CN113938109A - Surface acoustic wave filter packaging structure - Google Patents
Surface acoustic wave filter packaging structure Download PDFInfo
- Publication number
- CN113938109A CN113938109A CN202111536132.2A CN202111536132A CN113938109A CN 113938109 A CN113938109 A CN 113938109A CN 202111536132 A CN202111536132 A CN 202111536132A CN 113938109 A CN113938109 A CN 113938109A
- Authority
- CN
- China
- Prior art keywords
- chip
- conductive adhesive
- height
- hollow
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The invention provides a packaging structure of a surface acoustic wave filter. The packaging structure comprises a substrate; two colloid grooves and a metal wire layer are arranged in the matrix; the two colloid grooves are communicated with the metal wire layer; the metal wire layer extends to the outer surface of the bottom of the substrate and is electrically connected with the solder balls at the bottom of the substrate; conductive adhesive is filled into the two colloid grooves; the conductive adhesive is in contact connection with the metal wire layer; the upper surface of the conductive adhesive is higher than the upper surface of the substrate; and welding spot pillars are bonded on the conductive adhesive; a chip is arranged on the welding spot support; gaps are formed among the chip, the base body and the two welding spot supporting columns, and the IDT functional area of the chip is arranged in the gaps; the upper surface of the base body is provided with two connecting discs; the connecting disc is provided with a hollow glass supporting column; two ends of the chip are embedded in the hollow glass support columns; a cover plate is arranged above the filtering chip; the cover plate is bonded with the base body.
Description
Technical Field
The invention provides a surface acoustic wave filter packaging structure, and belongs to the technical field of filters.
Background
At present, the main packaging techniques of the surface acoustic wave filter include substrate packaging such as metal packaging, plastic packaging, surface mount, flip chip bonding, and the like, or surface film-coated packaging using devices. The existing filter packaging structure has the following defects: because need consolidate through the solder joint between chip and the base member and be connected, but because need leave the space between chip and the base member, this just needs the solder joint to have certain height, when appearing highly, when having external force influence between chip and the base member, will lead to the solder joint to break, and then influence the filter performance. Although the welding spot is protected by being transferred to the groove body through the groove body structure in the prior art, the welding spot is transferred to the groove body, and enough gaps are reserved between the chip and the base body, so that the length of the welding spot is lengthened, the edge of the groove body is always a right-angle edge, and the welding spot is easily broken under the condition of external force, so that the performance of the filter is affected.
Disclosure of Invention
The invention provides a packaging structure of a surface acoustic wave filter, which is used for solving the problem that welding spots between a chip and a base body in the existing filter are easy to break, and adopts the following technical scheme:
a surface acoustic filter package structure, the package structure comprising a substrate; two colloid grooves and a metal wire layer are arranged in the matrix; the two colloid grooves are communicated with the metal wire layer; the metal wire layer extends to the outer surface of the bottom of the substrate in the substrate and is electrically connected with the solder balls at the bottom of the substrate; a passivation layer is arranged on the outer surface of the bottom of the base body; conductive adhesive is filled into the two colloid grooves; the conductive adhesive is in contact connection with the metal wire layer; the upper surface of the conductive adhesive is higher than the upper surface of the substrate; and welding spot pillars are bonded on the conductive adhesive; a chip is arranged on the welding spot support; gaps are formed among the chip, the base body and the two welding spot supporting columns, and the IDT functional area of the chip is arranged in the gaps; the upper surface of the base body is provided with two connecting discs; the connecting disc is provided with a hollow glass supporting column; two ends of the chip are embedded in the hollow glass support columns; a cover plate is arranged above the filtering chip; the cover plate is bonded with the base body.
Furthermore, two sides of the welding spot support column are respectively provided with a support auxiliary sheet; the outer side of the supporting auxiliary sheet is provided with a conductive adhesive column; the conductive adhesive column is adhered to the part of the conductive adhesive, which is higher than the upper surface of the base body.
Further, the length of the supporting auxiliary sheet satisfies the following condition:
wherein the content of the first and second substances,H p indicating the length of the supporting auxiliary piece; d represents the width of the welding spot support column;Hshowing the height of the solder joint support column;hindicating the height of the colloid part of the conductive adhesive higher than the upper surface of the substrate;αandβthe height adjustment coefficient is expressed, and,αthe value range is 0.64-0.78;βthe value range is 2.3-3.5.
Further, the height of the conductive adhesive column is more than 0.67 times of the installation height of the supporting auxiliary sheet.
Further, the height of the colloid part of the conductive adhesive higher than the upper surface of the substrate satisfies the following relationship:
0.075H<h<0.15H
wherein the content of the first and second substances,hindicating the height of the colloid part of the conductive adhesive higher than the upper surface of the substrate;Hindicating the height of the solder joint support posts.
Further, the colloid groove comprises a first trapezoidal structure and a second trapezoidal structure; the lower bottoms of the first ladder-shaped structures and the second ladder-shaped structures are oppositely communicated; the height and bottom dimensions of the first ladder structure are greater than those of the second ladder structure; the upper bottom of the first trapezoid structure is connected with the welding spot support column; and the upper bottom of the second ladder-shaped structure is connected with the metal wire layer.
Further, the bottom surface of the lower bottom of the first trapezoid structure and the bottom surface of the lower bottom of the second trapezoid structure are both square structures; the ratio of the side length of the bottom surface of the lower bottom of the first trapezoid structure to the side length of the bottom surface of the lower bottom of the second trapezoid structure ranges from 1:0.92 to 1: 0.83; preferably 1: 0.85; the ratio of the height of the first trapezoidal structure to the height of the second trapezoidal structure is 11: 9.
Further, the hollow glass support column comprises two hollow side walls and a plane side wall; the two hollow side walls and the plane side wall are sequentially and mutually and vertically connected; the two hollow side walls are respectively abutted against the front side wall and the rear side wall of the filter chip; the plane side walls are abutted against the end walls at two ends of the filter chip.
Further, a right-angled trapezoid hollow structure is arranged on the bottom edge of one side, connected with the connecting disc, of the hollow side wall; an inclined beam is arranged on the right trapezoid hollow structure; a parallelogram hollowed-out structure with a rectangular bulge at one corner is arranged between the inclined beam and the top edge of the hollowed-out side wall; the filter chip comprises a filter chip, a parallelogram hollow structure and a filter chip, wherein one corner of the parallelogram hollow structure, which is provided with a rectangular bulge, is one corner close to the center of the side wall of the filter chip; a right trapezoid extension part is arranged on one side, close to the central position of the side wall of the filtering chip, of the top edge of the hollowed-out side wall; and one side of the parallelogram hollow structure is provided with a bearing bulge, and the bearing bulge is used for bearing the filtering chip.
Further, the ratio of the long bottom edge of the right trapezoid hollow structure to the long edge of the parallelogram hollow structure is 1: 2; the ratio of the short bottom edge of the right-angled trapezoid hollow structure to the long edge of the parallelogram hollow structure is 1: 3; the rectangular bulge is a square bulge, and the side length of the square bulge has a value range of: 0.15h l ≤L≤0.18h l Wherein, in the step (A),h l the height of the parallelogram hollow structure is shown.
The invention has the beneficial effects that:
according to the packaging structure of the surface acoustic wave filter, the colloid grooves, the conductive adhesive columns and the supporting auxiliary pieces which are oppositely arranged through the two trapezoid structures are combined in structure and size, so that when the welding spot supporting columns are influenced by external force, the welding spot supporting columns are effectively supported through the colloid grooves, the conductive adhesive columns and the supporting auxiliary pieces, the stability of the welding spot supporting columns is greatly improved, and the welding spot supporting columns are effectively prevented from being broken. Simultaneously, because the solder joint support column install in the colloid groove outside can effectively shorten the length of solder joint support column improves its steadiness, and, when the exogenic action appears, the outer edge of colloid groove can't be right the solder joint support column produces the influence, has further reduced the rupture breakage rate of solder joint support column. On the other hand, support the filtering chip through the fretwork glass support column to, when the chip received the external force influence, can carry out effectual decomposition with external force through the hollow out construction of fretwork glass support column, the influence power of weakening external force to the chip vibration reduces the chip at the outside displacement range of external force effect, and then reduces wrench movement and the displacement influence to the solder joint support column, further improves the breakage resistance of solder joint support column.
Drawings
FIG. 1 is a schematic structural diagram of a package structure according to the present invention;
FIG. 2 is a schematic view of the structure of the hollow glass support column according to the present invention;
FIG. 3 is a schematic view of the installation between the hollow glass support column and the filter chip according to the present invention;
(1, a cover plate; 2, a filter chip; 3, an IDT functional region; 4, conductive adhesive; 5, an adhesive groove; 6, a solder joint support column; 7, a support auxiliary sheet; 8, a connecting disc; 9, a hollow glass support column; 10, a solder ball; 11, a metal wire layer; 12, a base; 13, a passivation layer; 14, a conductive adhesive column; 91, a hollow side wall; 92, a plane side wall).
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
In the package structure of the surface acoustic wave filter according to the embodiment of the present invention, as shown in fig. 1, the package structure includes a substrate; two colloid grooves and a metal wire layer are arranged in the matrix; the two colloid grooves are communicated with the metal wire layer; the metal wire layer extends to the outer surface of the bottom of the substrate in the substrate and is electrically connected with the solder balls at the bottom of the substrate; a passivation layer is arranged on the outer surface of the bottom of the base body; conductive adhesive is filled into the two colloid grooves; the conductive adhesive is in contact connection with the metal wire layer; the upper surface of the conductive adhesive is higher than the upper surface of the substrate; and welding spot pillars are bonded on the conductive adhesive; a chip is arranged on the welding spot support; gaps are formed among the chip, the base body and the two welding spot supporting columns, and the IDT functional area of the chip is arranged in the gaps; the upper surface of the base body is provided with two connecting discs; the connecting disc is provided with a hollow glass supporting column; two ends of the chip are embedded in the hollow glass support columns; a cover plate is arranged above the filtering chip; the cover plate is bonded with the base body. Wherein, two sides of the welding spot support column are respectively provided with a support auxiliary sheet; the outer side of the supporting auxiliary sheet is provided with a conductive adhesive column; the conductive adhesive column is adhered to the part of the conductive adhesive, which is higher than the upper surface of the base body.
The working principle and the effect of the technical scheme are as follows: the colloid groove that this embodiment provided, conductive adhesive post and the structure and the size setting that support the auxiliary piece that set up relatively through two trapezium structures combine together and can receive external force influence at the solder joint support column when, through the colloid groove to with conductive adhesive post, support the auxiliary piece to the solder joint support column effectively support, improve the steadiness of solder joint support column in the very big degree, prevent effectively that the solder joint support column from taking place to break. Simultaneously, because the solder joint support column install in the colloid groove outside can effectively shorten the length of solder joint support column improves its steadiness, and, when the exogenic action appears, the outer edge of colloid groove can't be right the solder joint support column produces the influence, has further reduced the rupture breakage rate of solder joint support column. On the other hand, support the filtering chip through the fretwork glass support column to, when the chip received the external force influence, can carry out effectual decomposition with external force through the hollow out construction of fretwork glass support column, the influence power of weakening external force to the chip vibration reduces the chip at the outside displacement range of external force effect, and then reduces wrench movement and the displacement influence to the solder joint support column, further improves the breakage resistance of solder joint support column.
In one embodiment of the present invention, the height of the conductive adhesive pillar is more than 0.67 times the installation height of the supporting auxiliary plate. The height of the colloid part of the conductive adhesive, which is higher than the upper surface of the base body, satisfies the following relation:
0.075H<h<0.15H
wherein the content of the first and second substances,hindicating the height of the colloid part of the conductive adhesive higher than the upper surface of the substrate;Hindicating the height of the solder joint support posts.
The effect of the above technical scheme is as follows: set up the conducting resin to be higher than the upper surface of base member and can lie in that the conducting resin post is carried out the intercommunication and is glued when improving the conducting resin post steadiness, reduce the influence of colloidal groove to the solder joint support column, simultaneously, be higher than through above-mentioned conducting resin the condition setting of the colloid part's of the upper surface of base member height can effectively control the conducting resin and spill over in the volume of base member, prevents that too much conducting resin from producing unnecessary electricity and connects the influence filter chip performance, simultaneously, can guarantee again that the conducting resin have enough overflow volume guarantee with bonding steadiness between the conducting resin post. On the other hand, the height of the conductive adhesive column can be set to effectively improve the supporting force between the conductive adhesive column and the supporting auxiliary sheet, effectively improve the supporting force of the supporting auxiliary sheet on the welding spot supporting column, and further reduce the breakage rate of the welding spot supporting column.
In an embodiment of the present invention, a mounting bottom surface of the auxiliary supporting piece is lower than a highest surface of a height of the colloid part of the conductive adhesive higher than the upper surface of the base body, and a length of the auxiliary supporting piece satisfies the following condition:
wherein the content of the first and second substances,H p indicating the length of the supporting auxiliary piece; d represents the width of the welding spot support column;Hshowing the height of the solder joint support column;hindicating the height of the colloid part of the conductive adhesive higher than the upper surface of the substrate;αandβthe height adjustment coefficient is expressed, and,αthe value range is 0.64-0.78;βthe value range is 2.3-3.5.
The effect of the above technical scheme is as follows: the length of the auxiliary supporting sheet obtained through the formula can be set in a targeted manner according to the actual design condition of the welding spot supporting column. Can all produce the firm helping hand of support of maximize to the solder joint support column of the not unidimensional condition, simultaneously, combine the conducting resin to be higher than the height of the colloid part of the upper surface of base member acquires the length of supporting the auxiliary plate, has fully considered to work as the installation bottom surface of supporting the auxiliary plate is less than the conducting resin and is higher than under the condition of the highest face of the height of the colloid part of the upper surface of base member, improve support the stability of auxiliary plate to the solder joint support column simultaneously, it is right spill over the conducting resin of base member surface height and carry out the scope and clamp down, prevent that the conducting resin from excessively overflowing and influencing chip performance. On the other hand, the length of the supporting auxiliary sheet obtained through the formula can ensure that the welding spot supporting column is effectively supported, and meanwhile, an enough gap is formed between the supporting auxiliary sheet and the filter chip, so that when the conductive adhesive is solidified and expanded to generate acting force on the supporting auxiliary sheet to enable the supporting auxiliary sheet to be too high, the upper end of the supporting auxiliary sheet is effectively prevented from contacting the filter chip, and further the performance of the filter chip is prevented from being influenced.
According to one embodiment of the invention, the glue groove comprises a first trapezoid structure and a second trapezoid structure; the lower bottoms of the first ladder-shaped structures and the second ladder-shaped structures are oppositely communicated; the height and bottom dimensions of the first ladder structure are greater than those of the second ladder structure; the upper bottom of the first trapezoid structure is connected with the welding spot support column; and the upper bottom of the second ladder-shaped structure is connected with the metal wire layer.
The bottom surface of the lower bottom of the first trapezoid structure and the bottom surface of the lower bottom of the second trapezoid structure are both square structures; the ratio of the side length of the bottom surface of the lower bottom of the first trapezoid structure to the side length of the bottom surface of the lower bottom of the second trapezoid structure ranges from 1:0.92 to 1: 0.83; preferably 1: 0.85; the ratio of the height of the first trapezoidal structure to the height of the second trapezoidal structure is 11: 9.
The working principle and the effect of the technical scheme are as follows: the structure and the size proportion setting of the colloid groove that utilize to have first trapezium structure and second trapezium structure can be in when the solder joint support column meets external force effect, through the outside dispersion effort of two hypotenuses that first trapezium structure and second trapezium structure leaned out, will external force shifts and weakens in going to the base member, prevents that all stresses from all concentrating on the solder joint support column and making its production fracture. Meanwhile, the first trapezoid structure and the second trapezoid structure are different in arrangement direction, so that the first trapezoid structure and the second trapezoid structure can deal with external forces in different directions, and can generate enough external force dispersion and weakening for the external forces in different directions.
The structure and the size proportion of the colloid groove are matched to be arranged to transfer the external force action to the base body to the maximum extent, disperse and weaken the external force, reduce the influence of the external force on the welding spot supporting column and further reduce the breakage rate of the welding spot supporting column.
In one embodiment of the invention, the hollow glass support column comprises two hollow side walls and a plane side wall; the two hollow side walls and the plane side wall are sequentially and mutually and vertically connected; the two hollow side walls are respectively abutted against the front side wall and the rear side wall of the filter chip; the plane side walls are abutted against the end walls at two ends of the filter chip. The bottom edge of one side of the hollow side wall connected with the connecting disc is provided with a right-angled trapezoid hollow structure; an inclined beam is arranged on the right trapezoid hollow structure; a parallelogram hollowed-out structure with a rectangular bulge at one corner is arranged between the inclined beam and the top edge of the hollowed-out side wall; the filter chip comprises a filter chip, a parallelogram hollow structure and a filter chip, wherein one corner of the parallelogram hollow structure, which is provided with a rectangular bulge, is one corner close to the center of the side wall of the filter chip; a right trapezoid extension part is arranged on one side, close to the central position of the side wall of the filtering chip, of the top edge of the hollowed-out side wall; and one side of the parallelogram hollow structure is provided with a bearing bulge, and the bearing bulge is used for bearing the filtering chip. The right trapezoidThe ratio of the long bottom edge of the hollow structure to the long edge of the parallelogram hollow structure is 1: 2; the ratio of the short bottom edge of the right-angled trapezoid hollow structure to the long edge of the parallelogram hollow structure is 1: 3; the rectangular bulge is a square bulge, and the side length of the square bulge has a value range of: 0.15h l ≤L≤0.18h l Wherein, in the step (A),h l the height of the parallelogram hollow structure is shown.
The working principle and the effect of the technical scheme are as follows: through the setting of the parallelogram hollow out construction and the right trapezoid hollow out construction of fretwork glass support column, receive under the great condition of external force influence at the filtering chip, can be right when the filtering chip produces enough holding power and fixed force, will through parallelogram hollow out construction and right trapezoid hollow out construction external force dissipates on apron and base member, reduces the stress degree of filtering chip, and then reduces the influence of external force to the solder joint support column. On the other hand, through the setting of sloping roof beam, can be provided with two hollow out construction at the glass support column to under the thinner condition of glass support column preparation, effectively improve the intensity of fretwork glass support column, effectively prevent glass support column self fracture. Simultaneously, because parallelogram hollow out construction when the external force that comes above the one-tenth hand, because parallelogram hollow out construction's acute angle structure, it is how big stress that this acute angle end point goes out to concentrate easily, easily makes the glass support column cracked, consequently, through the bellied external force that sets up dispersion and this summit one-tenth hand of weakening of rectangle, and then improve the intensity of fretwork glass support column, effectively prevent glass support column self fracture.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A surface acoustic wave filter package structure, characterized in that the package structure comprises a substrate; two colloid grooves and a metal wire layer are arranged in the matrix; the two colloid grooves are communicated with the metal wire layer; the metal wire layer extends to the outer surface of the bottom of the substrate in the substrate and is electrically connected with the solder balls at the bottom of the substrate; a passivation layer is arranged on the outer surface of the bottom of the base body; conductive adhesive is filled into the two colloid grooves; the conductive adhesive is in contact connection with the metal wire layer; the upper surface of the conductive adhesive is higher than the upper surface of the substrate; and welding spot pillars are bonded on the conductive adhesive; a chip is arranged on the welding spot support; gaps are formed among the chip, the base body and the two welding spot supporting columns, and the IDT functional area of the chip is arranged in the gaps; the upper surface of the base body is provided with two connecting discs; the connecting disc is provided with a hollow glass supporting column; two ends of the chip are embedded in the hollow glass support columns; a cover plate is arranged above the filter chip; the cover plate is bonded with the base body.
2. The SAW filter package structure of claim 1, wherein two sides of the solder bump support pillars are respectively provided with an auxiliary support sheet; the outer side of the supporting auxiliary sheet is provided with a conductive adhesive column; the conductive adhesive column is adhered to the part of the conductive adhesive, which is higher than the upper surface of the base body.
3. The SAW filter package structure of claim 2, wherein the length of the supporting auxiliary sheet satisfies the following condition:
wherein the content of the first and second substances,H p indicating the length of the supporting auxiliary piece; d represents the width of the welding spot support column;Hshowing the height of the solder joint support column;hindicating the height of the colloid part of the conductive adhesive higher than the upper surface of the substrate;αandβthe height adjustment coefficient is expressed, and,αthe value range is 0.64-0.78;βthe value range is 2.3-3.5.
4. The SAW filter package structure of claim 2, wherein the height of said columns of conductive adhesive exceeds the height of said supporting sub-sheets by 0.67 times.
5. The SAW filter package structure of claim 1, wherein the height of the glue portion of the conductive glue above the top surface of the substrate satisfies the following relationship:
0.075H<h<0.15H
wherein the content of the first and second substances,hindicating the height of the colloid part of the conductive adhesive higher than the upper surface of the substrate;Hindicating the height of the solder joint support posts.
6. The SAW filter package structure of claim 1, wherein the glue trench comprises a first trapezoidal structure and a second trapezoidal structure; the lower bottoms of the first ladder-shaped structures and the second ladder-shaped structures are oppositely communicated; the height and bottom dimensions of the first ladder structure are greater than those of the second ladder structure; the upper bottom of the first trapezoid structure is connected with the welding spot support column; and the upper bottom of the second ladder-shaped structure is connected with the metal wire layer.
7. The SAW filter package structure of claim 6, wherein the bottom surface of the lower base of the first trapezoid structure and the bottom surface of the lower base of the second trapezoid structure are both square structures; the ratio of the side length of the bottom surface of the lower bottom of the first trapezoid structure to the side length of the bottom surface of the lower bottom of the second trapezoid structure ranges from 1:0.92 to 1: 0.83; the ratio of the height of the first trapezoidal structure to the height of the second trapezoidal structure is 11: 9.
8. The SAW filter package structure of claim 1, wherein the pierced glass support posts comprise two pierced sidewalls and one planar sidewall; the two hollow side walls and the plane side wall are sequentially and mutually and vertically connected; the two hollow side walls are respectively abutted against the front side wall and the rear side wall of the filter chip; the plane side walls are abutted against the end walls at two ends of the filter chip.
9. The SAW filter package structure of claim 8, wherein a right trapezoid hollow structure is provided on a bottom edge of one side of the hollow side wall connected to the connection pad; an inclined beam is arranged on the right trapezoid hollow structure; a parallelogram hollowed-out structure with a rectangular bulge at one corner is arranged between the inclined beam and the top edge of the hollowed-out side wall; the filter chip comprises a filter chip, a parallelogram hollow structure and a filter chip, wherein one corner of the parallelogram hollow structure, which is provided with a rectangular bulge, is one corner close to the center of the side wall of the filter chip; a right trapezoid extension part is arranged on one side, close to the central position of the side wall of the filtering chip, of the top edge of the hollowed-out side wall; and one side of the parallelogram hollow structure is provided with a bearing bulge, and the bearing bulge is used for bearing the filtering chip.
10. The SAW package structure of claim 9, wherein the ratio of the long bottom side of the right trapezoid hollowing structure to the long side of the parallelogram hollowing structure is 1: 2; the ratio of the short bottom edge of the right-angled trapezoid hollow structure to the long edge of the parallelogram hollow structure is 1: 3; the rectangular bulge is a square bulge, and the side length of the square bulge has a value range of: 0.15h l ≤L≤0.18h l Wherein, in the step (A),h l the height of the parallelogram hollow structure is shown.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111536132.2A CN113938109B (en) | 2021-12-16 | 2021-12-16 | Surface acoustic wave filter packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111536132.2A CN113938109B (en) | 2021-12-16 | 2021-12-16 | Surface acoustic wave filter packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113938109A true CN113938109A (en) | 2022-01-14 |
| CN113938109B CN113938109B (en) | 2022-04-01 |
Family
ID=79289065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111536132.2A Active CN113938109B (en) | 2021-12-16 | 2021-12-16 | Surface acoustic wave filter packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113938109B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114094978A (en) * | 2022-01-19 | 2022-02-25 | 深圳新声半导体有限公司 | Decoupling packaging structure of surface acoustic wave filter bank |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102496759A (en) * | 2011-11-29 | 2012-06-13 | 华为技术有限公司 | Planar waveguide, waveguide filter and antenna |
| US20140319565A1 (en) * | 2013-04-26 | 2014-10-30 | Advanced Optoelectronic Technology, Inc. | Light emitting diode package |
| CN105186070A (en) * | 2015-09-18 | 2015-12-23 | 无锡泓瑞航天科技有限公司 | Low-temperature refrigerator multi-path superconductor filter support structure |
| US20180062618A1 (en) * | 2016-08-25 | 2018-03-01 | General Electric Company | Embedded rf filter package structure and method of manufacturing thereof |
| CN109660229A (en) * | 2018-12-20 | 2019-04-19 | 杰群电子科技（东莞）有限公司 | A kind of SAW filter processing technology and SAW filter and electronic product |
| CN110943710A (en) * | 2019-11-18 | 2020-03-31 | 王之奇 | Filter chip packaging structure and wafer level packaging method thereof |
| CN111555732A (en) * | 2020-05-12 | 2020-08-18 | 中国电子科技集团公司第二十六研究所 | Thin film bulk acoustic wave device packaging structure and packaging method thereof |
| CN111769812A (en) * | 2020-05-26 | 2020-10-13 | 甬矽电子(宁波)股份有限公司 | Surface acoustic wave filter chip packaging structure and packaging method |
| CN112367061A (en) * | 2020-09-16 | 2021-02-12 | 厦门云天半导体科技有限公司 | Glass cover plate-based surface acoustic wave filter packaging method and structure |
| CN213661584U (en) * | 2020-12-07 | 2021-07-09 | 苏州晶方半导体科技股份有限公司 | Surface acoustic wave filter chip packaging structure |
| CN113316072A (en) * | 2021-05-27 | 2021-08-27 | 武汉大学 | Piezoelectric acoustic transducer with filtering function and manufacturing method thereof |
| CN113675102A (en) * | 2021-10-22 | 2021-11-19 | 深圳新声半导体有限公司 | Method for chip packaging and chip particles |
-
2021
- 2021-12-16 CN CN202111536132.2A patent/CN113938109B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102496759A (en) * | 2011-11-29 | 2012-06-13 | 华为技术有限公司 | Planar waveguide, waveguide filter and antenna |
| US20140319565A1 (en) * | 2013-04-26 | 2014-10-30 | Advanced Optoelectronic Technology, Inc. | Light emitting diode package |
| CN105186070A (en) * | 2015-09-18 | 2015-12-23 | 无锡泓瑞航天科技有限公司 | Low-temperature refrigerator multi-path superconductor filter support structure |
| US20180062618A1 (en) * | 2016-08-25 | 2018-03-01 | General Electric Company | Embedded rf filter package structure and method of manufacturing thereof |
| CN109660229A (en) * | 2018-12-20 | 2019-04-19 | 杰群电子科技（东莞）有限公司 | A kind of SAW filter processing technology and SAW filter and electronic product |
| CN110943710A (en) * | 2019-11-18 | 2020-03-31 | 王之奇 | Filter chip packaging structure and wafer level packaging method thereof |
| CN111555732A (en) * | 2020-05-12 | 2020-08-18 | 中国电子科技集团公司第二十六研究所 | Thin film bulk acoustic wave device packaging structure and packaging method thereof |
| CN111769812A (en) * | 2020-05-26 | 2020-10-13 | 甬矽电子(宁波)股份有限公司 | Surface acoustic wave filter chip packaging structure and packaging method |
| CN112367061A (en) * | 2020-09-16 | 2021-02-12 | 厦门云天半导体科技有限公司 | Glass cover plate-based surface acoustic wave filter packaging method and structure |
| CN213661584U (en) * | 2020-12-07 | 2021-07-09 | 苏州晶方半导体科技股份有限公司 | Surface acoustic wave filter chip packaging structure |
| CN113316072A (en) * | 2021-05-27 | 2021-08-27 | 武汉大学 | Piezoelectric acoustic transducer with filtering function and manufacturing method thereof |
| CN113675102A (en) * | 2021-10-22 | 2021-11-19 | 深圳新声半导体有限公司 | Method for chip packaging and chip particles |
Non-Patent Citations (2)
| Title |
|---|
| JAEJIN LEE: "Scalable Package-level RFI Filter for Digital Clock Noise Mitigation in 5-GHz and future 6-GHz WiFi Applications", 《2019 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL & POWER INTEGRITY (EMC+SIPI)》 * |
| 王立成: "面阵列芯片封装设备中的视觉定位技术", 《中国优秀博硕士学位论文全文数据库(硕士)信息科技辑》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114094978A (en) * | 2022-01-19 | 2022-02-25 | 深圳新声半导体有限公司 | Decoupling packaging structure of surface acoustic wave filter bank |
| CN114094978B (en) * | 2022-01-19 | 2022-04-15 | 深圳新声半导体有限公司 | Decoupling packaging structure of surface acoustic wave filter bank |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113938109B (en) | 2022-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6657290B2 (en) | Semiconductor device having insulation layer and adhesion layer between chip lamination | |
| KR100207969B1 (en) | Semiconductor package | |
| KR101563911B1 (en) | Semiconductor package | |
| KR101661442B1 (en) | Stud bump structure for semiconductor package assemblies | |
| US20030102570A1 (en) | Electronic device and a method of manufacturing the same | |
| CN113938109B (en) | Surface acoustic wave filter packaging structure | |
| KR900005587A (en) | Semiconductor device and manufacturing method | |
| KR102113751B1 (en) | Semiconductor interposer, integrated circuit package, and method for improving the reliability of a connection to a via in a substrate | |
| KR100368776B1 (en) | Semiconductor device and method for manufacturing same | |
| US7049217B2 (en) | Method of forming multi-piled bump | |
| US20050179142A1 (en) | Flip-chip attach structure | |
| KR101610827B1 (en) | Method of forming bonding structure | |
| CN201229937Y (en) | Flip chip encapsulation construction having non-array projection | |
| JP3981817B2 (en) | Manufacturing method of semiconductor device | |
| TW200605304A (en) | Flip-chip semiconductor package with lead frame and method for fabricating the same | |
| US20090261467A1 (en) | Semiconductor device | |
| JP4386012B2 (en) | Bump bonded body manufacturing method | |
| CN111769812A (en) | Surface acoustic wave filter chip packaging structure and packaging method | |
| JP2005353709A (en) | Chip solid electrolytic capacitor and its manufacturing process | |
| JP3777840B2 (en) | Mounting method of semiconductor device | |
| WO2021220559A1 (en) | Semiconductor device and manufacturing method for semiconductor device | |
| CN219937034U (en) | Semiconductor package | |
| CN216849904U (en) | Semiconductor packaging structure | |
| JPH10209205A (en) | Mounting structure for chip | |
| US20050199996A1 (en) | Two solder array structure with two high melting solder joints |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |