CN111739873B - Flexible substrate lamination packaging structure and flexible substrate lamination packaging method - Google Patents

Flexible substrate lamination packaging structure and flexible substrate lamination packaging method Download PDF

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Publication number
CN111739873B
CN111739873B CN202010798440.1A CN202010798440A CN111739873B CN 111739873 B CN111739873 B CN 111739873B CN 202010798440 A CN202010798440 A CN 202010798440A CN 111739873 B CN111739873 B CN 111739873B
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component
substrate
flexible substrate
attached
chip
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CN111739873A (en
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何正鸿
蒋瑞董
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Forehope Electronic Ningbo Co Ltd
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Forehope Electronic Ningbo Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Abstract

The embodiment of the invention provides a flexible substrate laminated packaging structure and a flexible substrate laminated packaging method, and relates to the technical field of chip packaging.

Description

Flexible substrate lamination packaging structure and flexible substrate lamination packaging method
Technical Field
The invention relates to the technical field of chip packaging, in particular to a flexible substrate lamination packaging structure and a flexible substrate lamination packaging method.
Background
With the rapid development of the semiconductor industry, electronic products are miniaturized with higher density, more functions, smaller product size and smaller distance between solder balls, so that a pop (package on package) stacking structure is widely applied to the semiconductor industry. And the flexible substrate stacking structure is combined with the POP product stacking, chips with different functions are packaged and stacked, and the packaging structure has the main advantages of high-density integration, small size of packaged products, excellent product performance and great utilization of stacking space.
In the prior art, the flexible substrate flank IC device needs to be connected with the flexible substrate flank circuit, in order to realize the flank stacking, the circuit layer needs to be arranged on the flexible substrate flank, the IC device is electrically connected with the circuit layer, and when the flexible substrate is bent to form the flank, the risk of damage of the bent circuit layer exists, so that the product stacking failure is caused.
Disclosure of Invention
The object of the present invention includes, for example, providing a flexible substrate stack packaging structure and a flexible substrate stack packaging method, which can avoid the risk of line failure caused by bending of a flexible substrate.
Embodiments of the invention may be implemented as follows:
in a first aspect, an embodiment of the present invention provides a flexible substrate stack package structure, including:
a flexible substrate;
the first component is reversely attached to the middle part of the flexible substrate and is electrically connected with the flexible substrate;
the second component is attached to the side wing of the flexible substrate in an insulating mode, wherein the side wing of the flexible substrate is folded upwards, so that the second component is attached to the side wall of the first component;
a third component attached to both the second component and the first component;
wherein the third component is electrically connected to both the first component and the second component.
In an optional embodiment, the first component includes a first substrate, a first chip, and a first plastic package body, the first chip is attached to the first substrate, the first plastic package body is disposed on the first substrate and covers the first chip, the first plastic package body is attached to the middle of the flexible substrate, and the first substrate and the flexible substrate are disposed at an interval and electrically connected.
In an alternative embodiment, the first substrate is electrically connected to the flexible substrate by a connection line.
In an optional embodiment, the second component includes a second substrate, a second chip, a conductive pillar, and a second plastic package, the second substrate is attached to the sidewall of the first component, the second chip is attached to the second substrate, the conductive pillar is disposed at one side edge of the second substrate and spaced apart from the flexible substrate, the third component is in electrical contact with the conductive pillar, the second plastic package is disposed on the second substrate and wraps outside the second chip, and the second plastic package is attached to a side wing of the flexible substrate.
In an alternative embodiment, the third component includes a third substrate, a third chip, and a third plastic package, the third substrate is attached to the second component and the first component, the third chip is attached to the third substrate, and the third plastic package is disposed on the third substrate and covers the third chip.
In an optional embodiment, the back surface of the third substrate is soldered to the first component and the second component through solder balls, and a filling adhesive layer is further disposed between the third substrate and the first component and between the third substrate and the second component, and the filling adhesive layer covers the solder balls.
In an optional embodiment, two second components are mounted on two side walls of the first component respectively; the number of the third elements is two, and the two third elements are respectively attached to two side edges of the first element and are respectively attached to the two second elements.
In a second aspect, an embodiment of the present invention provides a flexible substrate stack packaging method, including:
inversely mounting a first component on the middle part of the flexible substrate, and electrically connecting the first component with the flexible substrate;
inversely mounting a second component on the side wing of the flexible substrate;
folding the side wings of the flexible substrate upwards to enable the second component to be attached to the side walls of the first component;
and attaching a third component to the first component and the second component, and electrically connecting the third component to the first component and the second component respectively.
In an alternative embodiment, the step of attaching the second component upside down to the side flaps of the flexible substrate comprises:
preparing the second component;
and bonding the second component to the side wing of the flexible substrate through an adhesive layer or silver paste.
In an alternative embodiment, the step of fabricating the second component comprises:
forming a conductive pillar on the second substrate;
mounting a second chip on the second substrate;
and forming a second plastic package body wrapping the second chip on the second substrate to prepare and form the second binary device.
The beneficial effects of the embodiment of the invention include, for example:
according to the laminated packaging structure of the flexible substrate, the first component and the second component are respectively attached to the flexible substrate, the second component is attached to the side wall of the first component after the flexible substrate is folded, the third component is attached to the first component and the second component, and the third component is electrically connected with the first component and the second component respectively, so that the second component can be attached to the flexible substrate in an insulating mode, a circuit layer is prevented from being arranged on the flexible substrate, the problem that the circuit layer fails due to bending of the flexible substrate is solved, and the effectiveness and stability of stacking are guaranteed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of a flexible substrate stack package structure according to a first embodiment of the invention;
FIG. 2 is a schematic diagram of the structure of the first component of FIG. 1;
FIG. 3 is a schematic diagram of the second component of FIG. 1;
FIG. 4 is a schematic diagram of the third device of FIG. 1;
fig. 5 is a block diagram illustrating steps of a flexible substrate stack packaging method according to a second embodiment of the present invention;
fig. 6 to 16 are process flow charts of preparing a second substrate in a flexible substrate stack packaging method according to a second embodiment of the invention;
fig. 17-20 are process flow diagrams of a flexible substrate stack packaging method according to a second embodiment of the invention.
Icon: 100-flexible substrate stack package structure; 110-a flexible substrate; 130-a first component; 131-a first substrate; 133-first chip; 135-a first plastic package body; 150-a second component; 151-second chip; 153-a second substrate; 155-conductive post; 155 a-a resin layer; 155 b-side mount pad; 157-a second plastic package body; 170-a third component; 171-a third chip; 173-a third substrate; 173 a-solder ball; 175-a third plastic package body; 177-filling the glue layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
As disclosed in the background art, the conventional IC device on the flexible substrate side wing needs to be connected to the circuit on the flexible substrate side wing, in order to stack the side wings, a circuit layer needs to be arranged on the side wing of the flexible substrate, and then the IC device is electrically connected to the circuit layer. In addition, in the prior art, after laser grooving, a conductive layer (for realizing a metal column) needs to be filled and connected with a pad on the surface of a substrate, so that the problem that welding spots on the surface of the substrate are damaged due to poor clamping control of laser grooving power exists, and after a plastic package body is grooved, the conductive layer is not well welded, after the metal layer is filled, a metal layer on the surface of the plastic package body needs to be ground by using a grinding process, so that a substrate solder ball is welded, so that the problem that the metal layer is broken due to the grinding process exists, and the welding failure of products during stacking of IC devices (POP package. Meanwhile, the existing stacking structure is welded by using solder balls without protection, and the problem of product failure is caused by hidden cracks of solder ball welding parts when a product is tested in reliability/falling. The adoption of the existing flexible substrate stacking technology and the stacking structure can not realize the parallel stacking of IC devices.
The flexible substrate lamination packaging structure and the method provided by the invention can effectively solve the problems caused by the stacking of the traditional flexible substrates.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
First embodiment
Referring to fig. 1 to 4, the present embodiment provides a flexible substrate stack package structure 100, which avoids the circuit layer being disposed on a flexible substrate 110, thereby avoiding the problem of circuit layer failure caused by bending of the flexible substrate 110, and ensuring the effectiveness and stability of stacking.
The flexible substrate laminated package structure 100 provided by the embodiment includes a flexible substrate 110, a first component 130, a second component 150, and a third component 170, wherein the first component 130 is inversely attached to the middle of the flexible substrate 110 and is electrically connected to the flexible substrate 110; the second component 150 is attached to the side of the flexible substrate 110 in an insulated manner, wherein the side of the flexible substrate 110 is folded upwards so that the second component 150 is attached to the side wall of the first component 130, the third component 170 is attached to both the second component 150 and the first component 130, and the third component 170 is electrically connected to both the first component 130 and the second component 150.
In this embodiment, the first component 130 is attached to the middle of the flexible substrate 110 in an inverted manner, that is, the side of the plastic package of the first component 130 is bonded to the middle of the flexible substrate 110 through a glue layer/silver paste, and the second component 150 is also attached to the middle of the flexible substrate 110 in an inverted manner, that is, the side of the plastic package of the second component 150 is bonded to the side of the flexible substrate 110 through a glue layer/silver paste, so that the second component 150 is attached to the flexible substrate 110 in an insulated manner, and the side of the flexible substrate 110 is folded upwards, so that the second component 150 is attached to the side wall of the first component 130.
It should be noted that, in this embodiment, the middle portion of the flexible substrate 110 refers to the middle position of the flexible substrate 110, and has a mounting area for mounting the first component 130, two sides of the mounting area for mounting the first component 130 are flanks of the flexible substrate 110, and the flanks of the flexible substrate 110 have a mounting area for mounting the second component 150.
In this embodiment, there are two second components 150, two second components 150 are respectively attached to the side flaps on two sides of the flexible substrate 110, and are attached to two opposite side walls of the first component 130 after the side flaps of the flexible substrate 110 are folded, meanwhile, there are two third components 170, and two third components 170 are respectively attached to two side edges of the first component 130, and are respectively attached to two second components 150. Specifically, the left third component 170 is attached to the left second component 150 and the first component 130 and is electrically connected to both the first component 130 and the left second component 150, and the right third component 170 is attached to the right second component 150 and the first component 130 and is electrically connected to both the first component 130 and the rear second component 150.
In this embodiment, the height of the first component 130 relative to the middle of the flexible substrate 110 is the same as the height of the second component 150 relative to the middle of the flexible substrate 110, i.e., the second component 150 is attached to the sidewall of the first component 130 with the top surfaces of the two being flush, thereby enabling the third component 170 to be attached to both the second component 150 and the first component 130. The second component 150 stacked on the side wall of the first component 130 is used as a stacking horizontal plane to realize upward stacking, so that two third components 170 are stacked side by side, the stacking space is greatly utilized, the stacking size of a product is effectively reduced, and the performance of the product can be greatly improved.
Of course, in other preferred embodiments of the present invention, the third component 170 may be further stacked upwards, and the number of stacked layers may be determined according to actual requirements.
It should be noted that in this embodiment, the second component 150 is mounted on the first component 130 in an insulating manner, that is, the second component 150 is only electrically connected to the corresponding third component 170, the plastic package side of the second component 150 is bonded to the side edge of the flexible substrate 110 through a glue layer/silver paste, the substrate side of the second component 150 is bonded to the side wall of the first component 130 through a silver paste/glue layer, and there is no direct electrical connection relationship between the second component 150 and the first component 130, and between the second component 150 and the side edge of the flexible substrate 110.
The first component 130 includes a first substrate 131, a first chip 133 and a first plastic package body 135, the first chip 133 is attached to the first substrate 131, the first plastic package body 135 is disposed on the first substrate 131 and covers the first chip 133, the first plastic package body 135 is attached to the middle portion of the flexible substrate 110, and the first substrate 131 and the flexible substrate 110 are disposed at an interval and electrically connected. Specifically, the first plastic package body 135 is bonded to the first substrate 131 through an adhesive layer/silver paste, the first chip 133 is flip-chip mounted on the first substrate 131, meanwhile, pads are disposed on the back surface of the first substrate 131, connecting lines are disposed on some of the pads, and the first substrate 131 is connected to the pads on the flexible substrate 110 through the connecting lines, so that the first substrate 131 is electrically connected to the flexible substrate 110.
In the present embodiment, the third device is attached to the back surface of the first substrate 131 and connected to a pad partially disposed on the back surface of the first substrate 131, thereby achieving electrical connection between the third device and the first substrate 131.
The second component 150 includes a second substrate 153, a second chip 151, conductive pillars 155, and a second plastic package 157, the second substrate 153 is attached to a sidewall of the first component 130, the second chip 151 is attached to the second substrate 153, the conductive pillars 155 are disposed at a side edge of the second substrate 153 and spaced apart from the flexible substrate 110, the third component 170 is in electrical contact with the conductive pillars 155, the second plastic package 157 is disposed on the second substrate 153 and wraps outside the second chip 151, and the second plastic package 157 is attached to a side edge of the flexible substrate 110. Specifically, conductive post 155 is externally coated with resin layer 155a, and a pad is formed on a sidewall of resin layer 155 a.
In this embodiment, the conductive pillar 155 is coated with a resin layer 155a, a side pad 155b is disposed on a sidewall of the resin layer 155a, and the conductive pillar 155 has a multi-layer structure, specifically, a two-layer structure, and corresponds to the two side pads 155b, respectively, by designing the conductive pillar 155 and the side pad 155b, a side welding function of the second component 150 is realized, and insulation mounting between the second component 150 and the flexible substrate 110 and the first component 130 can be realized, so as to avoid a conventional sidewall stacking structure, where a circuit needs to be arranged in the flexible substrate 110, so as to realize sidewall stacking, and avoid a conventional sidewall stacking structure, where a wiring circuit of the flexible substrate 110 in a bending area is damaged by a bending fatigue, thereby causing problems such as failure of a stacked structure product. In the process of manufacturing the second component 150, the side mounting pad 155b is connected to the substrate dicing street, and the side mounting pad 155b is exposed after the second molding compound 157 is diced.
In this embodiment, the second substrate 153 is bonded to the sidewall of the first plastic package body 135 through an adhesive layer/silver paste, the second plastic package body 157 is bonded to the side wing of the flexible substrate 110 through an adhesive layer/silver paste, the conductive pillar 155 is disposed on the second substrate 153 and located at the upper side edge of the second substrate 153, one end of the conductive pillar 155 is electrically connected to the second substrate 153, the other end of the conductive pillar is electrically connected to the side pad 155b on the sidewall of the resin layer 155a, and the side pad 155b on the sidewall is used for connecting the third component 170, so that the third component 170 is electrically connected to the second substrate 153.
Note that the side wall of the resin layer 155a is flush with the back surface of the first substrate 131 in this embodiment, so that the third component 170 can be smoothly attached to the side wall of the resin layer 155a and the back surface of the first substrate 131. The third element 170 is simultaneously connected to the side-mounted pads 155b on the sidewalls of the resin layer 155a and the pads on the back surface of the first substrate 131, thereby achieving the simultaneous electrical connection of the third element 170 to the second substrate 153 and the first substrate 131.
The third component 170 includes a third substrate 173, a third chip 171, and a third plastic package 175, wherein the third substrate 173 is attached to the second component 150 and the first component 130, the third chip 171 is attached to the third substrate 173, and the third plastic package 175 is disposed on the third substrate 173 and covers the third chip 171. Specifically, the third substrate 173 is attached to the sidewall of the resin layer 155a and the back surface of the first substrate 131 and is connected to the pads on the sidewall of the resin layer 155a and the pads on the back surface of the first substrate 131, respectively, so that the third substrate 173 is electrically connected to both the first substrate 131 and the second substrate 153.
In this embodiment, the back surface of the third substrate 173 is soldered on the first component 130 and the second component 150 through the solder balls 173a, and an underfill layer 177 is further disposed between the third substrate 173 and the first component 130 and between the third substrate 173 and the second component 150, and the underfill layer 177 covers the solder balls 173 a. Specifically, the back of third base plate 173 is provided with solder ball 173a, and weld on the pad on the resin layer 155a lateral wall and the pad at the back of first base plate 131 through solder ball 173a, realize the electricity and connect, the packing glue film 177 sets up the back at first base plate 131, and the cladding is outside solder ball 173a, realize reducing the effect in device bottom gap, and utilize packing glue film 177 to protect solder ball 173a, strengthen the intensity in third base plate 173 bottom welding area, thereby promote whole stacked structure's the intensity that piles up, it is higher to solve traditional structure and pile up, bottom solder ball 173a welds insecurely, lead to the problem of product inefficacy.
In the embodiment, the connection line between the first substrate 131 and the flexible substrate 110 is also partially covered in the underfill layer 177, so that the connection line between the flexible substrate 110 and the first substrate 131 can be protected by the underfill layer 177.
In other preferred embodiments of the present invention, the flexible substrate stack package structure 100 may not include the third component 170, that is, the second component 150 is attached to the sidewall of the first component 130, the pad on the sidewall of the resin layer 155a is connected to the pad on the back surface of the first substrate 131 by wire bonding, and the filling adhesive layer 177 covers all the connecting wires to play a role in fixing and protecting.
In summary, in the flexible substrate stacked package structure 100 provided in this embodiment, the underfill process is performed to complete the underfill of the two third components 170, so as to form the underfill layer 177 covering the solder balls 173a, thereby reducing the bottom gap of the IC device, protecting the solder balls 173a by using the underfill, and enhancing the strength of the bottom soldering area, thereby enhancing the stacking strength of the stacked structure, and solving the problem of product failure caused by the fact that the bottom solder balls 173a are soldered poorly when the conventional structure is stacked higher. Meanwhile, the wire bonding of the flexible substrate 110 is protected by the filling adhesive layer 177, and the bonding pad on the back surface of the first substrate 131 is connected with the bonding pad of the flexible substrate 110 by using a wire bonding process on the flexible substrate 110, so that the traditional packaging method is replaced and the flexible substrate 110 is welded by using a solder ball. Through designing the conductive columns 155 and the side-mounted pads 155b on the second substrate 153 of the second component 150, the side-welding function of the second component 150 is realized, so that the problem that a traditional side wall stacking structure needs to arrange circuits in the flexible substrate 110, side wall stacking is realized, and the problem that the flexible substrate 110 in the traditional side wall stacking structure is damaged by the bending fatigue caused by the bending fatigue of the wiring circuit in the bending area, so that the product of the stacking structure fails, is solved. The height of the second component 150 stacked on the side wall is consistent with that of the first component 130, and the second component and the first component are stacked upwards as a horizontal plane, so that the two third components 170 are stacked side by side, the stacking space is greatly utilized, the stacking size of a product is effectively reduced, and the performance of the product can be greatly improved. Adopt the novel stacked structure that this embodiment provided, can effectively solve traditional flexible substrate 110 and pile up the problem.
Second embodiment
Referring to fig. 5, the present embodiment provides a flexible substrate 110 stack packaging method for preparing the flexible substrate stack packaging structure 100 provided in the first embodiment, the method including:
s1: the first component 130 is attached upside down to the middle of the flexible substrate 110 and electrically connected to the flexible substrate 110.
Specifically, the first component 130 needs to be prepared, after the first component 130 is prepared and formed, the plastic package side of the first component 130 is bonded to the middle of the flexible substrate 110 through a glue layer/silver paste, and the electrical connection with the flexible substrate 110 is realized through a wire bonding process.
When the first component 130 is prepared, the first chip 133 is attached to the first substrate 131, the first chip 133 is flip-chip mounted on the first substrate 131 by the solder ball 173a, and then plastic packaging is performed by a plastic packaging machine, so that the first plastic package body 135 is formed on the first substrate 131, and the first plastic package body 135 wraps the first chip 133. When the first component 130 is mounted, the first plastic package body 135 is bonded to the middle of the flexible substrate 110 through a glue layer/silver paste, and the first substrate 131 and the flexible substrate 110 are arranged at an interval and electrically connected through a connecting line.
S2: the second component 150 is attached to the side wings of the flexible substrate 110 in an insulating manner.
Specifically, the second component 150 needs to be prepared first, and after the second component 150 is prepared and formed, the second component 150 is bonded to the side wing of the flexible substrate 110 through an adhesive layer/silver paste. Wherein the second component 150 is not in direct electrical connection with the flexible substrate 110.
When the second component 150 is manufactured, the conductive post 155 is formed at an edge of one side of the second substrate 153, the second chip 151 is attached to the second substrate 153, and a second plastic package 157 covering the second chip 151 is formed by using a plastic package machine, so that the second component 150 is manufactured. When the second component 150 is mounted, the second plastic package 157 is adhered to the side of the flexible substrate 110 through an adhesive layer/silver paste, and the second substrate 153 and the side of the flexible substrate 110 are spaced apart from each other.
It should be noted that, in actual operation, step S1 and step S2 may be performed synchronously and not sequentially.
S3: the side flaps of the flexible substrate 110 are folded over to attach the second component 150 to the side walls of the first component 130.
Specifically, the second substrate 153 is bonded to the sidewall of the first component 130 through a glue layer/silver paste, that is, the second substrate 153 is bonded to the sidewall of the first plastic package body 135, wherein there is no direct electrical connection between the second substrate 153 and the flexible substrate 110, and between the second substrate 153 and the first substrate 131. Also, when the second component 150 is mounted on the sidewall of the first component 130, the height of the second component 150 is the same as that of the first component 130, thereby forming a horizontal plane stacked upward.
S4: the third component 170 is mounted on the first component 130 and the second component 150 and electrically connected to the first component 130 and the second component 150, respectively.
Specifically, the third component 170 is first prepared, after the third component 170 is prepared and formed, the third component 170 is soldered to the first component 130 and the second component 150 through the solder balls 173a, and the first component 130 and the second component 150 are electrically connected through the solder balls 173 a.
When the third device 170 is prepared, the third chip 171 is mounted on the third substrate 173, and a third molding compound 175 covering the third chip 171 is formed by a molding machine, and then solder balls 173a are formed by ball-mounting on the back surface of the third substrate 173. When the third component 170 is mounted, the third substrate 173 is soldered to the first component 130 via the solder ball 173a to achieve electrical connection with the first substrate 131, and the third substrate 173 is soldered to the second component 150 via the solder ball 173a to achieve electrical connection with the second substrate 153 via the side-mounted pad 155b and the conductive post 155.
In this embodiment, the third chip 171 and the third substrate 173, the second chip 151 and the second substrate 153, and the first chip 133 and the first substrate 131 may be electrically connected by wire bonding, or may be electrically connected by solder balls 173 a.
As shown in fig. 6 to 20, in actual operation, the method for packaging a flexible substrate 110 by stacking provided by the present invention includes the steps of substrate manufacturing, component manufacturing, flexible substrate 110 providing, first component 130 and second component 150 mounting, flexible substrate 110 ball mounting, cutting, flexible substrate 110 folding, third component 170 mounting, routing, dispensing, and the like, and specifically includes the following steps:
step 1, referring to fig. 6 to 16 in combination, a second substrate 153 is prepared, the second substrate 153 being used for preparing the second component 150, and a conventional first substrate 131 and a third substrate 173 are provided, the first substrate 131 being used for preparing the first component 130, and the third substrate 173 being used for preparing the third component 170.
Step 2, a first component 130 is fabricated using the first substrate 131, a second component 150 is fabricated using the second substrate 153, and a third component 170 is fabricated using the third substrate 173.
Step 3, referring to fig. 17, the first component 130 and the second component 150 are mounted on the flexible substrate 110. Specifically, the first component 130 is mounted first, and the plastic package side of the first component 130 is mounted on the middle portion of the flexible substrate 110 in a downward facing manner, so that the first component 130 is mounted in an inverted manner, and the first component 130 and the flexible substrate 110 are baked and fixed by using a glue layer. And then the side of the plastic package body of the second component 150 is attached to the side wing of the flexible substrate 110 in a downward manner, so that the inverted attachment of the second component 150 is realized, and the baking and fixing of the first component 130 and the flexible substrate 110 are realized by using a glue layer.
Step 4, referring to fig. 18, the flexible substrate 110 is subjected to ball planting on the back surface thereof, and the flexible substrate 110 is cut into individual pieces.
Step 5, referring to fig. 19, the flexible substrate 110 is bent/folded by using a machine to drive the second component 150 to be attached to the sidewall of the first component 130. Specifically, the substrate side of the second component 150 is bonded to the sidewall of the first component 130 by a glue layer, so as to realize sidewall stacking.
Step 6, referring to fig. 20, a third component 170 is mounted on the second component 150 and the second component 150. Specifically, the solder ball 173a at the bottom of the third component 170 is partially soldered to the side-mounted pad 155b of the second component 150, so as to electrically connect the third component 170 and the second component 150, and the solder ball 173a at the bottom of the third component 170 is partially soldered to the pad on the back side of the substrate of the first component 130, so as to electrically connect the third component 170 and the first component 130, so as to stack the third component 170.
Step 7, referring to fig. 1, wire bonding is performed at the bonding pad of the flexible substrate 110, and the first component 130 and the flexible substrate 110 are electrically connected through a connection line. And then, a dispensing process is performed to dispense between the third component 170 and the first component 130 and between the third component 170 and the second component 150, so as to form a filling adhesive layer 177 covering the solder balls 173a and the connecting lines, thereby playing a role in protecting the line arcs and soldering the solder balls 173 a.
It is noted that, when step 1 is executed, the following steps are included:
step 1a, referring to fig. 6, a substrate is taken, the pad is fabricated on the surface of the substrate, the RDL circuit is completed inside the substrate, and the substrate circuit connection is realized through a conductive hole (through hole), so as to complete the substrate fabrication process, which is a conventional substrate fabrication process.
Step 1b, referring to fig. 7, a PP material is laminated on the surface of the substrate to form a first insulating layer.
Step 1c, referring to fig. 8, a groove is formed in an edge of one side of the first insulating layer by using a laser grooving technology to expose the pad on the edge surface of the substrate, so as to form a first groove.
Step 1d, referring to fig. 9, electroplating a copper layer in the first groove and on the surface of the first insulating layer to fill the first groove and the surface of the first insulating layer to form a first copper layer;
step 1e, referring to fig. 10, the first copper layer is patterned, and the patterned layer is used to protect the desired areas, and the undesired areas of the copper layer are etched away, forming the first layer of conductive pillars 155 and the side mounting pads 155 b.
Step 1f, referring to fig. 11, a PP material is laminated on the surface of the first insulating layer to form a second insulating layer.
Step 1g, referring to fig. 12, a groove is formed in the second insulating layer by using a laser grooving technique to expose the first conductive pillar 155, and a second groove is formed.
Step 1h, referring to fig. 13, electroplating a copper layer in the second groove and on the surface of the second insulating layer to fill the second groove and the surface of the second insulating layer to form a second copper layer;
step 1i, referring to fig. 14, the second copper layer is patterned, and the pattern layer is used to protect the required areas, and the unnecessary areas of the copper layer are etched away, so as to form the second layer of conductive pillars 155 and the side mounting pads 155 b.
Step 1j, referring to fig. 15, a PP material is laminated on the surface of the second insulating layer to form a third insulating layer.
Step 1k, referring to fig. 16, a groove is formed downward in the third insulating layer by using a laser grooving technology to expose the substrate, thereby completing the preparation of the second substrate 153, wherein the insulating layer coated outside the first conductive pillar 155 and the second conductive pillar 155 forms a resin layer 155a, which plays a role in supporting and fixing.
In the present embodiment, the second substrate 153 is prepared through the above steps, and the second component 150 is formed by using the second substrate 153, but for the preparation of the second substrate 153, other methods may be adopted as long as the conductive post 155 can be formed on one side of the substrate, and the sidewall connection can be achieved.
It should be noted that the number of layers of the conductive pillars 155 and the side pads 155b in this embodiment can be made according to actual requirements, that is, the multiple layers of the conductive pillars 155 and the side pads 155b are formed by repeatedly performing steps 1f to 1i, and the number of layers is not specifically limited herein.
According to the flexible substrate 110 lamination packaging method provided by the invention, the glue filling process is utilized to complete the bottom filling of the two third elements 170 to form the filling glue layer 177 wrapping the solder balls 173a, so that the bottom gap of the IC device is reduced, the bottom filling glue is utilized to play a role in protecting the solder balls 173a, and the strength of the bottom welding area is enhanced, thereby improving the stacking strength of the stacking structure, and solving the problem that the product fails due to the fact that the bottom solder balls 173a are welded firmly when the stacking of the traditional structure is higher. Meanwhile, the wire bonding of the flexible substrate 110 is protected by the filling adhesive layer 177, and the bonding pad on the back surface of the first substrate 131 is connected with the bonding pad of the flexible substrate 110 by using a wire bonding process on the flexible substrate 110, so that the traditional packaging method is replaced and the solder ball 173a is used for welding with the flexible substrate 110. Through designing the conductive columns 155 and the side-mounted pads 155b on the second substrate 153 of the second component 150, the side-welding function of the second component 150 is realized, so that the problem that a traditional side wall stacking structure needs to arrange circuits in the flexible substrate 110, side wall stacking is realized, and the problem that the flexible substrate 110 in the traditional side wall stacking structure is damaged by the bending fatigue caused by the bending fatigue of the wiring circuit in the bending area, so that the product of the stacking structure fails, is solved. The height of the second component 150 stacked on the side wall is consistent with that of the first component 130, and the second component and the first component are stacked upwards as a horizontal plane, so that the two third components 170 are stacked side by side, the stacking space is greatly utilized, the stacking size of a product is effectively reduced, and the performance of the product can be greatly improved. By adopting the novel stacking method provided by the embodiment, the stacking problem of the traditional flexible substrate 110 can be effectively solved.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.

Claims (10)

1. A flexible substrate stack package structure, comprising:
a flexible substrate;
the first component is reversely attached to the middle part of the flexible substrate and is electrically connected with the flexible substrate;
the second component is attached to the side wing of the flexible substrate in an insulating mode, wherein the side wing of the flexible substrate is folded upwards, so that the second component is attached to the side wall of the first component;
a third component attached to both the second component and the first component;
wherein the third component is electrically connected to both the first component and the second component to electrically connect the first component and the second component.
2. The package structure of claim 1, wherein the first component comprises a first substrate, a first chip, and a first plastic package, the first chip is mounted on the first substrate, the first plastic package is disposed on the first substrate and covers the first chip, the first plastic package is mounted on a middle portion of the flexible substrate, and the first substrate is spaced from and electrically connected to the flexible substrate.
3. The flexible substrate stack package structure of claim 2, wherein the first substrate is electrically connected to the flexible substrate by a connection line.
4. The package structure of claim 1 or 2, wherein the second component includes a second substrate, a second chip, a conductive pillar, and a second plastic package, the second substrate is attached to a sidewall of the first component, the second chip is attached to the second substrate, the conductive pillar is disposed at a side edge of the second substrate and spaced apart from the flexible substrate, the third component is in electrical contact with the conductive pillar, the second plastic package is disposed on the second substrate and covers the second chip, and the second plastic package is attached to a side wing of the flexible substrate.
5. The flexible substrate laminated package structure according to claim 1 or 2, wherein the third component comprises a third substrate, a third chip, and a third plastic package body, the third substrate is attached to the second component and the first component, the third chip is attached to the third substrate, and the third plastic package body is disposed on the third substrate and covers the third chip.
6. The package on package structure of claim 5, wherein the back surface of the third substrate is soldered to the first component and the second component by solder balls, and a glue filling layer is further disposed between the third substrate and the first component and between the third substrate and the second component, and the glue filling layer covers the solder balls.
7. The laminated packaging structure of the flexible substrate according to claim 1 or 2, wherein the number of the second components is two, and the two second components are respectively attached to two side walls of the first component; the number of the third elements is two, and the two third elements are respectively attached to two sides of the first element and are respectively attached to the two second elements.
8. A flexible substrate lamination packaging method is characterized by comprising the following steps:
inversely mounting a first component on the middle part of the flexible substrate, and electrically connecting the first component with the flexible substrate;
mounting a second component on the side wing of the flexible substrate in an insulating way;
folding the side wings of the flexible substrate upwards to enable the second component to be attached to the side walls of the first component;
and attaching a third component on the first component and the second component, and electrically connecting the third component with the first component and the second component respectively so as to electrically connect the first component with the second component.
9. The method of claim 8, wherein the step of attaching the second component to the side wings of the flexible substrate comprises:
preparing the second component;
and bonding the second component to the side wing of the flexible substrate through an adhesive layer or silver paste.
10. The flexible substrate stack packaging method of claim 9, wherein the step of preparing the second component comprises:
forming a conductive pillar on the second substrate;
mounting a second chip on the second substrate;
and forming a second plastic package body wrapping the second chip on the second substrate to prepare and form the second binary device.
CN202010798440.1A 2020-08-11 2020-08-11 Flexible substrate lamination packaging structure and flexible substrate lamination packaging method Active CN111739873B (en)

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Publication number Priority date Publication date Assignee Title
US20090016032A1 (en) * 2007-07-12 2009-01-15 Seng Guan Chow Integrated circuit package system with flexible substrate and recessed package
US20090309197A1 (en) * 2008-06-11 2009-12-17 Seng Guan Chow Integrated circuit package system with internal stacking module
CN106783779A (en) * 2016-12-02 2017-05-31 华进半导体封装先导技术研发中心有限公司 A kind of stacking fan-out-type system-in-package structure high and preparation method thereof
CN111146194A (en) * 2019-12-30 2020-05-12 华进半导体封装先导技术研发中心有限公司 System-in-package structure and manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090016032A1 (en) * 2007-07-12 2009-01-15 Seng Guan Chow Integrated circuit package system with flexible substrate and recessed package
US20090309197A1 (en) * 2008-06-11 2009-12-17 Seng Guan Chow Integrated circuit package system with internal stacking module
CN106783779A (en) * 2016-12-02 2017-05-31 华进半导体封装先导技术研发中心有限公司 A kind of stacking fan-out-type system-in-package structure high and preparation method thereof
CN111146194A (en) * 2019-12-30 2020-05-12 华进半导体封装先导技术研发中心有限公司 System-in-package structure and manufacturing method

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