WO2021036900A1

WO2021036900A1 - Silicon optical module and optical transmission component

Info

Publication number: WO2021036900A1
Application number: PCT/CN2020/110206
Authority: WO
Inventors: 鲍赟; 王安斌; 张寅星; 隋春春; 谢崇进
Original assignee: 阿里巴巴集团控股有限公司
Priority date: 2019-08-26
Filing date: 2020-08-20
Publication date: 2021-03-04
Also published as: TW202113413A; CN112433303A

Abstract

A silicon optical module and an optical transmission component. The silicon optical module comprises: a substrate (10), a silicon optical chip (20), a covering body (30), and an optical fiber element (40); the silicon optical chip (20) is packaged on the substrate (10), and a side of the silicon optical chip (20) is provided with optical coupling ports; the covering body (30) is packaged on the substrate (10) and covers the outside of the silicon optical chip (20); a side of the covering body (30) is provided with a first opening (31); the optical coupling ports are exposed at the first opening (31); the optical fiber element (40) is provided with optical fibers (41), and the optical fiber element (40) forms a coupling connection with the silicon optical chip (20) inside the first opening (31); the optical fibers (41) mate with the optical coupling ports.

Description

Silicon optical module and optical transmission device

This application claims the priority of the Chinese patent application with the application number 201910789740.0 and the invention title of "silicon optical module and optical transmission device" filed on August 26, 2019, the entire content of which is incorporated into this application by reference.

Technical field

This specification relates to the field of optical communication technology, and in particular to a silicon optical module and an optical transmission device.

Background technique

In the fields of data communication, transmission and telecommunications, optical modules are used to send and receive optical signals and are the core components of the entire optical network. The traditional optical module adopts a discrete structure, and the optical signal in the optical chip is coupled to the optical fiber through passive components, such as a lens. For a long-distance transmission module, since many passive components are required, it is often necessary to couple and align each passive component one by one during the assembly process. Therefore, this requires high time cost, labor cost, process cost and material cost.

Summary of the invention

This specification proposes an integrated silicon optical module and optical transmission device.

According to the first aspect of the embodiments of this specification, a silicon optical module is provided, including:

Substrate

The silicon optical chip is packaged on the substrate, and the side of the silicon optical chip is provided with an optical coupling port;

A cover, packaged on the substrate and wrapped around the outside of the silicon optical chip; a first opening is opened on the side of the cover, and the light coupling port is exposed from the first opening;

An optical fiber element, the optical fiber element is provided with an optical fiber, the optical fiber element is coupled to the silicon optical chip in the first opening portion, and the optical fiber is butted with the optical coupling port.

Further, it further includes a fixing member disposed on the upper surface of the silicon optical chip, and the fixing member is exposed from the first opening;

The side end surface of the fixing member is flush with the side end surface of the silicon optical chip provided with the optical coupling port, and the fixing member is adhesively connected to the optical fiber element.

Further, a connecting portion is formed on the side portion of the fixing member extending in a direction approaching the optical fiber element, and the lower surface of the connecting portion abuts the upper surface of the optical fiber element.

Further, the optical coupling port is located on the upper side of the silicon optical chip, and the side end surface of the silicon optical chip provided with the optical coupling port is located on the inner side of the substrate.

Further, the side end surface of the cover body with the first opening portion is flush with the side end surface of the substrate.

Further, the optical coupling port is located at the lower side of the silicon optical chip, and the side end surface of the silicon optical chip provided with the optical coupling port is located on the inner side of the substrate;

The side of the substrate is provided with a second opening, the second opening is located below the first opening, and the side end surface of the silicon optical chip provided with the optical coupling port protrudes from the first opening. Two openings.

Further, the optical coupling port is located at the lower side of the silicon optical chip, and the side end surface of the silicon optical chip provided with the optical coupling port protrudes from the substrate.

Further, the side end surface of the cover provided with the first opening protrudes from the substrate, and the portion of the cover protruding from the substrate extends in a direction approaching the substrate to form an extension, so The extension portion abuts against the side end surface of the substrate.

Further, a protective sheet is provided on the lower surface of the extension portion, and the protective sheet is flush with the lower surface of the substrate.

Further, the number of the optical coupling ports is multiple, and the number of the optical fibers corresponds to the number of the optical coupling ports; the optical fibers include a laser input port, a signal transmitting port, and a signal receiving port.

Further, the plurality of optical coupling ports are arranged in the same direction, and the plurality of optical fibers are arranged in the same arrangement direction as the plurality of optical coupling ports.

According to a second aspect of the embodiments of the present specification, an optical module is provided, including: a circuit board and at least one silicon optical module as described in any of the above embodiments, the substrate being disposed on the circuit board.

It can be seen from the above technical solutions that, in the silicon optical module of this specification, the cover body is wrapped on the outside of the silicon optical chip, which can protect the silicon optical chip. By opening the first opening on the cover, the light coupling port of the silicon optical chip is partially exposed, which facilitates the coupling of the optical fiber element and the silicon optical chip, thereby forming an integrated structure, which is easy to assemble, and saves manpower and material costs.

Description of the drawings

Fig. 1 shows a three-dimensional schematic diagram of a silicon optical module cooperating with a laser according to an exemplary embodiment of this specification.

FIG. 2 is a three-dimensional schematic diagram of the silicon optical module shown in FIG. 1 with a cover removed.

Fig. 3 is a side view of Fig. 2.

Fig. 4 shows a three-dimensional schematic diagram of another silicon optical module according to an exemplary embodiment of the present specification.

FIG. 5 is a three-dimensional schematic diagram of the silicon optical module shown in FIG. 4 after removing the silicon optical chip and optical fiber components.

Fig. 6 is a three-dimensional schematic diagram of the silicon optical module shown in Fig. 4 after the cover and the optical fiber components are removed.

FIG. 7 is a three-dimensional schematic diagram of the silicon optical module shown in FIG. 4 after removing optical fiber components.

Fig. 8 is a side view of the silicon optical module shown in Fig. 4 with a cover removed.

FIG. 9 shows a three-dimensional schematic diagram of still another silicon optical module according to an exemplary embodiment of the present specification.

FIG. 10 is a three-dimensional schematic diagram of the silicon optical module shown in FIG. 9 after the cover and the optical fiber components are removed.

Fig. 11 is a three-dimensional schematic diagram of the silicon optical module shown in Fig. 9 with optical fiber components removed.

Fig. 12 is a schematic bottom view of the silicon optical module shown in Fig. 9.

detailed description

The exemplary embodiments will be described in detail here, and examples thereof are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with this specification. On the contrary, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.

The terms used in this specification are only for the purpose of describing specific embodiments, and are not intended to limit the specification. The singular forms of "a", "said" and "the" used in this specification and appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and/or" as used herein refers to and includes any or all possible combinations of one or more associated listed items.

It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, the information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this specification, the first information may also be referred to as second information, and similarly, the second information may also be referred to as first information. Depending on the context, the word "if" as used herein can be interpreted as "when" or "when" or "in response to determination".

Silicon Photonics is based on waveguide transmission, and uses the very mature silicon wafer processing technology of the semiconductor industry to highly integrate various devices, such as optical modulators, receivers, and passive waveguide devices, on a silicon substrate through an etching process. Therefore, this silicon optical chip module has the advantages of small size and high integration, and at the same time, it can reduce assembly links and improve test efficiency, thereby saving various time, manpower, process, and material costs.

This specification proposes an integrated silicon optical module and optical module. The silicon optical module and the optical module of this specification will be described in detail below with reference to the accompanying drawings. In the case of no conflict, the following embodiments and features in the implementation can be combined with each other.

Referring to FIG. 1, FIG. 2, and FIG. 3, an embodiment of the present specification provides a silicon optical module, which includes a substrate 10, a silicon optical chip 20, a cover 30 and an optical fiber element 40. Wherein, the silicon optical chip 20 is packaged on the substrate 10, and the cover body 30 is packaged on the substrate 10 and covers the outside of the silicon optical chip 20. It can be understood that a recessed cavity is formed on the cover 30, and the silicon optical chip 20 can be housed in it. The silicon optical chip 20 and the substrate 10 may be mounted on the substrate 10 through a flip chip (Flip chip) process. The cover 30 and the substrate 10 can also be packaged with glue.

The side of the silicon optical chip 20 is provided with an optical coupling port. The side of the cover 30 is provided with a first opening 31, and the light coupling port is exposed from the first opening 31. It is understandable that the first opening 31 may be formed by opening a gap on the upper surface and the side surface of the cover 30 to expose part of the upper surface of the silicon optical chip 20 and the side surface provided with the optical coupling port for assembling the optical fiber element 40. Optionally, the optical coupling port may be an optical port or an optical port.

The optical fiber element 40 is provided with an optical fiber 41, the optical fiber element 40 is coupled to the silicon optical chip 20 in the first opening 31, and the optical fiber 41 is butted with the optical coupling port. In practical applications, the silicon optical module described in this specification can be used in conjunction with the laser 50. The laser 50 can be used as an external device to cooperate with the silicon optical module of this specification through an optical fiber, or it can be packaged with the silicon optical module of this specification by a packaging method (for example, flip-chip technology), and used as an integral module. That is to say, the silicon optical module in this manual can be used in the scene where the laser is externally installed, or in the scene where the laser is built-in.

It can be seen from the above technical solutions that in the silicon optical module of this specification, the cover 30 is wrapped around the outside of the silicon optical chip 20 to protect the silicon optical chip 20. By opening the first opening 31 on the cover 30, the light coupling port of the silicon optical chip 20 is partially exposed, which facilitates the coupling of the optical fiber element 40 and the silicon optical chip 20, thereby forming an integrated structure, which is easy to assemble and saves manpower And material costs.

In an alternative embodiment, the substrate 10 and the cover 30 are both rectangular plates, and the size of the cover 30 is adapted to the size of the substrate 10 to ensure the flatness of the appearance of the silicon light module and facilitate assembly. The width of the first opening 31 is smaller than the width of the silicon optical chip 20. The inner side wall 32 of the first opening 31 and the rear end of the cover 30 can cover the outside of the silicon optical chip 20 from the front to back. The left end and the right end can be wrapped around the outside of the silicon optical chip 20 from the left and right directions, and then the silicon optical chip 20 is covered in the front and rear, left and right directions, which can protect the silicon optical chip 20. Optionally, the substrate 10 may be made of organic materials. The cover 30 can be made of a metal material, for example, a nickel-copper alloy, which can protect the silicon optical chip 20 and also have a good heat dissipation effect.

In an alternative embodiment, since the thickness of the silicon optical chip 20 is small, the optical fiber element 40 directly adheres to the silicon optical chip 20 with low firmness. In order to facilitate the assembly of the optical fiber element 40, the silicon optical module may further include a fixing member 60, which may be arranged on the upper surface of the exposed part of the silicon optical chip 20 from the first opening 31 of the cover 30 by glue bonding. The fixing member 60 is also exposed from the first opening 31. Optionally, the fixing member 60 may be an independent element provided separately, and the fixing member 60 may also be integrally formed with the cover 30 or integrally formed with the optical fiber element 40, which is more convenient for installation.

The first opening 31 is formed by opening a gap on the upper surface and the side surface of the cover 30 to expose part of the upper surface of the silicon optical chip 20. When assembling the optical fiber element 40, it is convenient for the fixture to clamp the optical fiber element 40 to achieve The location of the docking with the silicon optical chip 20 is accurate. Specifically, the optical fiber element 40 may be aligned with the optical coupling port of the silicon optical chip 20 through an edge coupling process, and connected to the fixing member 60 by adhesive, thereby fixing the optical fiber element 40 and the silicon optical chip 20.

The side end surface of the fixing member 60 is flush with the side end surface of the silicon optical chip 20 provided with the optical coupling port (the front end surface shown in the figure), and the fixing member 60 and the optical fiber element 40 are made of colloid. Adhesive connection, thereby fixing the optical fiber element 40 and the silicon optical chip 20 to each other. Optionally, the height of the upper surface of the fixing member 60 is lower than the height of the upper surface of the cover 30 to ensure the flatness of the appearance of the silicon light module.

In order to further improve the accuracy of the assembly of the optical fiber element 40 and the silicon optical chip 20 and the stability of the connection position between the two, the side portion of the fixing member 60 extends in a direction close to the optical fiber element 40 to form a connecting portion 61. The lower surface of the portion 61 abuts against the upper surface of the optical fiber element 40. The connecting portion 61 can limit the position of the optical fiber element 40, and can prevent the position of the optical fiber element 40 from shifting upward during assembly, thereby achieving the effects of precise assembly and position fixation.

In an optional embodiment, the optical coupling port is located on the upper side of the silicon optical chip 20, and the position of the optical coupling port can refer to the direction of the dotted line in FIG. 3. The silicon optical chip 20 is provided with the optical coupling The side end surface of the opening is located inside the substrate 10. It is understandable that if the optical coupling port is arranged on the upper side of the silicon optical chip 20, the thickness of the silicon optical chip 20 can be appropriately increased, and the edge of the silicon optical chip 20 does not exceed the edge of the substrate 10. In this way, when the silicon optical chip 20 is mounted on the substrate 10, even a small amount of glue overflow will not affect the optical coupling port, ensuring that the device can work normally.

Further, the side end surface (the front end surface shown in the figure) of the cover body 30 with the first opening portion 31 is flush with the side end surface of the substrate 10, which can ensure the flatness of the appearance of the silicon optical module. For assembly.

In an alternative embodiment, the optical fiber component 40 may adopt a ribbon-shaped optical fiber structure. The number of the optical coupling ports may be multiple, and the number of the optical fibers 41 corresponds to the number of the optical coupling ports, and they are connected in a one-to-one correspondence. The optical fiber 41 includes a laser input port (Laser input port), a signal transmitting port (TX port, transport), and a signal receiving port (RX port, receive port). In this embodiment, the total number of optical fibers 41 may be ten, where the number of laser input ports may be two, and the number of signal transmitting ports and signal receiving ports may be four respectively. Of course, in other embodiments, the number of optical fibers 41 can be set according to actual needs, which is not limited in this specification.

The multiple optical coupling ports can be arranged in the same direction, for example, along the width direction of the silicon optical chip 20, which can reduce the thickness of the silicon optical chip 20 and reduce the overall space of the silicon optical module. It is arranged in the same arrangement direction as the multiple optical coupling ports, which is convenient for docking with the optical coupling ports.

Referring to FIGS. 4, 5, 6, 7 and 8, in an alternative embodiment, the optical coupling port is located at the lower side of the silicon optical chip 20, and the silicon optical chip 20 is provided with The side end surface with the optical coupling port is located inside the substrate 10. The optical coupling port is provided on the lower side of the silicon optical chip 20. When the silicon optical chip 20 is mounted on the substrate 10, there may be overflow of glue that affects the optical coupling port, thereby affecting the normal operation of the device. The side portion of the substrate 10 is provided with a second opening portion 11, the second opening portion is located below the first opening portion 31, and the side end surface of the silicon optical chip 20 provided with the light coupling port protrudes于The second opening 11.

The optical coupling port is provided on the lower side of the silicon optical chip 20. When the silicon optical chip 20 is mounted on the substrate 10, there may be overflow of glue that affects the optical coupling port, thereby affecting the normal operation of the device. Therefore, by opening the second opening 11 on the substrate 10, the position of the optical coupling port of the silicon optical chip 20 is suspended. When the silicon optical chip 20 is mounted on the substrate 10, even a small amount of glue will not overflow. Affect the optical coupling port to ensure that the device can work normally.

Generally, the thickness of the optical fiber element 40 is greater than the thickness of the silicon optical chip 20. In order to ensure the smoothness of the appearance of the silicon optical module, ensure the best coupling position, and save the overall volume of the silicon optical module, a part of the optical fiber element 40 It can be sunk into the second opening 11, and the thickness space of the substrate 10 is used to avoid that the thickness of the optical fiber element 40 is too high to exceed the upper surface of the cover 30 and affect the flatness of the appearance of the silicon light module.

In an alternative embodiment, since the thickness of the silicon optical chip 20 is small, the optical fiber element 40 directly adheres to the silicon optical chip 20 with low firmness. In order to facilitate the assembly of the optical fiber element 40, the silicon optical module may further include a fixing member 60, which may be arranged on the upper surface of the exposed part of the silicon optical chip 20 from the first opening 31 of the cover 30 by glue bonding. The fixing member 60 is also exposed from the first opening 31.

The side end surface of the fixing member 60 is flush with the side end surface of the silicon optical chip 20 provided with the optical coupling port, and the fixing member 60 and the optical fiber element 40 are connected by glue bonding, thereby connecting the optical fiber element 40 And the silicon optical chip 20 are fixed to each other. Optionally, the height of the upper surface of the fixing member 60 is lower than the height of the upper surface of the cover 30 to ensure the flatness of the appearance of the silicon light module.

In order to further improve the stability of the connection between the optical fiber element 40 and the silicon optical chip 20, the side portion of the fixing member 60 extends in a direction close to the optical fiber element 40 to form a connecting portion 61, and the lower surface of the connecting portion 61 is connected to The upper surfaces of the optical fiber components 40 abut and are fixed to each other. The optical fiber element 40 is fixed to the fixing member 60 in both the horizontal and vertical directions, so as to better fix the optical fiber element 40 and the silicon optical chip 20, so as to prevent the optical fiber element 40 and the silicon optical chip 20 from being insufficiently bonded to each other The situation happened.

Further, the side end surface of the cover body 30 provided with the first opening 31 is flush with the side end surface of the substrate 10, which can ensure the flatness of the appearance of the silicon light module for assembly.

In an optional embodiment, the number of the optical coupling ports is multiple, and the number of the optical fibers 41 corresponds to the number of the optical coupling ports, and they are connected in a one-to-one correspondence. The optical fiber 41 includes a laser input port (Laser input port), a signal transmitting port (TX port, transport), and a signal receiving port (RX port, receive port). In this embodiment, the total number of optical fibers 41 may be ten, where the number of laser input ports may be two, and the number of signal transmitting ports and signal receiving ports may be four respectively. Of course, in other embodiments, the number of optical fibers 41 can be set according to actual needs, which is not limited in this specification.

Referring to FIGS. 9, 10, 11 and 12, in an alternative embodiment, the optical coupling port is located at the lower side of the silicon optical chip 20, and the silicon optical chip 20 is provided with the The side end surface of the optical coupling port protrudes from the substrate 10. The optical coupling port is provided on the lower side of the silicon optical chip 20. When the silicon optical chip 20 is mounted on the substrate 10, there may be overflow of glue that affects the optical coupling port, thereby affecting the normal operation of the device.

Therefore, the side end surface of the silicon optical chip 20 provided with the optical coupling port is set to protrude from the substrate 10, so that the position of the optical coupling port of the silicon optical chip 20 is suspended below the silicon optical chip 20 and the substrate 10 When mounting, even if there is a small amount of glue overflow, it will not affect the optical coupling port, ensuring that the device can work normally.

Since the side end surface of the silicon optical chip 20 provided with the optical coupling port protrudes from the substrate 10, in order to protect the portion of the silicon optical chip 20 protruding from the substrate, the cover 30 is provided with the first opening The side end surface of the portion 31 protrudes from the substrate 10, and the portion of the cover 30 protruding from the substrate 10 extends in a direction approaching the substrate 10 to form an extension portion 33. The extension portion 33 and the substrate The side end surfaces of 10 abut against each other, which can protect the silicon optical chip 20. It can be understood that an extension 33 is formed on both side walls of the first opening 31 respectively.

A space is formed between the two extensions 33 of the cover 30. Generally, the thickness of the optical fiber element 40 is greater than the thickness of the silicon optical chip 20. The optical fiber element 40 depends on the position of the optical coupling port of the silicon optical chip 20. A part of the optical fiber element 40 can sink into the space, so as to ensure the optimal position for coupling with the silicon optical chip 20.

Further, in order to better protect the silicon optical chip 20, a protective sheet 34 is provided on the lower surface of the extension portion 33. The protective sheet 34 is flush with the lower surface of the substrate 10 and covers the silicon optical chip 20. The exposed part of the bottom surface of the chip 20. Optionally, the protective sheet 34 may be a metal protective sheet, which can achieve a certain heat dissipation effect.

The side end surface of the fixing member 60 is flush with the side end surface of the silicon optical chip 20 provided with the optical coupling port, and the fixing member 60 and the optical fiber element 40 are connected by glue bonding, thereby connecting the optical fiber element 40 And the silicon optical chip 20 are fixed to each other. Optionally, the height of the upper surface of the fixing member 60 is lower than the height of the upper surface of the cover 30 to ensure the flatness of the appearance of the silicon optical module.

The embodiment of the present specification also provides an optical module including a circuit board and at least one silicon optical module, and the substrate of the silicon optical module is arranged on the circuit board. It should be noted that the description of the silicon optical module in the foregoing embodiments and implementations is also applicable to the optical module in this specification. Optionally, the optical module may be a QSFP DD module, a Co-package module, and so on. Among them, the circuit board of the QSFP DD module can be configured with a silicon optical module. The circuit board of the Co-package module can be configured with multiple silicon optical modules.

It can be seen from the above technical solutions that the cover body of the silicon optical module used in the optical module of this specification is covered on the outside of the silicon optical chip, which can protect the silicon optical chip. By opening the first opening on the cover, the light coupling port of the silicon optical chip is partially exposed, which facilitates the coupling of the optical fiber element and the silicon optical chip, thereby forming an integrated structure, which is easy to assemble, and saves manpower and material costs.

Those skilled in the art will easily think of other embodiments of this specification after considering the specification and practicing the invention and creation disclosed herein. This specification is intended to cover any variations, uses, or adaptive changes of this specification. These variations, uses, or adaptive changes follow the general principles of this specification and include common knowledge or customary technical means in the technical field that are not disclosed in this specification. . The description and the embodiments are only regarded as exemplary, and the true scope and spirit of the description are pointed out by the following claims.

It should also be noted that the terms "include", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, product or device that includes a series of elements includes not only those elements, but also Other elements that are not explicitly listed, or they also include elements inherent to such processes, methods, commodities, or equipment. If there are no more restrictions, the element defined by the sentence "including a..." does not exclude the existence of other identical elements in the process, method, commodity, or equipment that includes the element.

The above are only the preferred embodiments of this specification and are not intended to limit this specification. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this specification shall be included in this specification. Within the scope of protection.

Claims

A silicon optical module, characterized in that it comprises:

Substrate

The silicon optical chip is packaged on the substrate, and the side of the silicon optical chip is provided with an optical coupling port;

A cover, packaged on the substrate and wrapped around the outside of the silicon optical chip; a first opening is opened on the side of the cover, and the light coupling port is exposed from the first opening;

An optical fiber element, the optical fiber element is provided with an optical fiber, the optical fiber element is coupled to the silicon optical chip in the first opening portion, and the optical fiber is butted with the optical coupling port.
The silicon optical module according to claim 1, further comprising a fixing member disposed on the upper surface of the silicon optical chip, and the fixing member is exposed from the first opening;

The side end surface of the fixing member is flush with the side end surface of the silicon optical chip provided with the optical coupling port, and the fixing member is adhesively connected to the optical fiber element.
The silicon optical module according to claim 2, wherein the side portion of the fixing member extends in a direction approaching the optical fiber element to form a connecting portion, and the lower surface of the connecting portion is connected to the upper surface of the optical fiber element. The surfaces abut against each other.
The silicon optical module according to claim 1, wherein the optical coupling port is located on the upper side of the silicon optical chip, and the side end surface of the silicon optical chip provided with the optical coupling port is located on the side of the substrate. Inside.
4. The silicon optical module according to claim 4, wherein the side end surface of the cover body with the first opening is flush with the side end surface of the substrate.
The silicon optical module according to claim 1, wherein the optical coupling port is located at the lower side of the silicon optical chip, and the side end surface of the silicon optical chip provided with the optical coupling port is located on the side of the substrate. Inside

The side of the substrate is provided with a second opening, the second opening is located below the first opening, and the side end surface of the silicon optical chip provided with the optical coupling port protrudes from the first opening. Two openings.
7. The silicon optical module according to claim 6, wherein the side end surface of the cover body with the first opening is flush with the side end surface of the substrate.
The silicon optical module according to claim 1, wherein the optical coupling port is located at the lower side of the silicon optical chip, and the side end surface of the silicon optical chip provided with the optical coupling port protrudes from the Substrate.
The silicon optical module according to claim 8, wherein the side end surface of the cover provided with the first opening protrudes from the substrate, and the part of the cover protruding from the substrate is closer to An extension portion is formed extending in the direction of the substrate, and the extension portion abuts against a side end surface of the substrate.
9. The silicon optical module according to claim 9, wherein a protective sheet is provided on the lower surface of the extension portion, and the protective sheet is flush with the lower surface of the substrate.
The silicon optical module according to claim 1, wherein the number of the optical coupling port is multiple, and the number of the optical fiber corresponds to the number of the optical coupling port; the optical fiber includes a laser input port, Signal transmitting port, and signal receiving port.
11. The silicon optical module of claim 11, wherein the plurality of optical coupling ports are arranged in the same direction, and the plurality of optical fibers are arranged in the same direction as the plurality of optical coupling ports.
An optical transmission device, characterized by comprising: a circuit board and at least one silicon optical module according to any one of claims 1 to 12, and the substrate is arranged on the circuit board.