the second mounting through hole is adaptive to the shape and the size of the detector chip set, the second mounting through hole is communicated with the first mounting through hole, and a notch adaptive to cold shield mounting is cut on the non-bonding side of the ceramic substrate. The infrared detector Dewar type cold head can realize quick refrigeration, can reduce the thermal stress of a detector chip set, and has the advantages of short refrigeration and working response time, small heat loss and long service life.
Description
Technical Field
The invention relates to a Dewar cold head for rapid refrigeration and an infrared detector Dewar component, and belongs to the technical field of refrigeration infrared detectors.
Background
The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
At present, a refrigeration infrared detector mainly comprises a Dewar, a detector chip set and a refrigerator, wherein the Dewar provides a vacuum working environment for a Dewar cold head, the refrigerator provides cold energy for a Dewar cold head structure through the Dewar, the Dewar cold head is a laminated structure of a cold finger cylinder, a cold table, a ceramic substrate, the detector chip set and a cold screen, and all structures are bonded through corresponding bonding glue, and the structure has the following problems:
1. because the detector is in operation, the cold quantity provided by the refrigerator needs to be transmitted to the detector chip set, the cold stage, the ceramic substrate and each glue layer increase the thermal resistance of the refrigerator for transmitting the heat to the detector chip set, the refrigeration time and the working response time of the detector are increased, and the heat loss of the assembly is increased by the cold stage, the ceramic substrate and the adhesive;
2. the thermal expansion coefficient difference between the ceramic substrate and the detector chipset is large, the thermal expansion cannot be matched, the stress of the ceramic substrate to the detector chipset is large, and the performance of the detector chipset is reduced;
3. glue air release is a main reason influencing the vacuum life of the detector, and the service life of the detector is reduced due to air release of each layer of glue;
4. the traditional packaging technology is that two temperature sensors are bonded on a ceramic substrate, one is used for measuring temperature and the other is used for controlling temperature, and the two temperature sensors increase the refrigeration time and the working response time of a detector;
5. the cold screen of traditional packaging technology bonds on ceramic substrate, and cold volume is conducted on the cold screen through cold platform, ceramic substrate, and cold volume transmission efficiency is low.
It should be noted that the above background description is only for the convenience of clear and complete description of the technical solutions in the present specification and for the understanding of those skilled in the art. Such solutions are not considered to be known to the person skilled in the art merely because they have been set forth in the background section of the present specification.
Disclosure of Invention
The invention aims to solve the technical problems of the prior art and provides a Dewar cold head for rapid refrigeration and an infrared detector Dewar component.
The scheme is realized by the following technical measures: the utility model provides a dewar cold head for quick refrigeration, it includes cold finger cylinder, cold platform, ceramic substrate, temperature sensor, detector chip group, cold screen and low temperature light filter, ceramic substrate's bottom surface is installed on the cold platform, the top surface carries out thin film circuit metallization and is handled, sets up the installation through-hole one that suits with temperature sensor shape and size and the installation through-hole two that suits with detector chip group shape and size on ceramic substrate, installation through-hole two communicates with installation through-hole one, cuts out the breach that adapts to the installation of cold screen at ceramic substrate's non-bonded side.
Preferably, the packaging method is as follows:
s1: the bottom surface of the ceramic substrate is fixedly connected with the upper end of the cooling table through the adhesive;
s2: respectively arranging the temperature sensor and the detector chip set in the first mounting through hole and the second mounting through hole, and fixedly bonding the temperature sensor and the detector chip set with the upper end surface of the cold stage through bonding glue;
s3: after the bonding glue is solidified, bonding the detector chip set and the temperature sensor with a metalized area of the thin film circuit on the ceramic substrate respectively;
s4: placing the bonding end at the lower end of the cold shield at the notch on the ceramic substrate and bonding and fixing the bonding end with the cold shield bonding area of the cold stage through bonding glue;
s5: and bonding the low-temperature optical filter at the upper opening of the cold shield.
Preferably, the first mounting through hole is opened at a non-bonding side of the second mounting through hole.
Preferably, the cold platform is of a step cylinder structure, the cold platform is in airtight welding with the cold finger cylinder, and a groove is formed in the end face of the cold platform on the side welded with the cold finger cylinder.
Preferably, the cold stage is made of silicon carbide or aluminum nitride.
Preferably, the cold plate is made of 4J36 Invar alloy, 4J29 Kovar alloy, 4J32 super Invar alloy or Mo metal molybdenum.
The invention also provides an infrared detector dewar assembly which comprises the dewar cold head for rapid refrigeration.
The invention has the beneficial effects that:
1. in the invention, the end surface welded with the cold finger cylinder in the cold stage is provided with the groove, so that the lower end surface of the cold stage is thinned, the ceramic substrate is provided with the first mounting through hole, the second mounting through hole and the gap suitable for mounting the cold shield, the volumes of the cold stage and the ceramic substrate are reduced compared with the prior art, the distance of cold energy conducted to a chip is shorter, the cold energy loss is less, the overall heat loss of a Dewar cold head is reduced, the heat transfer resistance of the Dewar cold head is reduced, the refrigeration time is reduced, and the working response time of the infrared detector is effectively accelerated;
2. according to the invention, the temperature sensor, the detector chip set and the cold shield are directly fixed with the cold stage through the adhesive, so that a layer of adhesive and part of ceramic are reduced compared with the prior art, the heat load of the Dewar cold head is reduced, the influence of residual gas of the adhesive on the vacuum life of the detector is effectively reduced, and the service life of the detector is prolonged;
3. according to the invention, through processing the ceramic substrate, the detector chip set is directly bonded with the cold stage with a thermal expansion coefficient more similar to that of the cold stage, so that the stress influence of the ceramic substrate on the detector chip set is reduced, and the possibility of increasing blind pixels of the detector chip set is reduced;
4. according to the invention, the ceramic substrate is processed, the cold screen is directly bonded and fixed with the cold table, so that the loss of cold energy is reduced, the cooling rate of the cold screen and the lowest temperature of the cold screen are increased, the influence of background noise generated by the cold screen on the performance of a chip is reduced, and the response time of the infrared detector is favorably prolonged;
5. in the invention, the temperature sensor and the detector chip set are bonded on the same platform (cold platform), so that the monitored temperature is more accurate;
6. in the invention, the temperature measurement and control functions of the temperature sensor are combined into one temperature sensor, so that one part is reduced, and the thermal mass is reduced.
Therefore, compared with the prior art, the invention has prominent substantive features and remarkable progress, and the beneficial effects of the implementation are also obvious.
Drawings
Fig. 1 is a schematic sectional view of a dewar cold head for rapid cooling according to the present invention.
Fig. 2 is a schematic top view of a ceramic substrate.
In the figure, 1-ceramic substrate, 2-temperature sensor, 3-detector chip group, 4-cold screen, 5-gap, 6-cold stage, 7-cold finger cylinder, 8-groove, 9-installation through hole I, 10-installation through hole II, 11-bonding wire, 12-thin film circuit metallization processing area, and 13-low temperature optical filter.
Detailed Description
In order to clearly illustrate the technical features of the present solution, the following explains the present solution by way of specific embodiments and with reference to the accompanying drawings.
A Dewar cold head for rapid refrigeration is shown in the figure and comprises a cold finger cylinder 7, a cold table 6, a ceramic substrate 1, a temperature sensor 2, a detector chip set 3, a cold screen 4 and a low-temperature optical filter 13. The cooling table 6 is made of a composite ceramic material, and preferably, the cooling table 6 is made of silicon carbide or aluminum nitride. The cold stage 6 can also be made of metal materials, and preferably, the cold stage 6 is made of 4J36 Invar alloy, 4J29 Kovar alloy, 4J32 super Invar alloy or Mo metal molybdenum. The cold platform 6 is of a step cylinder structure, the cold platform 6 is in airtight welding with the cold finger cylinder 7, a groove 8 is formed in the end face of the cold platform 6, which is in welding side with the cold finger cylinder 7, the groove 8 enables the lower end face of the cold platform 6 to be thinned, the distance for conducting cold energy to the detector chip set 3 is shorter, the loss cold energy is less, and the heat transfer resistance of the Dewar cold head is reduced.
The detector chip group 3 consists of a silicon circuit and a detector chip, the silicon circuit is arranged below the detector chip and connected with the detector chip through inverse welding, and the silicon circuit is fixedly bonded with the cold stage 6 through bonding glueConstant, thermal expansion coefficient of (80k) silicon circuit at low temperature is 1.15X 10-6The cold stage 6 is made of silicon carbide, aluminum nitride, 4J36 Invar, 4J29 Kovar, 4J32 super Invar or Mo metal molybdenum with the thermal expansion coefficient more similar to that of silicon, so that the large stress on the detector chip set 3 in operation can be reduced.
The bottom surface of the ceramic substrate 1 is arranged on the cold stage 6, the top surface is subjected to thin film circuit metallization treatment, and the thin film circuit metallization treatment is realized by carrying out pattern metallization on the surface of the ceramic substrate 1 by utilizing the technologies of semiconductor thin film vacuum evaporation, electroplating, photoetching and the like, so that the ceramic substrate 1 has the function of electrical connection. A first mounting through hole 9 which is adaptive to the shape and the size of the temperature sensor 2 and a second mounting through hole 10 which is adaptive to the shape and the size of the detector chip set 3 are formed in the ceramic substrate 1, and the shape and the size of the first mounting through hole 9 are set according to the shape and the size of the temperature sensor 2, for example, the first mounting through hole 9 is a square hole of 0.7mm multiplied by 0.7 mm. The shape and size of the second mounting through hole 10 are set according to the shape and size of the detector chip set 3, for example, the second mounting through hole 10 is a rectangular hole of 12mm × 10 mm. The second mounting through hole 10 is communicated with the first mounting through hole 9, and the first mounting through hole 9 is arranged on the non-bonding side of the second mounting through hole 10.
A notch 5 is cut in the non-bonding side of the ceramic substrate 1 to accommodate the installation of the cold shield 4. After the notch 5 is formed in the ceramic substrate 1, the bonding end at the lower end of the cold screen 4 can be directly bonded and fixed with the cold table 6, so that the loss of cold energy is reduced, the cooling rate of the cold screen 4 and the lowest temperature of the cold screen 4 are accelerated, the influence of background noise generated by the cold screen 4 on the performance of the detector chip set 3 is reduced, and the response time of the infrared detector is favorably shortened.
The packaging method of the Dewar cold head for rapid refrigeration comprises the following steps:
s1: the bottom surface of the ceramic substrate 1 is fixedly connected with the upper end of the cold table 6 through adhesive;
s2: the temperature sensor 2 and the detector chip set 3 are respectively arranged in the first mounting through hole 9 and the second mounting through hole 10, and the temperature sensor 2 and the detector chip set 3 are fixedly connected with the upper end face of the cold stage 6 through adhesive; therefore, the detector chip set 3 is directly bonded with the cold stage 6 with a more similar thermal expansion coefficient, the stress influence of the ceramic substrate 1 on the detector chip set 3 is reduced, the condition of blind pixel failure of the detector chip set 3 is reduced, the temperature sensor 2 and the detector chip set 3 are bonded on the same platform (the cold stage 6), and the monitored temperature is more accurate;
s3: after the bonding glue is solidified, bonding the detector chip set 3 and the temperature sensor 2 with the area 12 of the ceramic substrate 1 subjected to the thin film circuit metallization treatment respectively;
s4: placing the bonding end at the lower end of the cold shield 4 at the notch 5 on the ceramic substrate 1 and fixedly bonding the bonding end with the cold shield bonding area of the cold stage 6 through bonding glue;
s5: the low temperature filter 13 is bonded to the upper opening of the cold shield 4.
The invention also provides an infrared detector dewar assembly which comprises the dewar cold head for rapid refrigeration.
The infrared detector is applied to the environment with ultrahigh vibration and ultrahigh acceleration, such as missile or aerospace, so the reliability requirement of the infrared detector is higher than that of the infrared detector used on the ground, and particularly for the bonding wire, the bonding wire with long length and large span cannot meet the use requirement in the high-strength environment.
In the infrared detector Dewar component, a detector chip set 3 is firstly in lead bonding with a ceramic substrate 1 and then in bonding with the Dewar through the ceramic substrate 1, an electric signal of the detector chip set 3 is led out, a bonding wire 11 has small span and short length, the swing amplitude of the bonding wire 11 along with vibration is greatly reduced, the possibility that the bonding wire 11 touches each other to generate short circuit phenomenon to cause the infrared detector failure is reduced, meanwhile, the swing amplitude of the bonding wire 11 is reduced, the reliability in application is greatly improved, the phenomenon that the detector chip set is pasted on a cold stage without a ceramic substrate is avoided, the electric signal of the detector chip set 3 is directly led out to the Dewar, the length of the bonding wire is longer, the bonding wire cannot bear ultrahigh-strength vibration and acceleration impact in missile flight, and the infrared detector is easy to break or is easy to collide with the short circuit in the missile flight to cause the infrared detector to lose response, the problems of task failure and great harm are easily caused.
Technical features not described in the present invention can be implemented by the prior art, and are not described in detail herein. The present invention is not limited to the above-described embodiments, and variations, modifications, additions and substitutions which are within the spirit of the invention and the scope of the invention may be made by those of ordinary skill in the art are also within the scope of the invention.
Claims (7)
1. The utility model provides a dewar cold head for quick refrigeration, it includes cold finger cylinder, cold platform, ceramic substrate, temperature sensor, detector chip group, cold screen and low temperature light filter, characterized by: the bottom surface of the ceramic substrate is arranged on a cold platform, the top surface of the ceramic substrate is subjected to thin film circuit metallization treatment, a first mounting through hole adaptive to the shape and size of the temperature sensor and a second mounting through hole adaptive to the shape and size of the detector chip set are formed in the ceramic substrate, the second mounting through hole is communicated with the first mounting through hole, and a notch adaptive to cold shield installation is cut at the non-bonding side of the ceramic substrate.
2. A dewar cold head for rapid cooling according to claim 1, wherein: the packaging method comprises the following steps:
s1: the bottom surface of the ceramic substrate is fixedly connected with the upper end of the cooling table through the adhesive;
s2: respectively arranging the temperature sensor and the detector chip set in the first mounting through hole and the second mounting through hole, and fixedly bonding the temperature sensor and the detector chip set with the upper end surface of the cold stage through bonding glue;
s3: after the bonding glue is solidified, bonding the detector chip set and the temperature sensor with a metalized area of the thin film circuit on the ceramic substrate respectively;
s4: placing the bonding end at the lower end of the cold shield at the notch on the ceramic substrate and bonding and fixing the bonding end with the cold shield bonding area of the cold stage through bonding glue;
s5: and bonding the low-temperature optical filter at the upper opening of the cold shield.
3. A dewar cold head for rapid cooling according to claim 2 wherein: the first mounting through hole is formed in the non-bonding side of the second mounting through hole.
4. A dewar cold head for rapid cooling according to claim 3 wherein: the cold platform is of a stepped cylinder structure, the cold platform is hermetically welded with the cold finger cylinder, and a groove is formed in the end face of the cold platform, which is on the side welded with the cold finger cylinder.
5. A dewar cold head for rapid cooling according to any one of claims 1 to 4, wherein: the cold stage is made of silicon carbide or aluminum nitride.
6. A dewar cold head for rapid cooling according to any one of claims 1 to 4, wherein: the cold stage is made of 4J36 invar alloy, 4J29 kovar alloy, 4J32 super invar alloy or Mo metal molybdenum.
7. An infrared detector dewar subassembly, characterized by: comprising a dewar cold head for rapid cooling according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210038939.1A CN114353953B (en) | 2022-01-13 | 2022-01-13 | Dewar cold head for rapid refrigeration and infrared detector Dewar assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210038939.1A CN114353953B (en) | 2022-01-13 | 2022-01-13 | Dewar cold head for rapid refrigeration and infrared detector Dewar assembly |
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| CN114353953A true CN114353953A (en) | 2022-04-15 |
| CN114353953B CN114353953B (en) | 2024-04-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116164846A (en) * | 2023-04-23 | 2023-05-26 | 山西创芯光电科技有限公司 | Packaging structure and packaging method for Dewar cold head of infrared detector |
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| Publication number | Publication date |
|---|---|
| CN114353953B (en) | 2024-04-12 |
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