CN116164846A - Packaging structure and packaging method for Dewar cold head of infrared detector - Google Patents
Packaging structure and packaging method for Dewar cold head of infrared detector Download PDFInfo
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- CN116164846A CN116164846A CN202310440140.XA CN202310440140A CN116164846A CN 116164846 A CN116164846 A CN 116164846A CN 202310440140 A CN202310440140 A CN 202310440140A CN 116164846 A CN116164846 A CN 116164846A
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- lead
- cold head
- cylindrical
- ceramic substrate
- dewar cold
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000000919 ceramic Substances 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 48
- 230000002093 peripheral effect Effects 0.000 claims abstract description 14
- 229910000679 solder Inorganic materials 0.000 claims abstract description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 12
- 239000010931 gold Substances 0.000 claims description 12
- 229910052737 gold Inorganic materials 0.000 claims description 12
- 238000003698 laser cutting Methods 0.000 claims description 12
- 210000001503 joint Anatomy 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- 238000004080 punching Methods 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003331 infrared imaging Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000004297 night vision Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The invention provides a packaging structure and a packaging method for a Dewar cold head of an infrared detector, wherein the packaging structure comprises the following steps: the detector chip is arranged in the center of the ceramic substrate, a plurality of cylindrical lead electrodes are arranged along the peripheral position of the ceramic substrate, each cylindrical lead electrode is hollow and cylindrical, and a lead column hole site is arranged in each cylindrical lead electrode; the Dewar cold head is provided with a plurality of lead columns along the peripheral position of the Dewar cold head; wherein the plurality of lead posts are inserted into the plurality of cylindrical lead electrodes and reinforced at the connection portions of the plurality of lead posts and the plurality of cylindrical lead electrodes with solder. The electric connection is realized by inserting the lead post of the Dewar cold head into the lead post hole site on the ceramic substrate, so that the quick, accurate and firm package can be realized, and the electric connection of the package structure can not be influenced by external shaking.
Description
Technical Field
The invention relates to the technical field of infrared detectors, in particular to a packaging structure and a packaging method for a Dewar cold head of an infrared detector.
Background
The infrared detector technology has the characteristics of passive detection, high detection precision and strong environmental adaptability, and is widely applied to the fields of early warning detection, intelligence reconnaissance, accurate striking, night vision, astronomical observation and the like. In order to meet the application requirements of large-field-of-view, high-spatial resolution and miniaturized infrared imaging systems, large-area array, miniaturized and high-reliability detector assemblies are important in recent years. Ceramic substrates are an important connection component in infrared detector dewar assemblies, typically as a connection intermediary for the chip and dewar.
In the application environment of the detector assembly, strong mechanical stress, stable shape, high strength and strong binding force are generally required. In addition, as the wave band detected by the detector is larger and larger, requirements on resistance, heat consumption and noise in the package are higher and higher, which provides a very high challenge for the connection of the ceramic substrate and the Dewar.
Fig. 1 shows a prior art Dewar cold head for an infrared detector. Fig. 2 shows a ceramic substrate for an infrared detector according to the prior art. Fig. 3 shows a prior art package of a ceramic substrate for an infrared detector and a dewar coldhead. In the prior art, the lead post 102 of the Dewar cold head 101 is connected with the lead electrode 201 of the ceramic substrate through the enamel wire 302, and the connection is reinforced by the solder 301. The ceramic substrate and the Dewar are connected by enamelled wires and soldering tin. However, under the condition of high-intensity vibration, the enameled wire is easy to shake sometimes even severely. Under the condition that the enameled wire continuously shakes, the connection between the enameled wire and the lead electrode is easy to fall off, so that faults occur.
In the practical application process, after the detector component is influenced by severe external force, the ceramic substrate and the dewar are connected to generate a falling phenomenon, and a reinforcing method for the connection of the ceramic substrate and the dewar is needed, so that the weight and the heat consumption of the detector component are not greatly increased, the capacity of the detector for resisting vibration and impact load can be enhanced, and the working reliability of the detector is ensured.
The present invention seeks to solve the above problems.
Disclosure of Invention
The invention aims to solve the problem that the Dewar cold head and a ceramic substrate are easy to break due to frequent shaking in the prior art, and provides a packaging structure and a packaging method for the Dewar cold head of an infrared detector.
An embodiment of a first aspect of the present invention provides a packaging structure for a Dewar cold head of an infrared detector, including: the detector chip is arranged in the center of the ceramic substrate, a plurality of cylindrical lead electrodes are arranged along the peripheral position of the ceramic substrate, each cylindrical lead electrode is hollow and cylindrical, and a lead column hole site is arranged in each cylindrical lead electrode; the Dewar cold head is provided with a plurality of lead posts along the peripheral position of the Dewar cold head, and the positions of the plurality of lead posts correspond to the positions of the plurality of cylindrical lead electrodes when the Dewar cold head is in butt joint with the ceramic substrate; wherein the plurality of lead posts are inserted into the plurality of cylindrical lead electrodes and reinforced at the connection portions of the plurality of lead posts and the plurality of cylindrical lead electrodes with solder.
Further, a gold plating process is performed on the surfaces of the detector chip and the cylindrical lead electrode of the ceramic substrate.
Further, the thickness of the deposited gold is 0.6mm.
Further, the hole site of the lead post is completed by laser cutting and punching.
Further, the laser cutting perforation diameter was 1.3mm.
An embodiment of a second aspect of the present invention provides a method for packaging a packaging structure for a Dewar cold head of an infrared detector, including: providing a ceramic substrate, wherein a detector chip is arranged in the center of the ceramic substrate, a plurality of cylindrical lead electrodes are arranged along the peripheral position of the ceramic substrate, each cylindrical lead electrode is hollow and cylindrical, and a lead column hole site is arranged in each cylindrical lead electrode; providing a Dewar cold head, wherein a plurality of lead posts are arranged along the peripheral position of the Dewar cold head, and the positions of the plurality of lead posts correspond to the positions of the plurality of cylindrical lead electrodes when the Dewar cold head is in butt joint with the ceramic substrate; and inserting the plurality of lead posts into the plurality of cylindrical lead electrodes, and reinforcing the joints of the plurality of lead posts and the plurality of cylindrical lead electrodes by using solder to form the packaging structure for the infrared detector Dewar cold head.
Further, a gold plating process is performed on the surfaces of the detector chip and the cylindrical lead electrode of the ceramic substrate.
Further, the thickness of the deposited gold is 0.6mm.
Further, the hole site of the lead post is completed by laser cutting and punching.
Further, the laser cutting perforation diameter was 1.3mm.
According to the packaging structure and the packaging method for the Dewar cold head of the infrared detector, the lead post of the Dewar cold head is inserted into the lead post hole site on the ceramic substrate to realize electric connection, so that quick, accurate and firm packaging can be realized, the electric connection of the packaging structure is not influenced by external shaking, the problem that an enameled wire falls off is solved, the reliability of the infrared detector is enhanced, and the service life of the infrared detector is greatly prolonged.
Drawings
Fig. 1 is a schematic diagram of a prior art Dewar cold head for an infrared detector.
Fig. 2 is a schematic diagram of a ceramic substrate for an infrared detector according to the prior art.
Fig. 3 is a schematic diagram of a prior art package of a ceramic substrate for an infrared detector and a dewar coldhead.
Fig. 4 is a schematic view of a ceramic substrate for an infrared detector according to an embodiment of the present invention.
Fig. 5 is a schematic diagram of a ceramic substrate for an infrared detector and a dewar coldhead package according to an embodiment of the present invention.
Reference numerals:
101: a Dewar cold head; 102: a lead post; 103: fixing the hole site;
201: a lead electrode; 202: a chip;
301: soldering tin; 302: enamelled wires;
401: a cylindrical lead electrode; 402: a lead post hole site; 403: a detector chip;
501: and a lead post.
Description of the embodiments
For a further understanding of the objects, construction, features, and functions of the invention, reference should be made to the following detailed description of the preferred embodiments.
As shown in fig. 4 and 5, an embodiment of the first aspect of the present invention provides a packaging structure for a dewar cold head of an infrared detector, including: a ceramic substrate, a detector chip 403 is arranged in the center of the ceramic substrate, a plurality of cylindrical lead electrodes 401 are arranged along the peripheral position of the ceramic substrate, each cylindrical lead electrode 401 is in a hollow cylindrical shape, and a lead column hole site 402 is arranged in each cylindrical lead electrode 401; the Dewar cold head is provided with a plurality of lead posts 501 along the peripheral position of the Dewar cold head, and the positions of the plurality of lead posts 501 correspond to the positions of the plurality of cylindrical lead electrodes 401 when the Dewar cold head is in butt joint with the ceramic substrate; wherein the plurality of lead posts 501 are inserted into the plurality of cylindrical lead electrodes 401 and are reinforced at the connection portions of the plurality of lead posts 501 and the plurality of cylindrical lead electrodes 401 with solder 301. The electric connection is realized by inserting the lead post of the Dewar cold head into the lead post hole site on the ceramic substrate, so that the quick, accurate and firm packaging can be realized, the electric connection of the packaging structure is not affected by external shaking, and the problem that the enameled wire falls off is solved.
Further, a gold plating process is performed on the surfaces of the detector chip and the cylindrical lead electrode of the ceramic substrate, and the thickness of the gold plating is 0.6mm, so that conductivity is enhanced and protection is provided.
Further, the hole site of the lead column is completed by laser cutting and punching, and the diameter of the laser cutting and punching is 1.3mm.
An embodiment of a second aspect of the present invention provides a method for packaging a packaging structure for a Dewar cold head of an infrared detector, including: providing a ceramic substrate, wherein a detector chip 403 is arranged in the center of the ceramic substrate, a plurality of cylindrical lead electrodes 401 are arranged along the peripheral position of the ceramic substrate, each cylindrical lead electrode 401 is hollow and cylindrical, and a lead column hole site 402 is arranged in each cylindrical lead electrode 401; providing a Dewar cold head, wherein a plurality of lead posts 501 are arranged along the peripheral position of the Dewar cold head, and the positions of the plurality of lead posts 501 correspond to the positions of the plurality of cylindrical lead electrodes 401 when the Dewar cold head is in butt joint with the ceramic substrate; and inserting the plurality of lead posts 501 into the plurality of cylindrical lead electrodes 401, and reinforcing the joints of the plurality of lead posts 501 and the plurality of cylindrical lead electrodes 401 by using soldering tin 301 to form the packaging structure for the infrared detector Dewar cold head. The electric connection is realized by inserting the lead post of the Dewar cold head into the lead post hole site on the ceramic substrate, so that the quick, accurate and firm packaging can be realized, the electric connection of the packaging structure is not affected by external shaking, and the problem that the enameled wire falls off is solved.
Further, a gold plating process is performed on the surfaces of the detector chip and the cylindrical lead electrode of the ceramic substrate, and the thickness of the gold plating is 0.6mm, so that conductivity is enhanced and protection is provided.
Further, the hole site of the lead column is completed by laser cutting and punching, and the diameter of the laser cutting and punching is 1.3mm.
According to the packaging method for the packaging structure of the Dewar cold head of the infrared detector, the lead post of the Dewar cold head is inserted into the lead post hole site on the ceramic substrate to realize electric connection, so that quick, accurate and firm packaging can be realized, the electric connection of the packaging structure is not influenced by external shaking, the problem that an enameled wire falls off is solved, the reliability of the infrared detector is enhanced, and the service life of the infrared detector is greatly prolonged.
In the description of the present invention, it should be understood that the terms "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer" orientation or positional relationship are merely for convenience of description and to simplify the description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.
The invention has been described with respect to the above-described embodiments, however, the above-described embodiments are merely examples of practicing the invention. It should be noted that the disclosed embodiments do not limit the scope of the invention. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.
Claims (10)
1. A package structure for an infrared detector dewar cold head, comprising:
the detector chip is arranged in the center of the ceramic substrate, a plurality of cylindrical lead electrodes are arranged along the peripheral position of the ceramic substrate, each cylindrical lead electrode is hollow and cylindrical, and a lead column hole site is arranged in each cylindrical lead electrode; and
the Dewar cold head is provided with a plurality of lead posts along the peripheral position of the Dewar cold head, and the positions of the plurality of lead posts correspond to the positions of the plurality of cylindrical lead electrodes when the Dewar cold head is in butt joint with the ceramic substrate;
wherein the plurality of lead posts are inserted into the plurality of cylindrical lead electrodes and reinforced at the connection portions of the plurality of lead posts and the plurality of cylindrical lead electrodes with solder.
2. The package structure for the Dewar cold head of the infrared detector according to claim 1, wherein a gold plating process is performed on the surfaces of the detector chip and the cylindrical lead electrode of the ceramic substrate.
3. The package structure for the infrared detector dewar cold head as claimed in claim 2, wherein the gold deposit thickness is 0.6mm.
4. The package structure for an infrared detector dewar cold head as claimed in claim 1, wherein the lead post hole site is formed by laser cutting and punching.
5. The package structure for an infrared detector dewar cold head as claimed in claim 1, wherein the laser cutting perforation diameter is 1.3mm.
6. A packaging method for a packaging structure of a Dewar cold head of an infrared detector, comprising:
providing a ceramic substrate, wherein a detector chip is arranged in the center of the ceramic substrate, a plurality of cylindrical lead electrodes are arranged along the peripheral position of the ceramic substrate, each cylindrical lead electrode is hollow and cylindrical, and a lead column hole site is arranged in each cylindrical lead electrode;
providing a Dewar cold head, wherein a plurality of lead posts are arranged along the peripheral position of the Dewar cold head, and the positions of the plurality of lead posts correspond to the positions of the plurality of cylindrical lead electrodes when the Dewar cold head is in butt joint with the ceramic substrate; and
and inserting the plurality of lead posts into the plurality of cylindrical lead electrodes, and reinforcing the joints of the plurality of lead posts and the plurality of cylindrical lead electrodes by using soldering tin to form the packaging structure for the infrared detector Dewar cold head.
7. The method of claim 6, wherein the surface of the ceramic substrate and the surface of the cylindrical lead electrode are subjected to a gold plating process.
8. The method of claim 7, wherein the thickness of the immersion gold is 0.6mm.
9. The method of claim 6, wherein the hole sites of the lead posts are formed by laser cutting and punching.
10. The method for packaging a packaging structure for an infrared detector dewar cold head as claimed in claim 6, wherein the laser cutting perforation diameter is 1.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310440140.XA CN116164846A (en) | 2023-04-23 | 2023-04-23 | Packaging structure and packaging method for Dewar cold head of infrared detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310440140.XA CN116164846A (en) | 2023-04-23 | 2023-04-23 | Packaging structure and packaging method for Dewar cold head of infrared detector |
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| Publication Number | Publication Date |
|---|---|
| CN116164846A true CN116164846A (en) | 2023-05-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310440140.XA Pending CN116164846A (en) | 2023-04-23 | 2023-04-23 | Packaging structure and packaging method for Dewar cold head of infrared detector |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117889965A (en) * | 2024-03-15 | 2024-04-16 | 山西创芯光电科技有限公司 | Performance test method of medium-short wave double-color infrared detector |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2861992Y (en) * | 2005-09-09 | 2007-01-24 | 昆明物理研究所 | Micro-vacuometer built-in infrared detector dewar assembly |
| CN109084902A (en) * | 2018-08-14 | 2018-12-25 | 中国电子科技集团公司第十研究所 | Dewar and Dewar component are surveyed in chip testing alternating temperature |
| CN114353953A (en) * | 2022-01-13 | 2022-04-15 | 浙江珏芯微电子有限公司 | Dewar cold head for rapid refrigeration and infrared detector Dewar assembly |
-
2023
- 2023-04-23 CN CN202310440140.XA patent/CN116164846A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2861992Y (en) * | 2005-09-09 | 2007-01-24 | 昆明物理研究所 | Micro-vacuometer built-in infrared detector dewar assembly |
| CN109084902A (en) * | 2018-08-14 | 2018-12-25 | 中国电子科技集团公司第十研究所 | Dewar and Dewar component are surveyed in chip testing alternating temperature |
| CN114353953A (en) * | 2022-01-13 | 2022-04-15 | 浙江珏芯微电子有限公司 | Dewar cold head for rapid refrigeration and infrared detector Dewar assembly |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117889965A (en) * | 2024-03-15 | 2024-04-16 | 山西创芯光电科技有限公司 | Performance test method of medium-short wave double-color infrared detector |
| CN117889965B (en) * | 2024-03-15 | 2024-05-24 | 山西创芯光电科技有限公司 | Performance test method of medium-short wave double-color infrared detector |
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