CN206672915U - Encapsulating structure - Google Patents
Encapsulating structure Download PDFInfo
- Publication number
- CN206672915U CN206672915U CN201621037945.1U CN201621037945U CN206672915U CN 206672915 U CN206672915 U CN 206672915U CN 201621037945 U CN201621037945 U CN 201621037945U CN 206672915 U CN206672915 U CN 206672915U
- Authority
- CN
- China
- Prior art keywords
- substrate
- control chip
- top surface
- encapsulating structure
- connection electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
The utility model discloses a kind of encapsulating structure and is used for ultrasonic fingerprint sensor, and it includes substrate, control chip, ultrasonic probe and encapsulating material.The substrate includes substrate top surface, and the substrate top surface is provided with multiple first connection electrodes.The control chip includes die bottom surface, and the die bottom surface is provided with multiple second connection electrodes, and the control chip connects the connection corresponding with first connection electrode of the substrate second connection electrode by flip chip mounting technique.The ultrasonic probe is arranged on the control chip, and the ultrasonic probe is used to launch ultrasonic wave under the control of the substrate and the control chip and detects the ultrasonic wave reflected.The encapsulating material covers the substrate and the control chip and the fixed ultrasonic probe by mould pressing technology.In above-mentioned encapsulating structure, due to using flip chip mounting technique connection control chip and substrate so that the small volume of encapsulating structure.
Description
Technical field
It the utility model is related to ultrasonic fingerprint sensor, and in particular to a kind of encapsulation for ultrasonic fingerprint sensor
Structure.
Background technology
The encapsulating structure of existing ultrasonic sensor includes substrate, control chip and ultrasonic probe, control chip with
Substrate connection, and coordinate co- controlling ultrasonic probe with substrate.Control chip is connected with substrate by lead key closing process, is led
Cause encapsulating structure volume larger.
Utility model content
The utility model is intended to one of technical problem at least solving in correlation technique to a certain extent.Therefore, this reality
With a kind of encapsulating structure of new proposition.
The encapsulating structure of the utility model embodiment is used for ultrasonic fingerprint sensor, it include substrate, control chip,
Ultrasonic probe and encapsulating material.The substrate includes substrate top surface, and the substrate top surface is provided with multiple first connection electrodes.
The control chip includes die bottom surface, and the die bottom surface is provided with multiple second connection electrodes, and the control chip passes through
Flip chip mounting technique connects the substrate and causes second connection electrode connection corresponding with first connection electrode, institute
State the multiple first connection electrode of orthographic projection covering that die bottom surface is located at the substrate top surface.The ultrasonic probe is set
On the control chip, the ultrasonic probe is used to launch ultrasonic wave under the control of the substrate and the control chip
And detect the ultrasonic wave reflected.The encapsulating material covers the substrate and the control chip by mould pressing technology and consolidated
The fixed ultrasonic probe.
In above-mentioned encapsulating structure, due to using flip chip mounting technique connection control chip and substrate so that encapsulation knot
The small volume of structure.
In some embodiments, the encapsulating structure includes connecting the first of the substrate top surface and the die bottom surface
Adhesive-layer.
In some embodiments, the control chip falls in the substrate top surface in the orthographic projection of the substrate top surface
It is interior.
In some embodiments, the substrate includes the substrate bottom surface opposite with the substrate top surface, the substrate bag
The 3rd connection electrode for being formed at the substrate bottom surface is included, the interior formation predetermining circuit of the substrate connects described in a predetermined manner
First connection electrode and the 3rd connection electrode are to realize predetermined function.
In some embodiments, the 3rd connection electrode is land grid array weld pad.
In some embodiments, the control chip includes the chip top surface opposite with the die bottom surface, the core
Piece top surface is connected formed with multiple 4th connection electrodes, the 4th connection electrode by silicon hole technology with part described second
Electrode pair should be connected.
In some embodiments, the ultrasonic probe includes piezoelectric layer, transmitting limit and receives polar curve.The piezoelectricity
Layer is made up of piezo column array.The transmitting limit is formed at below the piezoelectric layer, each transmitting limit with it is corresponding
A piece piezo column connection.The receiving pole line is formed above the piezoelectric layer, every described receive polar curve with it is corresponding
Piezo column described in a line connects.
In some embodiments, the transmitting limit is provided with probe connection electrode.The control chip includes chip
Top surface, the control chip include being formed at the 5th connection electrode of the chip top surface.It is described probe connection electrode with it is described
5th connection electrode is corresponding to be connected.
In some embodiments, the ultrasonic probe is pasted using flip chip mounting technique and the control chip
Close.
In some embodiments, the ultrasonic probe includes the probe top surface away from the substrate, the package material
Material flushes with the probe top surface.
Additional aspect and advantage of the present utility model will be set forth in part in the description, partly by from following description
In become obvious, or by it is of the present utility model practice recognize.
Brief description of the drawings
In description of the of the present utility model above-mentioned and/or additional aspect and advantage from combination accompanying drawings below to embodiment
It will be apparent and be readily appreciated that, wherein：
Fig. 1 is the floor map of the encapsulating structure of the utility model embodiment.
Fig. 2 is the floor map of the substrate of the utility model embodiment.
Fig. 3 is the floor map of the control chip of the utility model embodiment.
Fig. 4 is the floor map of the ultrasonic probe of the utility model embodiment.
Fig. 5 is another floor map of the encapsulating structure of the utility model embodiment.
Embodiment
Embodiment of the present utility model is described further below in conjunction with accompanying drawing.Same or similar label in accompanying drawing
Same or similar element or the element with same or like function are represented from beginning to end.
In addition, the embodiment of the present utility model described below in conjunction with the accompanying drawings is exemplary, it is only used for explaining this reality
With new embodiment, and it is not intended that to limitation of the present utility model.
Referring to Fig. 1, the encapsulating structure 10 of the utility model embodiment includes substrate 12, control chip 14, ultrasonic wave
Probe 18 and encapsulating material 11.Substrate 12 includes substrate top surface 122, and substrate top surface 122 is provided with multiple first connection electrodes
124.Control chip 14 includes die bottom surface 142, and die bottom surface 142 is provided with multiple second connection electrodes 144, control chip 14
Pass through the connection electrode 144 of flip chip mounting technique connecting substrate 12 second and the 142 corresponding connection of the first connection electrode.It is super
Sonic probe 18 is arranged on control chip 14, and ultrasonic probe 18 is used to launch under the control of substrate 12 and control chip 14
Ultrasonic wave simultaneously detects the ultrasonic wave reflected.Encapsulating material 11 covers substrate 12 and control chip 14 by mould pressing technology and consolidated
Determine ultrasonic probe 18.
The encapsulating structure 10 of the utility model embodiment is using flip chip mounting technique connection control chip 14 and base
Plate 12 so that the small volume of encapsulating structure 10.
In some embodiments, substrate 12 can be the printed circuit board (PCB) either silicon base formed with circuit.
In some embodiments, encapsulating structure 10 includes connecting substrate top surface 122 and the first viscose glue of die bottom surface 142
Layer 13.
In other words, control chip 14 is fixed on the substrate 12 by the first adhesive-layer 13, in this way, it is simple in construction, it is easy to
Processing, can further reduce cost.Meanwhile using gluing connected mode control chip 14 can be made to be fixed with substrate 12 and connected
Connect that the space of occupancy is smaller, and then make it that the volume of encapsulating structure 10 is smaller.
In some embodiments, control chip 14 can also be connected with substrate 12 using other modes, or pass through envelope
Package material 11 makes control chip 14 be brought into close contact with substrate 12.
In some embodiments, the first adhesive-layer 13 is diallyl fumarate glue or liquid non-conductive adhesive.
In this way, the first adhesive-layer 13 has good adhesive property, and then make it that control chip 14 is Nian Jie with substrate 12
Stability is higher.The cost of glue sticking control chip 14 and substrate 12 produce in enormous quantities simultaneously in using the above-mentioned type is relatively low,
So as to reduce the packaging cost of encapsulating structure 10.
In other embodiments, the material of the first adhesive-layer 13 is not limited to embodiment discussed above, can also root
Set according to actual conditions.
In some embodiments, control chip 14 falls in substrate top surface 122 in the orthographic projection of substrate top surface 122.
In this way, encapsulating material 11 can contact with substrate top surface 122, so as to improve the package strength of encapsulating material 11.
In some embodiments, substrate 12 and control chip 14 can substantially rectangular sheets.The chi of control chip 14
The very little size less than substrate 12, control chip 14, which aligns, is arranged on the center of substrate 12, and therefore, control chip 14 is in substrate
The orthographic projection of top surface 122 falls in substrate top surface 122.
Referring to Fig. 2, in some embodiments, circuit substrate 12 includes the substrate bottom surface opposite with substrate top surface 122
126, circuit substrate 12 includes the 3rd connection electrode 128 for being formed at substrate bottom surface 126, and predetermining circuit is formed in circuit substrate 12
The first connection electrode 124 and the 3rd connection electrode 128 are connected in a predetermined manner to realize predetermined function.
In this way, circuit substrate 12 provides the tie point of connection for external circuit (not shown), so as to which external circuit can lead to
Cross the 3rd connection electrode to be connected with circuit substrate 12, that is to say that the setting of the 3rd connection electrode 128 make it that encapsulating structure 10 can be with
It is connected with external circuit.
In some embodiments, the 3rd connection electrode 128 be land grid array weld pad (Land Grid Array,
LGA)。
In this way, the electrical connection between the 3rd connection electrode 128 and external circuit is applied to surface mounting technology technique.Therefore
Circuit substrate 12 can avoid the mode using welding from connecting, and then be easy to encapsulation to tie with external circuit by contact portion
Installation, dismounting and the replacing of structure 10.
In some embodiments, the 3rd connection electrode 128 is arranged in substrate 12, and the 3rd connection electrode 128 is away from base
The side 128a of plate 12 flushes with substrate bottom surface 126.
It is appreciated that contact 124 and the position relationship of substrate bottom surface 126 can be set according to actual conditions, and it is not limited to
Embodiment discussed above.
In some embodiments, control chip 14 includes the chip top surface 146 opposite with die bottom surface 142, chip top
Face 146 is connected electricity by silicon hole technology formed with multiple 4th connection electrodes 148, the 4th connection electrode 148 with part second
Pole 144 is corresponding to be connected.
So so that the 4th connection electrode 148 can be connected in die bottom surface 142 with the first connection electrode 142, avoid making
Connected with connecting line, and then make it that the appearance and size of control chip 14 is smaller, and make it that the volume of encapsulating structure 10 is smaller.Simultaneously
4th connection electrode 148 and the second connection electrode 144 are connected by silicon hole technology so that control chip 14 can with substrate 12
It is bonded by flip chip mounting technique.
Fig. 4 and Fig. 5 is referred to, in some embodiments, ultrasonic probe 18 includes piezoelectric layer 182, transmitting limit 184
And receive polar curve 186.Piezoelectric layer 182 is made up of piezo column 182a arrays.Transmitting limit 184 is formed at the lower section of piezoelectric layer 182, often
Individual transmitting limit 184 and corresponding piezo column 182a connections.Receive polar curve 186 and be formed at the top of piezoelectric layer 182, every connects
Receive polar curve 186 and corresponding a line piezo column 182a connections.
In this way, transmitting limit 184 can be excited individually to a certain piezo column 182a, row is avoided to excite multiple piezoelectricity
Post 182a and produce larger lateral noise, and then ensure that ultrasonic probe 18 can more accurately identify fingerprint.Simultaneously because
The power that point excites is smaller, thus the energy consumption of ultrasonic probe 18 is smaller.In addition, when transmitting limit 184 is entered with control chip 14
During row bonding, point-to-point bonding can be passed through.
In some embodiments, separation layer 188 is provided between pressure point post 182a, separation layer 188 is epoxy resin material
Matter.
In this way, the gap between piezo column 182a is filled using insulating materials, can prevent piezo column 182a it
Between ultrasonic wave transmitting and receive process are had an impact, and then reduce lateral noise.
In some embodiments, transmitting limit 184 is alloy-layer 184a, and alloy-layer 184a material can be copper, nickel
Or the metal material such as silver is made.
So so that emitter stage point 184 has preferable electric conductivity.
In some embodiments, launching limit 184 includes being arranged on the backing metal 184b below alloy-layer 184a.
In this way, the padded whole ultrasonic probes 18 of backing metal 184b, are easy to transmitting limit 184 to connect with control chip 14
Connect.
Referring to Fig. 3, in some embodiments, transmitting limit 184 is provided with probe connection electrode (not shown).Control
Chip 14 includes chip top surface 146, and control chip 14 includes being formed at the 5th connection electrode (not shown) of chip top surface 146；
Connection electrode of popping one's head in connection corresponding with the 5th connection electrode.
It is brought into close contact in this way, being easy to implement ultrasonic probe 18 and being realized with control chip 14, and then realizes stable be electrically connected
Connect.
Referring to Fig. 5, in some embodiments, the 5th connection electrode is arranged in control chip 14, control chip 14
It is embedded in the top of the 5th connection electrode formed with hole, probe connection electrode in hole.
In this way, it is easy to the connection between the probe connection electrode of ultrasonic probe 18 and the 5th connection electrode.
It is appreciated that in other embodiments, the position relationship of the 5th connection electrode and control chip 14 can basis
Actual conditions are set, and are not limited to embodiment discussed above.
In some embodiments, predetermining circuit is formed in control chip 14 and connects the second connection electrode in a predetermined manner
144 and the 5th connection electrode to realize predetermined function.
In this way, control chip 14 is the tie point that ultrasonic probe 18 provides connection, so as to which ultrasonic probe 18 can lead to
Cross the 5th connection electrode connection control chip 14.
In some embodiments, control chip 14 can be application specific integrated circuit, for controlling ultrasonic probe 18.
In some embodiments, ultrasonic probe 18 is bonded using flip chip mounting technique with control chip 14.
So so that ultrasonic probe 18 can preferably be bonded with control chip 14, the space that takes is smaller, and then subtract
The small volume of encapsulating structure 10.Ensure that the electrical connection stability between ultrasonic probe 18 and control chip 14 is higher simultaneously.
Referring to Fig. 1, in some embodiments, encapsulating structure 10 includes the second adhesive-layer 15, the second adhesive-layer 15 will
Ultrasonic probe 18 is bonded on control chip 14.
So so that ultrasonic probe 18 is more brought into close contact with control chip 14, and is firmly secured to control chip 14
On.
In some embodiments, the second adhesive-layer 15 is consistent with the material of the first adhesive-layer 13, in order to encapsulating structure
10 encapsulation, and reduce bonding cost.
In some embodiments, ultrasonic probe 18 include away from substrate 12 probe top surface 181, encapsulating material 11 with
Probe top surface 181 flushes.
Contacted in this way, reducing ultrasonic probe 18 with the external world, and then play a part of protecting ultrasonic probe 18.
In some embodiments, encapsulating structure 10 is in rectangular-shape, and then make it that structure is compacter.It is appreciated that
The shape of encapsulating structure 10 can be set according to actual conditions, and be not limited to the shape of above-mentioned embodiment discussion.
In some embodiments, encapsulating material 11 is epoxy resin.
Because epoxy resin has excellent adhesive strength to the surface of metal and nonmetallic materials, dielectric properties are good,
Deformation retract rate is small, and product size stability is good, and hardness is high, and pliability is preferable, the features such as to alkali and most of solvent-stable.Such as
This, encapsulating material 11 uses epoxy resin to be easy to encapsulate ultrasonic sensor structure 10 and cause encapsulation knot as filled media
Structure is more stable.
In some embodiments, the material of encapsulating material 11 can also be that other non-conductive materials can also be simultaneously
Other non-depressed electric materials.
It is appreciated that the material of encapsulating material 11 can be set according to actual conditions, and it is not limited to implementation discussed above
Mode.
In the utility model, unless otherwise clearly defined and limited, fisrt feature is "above" or "below" second feature
Can be that the first and second features directly contact, or the first and second features pass through intermediary mediate contact.Moreover, first is special
Sign second feature " on ", " top " and " above " can be fisrt feature directly over second feature or oblique upper, or only
Represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " lower section " and " below " can be with
Be fisrt feature immediately below second feature or obliquely downward, or be merely representative of fisrt feature level height and be less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or the spy for combining the embodiment or example description
Point is contained at least one embodiment or example of the present utility model.In this manual, to the schematic table of above-mentioned term
State and be necessarily directed to identical embodiment or example.Moreover, specific features, structure, material or the feature of description can be with
Combined in an appropriate manner in any one or more embodiments or example.In addition, in the case of not conflicting, this area
Technical staff the different embodiments or example and the feature of different embodiments or example described in this specification can be entered
Row combines and combination.
Although embodiment of the present utility model has been shown and described above, it is to be understood that above-described embodiment is
Exemplary, it is impossible to it is interpreted as to limitation of the present utility model, one of ordinary skill in the art is in the scope of the utility model
It is interior above-described embodiment to be changed, changed, replaced and modification.
Claims (10)
1. a kind of encapsulating structure, for ultrasonic fingerprint sensor, it is characterised in that the encapsulating structure includes：
Substrate, the substrate include substrate top surface, and the substrate top surface is provided with multiple first connection electrodes；
Control chip, the control chip include die bottom surface, and the die bottom surface is provided with multiple second connection electrodes, described
Control chip connects the substrate second connection electrode by flip chip mounting technique and is connected electricity with described first
Extremely corresponding connection, the orthographic projection that the die bottom surface is located at the substrate top surface cover the multiple first connection electrode；
Ultrasonic probe, the ultrasonic probe are arranged on the control chip, and the ultrasonic probe is used in the base
Launch ultrasonic wave under the control of plate and the control chip and detect the ultrasonic wave reflected；And
Encapsulating material, the encapsulating material cover the substrate and the control chip and the fixed ultrasound by mould pressing technology
Ripple is popped one's head in.
2. encapsulating structure as claimed in claim 1, it is characterised in that the encapsulating structure include connecting the substrate top surface and
First adhesive-layer of the die bottom surface.
3. encapsulating structure as claimed in claim 1, it is characterised in that orthographic projection of the control chip in the substrate top surface
Fall in the substrate top surface.
4. encapsulating structure as claimed in claim 1, it is characterised in that the substrate includes the base opposite with the substrate top surface
Plate bottom surface, the substrate include being formed at the 3rd connection electrode of the substrate bottom surface, formed in the substrate predetermining circuit with
Predetermined mode connects first connection electrode and the 3rd connection electrode to realize predetermined function.
5. encapsulating structure as claimed in claim 4, it is characterised in that the 3rd connection electrode is welded for land grid array
Pad.
6. encapsulating structure as claimed in claim 1, it is characterised in that the control chip includes opposite with the die bottom surface
Chip top surface, the chip top surface passes through silicon hole technology formed with multiple 4th connection electrodes, the 4th connection electrode
It is corresponding with part second connection electrode to be connected.
7. encapsulating structure as claimed in claim 1, it is characterised in that the ultrasonic probe includes：
Piezoelectric layer, the piezoelectric layer are made up of piezo column array；
Launch limit, the transmitting limit is formed at below the piezoelectric layer, each transmitting limit and a corresponding institute
State piezo column connection；And
Polar curve is received, the receiving pole line is formed above the piezoelectric layer, every reception polar curve and corresponding a line institute
State piezo column connection.
8. encapsulating structure as claimed in claim 7, it is characterised in that the transmitting limit is provided with probe connection electrode；
The control chip includes chip top surface, and the control chip includes the 5th connection electricity for being formed at the chip top surface
Pole；
The probe connection electrode connection corresponding with the 5th connection electrode.
9. encapsulating structure as claimed in claim 8, it is characterised in that the ultrasonic probe uses flip chip mounting technique
It is bonded with the control chip.
10. encapsulating structure as claimed in claim 1, it is characterised in that the ultrasonic probe is included away from the substrate
Probe top surface, the encapsulating material flush with the probe top surface.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621037945.1U CN206672915U (en) | 2016-09-05 | 2016-09-05 | Encapsulating structure |
| US15/489,873 US10262178B2 (en) | 2016-09-05 | 2017-04-18 | Ultrasonic fingerprint sensor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621037945.1U CN206672915U (en) | 2016-09-05 | 2016-09-05 | Encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206672915U true CN206672915U (en) | 2017-11-24 |
Family
ID=60356124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621037945.1U Expired - Fee Related CN206672915U (en) | 2016-09-05 | 2016-09-05 | Encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206672915U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019144361A1 (en) * | 2018-01-25 | 2019-08-01 | 深圳市贝瑞森传感科技有限公司 | Ultrasonic transceiver probe, ultrasonic transduction array device and fetal doppler |
-
2016
- 2016-09-05 CN CN201621037945.1U patent/CN206672915U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019144361A1 (en) * | 2018-01-25 | 2019-08-01 | 深圳市贝瑞森传感科技有限公司 | Ultrasonic transceiver probe, ultrasonic transduction array device and fetal doppler |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 330013 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330013 east of Xueyuan 6th Road, south of Tianxiang Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 no.1189 Jingdong Avenue, high tech Zone, Nanchang City, Jiangxi Province Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171124 Termination date: 20210905 |