CN111769812A - Surface acoustic wave filter chip packaging structure and packaging method - Google Patents
Surface acoustic wave filter chip packaging structure and packaging method Download PDFInfo
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- CN111769812A CN111769812A CN202010456137.3A CN202010456137A CN111769812A CN 111769812 A CN111769812 A CN 111769812A CN 202010456137 A CN202010456137 A CN 202010456137A CN 111769812 A CN111769812 A CN 111769812A
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- acoustic wave
- surface acoustic
- wave filter
- filter chip
- substrate
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- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 108
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000003466 welding Methods 0.000 claims abstract description 118
- 239000000758 substrate Substances 0.000 claims abstract description 94
- 229910000679 solder Inorganic materials 0.000 claims abstract description 52
- 238000007789 sealing Methods 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 7
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 230000005611 electricity Effects 0.000 claims abstract description 3
- 239000000853 adhesive Substances 0.000 claims description 45
- 230000001070 adhesive effect Effects 0.000 claims description 45
- 230000008093 supporting effect Effects 0.000 claims description 38
- 239000000084 colloidal system Substances 0.000 claims description 21
- 238000005476 soldering Methods 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 230000004927 fusion Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000007731 hot pressing Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 210000005056 cell body Anatomy 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
Abstract
The invention provides a surface acoustic wave filter chip packaging structure and a packaging method, and belongs to the technical field of chip packaging. Surface acoustic wave filter chip package structure includes: the base plate, be formed with the welding hole on one side face of base plate, the bottom in welding hole is connected with the circuit electricity in the base plate, and the welding hole intussuseption is filled with the conducting resin, and the lug solder joint of surface acoustic wave filter chip stretches into and is connected with the conducting resin in the welding hole, and the workspace of surface acoustic wave filter chip is towards the base plate, and surface acoustic wave filter chip encircles workspace and base plate sealing connection, formation cavity between workspace and base plate. The invention aims to provide a packaging structure and a packaging method of a surface acoustic wave filter chip, which can enhance the connection strength between a bump welding spot of the surface acoustic wave filter chip and a substrate, thereby reducing the probability of poor packaging structure caused by external force.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a surface acoustic wave filter chip packaging structure and a surface acoustic wave filter chip packaging method.
Background
The surface acoustic wave filter (saw filter) uses lithium niobate or lead titanate oxide and other piezoelectric crystals as substrates, and two groups of interdigital metal electrodes with energy conversion function, namely an input transducer and an output transducer, are manufactured by a photoetching process. The input transducer and the output transducer can convert the input signal of the electric wave into mechanical energy, and the mechanical energy is converted into an electric signal to be output after being processed, so that the aim of filtering unnecessary signals and noises is fulfilled, and the signal receiving quality is improved. Due to the performance and design function requirements of the surface acoustic wave filter product, the functional area of the surface acoustic wave filter chip is required to be ensured not to contact any substance, namely, the cavity structure design.
In the packaging structure of the surface acoustic wave filter chip in the prior art, generally, glue is dispensed on a substrate, the chip is inversely mounted on the substrate, and a bump welding point of the chip is welded with a welding point corresponding to the substrate, so that the chip is electrically connected with the substrate, and the chip is bonded and sealed by the glue dispensed on the substrate, so that a sealed cavity is formed between a working area of the chip and the substrate. Because the gap between the chip and the substrate is supported by the bump solder joint of the chip in the cavity structure, the welding structure between the bump solder joint of the chip and the substrate is easy to break under the influence of external force, and the performance of the packaging structure is poor.
Disclosure of Invention
The invention aims to provide a packaging structure and a packaging method of a surface acoustic wave filter chip, which can enhance the connection strength between a bump welding spot of the surface acoustic wave filter chip and a substrate, thereby reducing the probability of poor packaging structure caused by external force.
The embodiment of the invention is realized by the following steps:
in one aspect of the embodiments of the present invention, a surface acoustic wave filter chip package structure is provided, including: the base plate, be formed with the welding hole on one side face of base plate, the bottom in welding hole is connected with the circuit electricity in the base plate, and the welding hole intussuseption is filled with the conducting resin, and the lug solder joint of surface acoustic wave filter chip stretches into and is connected with the conducting resin in the welding hole, and the workspace of surface acoustic wave filter chip is towards the base plate, and surface acoustic wave filter chip encircles workspace and base plate sealing connection, formation cavity between workspace and base plate.
Optionally, the surface acoustic wave filter chip is formed with a tank surrounding the working area, the tank is filled with a colloid, and the colloid is bonded with the substrate.
Optionally, a connection pad corresponding to the groove is formed on the substrate, and the colloid is connected with the connection pad.
Optionally, a gap is formed between the connecting pad and the surface of the surface acoustic wave filter chip.
Optionally, a support is disposed in the welding hole, and the support is connected to the bottom of the welding hole and the bump solder joint.
Optionally, the support body includes a support pillar having two ends respectively connected to the bottom of the welding hole and the bump welding point.
Optionally, the support column is provided in plurality.
Optionally, the support body includes a support rod having two ends respectively connected to the bottom of the welding hole and the bump welding point, a drag rod is connected to the support rod, the drag rod is located at the end of the support rod and connected to the bump welding point, and the drag rod and the support rod are crossed.
Optionally, the tow bar is perpendicular to the strut.
Optionally, the bottom of the welding hole is formed with a boss connected to a sidewall thereof, and the boss is used for supporting the welding point of the bump.
Optionally, the bump pad includes a conductive pillar and a solder ball, two ends of the conductive pillar are respectively connected to the saw filter chip and the solder ball, and the solder ball is connected to the support body and the conductive adhesive.
In another aspect of the embodiments of the present invention, a surface acoustic wave filter chip packaging method is provided, where the method includes:
forming a welding hole on the substrate so that the bottom of the welding hole is electrically connected with the circuit in the substrate;
filling conductive adhesive into the welding hole;
and the surface acoustic wave filter chip is pasted and mounted so that a bump welding point of the surface acoustic wave filter chip extends into the welding hole to be connected with the conductive adhesive, a cavity is formed between the working area of the surface acoustic wave filter chip and the substrate towards the substrate, and the surface acoustic wave filter chip surrounds the working area and is hermetically connected with the substrate.
Optionally, before the surface acoustic wave filter chip is mounted, the method further includes:
and forming a groove body surrounding the working area on the surface of the working area of the surface acoustic wave filter chip, and filling the groove body with colloid.
The embodiment of the invention has the beneficial effects that:
the surface acoustic wave filter chip packaging structure provided by the embodiment of the invention comprises a substrate, wherein a welding hole is formed on one side plate surface of the substrate, the bottom of the welding hole is electrically connected with a circuit in the substrate, and conductive adhesive is filled in the welding hole. And the bump welding point of the surface acoustic wave filter chip extends into the welding hole to be connected with the conductive adhesive, so that the surface acoustic wave filter chip is communicated with the circuit in the substrate. The working area of the surface acoustic wave filter chip faces the substrate and is connected with the substrate in a sealing mode around the working area, and a cavity is formed between the working area of the chip and the substrate under the support of the bump welding points of the chip. This packaging structure can play the guard action to the lug solder joint of surface acoustic wave filter chip through the welding hole to reduce shear stress and the bending stress that external force influence boss solder joint bore down. And because the welding hole is filled with the conductive adhesive, and the bump welding point of the surface acoustic wave filter chip is connected with the conductive adhesive, the connection strength between the bump welding point and the substrate can be enhanced through the bonding and the re-fusion of the conductive adhesive and the bump welding point. Therefore, the probability of poor performance and the like caused by the influence of external force on the packaging structure is reduced.
According to the surface acoustic wave filter chip packaging method provided by the embodiment of the invention, the welding hole is formed on the substrate at first, so that the bottom of the welding hole is electrically connected with the circuit in the substrate, and the welding hole is filled with the conductive adhesive. And then mounting the surface acoustic wave filter chip to enable a bump welding point of the surface acoustic wave filter chip to extend into the welding hole to be connected with the conductive adhesive, a working area of the surface acoustic wave filter chip faces the substrate to form a cavity with the substrate, and the surface acoustic wave filter chip surrounds the working area to be connected with the substrate in a sealing mode, so that a surface acoustic wave filter chip packaging structure is manufactured. The surface acoustic wave filter chip manufactured by the method can protect the bump welding points of the surface acoustic wave filter chip by utilizing the welding holes so as to reduce the shearing stress and the bending stress born by the bump welding points under the influence of external force. And because the welding hole is filled with the conductive adhesive, and the bump welding point of the surface acoustic wave filter chip is connected with the conductive adhesive, the connection strength between the bump welding point and the substrate can be enhanced through the bonding and the re-fusion of the conductive adhesive and the bump welding point. Therefore, the probability of poor performance and the like caused by the influence of external force on the packaging structure is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a surface acoustic wave filter chip package structure according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a saw filter chip according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a solder hole of a surface acoustic wave filter chip package structure according to an embodiment of the present invention;
fig. 4 is a second schematic structural diagram of a solder hole of a saw filter chip package structure according to an embodiment of the present invention;
fig. 5 is a schematic flowchart of a surface acoustic wave filter chip packaging method according to an embodiment of the present invention.
Icon: 110-a substrate; 120-welding holes; 121-conductive glue; 130-surface acoustic wave filter chip; 131-a working area; 132-a trough body; 133-colloid; 140-bump pads; 150-a connecting disc; 160-a support; 161-support column; 162-a strut; 163-tow bar.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
An embodiment of the present invention provides a surface acoustic wave filter chip package structure, as shown in fig. 1, including: the substrate 110 is provided with a welding hole 120 on one side of the substrate 110, the bottom of the welding hole 120 is electrically connected with a circuit in the substrate 110, the welding hole 120 is filled with a conductive adhesive 121, a bump welding point 140 of the surface acoustic wave filter chip 130 extends into the welding hole 120 and is connected with the conductive adhesive 121, a working area 131 of the surface acoustic wave filter chip 130 faces the substrate 110, the surface acoustic wave filter chip 130 surrounds the working area 131 and is hermetically connected with the substrate 110, and a cavity is formed between the working area 131 and the substrate 110.
It should be noted that the inner wall of the soldering hole 120 may be made of a conductive material, so as to improve the electrical connection effect among the soldering hole 120, the conductive adhesive 121, the circuit in the substrate 110, and the surface wave filter chip. For example, the substrate 110 may be formed by forming a conductive layer on the inner wall of the solder hole 120, or by using a lamination technique, forming a circuit layer, then making the solder hole 120 with a conductive material and electrically connecting the bottom of the solder hole 120 with the circuit of the circuit layer, and then laminating and packaging the solder hole 120 with a packaging layer, so as to form the circuit layer, the packaging layer and the substrate 110 with the solder hole 120. Certainly, in practical applications, the inner wall of the welding hole 120 may also be non-conductive, and only the bottom of the welding hole 120 needs to be capable of being conducted with the circuit in the substrate 110, that is, the conductive adhesive 121 may be conducted with the circuit in the substrate 110 in the welding hole 120, which is not limited herein.
In the surface acoustic wave filter chip packaging structure, the connection between the conductive adhesive 121 in the welding hole 120 and the bump welding point 140 can be performed by adopting a hot-pressing fusion welding technology, so that the conductive adhesive 121 can be bonded and fused with the bump welding point 140, and the connection strength between the bump welding point 140 and the conductive adhesive 121 is improved.
It should be noted that, in order to form a cavity between the working region 131 of the saw filter chip 130 and the substrate 110, after the bump pad 140 of the saw filter chip 130 is connected to the conductive adhesive 121 in the solder hole 120 of the substrate 110, a gap is required between the saw filter chip 130 and the substrate 110, and therefore, a specific height design of the bump pad 140 may be determined by a person skilled in the art according to a depth of a solder joint, a filling height of the conductive adhesive 121, and a required cavity height, which is not limited herein.
In practical applications, the saw filter chip 130 is hermetically connected to the substrate 110 around the working area 131, which may be performed by performing sealant dispensing on an area on the substrate 110 corresponding to the working area 131 around the chip, so that the saw filter chip 130 can be hermetically connected to the substrate 110 around the working area 131 by using a sealant during chip mounting. Of course, in the embodiment of the present invention, the saw filter chip 130 may be hermetically connected to the substrate 110 around the working area 131 thereof in other manners, which are not limited herein.
It should be noted that, as will be known by those skilled in the art, the package structure may further include a plastic package body for protecting the saw filter chip 130 in a plastic package manner, and a solder ball or a pin connected to a circuit in the substrate 110 is formed on a side of the substrate 110 away from the saw filter chip 130, so as to connect the package structure with an external device.
The surface acoustic wave filter chip packaging structure provided by the embodiment of the invention can comprise a substrate 110, wherein a welding hole 120 is formed on one side plate surface of the substrate 110, the bottom of the welding hole 120 is electrically connected with a circuit in the substrate 110, and the welding hole 120 is filled with a conductive adhesive 121. The bump pads 140 of the saw filter chip 130 extend into the bonding holes 120 and are connected to the conductive adhesive 121, so that the saw filter chip 130 is connected to the circuit in the substrate 110. The active area 131 of the saw filter chip 130 faces the substrate 110, and is hermetically connected to the substrate 110 around the active area 131, and a cavity is formed between the active area 131 of the chip and the substrate 110 under the support of the bump pads 140 of the chip. The packaging structure can protect the bump welding points 140 of the surface acoustic wave filter chip 130 through the welding holes 120, so that the shearing stress and the bending stress born by the bump welding points 140 under the influence of external force are reduced. Moreover, the conductive adhesive 121 is filled in the solder hole 120, and the bump pad 140 of the saw filter chip 130 is connected to the conductive adhesive 121, so that the connection strength between the bump pad 140 and the substrate 110 can be enhanced by bonding and re-fusing the conductive adhesive 121 and the bump pad 140. Therefore, the probability of poor performance and the like caused by the influence of external force on the packaging structure is reduced.
Alternatively, as shown in fig. 1 and fig. 2, the saw filter chip 130 is formed with a groove 132 surrounding the working area 131, the groove 132 is filled with a colloid 133, and the colloid 133 is adhered to the substrate 110.
It should be noted that, since the slot 132 surrounds the working area 131 of the saw filter chip 130, the slot 132 is located on a side surface of the saw filter chip 130 where the functional area is located, and in order to avoid the slot 132 from affecting the function of the saw filter chip 130, the slot 132 is usually located away from the chip circuit, that is, the bump pads 140 of the chip are in the area surrounded by the slot 132.
Through forming the groove body 132 on the surface acoustic wave filter chip 130 and filling the colloid 133 in the groove body 132, after the surface acoustic wave filter chip 130 is attached to the substrate 110, the chip and the substrate 110 can be conveniently connected in a sealing manner by the colloid 133 by using the hot-pressing fusion welding technology without performing adhesive dispensing operation on the substrate 110, so that the whole surface acoustic wave filter chip can be integrally attached and then single cutting is performed, and the packaging efficiency is improved.
Alternatively, as shown in fig. 1, a land 150 corresponding to the groove 132 is formed on the substrate 110, and the gel 133 is connected to the land 150.
The connection pad 150 formed on the substrate 110 corresponding to the groove 132 of the saw filter chip 130 allows the adhesive 133 to be more easily connected to the substrate 110 by thermocompression bonding, and the connection between the adhesive 133 and the substrate 110 can be more securely achieved.
Alternatively, the land 150 has a gap with the surface of the saw filter chip 130.
By providing the land 150 and the surface of the saw filter chip 130 with a gap therebetween, for example, the surface of the land 150 and the surface of the substrate 110 are flattened. The colloid 133 in the groove 132 of the chip can flow out from the groove 132 and be connected to the land 150 at the time of thermocompression bonding, and the contact area between the colloid 133 and the land 150 can be increased, thereby improving the connection effect between the two.
Of course, in practical application, the connecting pad 150 may be abutted to the opening of the slot 132 of the saw filter chip 130, so that the connecting pad 150 can support the saw filter chip 130, thereby further reducing the influence of external force on the bump pad 140 of the saw filter chip 130.
Optionally, a support 160 is disposed in the welding hole 120 shown in fig. 3 and 4, and the support 160 is connected to the bottom of the welding hole 120 and the bump pad 140.
The bump pads 140 can be supported by the support bodies 160 disposed in the welding holes 120, so that the connection strength of the bump pads 140 is enhanced, and the influence of an external force on the bump pads 140 is reduced. The colloid 133 in the welding hole 120 may partially cover the supporting body 160 or completely cover the supporting body according to the actual filling height, which is not limited herein. In practical applications, after the bump pads 140 are connected to the supporting body 160 in the welding holes 120, the colloid 133 can cover the connection between the bump pads 140 and the supporting body 160, so as to improve the connection strength of the bump pads 140 to the substrate 110.
Alternatively, as shown in fig. 4, the supporting body 160 includes a supporting column 161 having two ends respectively connected to the bottom of the welding hole 120 and the bump pad 140.
The bump pads 140 are supported by the supporting columns 161 to strengthen the connection strength of the bump pads 140, the structure is convenient to arrange, and the cost is relatively low.
Illustratively, the number of the supporting columns 161 may be set to be plural according to the strength requirement of the actual bump pads 140.
By providing the supporting columns 161 in plural, the supporting effect of the supporting columns 161 on the bump pads 140 can be further enhanced.
In practical applications, the supporting column 161 may also be replaced by an upright sheet-like structure, which is not limited in the embodiment of the present invention.
Alternatively, as shown in fig. 3, the supporting body 160 includes a supporting rod 162 having two ends respectively connected to the bottom of the welding hole 120 and the bump welding point 140, a pulling rod 163 is connected to the supporting rod 162, the pulling rod 163 is located at the end of the supporting rod 162 and connected to the bump welding point 140, and the pulling rod 163 and the supporting rod 162 cross each other.
By configuring the supporting body 160 as the support bar 162 and the drag bar 163, the supporting body 160 can increase the contact range with the bump pad 140 by the drag bar 163, thereby improving the supporting effect on the bump pad 140 to enhance the connection strength of the bump pad 140 in the welding hole 120.
For example, the support bar 163 may be perpendicular to the support bar 162, so that the support bar 163 can support the bump pads 140 better and have better stability.
Optionally, the bottom of the soldering hole 120 is formed with a boss connected to a sidewall thereof, the boss being used to support the bump pad 140.
The bump pads 140 are supported by forming a boss at the bottom of the solder hole 120.
When the solder hole 120 of the package structure has a support 160 therein, and the support 160 is a support post 161 with two ends respectively connected to the bottom of the solder hole 120 and the bump pad 140, the support post 161 can be connected to a boss formed at the bottom of the solder hole 120.
Alternatively, as shown in fig. 1, the bump pads 140 include conductive pillars and solder balls (not shown), two ends of each conductive pillar are respectively connected to the saw filter chip 130 and the solder balls, and the solder balls are connected to the supporting body 160 and the conductive adhesive 121.
By providing the solder balls, the solder balls and the conductive adhesive 121 can be re-fused and connected to the supporting body 160 by hot-press fusion welding, and a composite body is formed at the connection position, thereby improving the connection strength and firmness between the bump pads 140 and the conductive adhesive 121 and the supporting body 160. Thereby improving the impact resistance of the bump pad 140.
The conductive posts may be copper posts, and the solder balls may be solder paste, which is not limited herein as long as the conductive posts have conductivity and the solder balls can achieve thermocompression bonding.
In practical application, after the solder balls and the conductive adhesive 121 are fused, the connecting portion between the support body 160 and the solder balls can be covered, so that the strength and the firmness of the whole connecting structure are improved.
When the supporting body 160 is configured to include the supporting rod 162 and the towing bar 163, the towing bar 163 can be wrapped by the solder balls, and the solder balls can be better supported and fixed by the towing bar 163, so that the connection stability and strength between the supporting body 160 and the solder balls are enhanced. The plurality of dragging rods 163 can be further arranged, the plurality of dragging rods 163 can play a role of framework support through the cladding of the solder balls on the plurality of dragging rods 163, and therefore the structural stability and the strength of the combined body formed by the solder balls and the conductive adhesive 121 after re-fusion are improved. Also, the plurality of drag levers 163 may be disposed in parallel or cross with each other.
When the bottom of the solder hole 120 of the package structure is formed with a bump, the solder ball can be held by the bump to improve the effect of fusion with the colloid 133 during the thermal compression welding of the solder ball.
In another aspect of the embodiments of the present invention, a surface acoustic wave filter chip packaging method is provided, which can be used to manufacture the surface acoustic wave filter chip packaging structure described above, so as to enhance the connection strength between the bump solder joint of the surface acoustic wave filter chip and the substrate, thereby reducing the probability of the packaging structure being affected by external force to cause defects.
As shown in fig. 5, the saw filter chip packaging method may include:
s501: solder holes are formed in the substrate so that the bottoms of the solder holes are electrically connected to the wiring in the substrate.
S502: and filling conductive adhesive into the welding hole.
S503: and the surface acoustic wave filter chip is pasted and mounted so that a bump welding point of the surface acoustic wave filter chip extends into the welding hole to be connected with the conductive adhesive, a cavity is formed between the working area of the surface acoustic wave filter chip and the substrate towards the substrate, and the surface acoustic wave filter chip surrounds the working area and is hermetically connected with the substrate.
The circuit layer is formed on the substrate, the conductive layer is laminated, the conductive layer is etched to form a welding hole-shaped structure, the bottom of the welding hole-shaped structure is electrically connected with the circuit of the circuit layer, and the welding hole-shaped structure is laminated and packaged by the laminated packaging layer to form the whole substrate consisting of the circuit layer, the packaging layer and the welding hole-shaped structure. Of course, in practical applications, a soldering hole or the like may also be formed by drilling a hole in the substrate and forming a conductive layer on the inner wall of the hole, and is not particularly limited herein. It is sufficient that a solder hole for electrically connecting the bottom portion and the wiring in the substrate can be formed in the substrate.
In practical applications, before filling the conductive paste into the welding hole, a support may be disposed in the welding hole. So that the bump welding points can be connected with the supporting body after the chip is pasted and structurally supported by the supporting body.
The surface acoustic wave filter chip can adopt a hot-pressing fusion welding technology so that the conductive adhesive in the welding hole and the bump welding point of the chip are fused to form a composite body for connection, and therefore the connection strength of the bump welding point is improved.
According to the surface acoustic wave filter chip packaging method provided by the embodiment of the invention, the welding hole can be formed on the substrate firstly, so that the bottom of the welding hole is electrically connected with the circuit in the substrate, and the welding hole is filled with the conductive adhesive. And then mounting the surface acoustic wave filter chip to enable a bump welding point of the surface acoustic wave filter chip to extend into the welding hole to be connected with the conductive adhesive, a working area of the surface acoustic wave filter chip faces the substrate to form a cavity with the substrate, and the surface acoustic wave filter chip surrounds the working area to be connected with the substrate in a sealing mode, so that a surface acoustic wave filter chip packaging structure is manufactured. The surface acoustic wave filter chip manufactured by the method can protect the bump welding points of the surface acoustic wave filter chip by utilizing the welding holes so as to reduce the shearing stress and the bending stress born by the bump welding points under the influence of external force. And because the welding hole is filled with the conductive adhesive, and the bump welding point of the surface acoustic wave filter chip is connected with the conductive adhesive, the connection strength between the bump welding point and the substrate can be enhanced through the bonding and the re-fusion of the conductive adhesive and the bump welding point. Therefore, the probability of poor performance and the like caused by the influence of external force on the packaging structure is reduced.
Optionally, before the surface acoustic wave filter chip is mounted, the method further includes:
and forming a groove body surrounding the working area on the surface of the working area of the surface acoustic wave filter chip, and filling the groove body with colloid.
Through forming the cell body on the surface acoustic wave filter chip to pack the colloid in the cell body, can make this surface acoustic wave filter chip paste after on the base plate, utilize hot pressing fusion welding technique alright with convenient utilize colloid sealing connection with chip and base plate, and need not carry out some glue operations on the base plate, thereby can realize carrying out single cutting again after whole subsides dress, improve encapsulation efficiency.
In practical application, after the welding holes are formed in the substrate, a connecting disc corresponding to a groove body of the surface acoustic wave filter chip can be formed, so that colloid in the groove body can be more reliably connected with the substrate. When the bonding hole is formed by a lamination technique, the land may be formed by etching of the conductive layer together with the bonding hole. And are not limited herein.
It can be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific implementation manners and effects of the structures and the like related to the above described surface acoustic wave filter chip packaging method may refer to the corresponding descriptions and explanations in the foregoing surface acoustic wave filter chip packaging structure embodiments, and are not described in detail herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (13)
1. A surface acoustic wave filter chip package structure, comprising: the base plate, be formed with the welding hole on one side face of base plate, the bottom in welding hole with circuit electricity in the base plate is connected, the welding hole intussuseption is filled with the conducting resin, the lug solder joint of surface acoustic wave filter chip stretch into in the welding hole with the conducting resin is connected, the workspace orientation of surface acoustic wave filter chip the base plate, surface acoustic wave filter chip encircles the workspace with base plate sealing connection, the workspace with form the cavity between the base plate.
2. The surface acoustic wave filter chip package structure as claimed in claim 1, wherein the surface acoustic wave filter chip is formed with a groove surrounding the working area, the groove is filled with a colloid, and the colloid is bonded to the substrate.
3. The surface acoustic wave filter chip package structure as claimed in claim 2, wherein a land corresponding to the groove is formed on the substrate, and the paste is connected to the land.
4. The surface acoustic wave filter chip package structure as set forth in claim 3, wherein a gap is provided between said land and a surface of said surface acoustic wave filter chip.
5. The surface acoustic wave filter chip package structure as claimed in claim 1, wherein a support is provided in the bonding hole, the support being connected to a bottom of the bonding hole and the bump pad.
6. The surface acoustic wave filter chip packaging structure as claimed in claim 5, wherein the supporting body includes a supporting pillar having both ends connected to the bottom of the bonding hole and the bump pad, respectively.
7. The surface acoustic wave filter chip packaging structure as claimed in claim 6, wherein the support pillar has a plurality.
8. The surface acoustic wave filter chip packaging structure of claim 5, wherein the supporting body includes a supporting rod having two ends respectively connected to the bottom of the soldering hole and the bump pad, a pulling rod is connected to the supporting rod, the pulling rod is located at the end of the supporting rod and connected to the bump pad, and the pulling rod and the supporting rod are crossed with each other.
9. The surface acoustic wave filter chip packaging structure of claim 8, wherein the tie bar is perpendicular to the support bar.
10. The surface acoustic wave filter chip package structure as claimed in claim 5, wherein a boss connected to a sidewall of the bonding hole is formed at a bottom of the bonding hole, the boss being for supporting the bump pad.
11. The surface acoustic wave filter chip package structure as claimed in any one of claims 5 to 10, wherein the bump pads include conductive posts and solder balls, two ends of the conductive posts are respectively connected to the surface acoustic wave filter chip and the solder balls, and the solder balls are connected to the supporting body and the conductive adhesive.
12. A surface acoustic wave filter chip packaging method is characterized by comprising the following steps:
forming a welding hole on a substrate so that the bottom of the welding hole is electrically connected with a circuit in the substrate;
filling conductive adhesive into the welding hole;
paste dress surface acoustic wave filter chip, so that the lug solder joint of surface acoustic wave filter chip stretch into in the weld hole with conducting resin connects, just the workspace orientation of surface acoustic wave filter chip the base plate with the base plate forms the cavity, surface acoustic wave filter chip encircles the workspace with base plate sealing connection.
13. A surface acoustic wave filter chip packaging method is characterized in that before the surface acoustic wave filter chip is mounted, the method further comprises the following steps:
and forming a groove body surrounding the working area on the surface of the working area of the surface acoustic wave filter chip, and filling the groove body with colloid.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113938109A (en) * | 2021-12-16 | 2022-01-14 | 深圳新声半导体有限公司 | Surface acoustic wave filter packaging structure |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4023124A (en) * | 1974-08-02 | 1977-05-10 | U.S. Philips Corporation | Acoustic surface wave devices |
| JP2005318435A (en) * | 2004-04-30 | 2005-11-10 | Toyo Commun Equip Co Ltd | Piezoelectric device and oscillator |
| CN1808897A (en) * | 2005-01-17 | 2006-07-26 | 精工爱普生株式会社 | Surface acoustic wave chip, surface acoustic wave device, and manufacturing method for implementing the same |
| CN105281706A (en) * | 2015-11-06 | 2016-01-27 | 江苏长电科技股份有限公司 | Surface acoustic wave filter encapsulation structure and manufacturing method |
| US20180159505A1 (en) * | 2016-12-05 | 2018-06-07 | Samsung Electro-Mechanics Co., Ltd | Acoustic wave filter device |
| CN108292914A (en) * | 2015-12-11 | 2018-07-17 | 株式会社村田制作所 | Acoustic wave device |
| US20200092658A1 (en) * | 2017-05-05 | 2020-03-19 | Goertek Inc. | Mems microphone |
| CN111052606A (en) * | 2017-08-31 | 2020-04-21 | 株式会社村田制作所 | Elastic wave device and elastic wave module provided with same |
-
2020
- 2020-05-26 CN CN202010456137.3A patent/CN111769812A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4023124A (en) * | 1974-08-02 | 1977-05-10 | U.S. Philips Corporation | Acoustic surface wave devices |
| JP2005318435A (en) * | 2004-04-30 | 2005-11-10 | Toyo Commun Equip Co Ltd | Piezoelectric device and oscillator |
| CN1808897A (en) * | 2005-01-17 | 2006-07-26 | 精工爱普生株式会社 | Surface acoustic wave chip, surface acoustic wave device, and manufacturing method for implementing the same |
| CN105281706A (en) * | 2015-11-06 | 2016-01-27 | 江苏长电科技股份有限公司 | Surface acoustic wave filter encapsulation structure and manufacturing method |
| CN108292914A (en) * | 2015-12-11 | 2018-07-17 | 株式会社村田制作所 | Acoustic wave device |
| US20180159505A1 (en) * | 2016-12-05 | 2018-06-07 | Samsung Electro-Mechanics Co., Ltd | Acoustic wave filter device |
| US20200092658A1 (en) * | 2017-05-05 | 2020-03-19 | Goertek Inc. | Mems microphone |
| CN111052606A (en) * | 2017-08-31 | 2020-04-21 | 株式会社村田制作所 | Elastic wave device and elastic wave module provided with same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113938109A (en) * | 2021-12-16 | 2022-01-14 | 深圳新声半导体有限公司 | Surface acoustic wave filter packaging structure |
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