CN203572589U - Package structure of platinum resistor temperature sensor for measuring low-temperature medium - Google Patents
Package structure of platinum resistor temperature sensor for measuring low-temperature medium Download PDFInfo
- Publication number
- CN203572589U CN203572589U CN201320677798.4U CN201320677798U CN203572589U CN 203572589 U CN203572589 U CN 203572589U CN 201320677798 U CN201320677798 U CN 201320677798U CN 203572589 U CN203572589 U CN 203572589U
- Authority
- CN
- China
- Prior art keywords
- measuring
- sensitive element
- lead wire
- platinum resistor
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 229910052697 platinum Inorganic materials 0.000 title claims abstract description 35
- 239000000919 ceramic Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000007789 sealing Methods 0.000 claims abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 11
- 238000005259 measurement Methods 0.000 claims description 9
- 239000000565 sealant Substances 0.000 claims description 7
- 239000012530 fluid Substances 0.000 claims description 6
- 238000012856 packing Methods 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 9
- 239000001307 helium Substances 0.000 abstract description 6
- 229910052734 helium Inorganic materials 0.000 abstract description 6
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 abstract description 6
- 239000007789 gas Substances 0.000 abstract description 4
- 239000003292 glue Substances 0.000 abstract 2
- 238000001816 cooling Methods 0.000 abstract 1
- 150000003057 platinum Chemical class 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The utility model provides a package structure of a platinum resistor temperature sensor for measuring a low-temperature medium. The package structure comprises a sensor shell, a ceramic platinum resistor sensitive element and a measuring lead wire are placed in the sensor shell, the end part of the sensor shell is sealed by sealing glue; one end of the measuring lead wire is connected to the ceramic platinum resistor sensitive element, the other end of the measuring lead wire stretches out of the sealing glue; the middle of the measuring lead wire is wound into a spiral shape and is placed in the middle of the sensor shell; and a filling material is filled in two ends of the sensor shell and the two ends of the measuring lead wire. The platinum resistor temperature sensor package structure can be used to measure temperature of low-temperature helium gas (the lowest temperature of the helium gas can reach 77 K); a measuring lead wire is wound into a spiral shape and then is placed into the sensor shell, and the measuring lead wire with a longer length and a ceramic platinum resistor sensitive element are simultaneously subjected to an adequate pre-cooling treatment to eliminate or reduce the thermal conduction of the sensitive element and the measuring lead wire so as to shorten the responding time of the platinum resistor sensitive element.
Description
Technical field
The utility model relates to platinum resistance temperature sensor, is specifically related to a kind of for measuring the platinum sensor of cryogenic media.
Background technology
Platinum resistance temperature sensor is to utilize its resistance to become certain funtcional relationship with temperature and the temperature sensor made, because there being wider temperature-measuring range (260 ℃～650 ℃) to be widely used the measurement in cryogenic media temperature, the response time of the temperature sensor after encapsulating with ceramic platinum resistance sensitive element is the key factor that affects measuring accuracy, and the error producing because of its encapsulating structure different sensors response time has very large difference.
Summary of the invention
The purpose of this utility model be to provide a kind of reduce or eliminate measuring error that the response time produces for measuring the platinum resistance temperature sensor encapsulating structure of cryogenic media.
Realize the technical scheme of the utility model object: a kind of for measuring the platinum resistance temperature sensor encapsulating structure of cryogenic media, it comprises sensor housing, placing ceramic platinum resistance sensitive element and measurement lead-in wire in sensor housing, sensor shell end of body passes through sealant sealing; One end of measuring lead-in wire connects ceramic platinum resistance sensitive element, and the other end of measuring lead-in wire extends fluid sealant; Described measurement lead-in wire center section coiled is filled in sensor housing middle part; In sensor housing two ends and at the two ends of measuring lead-in wire, adopt packing material to fill.
As above a kind of for measuring the platinum resistance temperature sensor encapsulating structure of cryogenic media, the sensor housing wall thickness described in it is 0.5mm; Described sensor housing is that 1Cr18Ni9Ti material is made; Described packing material is aluminium oxide.
Effect of the present utility model is: described in the utility model for measuring the platinum resistance temperature sensor encapsulating structure of cryogenic media, can be used for the temperature monitoring of low temperature helium (minimum temperature 77K).Measurement lead-in wire coiled is inserted in sensor housing, make measurement lead-in wire and the ceramic platinum resistance sensitive element more grown carry out abundant precooling simultaneously, can eliminate or reduce like this sensitive element and the heat conduction of measuring lead-in wire, to shorten the response time of platinum resistance sensitive element.At embedding packing material aluminium oxide, enrich internal voids, to improve the thermal response of platinum resistance sensitive element.
Accompanying drawing explanation
Fig. 1 is existing platinum resistance temperature sensor encapsulating structure schematic diagram;
Fig. 2 is described in the utility model for measuring the platinum resistance temperature sensor encapsulating structure schematic diagram of cryogenic media.
In figure: 1. sensor housing; 2. packing material; 3. ceramic platinum resistance sensitive element; 4. measure lead-in wire; 5. fluid sealant.
Embodiment
Below in conjunction with the drawings and specific embodiments, to described in the utility model, for the platinum resistance temperature sensor encapsulating structure of measuring cryogenic media, be further described.
As shown in Figure 2, described in the utility model a kind of for measuring the platinum resistance temperature sensor encapsulating structure of cryogenic media, can be used for the temperature monitoring of low temperature helium (minimum temperature 77K).It comprises the sensor housing 1 that 1Cr18Ni9Ti material is made, and at the interior placing ceramic platinum resistance of sensor housing 1 sensitive element 3 and measurement lead-in wire 4, sensor housing 1 end seals by fluid sealant 5.
Measuring lead-in wire 4 center section coileds is filled in sensor housing 1 middle part; In sensor housing 1 two ends and at the two ends of measuring lead-in wire 4, adopt alumina filled material 2 to fill.
One end of measuring lead-in wire 4 connects ceramic platinum resistance sensitive element 3, and the other end of measuring lead-in wire 4 extends fluid sealant 5.
Alumina filled material 2 has been used in the vibration of considering the impact of cold helium tube road high-pressure gas flow to sensor and produce in encapsulation process, to avoid the fracture of the sensitive element that ceramic platinum resistance sensitive element 3 causes because of shake.
Measure the transition lead wire that lead-in wire 4 is ceramic platinum resistance sensitive element 3 and external cable, first measure lead-in wire and want satisfied temperature requirement, secondly under the requirement that guarantees sensitive element current capacity, physical strength, should select the measurement lead-in wire that sectional area is little, to reduce sensitive element and the heat conduction of measuring lead-in wire as far as possible.
Claims (3)
1. one kind for measuring the platinum resistance temperature sensor encapsulating structure of cryogenic media, it comprises sensor housing (1), placing ceramic platinum resistance sensitive element (3) and measurement lead-in wire (4) in sensor housing (1), sensor housing (1) end is by fluid sealant (5) sealing; One end of measuring lead-in wire (4) connects ceramic platinum resistance sensitive element (3), and the other end of measuring lead-in wire (4) extends fluid sealant (5); It is characterized in that: described measurement lead-in wire (4) center section coiled is filled in sensor housing (1) middle part; In sensor housing (1) two ends and at the two ends of measuring lead-in wire (4), adopt packing material (2) to fill.
2. according to claim 1 a kind of for measuring the platinum resistance temperature sensor encapsulating structure of cryogenic media, it is characterized in that: described sensor housing (1) wall thickness is 0.5mm.
3. according to claim 1 a kind of for measuring the platinum resistance temperature sensor encapsulating structure of cryogenic media, it is characterized in that: described sensor housing is that 1Cr18Ni9Ti material is made; Described packing material is aluminium oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320677798.4U CN203572589U (en) | 2013-10-30 | 2013-10-30 | Package structure of platinum resistor temperature sensor for measuring low-temperature medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320677798.4U CN203572589U (en) | 2013-10-30 | 2013-10-30 | Package structure of platinum resistor temperature sensor for measuring low-temperature medium |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203572589U true CN203572589U (en) | 2014-04-30 |
Family
ID=50540316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320677798.4U Expired - Lifetime CN203572589U (en) | 2013-10-30 | 2013-10-30 | Package structure of platinum resistor temperature sensor for measuring low-temperature medium |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203572589U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109297209A (en) * | 2018-10-23 | 2019-02-01 | 中国科学院理化技术研究所 | Temperature measuring assembly of working medium of refrigeration or heat pump system and refrigeration or heat pump system |
| CN109855754A (en) * | 2017-11-30 | 2019-06-07 | 北京航天试验技术研究所 | A kind of temperature sensor |
| CN113984238A (en) * | 2021-09-23 | 2022-01-28 | 北京遥测技术研究所 | High-precision quick-response air temperature sensor suitable for deep space detection |
-
2013
- 2013-10-30 CN CN201320677798.4U patent/CN203572589U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109855754A (en) * | 2017-11-30 | 2019-06-07 | 北京航天试验技术研究所 | A kind of temperature sensor |
| CN109297209A (en) * | 2018-10-23 | 2019-02-01 | 中国科学院理化技术研究所 | Temperature measuring assembly of working medium of refrigeration or heat pump system and refrigeration or heat pump system |
| CN113984238A (en) * | 2021-09-23 | 2022-01-28 | 北京遥测技术研究所 | High-precision quick-response air temperature sensor suitable for deep space detection |
| CN113984238B (en) * | 2021-09-23 | 2023-11-07 | 北京遥测技术研究所 | High-precision quick-response air temperature sensor suitable for deep space exploration |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140430 |
|
| CX01 | Expiry of patent term |