CN109084902A - Dewar and Dewar component are surveyed in chip testing alternating temperature - Google Patents
Dewar and Dewar component are surveyed in chip testing alternating temperature Download PDFInfo
- Publication number
- CN109084902A CN109084902A CN201810923435.1A CN201810923435A CN109084902A CN 109084902 A CN109084902 A CN 109084902A CN 201810923435 A CN201810923435 A CN 201810923435A CN 109084902 A CN109084902 A CN 109084902A
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- dewar
- shell
- refrigeration machine
- cold
- cold head
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- 238000012360 testing method Methods 0.000 title claims abstract description 23
- 238000005057 refrigeration Methods 0.000 claims abstract description 39
- 238000007789 sealing Methods 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 18
- 239000012212 insulator Substances 0.000 claims description 12
- 239000011152 fibreglass Substances 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 5
- 230000017525 heat dissipation Effects 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
- 239000007788 liquid Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- 239000005030 aluminium foil Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910001069 Ti alloy Inorganic materials 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000003471 anti-radiation Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0205—Mechanical elements; Supports for optical elements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Testing Resistance To Weather, Investigating Materials By Mechanical Methods (AREA)
Abstract
The invention discloses Dewar and Dewar component are surveyed in a kind of chip testing alternating temperature, the Dewar includes shell, the first cold finger, cold head inside the shell is set, window assembly, connector outside shell are set, exhaust nozzle on the shell is set, the bottom of the shell is equipped with the flange for connecting refrigeration machine, and the first cold finger in the shell is made of the support tube of multilayer hollow, and the inner cavity of the support tube is for being nested in outside the second cold finger of the refrigeration machine.Middle survey Dewar of the invention adopts the test that can be realized low temperature chip.
Description
Technical field
The present invention relates to detector fields, and in particular to Dewar and Dewar component are surveyed in a kind of chip testing alternating temperature.
Background technique
Infrared detector technology has the characteristics that passive detection, detection accuracy is high, environmental suitability is strong, is widely used in night
Depending on fields such as, astronomical observations.
It after the completion of infrared detector chip preparation, before carrying out formal component package, is tested, to examine
Its electric property, this process are known as surveying in chip.Surveying in chip is that infrared detector semiconductor product must during realization
Indispensable step.A low temperature environment is provided for infrared detector chip by middle survey Dewar, examines infrared detector chip
Whether can be realized set function, provides a kind of measurement for the q&r of final products.Current test method master
Low temperature environment is provided using the relatively common cryogenic liquid (refrigeration working medium) such as liquid nitrogen, liquid helium, liquid argon, and due to these low temperature
The special nature of liquid determines the design feature of refrigerated storage tank.
In recent years, as the rapid development of refrigeration type infrared detector technology, long wave or very long wave component need work to exist
The operating temperature of 60K or 55K.It surveys Dewar in existing liquid nitrogen to be limited by refrigeration working medium, survey Dewar is merely able to interior in liquid nitrogen
Portion pours into liquid nitrogen, so that chip is reduced to 77K temperature using liquid nitrogen, temperature fall time, rate of temperature fall fixation are non-adjustable, and temperature is not
77K can be dropped to hereinafter, therefore making for surveying Dewar in distinct temperature (low temperature that temperature is lower than 77K) chip to be unable to satisfy
Use demand.
Summary of the invention
The present invention, which provides, surveys Dewar and Dewar component in a kind of chip testing alternating temperature, can be realized the survey of low temperature chip
Examination.
According to one aspect of the present invention, a kind of chip testing is provided with Dewar, including shell is surveyed in alternating temperature, and setting is outside
Window assembly, connector outside shell is arranged in the first cold finger, cold head in shell, and exhaust nozzle on the shell is arranged, described outer
The bottom of shell is equipped with the flange for connecting refrigeration machine, and the first cold finger in the shell is made of the support tube of multilayer hollow,
The inner cavity of the support tube is for being nested in outside the second cold finger of the refrigeration machine.
Optionally, in Dewar of the present invention, the support tube of the multilayer hollow includes thin-wall tube and glass reinforced plastic pipe, described
Glass reinforced plastic pipe is set in outside the thin-wall tube.
Optionally, in Dewar of the present invention, one or more layers radiation protection is additionally provided with outside the support tube of the multilayer hollow
Shielded layer.
Optionally, in Dewar of the present invention, the bottom of the shell is also provided with for radiating to the refrigeration machine
Annular thermal trough or/and seal groove, interior first be equipped with for sealing the shell and the refrigeration machine of the seal groove
Sealing ring.
Optionally, in Dewar of the present invention, the two sides of the shell are respectively equipped with outwardly extending junction block, described each
The insulator for connecting the lead of the connector and the cold head, the shell and the insulation are respectively provided on junction block
It is equipped between son for sealing fixed low temperature glue.
Optionally, in Dewar of the present invention, the window seat of the window assembly is fixed on the upper shell by nut
Portion is additionally provided with the second sealing ring between the window seat and shell of the window assembly.
Optionally, the connection in Dewar of the present invention, between the shell and first cold finger and the exhaust nozzle
Place is equipped with for sealing fixed low temperature glue.
Optionally, in Dewar of the present invention, the junction between the cold head and first cold finger is equipped with for close
The fixed low temperature glue of sealing.
Optionally, in Dewar of the present invention, the binding post of the cold head is made of Plug pin patch bay and contact pin tack two parts
Detachable contact pin structure, the Plug pin patch bay are fixed on the dead ring of the cold head, and the contact pin tack is described for welding
The lead of cold head.
According to another aspect of the invention, a kind of chip testing is provided with surveying Dewar component in alternating temperature, which is characterized in that
Including Dewar and refrigeration machine, the Dewar uses Dewar described above, and the Dewar passes through the expanding machine of flange and refrigeration machine
It is connected.
Beneficial effects of the present invention: infrared detector chip test is being carried out using Dewar is surveyed in alternating temperature proposed by the present invention
When, it is coupled with refrigeration machine, is driven using refrigeration machine and carry out temperature control, so as to reach the special temperature between 60K-300K
Degree regulation solves current conventional liquid nitrogen test Dewar and is unable to satisfy the job requirement of certain special test temperatures, and has
The features such as assembly test is simple and convenient, reusable.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And it can be implemented in accordance with the contents of the specification, and in order to allow above and other objects of the present invention, feature and advantage can
It is clearer and more comprehensible, the followings are specific embodiments of the present invention.
Detailed description of the invention
By reading the following detailed description of the preferred embodiment, various other advantages and benefits are common for this field
Technical staff will become clear.The drawings are only for the purpose of illustrating a preferred embodiment, and is not considered as to the present invention
Limitation.And throughout the drawings, the same reference numbers will be used to refer to the same parts.In the accompanying drawings:
The structural schematic diagram of Dewar is surveyed in the chip testing alternating temperature that Fig. 1 provides for first embodiment of the invention；
Fig. 2 is the structural schematic diagram of shell in first embodiment of the invention；
Fig. 3 is the inverted structural schematic diagram of shell in Fig. 2；
Fig. 4 is the structural schematic diagram of cold head, the first cold finger in first embodiment of the invention；
Fig. 5 is the enlarged diagram of dead ring and binding post in Fig. 4；
Fig. 6 is the assembling schematic diagram of shell and cold head and cold screen in first embodiment of the invention；
The structural schematic diagram of Dewar component is surveyed in the chip testing alternating temperature that Fig. 7 provides for second embodiment of the invention.
In attached drawing, 1 is window, and 2 be window seat, and 3 be nut, and 4 be shell, and 4-1 is flange positioning region, 4-2 is that annular is thermally conductive
Slot, 4-3 are seal groove, and 4-4 is junction block, and 4-5 is insulator, and 5 be exhaust nozzle, and 6 be flange, and 7 be cold screen, and 8 be connector,
9 be the first cold finger, and 10 be cold head, and 11 be dead ring, and 12 be binding post, and 12-1 is contact pin tack, and 12-2 is Plug pin patch bay, and 13 be to draw
Line, 14 be the compressor of refrigeration machine, and 15 be the expanding machine of refrigeration machine.
Specific embodiment
Exemplary embodiments of the present disclosure are described in more detail below with reference to accompanying drawings.Although showing the disclosure in attached drawing
Exemplary embodiment, it being understood, however, that may be realized in various forms the disclosure without should be by embodiments set forth here
It is limited.On the contrary, these embodiments are provided to facilitate a more thoroughly understanding of the present invention, and can be by the scope of the present disclosure
It is fully disclosed to those skilled in the art.
In the first embodiment of the present invention, a kind of chip testing is provided with Dewar is surveyed in alternating temperature, referring to Fig. 1, Fig. 2 and figure
Shown in 3, including shell 4, the first cold finger 9, cold head 10 in shell 4 are set, window assembly outside shell 4, connection are set
The exhaust nozzle 5 on shell 4 is arranged in device 8, is vacuum-evacuated by 5 pairs of inside of the exhaust nozzle, makes detector chip to be tested
In low-temperature vacuum environment.The bottom of the shell 4 is equipped with the flange 6 for connecting refrigeration machine, and the bottom of the shell 4 is equipped with
Flange positioning region 4-1, by flange positioning region 4-1 connecting flange, the flange is made of TC4 titanium alloy, heat-insulating property ratio
Stainless steel material is good, has certain restriction effect, alternating temperature Dewar appearance temperature when reducing work for refrigeration machine fever conduction
Degree.The first cold finger 9 in the shell is made of the support tube of multilayer hollow, and the inner cavity of the support tube is described for being nested in
Second cold finger outer wall of refrigeration machine.
In one specific embodiment of the present embodiment, the support tube of the multilayer hollow includes thin-wall tube and glass reinforced plastic pipe,
The glass reinforced plastic pipe is set in outside the thin-wall tube.Specifically, the present embodiment uses a thin-wall tube and a glass reinforced plastic pipe, institute
Thin-wall tube is stated using thin-wall tube made of TC4 titanium alloy, the glass reinforced plastic pipe is using glass reinforced plastic pipe made of expoxy glass.The branch
Stay tube can not only guarantee air-tightness, also have certain mechanic properties.
Further: one or more layers radiation-resistant glass layer, the anti-spoke are additionally provided with outside the support tube of the multilayer hollow
Shielded layer is penetrated using aluminium foil film (paper), by the way that the aluminium foil film to be wrapped on the glass reinforced plastic pipe of support outer tube layer.Aluminium foil is formed
Radiation-resistant glass layer, plays a role in insulation, and reduces the heat load of alternating temperature Dewar.Theory can be passed through for the number of plies of radiation-resistant glass layer
It calculates rational and wraps up the number of plies, or design the number of plies according to the design needs.Since the middle leakage heat for surveying Dewar is mainly conductive heat leakage
Middle survey Dewar design with radiation leakage heat, the present embodiment has vacuum layer, is in chip in vacuum environment, and leakage hot mode is mainly
Radiation leakage heat, while the wrapped multiple aluminium foil on the first cold finger outer wall, form anti-radiation insulation screen, reduce radiation leakage heat, guarantee
It is middle survey Dewar and refrigeration machine coupled after can reach the temperature of refrigeration machine setting, lower leakage heat, so that cold head part is surveyed
It is with good stability to try temperature.
The present invention couples survey Dewar in alternating temperature with refrigeration machine by the flange 6 of bottom, the second cold finger of refrigeration machine
It surveys in insertion in the first cold finger of Dewar and is bonded with cold head, by driving the controller of refrigeration machine, adjustable chip testing
Temperature fall time and temperature, cool down to cold head, and the detector chip on cold head is made to reach predetermined work temperature, realize 300K-
Chip testing temperature within the scope of 60K, the refrigeration machine in the present embodiment use sterlin refrigerator.
In an alternative embodiment of the invention, referring to fig. 4 and shown in Fig. 5, the cold head 10 is equipped with dead ring 11, wiring
Column 12 and lead 13, the binding post 12 of the cold head 10 are made of detachable Plug pin patch bay 12-2 and contact pin tack 12-1 two parts
Contact pin structure, the Plug pin patch bay 12-2 are fixed on the dead ring 11 of the cold head 10, and the contact pin tack 12-1 is for welding
The lead 13 of the cold head 10, the lead are around on binding post 12 with cold head 10 across dead ring 11 and are connected by low temperature brazing,
The other end is welded on insulator 4-5, and the signal as chip is drawn.The present embodiment binding post uses bi-body structure, repeatedly welds
Contact pin structure can be directly replaced after connecing, and be easily changed；Contact pin structure is directly welded in convenient for the lead-out wire of chip by bonding machine
It is easily operated to improve efficiency and soldering reliability to substitute human weld on contact pin tack.The cold head is arranged in the first cold finger
On, which provides signal for it and draws environment for assembling detector chip.Further, the cold head top assembly is cold
Screen, it is shown in Figure 6, optical field of view is provided for detector chip.
In another alternative embodiment of the invention, shown referring to figs. 2 and 3, the two sides of the shell 4 are respectively equipped with outward
Drawing for the connection connector 8 and the cold head 10 is respectively provided on the junction block 4-4, each junction block 4-4 of extension
The insulator 4-5 of line is equipped between the shell 4 and the insulator 4-5 for sealing fixed low temperature glue.Insulator 4-5
It is assemblied on shell 4, realizes that aerial lug 8 and the transition of internal cold head 10 are connect, the present embodiment is drawn with insulator and substituted
The mode that the lead of cold head is directly led out guarantees the reliability of air-tightness and the lead.Middle survey Dewar two sides are connected by insulator
The connector connect is used for the I/O interface of infrared detector, docks with test macro.
Shown in Figure 3 in another alternative embodiment of the invention, the bottom of the shell 4 is also provided with for institute
The annular thermal trough 4-2 or/and seal groove 4-3, the annular thermal trough 4-2 for stating refrigeration machine heat dissipation are located at flange positioning
The side of portion 4-1, the present embodiment open up there are two annular thermal trough, are located at the two sides of flange positioning region 4-1, pass through shell
The annular thermal trough that bottom opens up reduces the conduction heat of refrigeration machine.It is equipped in the seal groove 4-3 for sealing the shell
With the first sealing ring of the refrigeration machine, the innermost circle of outer casing bottom is arranged in the seal groove, and first sealing ring is adopted
It with O-ring seal, is sealed by the first sealing ring, has ensured the air-tightness between shell and refrigeration machine.
In another alternative embodiment of the invention, between the shell 4 and first cold finger 9 and the exhaust nozzle 5
Junction is equipped with for sealing fixed low temperature glue.Junction between the cold head 10 and first cold finger 9, which is equipped with, to be used
In the low temperature glue that sealing is fixed.Survey Dewar in alternating temperature and use metal structure, material is selected as 2A12 material, heating conduction compared with
It is good, it is fixed by low temperature glue, low temperature glue has good adhesive property in 60K or so temperature, guarantees the airtight of alternating temperature Dewar
Property.
In another alternative embodiment of the invention, the window seat 2 of the window assembly is fixed on the housing by nut
End, is additionally provided with the second sealing ring between the window seat 2 and shell 4 of the window assembly, second sealing ring uses O-shaped sealing
Circle, window seat 2 are fixed on shell in such a way that O-ring seal seals, and window 1 is bonded on window seat to meet detector chip survey
Try optical signal requirement.
Dewar is surveyed in the present embodiment can couple a variety of refrigeration machines, and middle survey Dewar passes through change the first Cold finger Size cooperation system
Cold meets more requirements.It is simple that Dewar overall structure is surveyed in this, is simplified assembly technology, is reduced and need to seal
Connector quantity has reduced gas leakage risk caused by assembly overlaps.Survey in this Dewar in chip testing use can Reusability,
77K temperature limiting that is simple and convenient, while breaching common Dewar container for liquefied nitrogen is dismounted, can satisfy the special test temperature of chip.
The assembly technology of the present embodiment, as follows:
1. carrying out dispensing after the binding post and dead ring assembly on cold head, it is fixed using frock clamp, to low temperature glue
After solidification, by dead ring centered assembling on cold head, and the cementing fixation of low temperature glue is used；
2. reassembling epoxy FRP pipes after the assembly of the titanium alloy thin-walled tube of cold head and the first cold finger, join solid
Fixed, after low temperature adhesive curing, the wrapped multiple aluminium foil on epoxy FRP pipes, aluminium foil is fixed using line and a small amount of low temperature glue.
3. cutting the lead of appropriate length, insulator is connect with lead by low temperature brazing.Insulator is assemblied in outer
On shell, lead is placed in interior of shell, and pours into low temperature glue sealing on the outside, and side bottom uses low temperature glue sticking activity inside the shell
Exhaust nozzle is assemblied on shell by charcoal with low temperature glue.
4. refilling assigned on shell, being fixed using low temperature glue, while using work after cold head and the first cold finger assembly one
Clamps carry out positioning and centering.
5. lead is passed through cold head, and 3-4 circle is wound on binding post, carry out spot welding using low temperature brazing.
6. connector device is assigned on shell, and connector lead and binding post are corresponded and carry out spot welding connection.
In the second embodiment of the present invention, a kind of chip testing is provided with Dewar component is surveyed in alternating temperature, referring to Fig. 7 institute
Show, including Dewar and refrigeration machine, the Dewar passes through flange and refrigeration using Dewar described in first embodiment, the Dewar
The expanding machine 15 of machine is connected, and the second cold finger of the refrigeration machine protrudes into the first cold finger of Dewar, 14 couples of compressor Du of refrigeration machine
Watt cold head cool down.
Due to illustrating in the first embodiment to the structure of Dewar, details are not described herein for the present embodiment.
It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that the process, method, article or the device that include a series of elements not only include those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or device institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including being somebody's turn to do
There is also other identical elements in the process, method of element, article or device.
The serial number of the above embodiments of the invention is only for description, does not represent the advantages or disadvantages of the embodiments.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited to above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form, all of these belong to the protection of the present invention.
Claims (10)
1. the first cold finger, cold head inside the shell with Dewar, including shell is surveyed in alternating temperature, is arranged in a kind of chip testing, setting exists
Window assembly, connector outside shell, are arranged exhaust nozzle on the shell, it is characterised in that: the bottom of the shell, which is equipped with, to be used
In the flange of connection refrigeration machine, the first cold finger in the shell is made of the support tube of multilayer hollow, the support tube it is interior
Chamber is for being nested in outside the second cold finger of the refrigeration machine.
2. Dewar as described in claim 1, which is characterized in that the support tube of the multilayer hollow includes thin-wall tube and glass reinforced plastic
Pipe, the glass reinforced plastic pipe are set in outside the thin-wall tube.
3. Dewar as claimed in claim 1 or 2, which is characterized in that be additionally provided with outside the support tube of the multilayer hollow one layer or
Multilayer radiation-proof shielded layer.
4. Dewar as described in claim 1, which is characterized in that the bottom of the shell is also provided with for the refrigeration machine
The annular thermal trough or/and seal groove of heat dissipation, the seal groove is interior to be equipped with for sealing the shell and the refrigeration machine
The first sealing ring.
5. Dewar as described in claim 1 or 4, which is characterized in that the two sides of the shell are respectively equipped with outwardly extending connect
Line seat is respectively provided with the insulator for connecting the lead of the connector and the cold head on each junction block, described outer
It is equipped between shell and the insulator for sealing fixed low temperature glue.
6. Dewar as described in claim 1, which is characterized in that the binding post of the cold head is by Plug pin patch bay and contact pin tack two
Divide and constitute detachable contact pin structure, the Plug pin patch bay is fixed on the dead ring of the cold head, and the contact pin tack is for welding
Connect the lead of the cold head.
7. Dewar as described in claim 1, which is characterized in that the junction between the cold head and first cold finger is equipped with
For sealing fixed low temperature glue.
8. Dewar as described in claim 1, which is characterized in that between the shell and first cold finger and the exhaust nozzle
Junction be equipped with for sealing fixed low temperature glue.
9. Dewar as described in claim 1, which is characterized in that the window seat of the window assembly is fixed on described outer by nut
Shell upper end is additionally provided with the second sealing ring between the window seat and shell of the window assembly.
10. a kind of chip testing is with surveying Dewar component in alternating temperature, which is characterized in that including Dewar and refrigeration machine, the Dewar is adopted
With any Dewar of claim 1 to 9, the Dewar is connected by flange with the expanding machine of refrigeration machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810923435.1A CN109084902A (en) | 2018-08-14 | 2018-08-14 | Dewar and Dewar component are surveyed in chip testing alternating temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810923435.1A CN109084902A (en) | 2018-08-14 | 2018-08-14 | Dewar and Dewar component are surveyed in chip testing alternating temperature |
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| CN109084902A true CN109084902A (en) | 2018-12-25 |
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| CN201810923435.1A Pending CN109084902A (en) | 2018-08-14 | 2018-08-14 | Dewar and Dewar component are surveyed in chip testing alternating temperature |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109769370A (en) * | 2019-01-10 | 2019-05-17 | 中国科学院上海技术物理研究所 | A kind of electric resistance array cooling device for hundreds of watts of refrigeration work consumptions of profound hypothermia scene |
| CN111571498A (en) * | 2020-05-11 | 2020-08-25 | 中国电子科技集团公司第十一研究所 | Device for assembling multiband detector chip |
| CN112484644A (en) * | 2020-10-27 | 2021-03-12 | 深圳供电局有限公司 | Cable core deviation Dewar monitoring device for arc laying of high-temperature superconducting cable |
| CN113270515A (en) * | 2021-04-19 | 2021-08-17 | 中国电子科技集团公司第十一研究所 | Infrared detector low-heat-leakage packaging device, preparation method thereof and infrared detector |
| CN113359001A (en) * | 2020-03-04 | 2021-09-07 | 中国科学院理化技术研究所 | Chip testing system |
| CN116164846A (en) * | 2023-04-23 | 2023-05-26 | 山西创芯光电科技有限公司 | Packaging structure and packaging method for Dewar cold head of infrared detector |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2108249U (en) * | 1991-11-25 | 1992-06-24 | 何曙安 | Liquid nitrogen metal dewar's bottle capable mounting refrigerative 64-unit infrared device on it |
| CN2711723Y (en) * | 2004-06-22 | 2005-07-20 | 中国科学院上海技术物理研究所 | Low temperature composite Dewar |
| CN205353806U (en) * | 2015-12-22 | 2016-06-29 | 中国电子科技集团公司第十一研究所 | Small -size low temperature black matrix temperature regulating device |
| CN106706136A (en) * | 2016-12-08 | 2017-05-24 | 中国电子科技集团公司第十研究所 | Refrigeration infrared detector |
| CN107340061A (en) * | 2017-05-31 | 2017-11-10 | 中国电子科技集团公司第十研究所 | A kind of infrared detector ice chest |
-
2018
- 2018-08-14 CN CN201810923435.1A patent/CN109084902A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2108249U (en) * | 1991-11-25 | 1992-06-24 | 何曙安 | Liquid nitrogen metal dewar's bottle capable mounting refrigerative 64-unit infrared device on it |
| CN2711723Y (en) * | 2004-06-22 | 2005-07-20 | 中国科学院上海技术物理研究所 | Low temperature composite Dewar |
| CN205353806U (en) * | 2015-12-22 | 2016-06-29 | 中国电子科技集团公司第十一研究所 | Small -size low temperature black matrix temperature regulating device |
| CN106706136A (en) * | 2016-12-08 | 2017-05-24 | 中国电子科技集团公司第十研究所 | Refrigeration infrared detector |
| CN107340061A (en) * | 2017-05-31 | 2017-11-10 | 中国电子科技集团公司第十研究所 | A kind of infrared detector ice chest |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109769370A (en) * | 2019-01-10 | 2019-05-17 | 中国科学院上海技术物理研究所 | A kind of electric resistance array cooling device for hundreds of watts of refrigeration work consumptions of profound hypothermia scene |
| CN113359001A (en) * | 2020-03-04 | 2021-09-07 | 中国科学院理化技术研究所 | Chip testing system |
| CN113359001B (en) * | 2020-03-04 | 2022-07-22 | 中国科学院理化技术研究所 | Chip testing system |
| CN111571498A (en) * | 2020-05-11 | 2020-08-25 | 中国电子科技集团公司第十一研究所 | Device for assembling multiband detector chip |
| CN112484644A (en) * | 2020-10-27 | 2021-03-12 | 深圳供电局有限公司 | Cable core deviation Dewar monitoring device for arc laying of high-temperature superconducting cable |
| CN112484644B (en) * | 2020-10-27 | 2022-07-22 | 深圳供电局有限公司 | Cable core deviation Dewar monitoring device for arc laying of high-temperature superconducting cable |
| CN113270515A (en) * | 2021-04-19 | 2021-08-17 | 中国电子科技集团公司第十一研究所 | Infrared detector low-heat-leakage packaging device, preparation method thereof and infrared detector |
| CN113270515B (en) * | 2021-04-19 | 2023-03-03 | 中国电子科技集团公司第十一研究所 | Infrared detector low-heat-leakage packaging device, preparation method thereof and infrared detector |
| CN116164846A (en) * | 2023-04-23 | 2023-05-26 | 山西创芯光电科技有限公司 | Packaging structure and packaging method for Dewar cold head of infrared detector |
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