CN207473158U - A kind of coaxial light emission component of high speed - Google Patents
A kind of coaxial light emission component of high speed Download PDFInfo
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- CN207473158U CN207473158U CN201721659926.7U CN201721659926U CN207473158U CN 207473158 U CN207473158 U CN 207473158U CN 201721659926 U CN201721659926 U CN 201721659926U CN 207473158 U CN207473158 U CN 207473158U
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- pin
- pedestals
- tube core
- laser tube
- light emission
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Abstract
The utility model is related to a kind of coaxial light emission component of high speed, including：Flexible PCB, TO pedestals, laser tube core, heat sink, lens hood, optical power monitoring diode and the first pin and second pin.It is described heat sink loaded on TO pedestals, thereon equipped with laser tube core；The optical power monitoring diode is loaded on the backlight power for being used to monitor laser tube core on TO pedestals and positioned at laser tube core below light-emitting surface；The lens hood is connected and concentric with laser tube core with TO pedestals；The flexible PCB is loaded on TO pedestals and is connect respectively with the first pin, second pin；Described heat sink equipped with microstrip line, described microstrip line one end is connect with the first pin, and the microstrip line other end is connect with laser tube core.The technical program uses common TO coaxial packagings mode, optimizes processing to its high-frequency signal path, realizes the transmission rate of 25Gbps, at low cost, simple for process, easily produces in batches.
Description
Technical field
The utility model is related to a kind of optical communication system light emission component technical field, more particularly to a kind of high speed is coaxial
The light emission component of encapsulation.
Background technology
In fiber optic communication, light emission component is the indispensable important component of photoelectric conversion module, at present,
10Gb/s short-distance transmissions field, the coaxial light emission component based on TO encapsulation are widely used in photoelectricity because manufacture cost is relatively low
In modular converter.But there are the losses of significant high-frequency transmission in common coaxial packaging structure, are not easy to be used in 25Gb/s transmission speed
Rate, at present in 25Gb/s transmission rates generally using packaged types such as BOX, compared to coaxial packaging mode, there are of high cost, techniques
The problems such as complicated.
Utility model content
The purpose of this utility model is to provide a kind of coaxial light emission component structures of high speed, by the technical program, make
It can be used for the transmission rate of 25Gb/s, be provided simultaneously with the inexpensive feature of coaxial packaging technique, be high speed optoelectronic modular converter
A kind of light emission component of low cost is provided.
The utility model is realized in this way：
A kind of coaxial light emission component of high speed, including：Flexible PCB, TO pedestals, laser tube core, heat sink, lens hood,
Optical power monitoring diode and the first pin and second pin；
The laser tube core is arranged on heat sink, described heat sink loaded on TO pedestals, the optical power monitoring diode
It is described loaded on the backlight power for being used to monitor laser tube core on TO pedestals and positioned at laser tube core below light-emitting surface
Mirror cap is connect with TO pedestals makes laser tube core level Hermetic Package, and first pin is arranged on connecting laser tube core on TO pedestals
Positive and negative anodes, the second pin be arranged on TO pedestals connect optical power monitoring diode positive and negative anodes, the flexible circuit
Plate is loaded on TO pedestals and is connect respectively with the first pin, second pin；Wherein, it is described heat sink equipped with microstrip line, the micro-strip
Line one end is connect with the first pin, and the microstrip line other end is connect with laser tube core.
Wherein, the flexible PCB includes leading positioned at signal line conductive layer, dielectric layer, the ground path of top layer successively
Electric layer and protective underlayer film layer, the flexible PCB are equipped with metallization VIA, and the metallization VIA is led with ground path
Electric layer connects, and ground path conductive layer is combined using conductive solder by metallization VIA with TO pedestals.
Wherein, the signal line conductive layer is equipped with signal line, and the signal line carries out designing impedance matching, and
It is connect with the first pin with scolding tin.
Wherein, 0.8 ~ 2.0mm of the metallization VIA length Typical value range, the metallization VIA width representative value model
0.8 ~ 1.5mm is enclosed, the metallization VIA edge and signal line distance controlling are in 0.3mm, the metallization VIA periphery
1mm ranges are without bottom protection film layer to expose ground path conductive layer.
Wherein, the laser tube core is mounted on the heat sink front center, and the laser tube core cathode uses
Eutectic Welding is mounted on microstrip line, the light extraction optical axis of the laser tube core light-emitting surface and central shaft, the lens of TO pedestals
The central shaft of cap is consistent；The laser tube core anode is connected using spun gold lead with microstrip line, to reduce the series connection introduced
Resistance and inductance, spun gold line length are less than 0.5mm.
Wherein, the microstrip line has carried out single-ended 25 Europe ohm high-frequency resistance matched design, and described microstrip line one end is close
Heat sink side, with heat sink side typical range be 0.05mm, and with the first pin eutectic Welding or Wear Characteristics of Epoxy Adhesive technique phase
Connection, the hanging distance of the first pin of control are less than 0.1mm.
Wherein, transition cushion block is further included, the transition cushion block is mounted on using Wear Characteristics of Epoxy Adhesive technique on TO pedestals, the light
Power monitor diode is mounted on using Wear Characteristics of Epoxy Adhesive technique on transition cushion block.
Wherein, the optical power monitoring diode center axis has 6 ~ 12 degree of folders with the laser tube core light extraction optical axis
Angle；First pin is 2, and the second pin is 2, further includes the third pin on 1 piece-root grafting ground, the third pin with
TO tube chamber welds with base is together.
Wherein, it is sealed between first pin and TO pedestals by glass material and is provided with single-ended 25 ohms impedance match
Design；The glass material of sealing is substantially flush with TO susceptor surfaces, and allowance control is in ± 0.05mm；
The heat sink aluminium nitride material small using coefficient of thermal expansion and high thermal conductivity makes, the prefabricated Au70Sn30 welderings in the back side
Material, is mounted on using eutectic Welding on TO pedestals.
Wherein, the lens hood is connect using resistance-welding process with TO pedestals, and the lens hood is flat window cap, globe lens cap
Or any one of aspheric lens hood, the lens hood surfaces externally and internally are coated with anti-reflection film, for reducing reflected light to laser pipe
The influence of core.
The utility model achieves following technique effect：
Using common TO coaxial packagings mode, processing is optimized to its high-frequency signal path, realizes 25Gbps's
Transmission rate, it is at low cost, it is simple for process, easily produce in batches.
Description of the drawings
Fig. 1 uses new embodiment light emission component structure diagram for this.
Fig. 2 is the bottom view and side view that this uses new embodiment light emission component.
Fig. 3 is the bottom view and side view of prior art light emission component.
Fig. 4 is the electromagnetic-field simulation result for structure shown in Fig. 2 and Fig. 3.
In figure：
100- flexible PCBs；101- top layer signals circuit conductive layers；102- dielectric layers；103- ground path conductive layers；
104- protective underlayer film layers；105- metallization VIAs；106- conductive solders；107- signal lines；200- TO pedestals；201- swashs
Light device tube core；202- is heat sink；203- lens hoods；204- optical power monitoring diodes；205- transition cushion blocks；The first pins of 206-；
207- glass materials；208- microstrip lines；210- second pins；211- third pins.
Specific embodiment
Understand for the ease of those of ordinary skill in the art and implement the utility model, below in conjunction with the accompanying drawings and be embodied
Mode is described in further detail the utility model.
Such as a kind of Fig. 1 ~ structure of the coaxial light emission component of high speed shown in Fig. 2, including flexible PCB 100, TO pedestals
200th, laser tube core 201, heat sink 202, lens hood 203, optical power monitoring diode 204, transition cushion block 205.
The laser tube core 201 is arranged on heat sink 202, and described heat sink 202 are loaded on TO pedestals 200, the smooth work(
Rate monitoring diode 204 is loaded on TO pedestals 200 and is used to monitor laser below light-emitting surface positioned at laser tube core 201
The backlight power of tube core 201, the lens hood 203 is connect with TO pedestals 200 makes 201 level Hermetic Package of laser tube core, the TO
4 pins being provided through on pedestal 200, respectively 2 the first pins 206 and 2 second pins 210, two of which
First pin 206 is used for the positive and negative anodes of connecting laser tube core 201, other two second pin 210 is supervised for connecting luminous power
Control the positive and negative anodes of diode 204.The flexible PCB 100 is loaded on TO pedestals 200 to be drawn respectively with the first pin 206, second
Foot 210 connects；Wherein, described heat sink 202 microstrip line 208 being equipped with, described 208 one end of microstrip line is connect with the first pin 206,
208 other end of microstrip line is connect with laser tube core 201.
It is sealed between first pin 206 and TO pedestals 200 by glass material 207 and has carried out single-ended 25 ohms impedance match
Design, 200 surface of glass material 207 and TO pedestals of sealing is substantially flush, and allowance control is in ± 0.05mm, and reduction is because of the
High-frequency loss caused by one pin, 206 impedance mismatch.
The TO pedestals 200 are equipped with third pin 211, which welds together, to connect
Ground pin.
Described heat sink 202 are made of the aluminium nitride material that coefficient of thermal expansion is small and thermal conductivity is high, the prefabricated Au70Sn30 in the back side
Solder is mounted on using eutectic Welding on TO pedestals 200；Heat sink 202 front is equipped with microstrip line 208, has carried out single-ended
25 Europe ohm high-frequency resistance matched design.208 one end of microstrip line is with heat sink 202 side typical range close to heat sink 202 side
0.05mm, and be connected with the first pin 206 with eutectic Welding or Wear Characteristics of Epoxy Adhesive technique, control the hanging of the first pin 206
Distance is less than 0.1mm, reduces the high-frequency loss of junction.
201 cathode of laser tube core is mounted on using eutectic Welding on microstrip line 208, the laser tube core
201 are mounted on heat sink 202 front center, the light extraction optical axis of 201 light-emitting surface of laser tube core in TO pedestals 200
Mandrel, the central shaft of lens hood 203 are consistent, and 201 anode of laser tube core is connected using spun gold lead with microstrip line 208
It connects, to reduce the series resistance introduced and inductance, spun gold line length need to be controlled to be less than 0.5mm.
The transition cushion block 205, is mounted on using Wear Characteristics of Epoxy Adhesive technique on TO pedestals 200.Optical power monitoring diode 204
It is mounted on transition cushion block 205 using Wear Characteristics of Epoxy Adhesive technique, positioned at laser tube core 201 below light-emitting surface, central shaft
There are 6 ~ 12 degree of angles with 201 light extraction optical axis of laser tube core, for monitoring the backlight power of laser tube core 201.Luminous power
The positive and negative anodes of monitoring diode 204 are connect using spun gold with two second pins 210, in actual implementation, due to second pin
210 are connect with TO pedestals, accordingly it is also possible to by the positive or negative pole spun gold of optical power monitoring diode 204 and TO bottoms
Seat 200 is connected, and another pole is connected with second pin 210.
The lens hood 203 is connect using resistance-welding process with TO pedestals 200, completes the hermetic seal of laser tube core 201
Dress, central shaft are consistent with the light extraction optical axis of laser tube core 201.The lens hood 203 can be flat window cap or ball
Lens hood or aspheric lens hood, lens surfaces externally and internally are coated with anti-reflection film, for reducing shadow of the reflected light to laser tube core 201
It rings.
As shown in Fig. 1 ~ Fig. 2, the flexible PCB 100 includes the signal line conductive layer 101 positioned at top layer, is situated between successively
Matter layer 102, ground path conductive layer 103 and protective underlayer film layer 104.Signal line conductive layer 101 is equipped with signal line
107, designing impedance matching is carried out, is connect with the first pin 206 with scolding tin.
The flexible PCB 100 is equipped with metallization VIA 105, the metallization VIA 105 and ground path conductive layer
103 connections, 105 length 0.8 ~ 2.0mm of Typical value range of metallization VIA, 105 width Typical value range 0.8 of metallization VIA ~
1.5mm.105 edge of metallization VIA is with 107 distance controlling of signal line in 0.3mm.105 periphery 1mm models of metallization VIA
No bottom protection film layer 104 is enclosed, exposes ground path conductive layer 103.Using conductive solder 106, made by metallization VIA 105
Ground path conductive layer 103 is combined with TO pedestals 200.The metallization VIA 105 design enhances high-frequency signal reflux approach, subtracts
The high frequency reflection loss of few junction.
In practical application, external drive electric signal is transmitted through flexible PCB 100, is driven by pin 206, microstrip line 208
Dynamic laser tube core 209 works.The work of laser tube core 209 generates heat and is transferred out by heat sink 202 and pedestal 200.
Fig. 3 is the bottom view and side view of prior art light emission component.
Fig. 4 is the electromagnetic-field simulation result for structure shown in Fig. 2 and Fig. 3.The result shows that this exemplary construction of Fig. 2 echo damages
Consuming S11 parameters improves significantly, and return loss is less than -15dB in the range of 25GHz passbands, is fully available for 25Gbps data rates
Transmission.
It is emphasized that embodiment described in the utility model is illustrative rather than limited, therefore this reality
It is every new in this way according to this practicality by those skilled in the art with the novel embodiment being not limited to described in specific embodiment
The other embodiment that the technical solution of type obtains also belongs to the range of the utility model protection.
Claims (10)
1. a kind of coaxial light emission component of high speed, which is characterized in that including：Flexible PCB (100), TO pedestals (200), laser
Device tube core (201), heat sink (202), lens hood (203), optical power monitoring diode (204) and the first pin (206) and second
Pin (210)；
The laser tube core (201) is arranged on heat sink (202), and heat sink (202) are described loaded on TO pedestals (200)
Optical power monitoring diode (204) on TO pedestals (200) and positioned at laser tube core (201) below the light-emitting surface loaded on being used for
The backlight power of laser tube core (201) is monitored, the lens hood (203) connect with TO pedestals (200) makes laser tube core
(201) level Hermetic Package, first pin (206) are arranged on the positive and negative of connecting laser tube core (201) on TO pedestals (200)
Pole, the second pin (210) is arranged on the positive and negative anodes that optical power monitoring diode (204) is connected on TO pedestals (200), described
Flexible PCB (100) with the first pin (206), second pin (210) loaded on connecting respectively on TO pedestals (200)；Wherein, institute
Heat sink (202) are stated equipped with microstrip line (208), described microstrip line (208) one end is connect with the first pin (206), the micro-strip
Line (208) other end is connect with laser tube core (201).
2. the coaxial light emission component of high speed according to claim 1, which is characterized in that the flexible PCB (100) according to
Secondary signal line conductive layer (101), dielectric layer (102), ground path conductive layer (103) and protective underlayer including positioned at top layer
Film layer (104), the flexible PCB (100) are equipped with metallization VIA (105), the metallization VIA (105) and ground connection
Circuit conductive layer (103) connect, ground path conductive layer (103) using conductive solder (106) by metallization VIA (105) with
TO pedestals (200) combine.
3. the coaxial light emission component of high speed according to claim 2, which is characterized in that the signal line conductive layer
(101) be equipped with signal line (107), the signal line (107) carries out designing impedance matching, and with the first pin (206)
It is connected with scolding tin.
4. the coaxial light emission component of high speed according to claim 3, which is characterized in that the metallization VIA (105) is long
Spend Typical value range 0.8~2.0mm, metallization VIA (105) 0.8~1.5mm of width Typical value range, the metallization
Via (105) edge and signal line (107) distance controlling are in 0.3mm, metallization VIA (105) periphery 1mm ranges
No bottom protection film layer (104) is to expose ground path conductive layer (103).
5. the coaxial light emission component of high speed according to claim 1, which is characterized in that laser tube core (201) patch
Front center mounted in heat sink (202), laser tube core (201) cathode are mounted on micro-strip using eutectic Welding
On line (208), the light extraction optical axis of laser tube core (201) light-emitting surface and central shaft, the lens hood of TO pedestals (200)
(203) central shaft is consistent；Laser tube core (201) anode is connected using spun gold lead with microstrip line (208), to subtract
The series resistance and inductance introduced less, spun gold line length are less than 0.5mm.
6. the coaxial light emission component of high speed according to claim 5, which is characterized in that the microstrip line (208) carries out
Single-ended 25 Europe ohm high-frequency resistance matched design, described microstrip line (208) one end is close to heat sink (202) side, with heat sink (202)
Side typical range is 0.05mm, and is connected with the first pin (206) with eutectic Welding or Wear Characteristics of Epoxy Adhesive technique, control the
The hanging distance of one pin (206) is less than 0.1mm.
7. the coaxial light emission component of high speed according to claim 1, which is characterized in that further include transition cushion block (205), institute
It states transition cushion block (205) to be mounted on TO pedestals (200) using Wear Characteristics of Epoxy Adhesive technique, the optical power monitoring diode (204)
It is mounted on transition cushion block (205) using Wear Characteristics of Epoxy Adhesive technique.
8. the coaxial light emission component of high speed according to claim 1, which is characterized in that the optical power monitoring diode
(204) central shaft has 6~12 degree of angles with the laser tube core (201) light extraction optical axis；First pin (206) is 2
Root, the second pin (210) are 2, further include the third pin (211) on 1 piece-root grafting ground, the third pin (211) and TO
Pedestal (200) welds together.
9. the coaxial light emission component of high speed according to claim 1, which is characterized in that first pin (206) and TO
It is sealed between pedestal (200) by glass material (207) and is provided with single-ended 25 ohms impedance match and designed；The glass material of sealing
Material (207) is substantially flush with TO pedestals (200) surface, and allowance control is in ± 0.05mm；
The aluminium nitride material that heat sink (202) are small using coefficient of thermal expansion and thermal conductivity is high makes, the prefabricated Au70Sn30 welderings in the back side
Material, is mounted on using eutectic Welding on TO pedestals (200).
10. the coaxial light emission component of high speed according to claim 1, which is characterized in that the lens hood (203) is using electricity
Welding resistance technique is connect with TO pedestals (200), and the lens hood (203) is appointing in flat window cap, globe lens cap or aspheric lens hood
One kind, lens hood (203) surfaces externally and internally are coated with anti-reflection film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721659926.7U CN207473158U (en) | 2017-11-30 | 2017-11-30 | A kind of coaxial light emission component of high speed |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721659926.7U CN207473158U (en) | 2017-11-30 | 2017-11-30 | A kind of coaxial light emission component of high speed |
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| CN207473158U true CN207473158U (en) | 2018-06-08 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110178065A (en) * | 2019-04-11 | 2019-08-27 | 深圳市亚派光电器件有限公司 | Light emission component and preparation method thereof |
| CN110838879A (en) * | 2018-08-15 | 2020-02-25 | 苏州旭创科技有限公司 | Laser emitting assembly |
| CN110854669A (en) * | 2019-12-10 | 2020-02-28 | 武汉优信技术股份有限公司 | TO tube seat packaging structure and manufacturing method thereof |
| CN112838468A (en) * | 2021-01-04 | 2021-05-25 | 武汉光迅科技股份有限公司 | TO packaging structure |
| CN113064238A (en) * | 2021-03-22 | 2021-07-02 | 长飞光纤光缆股份有限公司 | Soft board for realizing connection with optical device, connection method and optical module |
| WO2021146914A1 (en) * | 2020-01-21 | 2021-07-29 | 齐鲁工业大学 | Coaxial laser transistor-outline can package |
| CN113540956A (en) * | 2020-04-09 | 2021-10-22 | 苏州旭创科技有限公司 | Coaxial photoelectric device and base thereof |
| CN114039270A (en) * | 2021-09-23 | 2022-02-11 | 苏州苏驼通信科技股份有限公司 | TO tube seat and preparation method thereof |
-
2017
- 2017-11-30 CN CN201721659926.7U patent/CN207473158U/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110838879A (en) * | 2018-08-15 | 2020-02-25 | 苏州旭创科技有限公司 | Laser emitting assembly |
| CN110838879B (en) * | 2018-08-15 | 2023-02-28 | 苏州旭创科技有限公司 | Laser emitting assembly |
| CN110178065A (en) * | 2019-04-11 | 2019-08-27 | 深圳市亚派光电器件有限公司 | Light emission component and preparation method thereof |
| CN110854669A (en) * | 2019-12-10 | 2020-02-28 | 武汉优信技术股份有限公司 | TO tube seat packaging structure and manufacturing method thereof |
| WO2021146914A1 (en) * | 2020-01-21 | 2021-07-29 | 齐鲁工业大学 | Coaxial laser transistor-outline can package |
| CN113540956A (en) * | 2020-04-09 | 2021-10-22 | 苏州旭创科技有限公司 | Coaxial photoelectric device and base thereof |
| CN113540956B (en) * | 2020-04-09 | 2022-09-20 | 苏州旭创科技有限公司 | Coaxial photoelectric device and base thereof |
| CN112838468A (en) * | 2021-01-04 | 2021-05-25 | 武汉光迅科技股份有限公司 | TO packaging structure |
| CN113064238A (en) * | 2021-03-22 | 2021-07-02 | 长飞光纤光缆股份有限公司 | Soft board for realizing connection with optical device, connection method and optical module |
| CN114039270A (en) * | 2021-09-23 | 2022-02-11 | 苏州苏驼通信科技股份有限公司 | TO tube seat and preparation method thereof |
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