TWI795024B - Integrated optical chip module and multi-axis fiber optic sensor - Google Patents

Abstract

A packaging solution for integrated optical chips. The integrated optical chip module formed after packaging includes integrated optical chips whose two ends are tailed with array optical fibers, a box body for packaging, a cover body, and a The carrier plate of the integrated optical chip, the acoustic wave absorbing coating, the dielectric adhesive coating and the electrical signal probe for electrically connecting the integrated optical chip. Since the acoustic wave absorbing coating is placed between the carrier of the integrated optical chip and the bottom of the box, and between the carrier of the integrated optical chip and the side of the box, it can effectively absorb the stress caused by The resulting vibrating sound waves. Furthermore, the dielectric glue coating is disposed between the integrated optical chip and the carrier, so the thermal electrons generated by the thermoelectric effect can be effectively released. In addition, the integrated optical chip module is a single packaged component and can be used in multi-axis optical fiber sensors.

Description

Integrated optical chip module and multi-axis optical fiber sensor

The present invention relates to an integrated optical chip module, and in particular to a multi-level integrated optical chip module with photoelectric modulation and demodulation functions packaged in a box and its multi-axis optical fiber sensor.

Traditional optical chips with photoelectric modulation and demodulation functions are mostly made of nonlinear photoelectric materials, so most of them are hard, brittle and easy to break like glass. Most of the packaging of this type of optical chip uses a metal shell to cover the surrounding of the optical chip, so as to protect and strengthen the relatively fragile optical chip, and to expand the application field of this type of optical chip. The above-mentioned packaged optical chip modules can cooperate with the design of the electrical signal probe and the optical fiber coupling interface to achieve the purpose of packaging the airtight integrated optical chip.

Please refer to the US Patent No. 5,790,730. This patent provides a vertical packaging solution for Integrated Optic Circuit (IOC). The packaging technology of the interface is to package the above-mentioned integrated optical chip vertically with the optical fiber. Then, the light source energy is coupled into the optical waveguide on the chip through the process of optical mode coupling by using the optical fiber and the grating coupling port on the integrated optical chip. In this optical waveguide, the modulation and demodulation functions of electro-optic can be performed. In addition, the modulated light can be coupled and exported by using the grating coupling port on the other side and the optical fiber. In this way, the function and purpose of packaging the integrated optical chip can be realized.

However, the above-mentioned vertical packaging solution of the integrated optical chip is a vertical optical fiber packaging solution, so it is necessary to align the grating coupling port on the integrated optical chip for efficient optical coupling packaging. If the integrated optical chip contains more than one pair of incoming and outgoing optical grating ports, in the actual package, it is often due to the process variation of the integrated optical chip, or the grating optical coupling port on the surface of the integrated optical chip. The structural defects of the integrated optical chip lead to an increase in optical loss. Therefore, this vertical packaging solution for the integrated optical chip increases the difficulty of packaging the integrated optical chip and greatly reduces the cost of such integrated optical chip modules. Feasibility of mass production.

In addition, please refer to the US patent application US 2002/0064338 A1, which provides a packaging solution for optical coupling of tailed optical fibers by using the front and rear ports of the waveguide of the integrated optical chip. Since this packaging solution does not need to use a grating for vertical optical coupling, it can skillfully avoid the difficulty of aligning the vertical optical fiber and the grating in the above-mentioned US 5,790,730 case. In addition, in terms of circuit wire interface, this published application utilizes traditional circuit signal connectors, such as SMA (Sub Miniature A, SMA) and other standardized microwave radio frequency connectors, which are arranged on both sides of the housing. Since most of the above-mentioned microwave and radio frequency joints have a fixed size, and the width is in the range of 5 cm to 15 cm, the overall package size is limited by this and it is difficult to shrink. Furthermore, the above-mentioned type of microwave radio frequency connector requires a specific metal wire wiring scheme. If the array integrated optical chip is to be packaged, it can be expected to lead to high packaging costs and substantially reduce the cost of the integrated optical chip module. The cost-effective advantage that was originally pursued.

In order to reduce the difficulty of packaging, US Published Patent No. 6,385,359 B1 proposes a simple integrated optical chip packaging solution without a carrier. This packaging solution utilizes the front and rear optical fiber tail connection technology, and cooperates with the side row type circuit connector to greatly reduce the package size of the integrated optical chip module. In this design, the pigtailed optical fiber that comes with the integrated optical chip is a simple entry and exit solution with one entry and one exit. The assembly solution is to first pigtail the integrated optical chip to the optical fiber, and then put it into the packaging box. Cooperate with the dielectric gel (dielectric gel) after coating and curing, and then connect the signal line to the cable connector on the box body through wire bonding, and finally place the top cover to complete the packaging to form an integrated optical chip module.

However, due to the difference in expansion coefficient between the integrated optical chip and the packaging box itself, excess stress will be generated between the interface between the two when the temperature is raised or lowered. This stress will trigger the piezoelectric effect of the integrated optical chip, making the solution The modulation and modulation signals are abnormal, and modulation failure may occur. Therefore, in the case of US 6,385,359 B1, a dielectric glue is used to coat the interface between the two, in addition to reducing vibration and causing damage to the integrated optical chip In addition to the possibility, it also simultaneously reduces the probability of abnormal modulation or failure caused by stress. The above solution requires the selection of specific dielectric adhesives that meet stress relief, such as EPO-TEK 353 ND, Dow Corning Q3-6575, Dow Corning Sylgard 577, etc. Alloy (KOVAR) boxes are bonded directly.

Since there is no buffer interlayer of other materials between the integrated optical chip and the Kovar box body, the integrated optical chip and the Kovar box body are only fixed by gluing. In the case of rapid temperature changes in the application field, there is a high probability that the temperature-dependent deformation of the integrated optical chip, the dielectric glue, and the Kovar alloy box will be out of sync, resulting in an integrated body. There is continuous accumulation of excess piezoelectric effect and acousto-optic effect in the photonics chip.

Furthermore, as documented in the public literature "Ponomarev, Roman Sergeevitch, Denis Igorevitch Shevtsov, and Pavel Victorovitch Karnaushkin. ""Shutdown" of the Proton Exchange Channel Waveguide in the Phase Modulator under the Influence of the Pyroelectric Effect." Applied Sciences 9.21 (2019 ): 4585.", if a large amount of thermal electron accumulation occurs in the optical waveguide on the integrated optical chip, it will cause the optical waveguide in the integrated optical chip to reach the collapse threshold coefficient, and suddenly generate a high The optical loss makes the modulation phenomenon of the integrated optical chip disappear suddenly, and causes the shutdown effect of the optical waveguide on the integrated optical chip, that is, the modulation function of the integrated optical chip will fail. Therefore, US 6,385,359 B1 still has room for improvement.

On the other hand, US Published Patent No. 8,070,368 B1 proposes a packaging solution for an airtight integrated optical chip module. This solution is similar to the above-mentioned package using the pigtailed optical fiber and the packaging box, but a layer of submount is specially sandwiched between the integrated optical chip and the packaging box. The material of the substrate can be stainless steel, lithium niobate crystal, or a variety of ceramic and glass materials, and the substrate mainly plays two important tasks: (1) thermal expansion coefficient matching and compensation; and (2) dielectric glue Interface conductive or insulating matching. In addition to the electro-optic effect to be used, the integrated optical chip module is often accompanied by thermoelectric effect (thermoelectric effect), piezoelectric effect and acousto-optic effect. The modulation and demodulation signals are abnormal or even invalid. Therefore, the packaging design of the carrier board is one of the important key technologies that determine the overall specifications of the integrated optical chip module, and it is also one of the solutions to reduce the closing effect of the optical waveguide.

The solution of US 8,070,368 B1 still does not solve the cumulative effect of excess capacitance brought about by the acousto-optic effect of the material. Due to the different vibration conditions of the base, carrier and integrated optical chip of the packaging box, there will be a chance to produce acousto-optic resonance (acousto-optic resonance) at a specific acoustic frequency, and through the acousto-optic effect of the material, The energy of acoustic resonance is converted into residual intensity modulation. The residual intensity modulation phenomenon caused by the above-mentioned acousto-optic effect often occurs below 5 MHz, and this frequency range is just the frequency operating range of most fiber optic sensors. Therefore, such as the published paper "Nikitenko, Alexander N., et al. "Influence of acousto-optic resonances in electro-optical modulator on fiber optic gyro performance and method for its compensation." IEEE Sensors Journal 18.1 (2017): 273-280. As mentioned above, the above-mentioned acousto-optic effect leads to redundant modulation and demodulation noise, which greatly reduces the frequency operating range that the integrated optical chip module can provide.

The integrated optical chip is mainly used as the core modulation and demodulation chip of the fiber optic sensor. The fiber optic sensor is such as a fiber optic gyroscope, a fiber optic current sensor and other application modules, and the above two modules are both The transaction has been successfully transferred. In the application of fiber optic gyroscopes, at least three axes of fiber optic gyroscopes are required to fully describe the attitude rotation. However, since each sensing axis is an independent component, in the prior art solutions, each sensing axis Axis measurement requires a set of packaged integrated optical chips, a set of optical devices, a set of sensing fiber optic rings, a set of light sources, and a set of light intensity detectors, which leads to the sale of a set of three-axis fiber optic gyroscopes. The price is very high, and each group of single-axis fiber optic gyroscopes is usually as high as tens of thousands of dollars.

Please refer to the published patent I719888 of the Republic of China. This published patent proposes an integrated optical chip that integrates a fiber optic splitter and a waveguide phase modulator using a single chip. In addition to reducing the overall volume of the core integrated optical chip, The optical reciprocity property, which is very important in fiber optic sensors, is also maintained. Although the concept patented in this announcement can miniaturize the single-axis optical fiber sensing unit, there is no literature yet to propose how to use a single packaged integrated optical chip to achieve simultaneous modulation and demodulation of multi-axis optical fiber sensors, and it can be used in practice. mass-produced solutions.

An embodiment of the present invention provides an integrated optical chip module, which includes: an integrated optical chip, a first side and a second side opposite to each other are respectively provided with an inlet fiber module and an outlet fiber module; an inlet An optical fiber array, coupled to the inlet optical fiber module; an outlet optical fiber array, coupled to the outlet optical fiber module; a box, a first side and a second side opposite to each other are provided with two holes to expose the A part of the entrance optical fiber array and the exit optical fiber array; a carrier plate used to carry the integrated optical chip; an acoustic wave absorbing coating is arranged between a bottom inner side of the box body and the carrier plate for use bonding the carrier board and the box body; a dielectric glue coating, disposed between the carrier board and the integrated optical chip, for bonding the carrier board and the integrated optical chip; at least one The electrical signal probe penetrates from the outside of the box to the inside of the box through at least one hole on a third side of the box adjacent to the first side and the second side of the box, and electrically The integrated optical chip is connected; and a cover is used for covering the box to seal the integrated optical chip in the box.

According to the above technical features, the integrated optical chip includes an optical chip substrate, an optical waveguide array, at least one set of optical phase modulators, two optical fiber coupling interfaces, the inlet fiber module and the outlet fiber module, wherein the optical waveguide The array is formed on one surface of the optical chip substrate, the optical waveguide array is coupled to the fiber coupling interfaces, the inlet fiber module and the outlet fiber module are formed on opposite sides of the optical chip substrate, and the fiber coupling interfaces are formed on On the surface of the optical chip substrate, and respectively coupled to the inlet fiber module and the outlet fiber module, and respectively coupled to the inlet fiber array and the outlet fiber array, and an optical phase modulator is formed on the optical chip substrate, and electrically Sexually connected to the electrical signal probe; wherein an optical signal to be modulated is introduced from the entrance optical fiber array, and sequentially passes through the entrance optical fiber module, the optical fiber coupling interface and the optical waveguide array, and the optical signal is received in the optical waveguide array The optical phase modulator modulates, and the modulated optical signal is transmitted by the optical waveguide array, passes through the other optical fiber coupling interface and the output optical fiber module in sequence, and is exported by the output optical fiber array.

According to the above technical features, the at least one set of optical phase modulators is three sets of optical phase modulators, and the optical waveguide array includes three sets of Y-branched optical waveguides interlaced with each other.

According to the above technical features, the optical phase modulator is used to modulate the optical signal of the optical waveguide array, and the way of modulating the optical signal is through an electro-optic effect, a plasmonic dispersion effect, an acousto-optic effect or a piezoelectric effect. modulation.

According to the above technical features, the acoustic wave absorbing coating is used to absorb a vibrating sound wave generated by a stress, and the dielectric glue coating is used to release a hot electron generated by a pyroelectric effect.

According to the above technical features, the dielectric adhesive coating is an optical refractive index adjustment conductive adhesive, an ultraviolet curing conductive adhesive or a conductive silicon adhesive.

According to the above technical features, the entrance optical fiber module is a V-shaped groove array optical fiber module, a U-shaped groove array optical fiber module or a U-shaped groove array optical fiber module, and an optical glue is used to fix a plurality of optical fibers of the entrance optical fiber array, wherein the The optical fiber is a single mode optical fiber, a multimode optical fiber or a polarization maintaining optical fiber.

According to the above technical features, the outlet fiber optic module is a V-shaped groove array fiber module, a U-shaped groove array fiber module or a U-shaped groove array fiber module, and an optical glue is used to fix a plurality of optical fibers of the outlet fiber array, wherein the The optical fiber is a single mode optical fiber, a multimode optical fiber or a polarization maintaining optical fiber.

According to the above technical features, the optical waveguide array can be used on a silicon-based material substrate, a group III-V material substrate, a silicon substrate, a sapphire substrate, a ceramic substrate, a quartz substrate or a nonlinear optical material substrate. A channel waveguide, a diffusion waveguide, a ridge waveguide or a buried waveguide array, wherein the nonlinear optical material is a lithium niobate, a lithium tantalate or a potassium titanyl phosphate material.

According to the above technical features, the carrier is a stainless steel substrate, a Kovar alloy material (KOVAR) substrate, a silicon substrate, a sapphire substrate, a ceramic substrate, a quartz substrate or a nonlinear optical material substrate, wherein the nonlinear optical The material is lithium niobate, lithium tantalate or potassium titanyl phosphate.

According to the above technical features, the at least one electrical signal probe is a plurality of electrical signal probes, and the electrical signal probe is a stainless steel material, a Kovar alloy material (KOVAR), an aerospace aluminum alloy material or A magnetically permeable metal alloy material, wherein the arrangement direction of the electrical signal probes is parallel to a horizontal plane of the integrated optical chip, and is electrically connected to electrodes on the integrated optical chip through a plurality of signal wires.

According to the above technical features, the signal wires are realized by a metal wire bonding technology, and the metal wire bonding technology is realized by a metal ball bonding technology, a metal wedge bonding technology, a metal ribbon bonding technology or a thermocompression bonding technology .

According to the above technical features, the material of the cover body and the box body is a stainless steel material, a Kovar alloy material (KOVAR), an aerospace aluminum alloy material or a magnetically permeable metal alloy material processed by electroplating technology.

According to the above technical features, the joining of the box body and the cover body is realized through a laser welding technique, an optical bonding technique or an airtight welding method.

An embodiment of the present invention provides an integrated optical chip module, which includes: a plurality of multi-axis sensing fiber rings; the aforementioned integrated optical chip module with multiple groups of optical phase modulators; a fiber sensor bracket, It is used to install the sensing fiber rings and accommodate the integrated optical chip module; wherein the outlet optical fiber array of the integrated optical chip module is coupled to the plurality of optical fibers of the inlet optical fiber array Induction fiber optic ring.

According to the above, in the integrated optical chip module provided by the present invention, since the acoustic wave absorbing coating is arranged between the carrier plate of the integrated optical chip and the bottom of the box body, and between the carrier plate and the box body Between the sides, it can effectively absorb the vibration and sound waves generated by the stress; moreover, the dielectric adhesive coating is arranged between the integrated optical chip and the carrier, so it can effectively release the heat generated by the thermoelectric effect electronic. In addition, the integrated chip of the integrated optical chip module directly integrates at least three sets of optical beam splitters (implemented by optical waveguide arrays) and at least three sets of optical phase modulators on a single optical chip substrate to realize The functions of modulating and demodulating at least three-axis optical fiber sensors are realized in a single packaged integrated optical chip.

For the benefit of the examiner to understand the technical features, content and advantages of the present invention and the effects that can be achieved, the present invention is hereby described in detail in the form of embodiments in conjunction with the accompanying drawings, and the drawings used therein, its The subject matter is only for illustration and auxiliary instructions, and not necessarily the true proportion and precise configuration of the present invention after implementation, so it should not be interpreted based on the proportion and configuration relationship of the attached drawings, and limit the scope of rights of the present invention in actual implementation. Together first describe.

An embodiment of the present invention provides a packaging solution for an integrated optical chip. The integrated optical chip module formed after the integrated optical chip is packaged includes an integrated optical chip whose two sides are tailed with an array of optical fibers, and is used for packaging The box body, the cover body, the carrier plate for carrying the integrated optical chip, the acoustic wave absorbing coating, the dielectric glue coating and the electrical signal probe for electrically connecting the integrated optical chip. The integrated optical chip is arranged on the carrier plate through the dielectric glue coating. A sound wave absorbing coating is arranged between the carrier plate and the bottom of the box body. One side of the box body is provided with at least one hole for allowing at least one electrical signal probe to pass through the box body and electrically connect the integrated optical chip. The cover is used to close the box to cover and protect the integrated optical chip.

Since the sound wave absorbing coating is placed between the carrier plate and the bottom of the box body, and between the carrier plate and the side of the box body (that is, the sound wave absorbing coating is coated in the interlayer between the carrier plate and the box body) , so the acoustic wave-absorbing coating can absorb vibrational sound waves generated by stress. Furthermore, the dielectric glue coating is disposed between the integrated optical chip and the carrier, so the thermal electrons generated by the thermoelectric effect can be effectively released. In addition, in the integrated optical chip module of the embodiment of the present invention, the components formed by the integrated optical chip and the carrier, the cover body and the box body, etc., are independent components from each other, so in mass production In the process of chemicalizing the chip module, the purpose of simple and fast installation can be achieved.

Furthermore, the integrated optical chip module of the embodiment of the present invention can be a multi-level integrated optoelectronic modulation and demodulation chip component (multi-level integrated optoelectronic modulation and demodulation chip component), wherein the multi-level integrated optoelectronic modulation and demodulation chip component The optoelectronic modulation and demodulation chip components use the electro-optical phase modulation effect, and cooperate with the use of integrated optical waveguide array and component optoelectronic packaging technology to realize the purpose of integration and easy and convenient packaging.

In addition, the integrated optical chip includes an optical chip substrate (with an optical waveguide array and at least one set of optical phase modulators on its surface), an exit optical fiber module and an entrance optical fiber module bonded to both sides of the optical chip substrate and connections. The egress fiber array and the inlet fiber array of the egress fiber module and the inlet fiber module. The integrated optical chip module is a single package component, and directly integrates multiple groups of modulation and demodulation photoelectric phase modulator arrays, so as to effectively realize the modulation and demodulation of multi-axis optical fibers in a single integrated optical chip The optical signal used by the sensor can be used to reduce the volume and weight of the current multi-axis fiber optic sensor.

The integrated optical chip module of the embodiment of the present invention is a single packaged component, and has the function of modulating and demodulating the signal of the multi-axis optical fiber sensor. Specifically, the present invention utilizes array fiber coupling technology and a packaging solution coated with a dielectric adhesive coating and an acoustic wave absorbing coating, and compared with the previous three-axis optical fiber sensor, three sets of packaged integrated optical chips must be used module, the present invention only needs one integrated optical chip module to be used for modulating and demodulating the signal of the multi-axis optical fiber sensor, and there is only one integrated optical chip in the integrated optical chip module . In particular, the present invention achieves the layered coating of the dielectric glue coating and the acoustic wave absorbing coating, and realizes the feasibility of simultaneously reducing the acousto-optic resonance and releasing the stress to accumulate thermal electrons, and using this packaging scheme, it is expected to be able to Reduce the component cost of the three-axis fiber optic sensor by about 23% to 39%.

Please note here that although the optical fiber module coupling technology, the dielectric glue coating and the packaging principle of the carrier board have been found in the literature, there is no teaching content in the literature at present to teach those with ordinary knowledge in the technical field of the present invention to integrate the three After modification, it is used to realize the solution of directly integrating multiple groups of modulation and demodulation elements on a single chip. Please note here that the method of integrating the dielectric glue coating and the acoustic wave absorbing coating described in the embodiment of the present invention can reduce the accumulation of hot electrons from the acoustic-optic resonance and thermal stress, and this solution is not simply combined or easily modified Existing literature, but those who can easily think about it, the specific details and explanations will be explained later with the drawings.

First, please refer to FIG. 1, which is an exploded view of an integrated optical chip module according to an embodiment of the present invention. In the embodiment of the present invention, the integrated optical chip module 9 includes a cover body 101, an integrated optical chip 102, a box body 103, a carrier plate 104, an electrical signal probe 105, an exit optical fiber array 108, and an entrance optical fiber array 109 , wherein the first side and the second side corresponding to each other of the integrated optical chip 102 (for example, the first side and the second side are respectively the left side and the right side) are connected to the entrance fiber optic module 107 and the exit fiber optic module respectively set therethrough 106 is coupled to the inlet fiber array 109 and the outlet fiber array 108 .

The first side of the integrated optical chip 102 is provided with an entrance optical fiber module 107 , and the entrance optical fiber module 107 is coupled to the entrance optical fiber array 109 for guiding multiple groups of optical signals of the entrance optical fiber array 109 into the integrated optical chip 102 . The electrical signal probe 105 is electrically connected to the integrated optical chip 102, and is used to introduce the modulated signal into the integrated optical chip 102, wherein the electrical signal probe 105 passes through one side of the box body 103 from the outside of the box body 103 (for example , the front side of the box body 103) the hole P3 penetrates the box body 103, and to the direction of the third side (for example, the third side is the front side) adjacent to the first side and the second side of the integrated optical chip 102 extend. The optical signal is transmitted on the optical waveguide of the integrated optical chip 102, and after modulation and demodulation is completed, it is received by the outlet fiber module 106 arranged on the second side of the integrated optical chip 102, and the outlet fiber module 106 is coupled to at the exit fiber array 108 , so as to output the modulated optical signal through the exit fiber array 108 .

The carrier board 104 is an L-shaped strip structure, a dielectric glue coating 313 is coated on the top, and an acoustic wave absorbing coating 311 is coated on the bottom of the carrier board 104 . The integrated optical chip 102 is bonded and fixed to the carrier 104 through the dielectric glue coating 313 . The integrated optical chip 102 and the carrier 104 are bonded and fixed on the inner bottom of the box body 103 through the acoustic wave absorbing coating 311 . Through the solution of coating the dielectric adhesive coating 313 on the top of the carrier 104 and the acoustic wave absorbing coating 311 on the bottom of the carrier 104, the goal of absorbing the acousto-optic resonance and releasing stress hot electrons can be achieved, so as to reduce the acousto-optic Functional purpose of resonance modulation interference and low waveguide closing effect. In addition, the shape of the carrier board 104 may be a U-shaped structure in other embodiments, and the present invention is not limited thereto.

Two holes P1 and P2 are provided on opposite sides (eg, left and right) of the box body 103 to allow the entrance fiber array 109 and the exit fiber array 108 to penetrate from the inside of the box 103 to the outside of the box 103 . The cover 101 is used to cover and fix on the box 103 to complete the rapid packaging of the integrated optical chip 102, wherein the opposite sides (for example, left and right) of the cover 101 have stoppers 1012 for the cover 101 When used for covering and fixing on the box body 103 , the holes P1 and P2 are sealed, and only the inlet fiber array 109 and the outlet fiber array 108 penetrate from the inside of the box body 103 to the outside of the box body 103 .

Please refer to FIG. 1 and FIG. 2. FIG. 2 is a plan view of an integrated optical chip of an integrated optical chip module according to an embodiment of the present invention. The integrated optical chip 102 includes an optical chip substrate 201 , an optical waveguide array 207 , an exit fiber module 106 , an entry fiber module 107 , multiple groups of optical phase modulators 206 and fiber coupling interfaces 208 and 209 . The fiber coupling interface 208 is disposed near the first side of the optical chip substrate 201 , and the fiber coupling interface 209 is disposed near the second side of the optical chip substrate 201 . The fiber coupling interfaces 208 and 209 are respectively coupled to the inlet fiber array 109 and the outlet fiber array 108 .

The optical waveguide array 207 is formed on the surface of the optical chip substrate 201 and is coupled to the fiber coupling interfaces 208 and 209 . Multiple groups of optical phase modulators 206 are formed on the surface of the optical chip substrate 201 . Multiple groups of optical phase modulators 206 are close to at least a part of the optical waveguides of the optical waveguide array 207, and are electrically connected to the electrical signal probe 105, wherein the multiple groups of optical phase modulators 206 are used to modulate the phase of the optical field in the optical waveguide, such as but not The limitation is through physical mechanisms such as electro-optic effect, plasmonic dispersion effect, acousto-optic effect or piezoelectric effect. The light to be modulated is introduced into the optical waveguide array 207 from the entrance fiber array 109 through the entrance fiber module 107 and the fiber coupling interface 208 in sequence. After the optical signal is modulated by the optical phase modulator 206, it passes through the exit fiber module 106 and the fiber coupling interface 209 in sequence , so as to export the modulated optical signal through the output fiber array 108 .

The entrance optical fiber module 107 and the exit optical fiber module 106 are optical fiber modules that use the surface of the optical chip substrate 201 to form an array of V-shaped grooves, an array of U-shaped grooves, or an array of U-shaped grooves, and place multiple optical fibers in sequence (the exit optical fiber array 108 or the entrance fiber array 109), and fixed by optical glue, wherein the connected optical fiber can be ordinary single-mode optical fiber, multi-mode optical fiber or polarization-maintaining optical fiber, etc., and its fiber size can be between 20 microns and 500 microns.

The optical fiber coupling interfaces 208 and 209 of the optical chip substrate 201 are achieved by using the mode matching between the designed optical fiber mode and the optical waveguide array 207. The optical fiber coupling interfaces 208 and 209 can be coated with optical glue for adjusting the refractive index and high-transmittance ultraviolet packaging Glue and other schemes are used to achieve the mode matching process and obtain an optical coupling interface with high coupling rate and low optical loss.

The formation method of the optical waveguide array 207 and multiple groups of optical phase modulators 206 of the optical chip substrate 201 can refer to the proposal proposed in the patent publication TW I719888 B of the Republic of China, which uses a nonlinear optical substrate, cooperates with the optical waveguide and electrode topology design, Multiple sets of optical phase modulators 206 can be completed on a single build-up material while maintaining the optical reciprocity characteristics required by fiber optic sensors, so details will not be described here.

Furthermore, the optical waveguide array 207 is a plurality of interleaved Y-branched waveguides, so as to integrate at least three pairs of optical phase modulators 206 and three groups of waveguide mode splitters in a single optical chip substrate 201, so as to realize The functions of modulating and demodulating at least three-axis fiber optic sensors are achieved in a single packaged integrated optical chip 102 .

The optical waveguide array 207 can be on a silicon-based material substrate, a III-V material substrate, a silicon substrate, a sapphire substrate, a ceramic substrate, a quartz substrate or a nonlinear optical material substrate (such as lithium niobate, lithium tantalate or potassium titanyl phosphate material) Above, it can be realized by channel waveguide, diffusion waveguide, ridge waveguide or buried waveguide array, and the present invention is not limited thereto.

Please refer to FIG. 1 and FIG. 3 at the same time. FIG. 3 is a cross-sectional view of an integrated optical chip module according to an embodiment of the present invention. When the cover body 101 is closed on the box body 103 , it will contact the wedge-shaped groove 309 to achieve the purpose of tight covering and packaging. Corresponding wedge-shaped grooves 309 of the cover 101 can be provided with corresponding grooves for engagement, and the joint and fixation of the cover 101 and the box body 103 can be through laser welding technology, optical gluing technology or airtight welding. In addition, from the inner side of the bottom of the box body 103 to the top, there are respectively the sound wave absorbing coating 311, the carrier plate 104 and the dielectric glue coating 313. The acoustic wave absorbing coating 311 is used to absorb the acousto-optic resonance, so as to reduce the probability of residual modulation caused by the acousto-optic resonance.

Please refer to FIG. 1 and FIG. 4 at the same time. FIG. 4 is a longitudinal sectional view of an integrated optical chip module according to an embodiment of the present invention. Multiple electrical signal probes 105 are electrically connected to multiple sets of optical phase modulators 206 of the integrated optical chip 102 through multiple sets of signal wires 404 . The material of the electrical signal probe 105 can be stainless steel material processed by electroplating technology, Kovar alloy material (KOVAR), aerospace aluminum alloy material or magnetic metal alloy material, etc. The arrangement direction of the electrical signal probe 105 is parallel to the integrated The horizontal surface of the optical chip 102 is electrically connected to the electrodes on the integrated optical chip 102 .

The signal wire 404 can be realized by metal wire bonding technology. The metal wire bonding technology can be realized by metal ball bonding technology, metal wedge bonding technology, metal strip bonding technology or thermocompression bonding and other technologies. The material of the cover body 101 and the box body 103 can be achieved by electroplating stainless steel material, Kovar alloy material (KOVAR), aerospace aluminum alloy material or magnetic metal alloy material. The material of the carrier plate 104 can be a stainless steel substrate, a Kovar alloy material (KOVAR) substrate, a silicon substrate, a sapphire substrate, a ceramic substrate, a quartz substrate or a nonlinear optical material substrate, such as lithium niobate, lithium tantalate or potassium titanyl phosphate .

Please refer to FIG. 5, which is a perspective view of a multi-axis fiber optic sensor according to an embodiment of the present invention. In a single integrated optical chip 102, the integrated optical chip module 9 of the present invention utilizes the optical fiber array module and three-layer simple packaging technology, and cooperates with the use of dielectric glue and acoustic wave absorbing glue to directly integrate multiple groups The optical beam splitter and phase modulator are packaged in a single integrated optical chip module 9, and this single integrated optical chip module 9 can provide multiple optical fiber sensing units. For example, in Figure 5, a single integrated optical chip module 9 is used in a three-axis optical fiber sensor, and the three-axis optical fiber sensor includes a three-axis optical fiber sensor bracket 501, three different axis The sensing optical fiber rings 502-504 and a single integrated optical chip module 9 (accommodated in the optical fiber sensor bracket 501). The sensing optical fiber rings 502-504 are installed on the three-axis optical fiber sensor bracket 501, and are coupled to a single integrated optical chip module 9 through the optical fiber F (the optical fiber of the exit optical fiber array 108 and the entrance optical fiber array 109), namely The functional purpose of using a single integrated optical chip module 9 to modulate and demodulate the multi-axis sensing optical fiber rings 502-504 can be achieved.

From the above description, it can be seen that compared with the existing literature, the present invention requires a set of integrated optical chip modules 9 for the sensing fiber rings 502-504 of each axis in the current scheme of the optical fiber sensor. However, if the present invention is implemented In the inventive solution, the multi-axis sensing optical fiber rings 502-504 only need to share a single integrated optical chip module 9, that is, the use of a single integrated optical chip module 9 can achieve integrated and integrated multi-axis optical fiber sensing According to the functional purpose of the device, the cost of the components constituting the three-axis optical fiber sensor is expected to be greatly reduced by about 23% to 39%.

Furthermore, due to the integration of optical fiber sensors and integrated optical chips in the past, most solutions choose to insert the integrated optical chip into the sensing fiber ring, resulting in the overall area of the optical fiber sensor will be reduced by the integrated optical chip of the package. Determined by the volume of the optical chip, if the packaged integrated optical chip module 9 of the present invention is used, the integrated optical chip module 9 can be independent of the sensing fiber rings 502-504. In addition to providing a fast assembly solution, in the design of mechanical components, it can increase a wider degree of design freedom to achieve the functional purpose of an economical mass-produced multi-axis optical fiber sensor.

In summary, the integrated optical chip module and multi-axis optical fiber sensor of the present invention can accurately achieve the expected use effect, and the present invention has not been disclosed before the application, and it is fully in line with the patent The provisions and requirements of the law. ￠It is really convenient to file an application for a patent for invention according to the law, and ask for the review and approval of the patent. However, the illustrations and descriptions disclosed above are only preferred embodiments of the present invention, and are not intended to limit the scope of protection of the present invention; those who are familiar with the art generally do other things based on the characteristics and scope of the present invention. Equivalent changes or modifications shall be regarded as not departing from the design scope of the present invention.

9:Integrated optical chip module 101: cover body 1012: block 102:Integrated optical chip 103: box body 104: carrier board 105: Electric signal probe 106: Export fiber optic module 107: Inlet fiber optic module 108: Export fiber array 109: Inlet fiber array P1～P3: holes 309: wedge groove 311: Acoustic absorbing coating 313: Dielectric glue coating 201: Optical chip substrate 206:Optical phase modulator 207:Optical waveguide array 208, 209: Fiber coupling interface 404: signal wire 501: Fiber optic sensor bracket 502～504: induction optical fiber ring F: optical fiber

The accompanying drawings are provided to enable those skilled in the art to which the present invention pertains to further understand the present invention, and are incorporated in and constitute a part of the specification of the present invention. The drawings illustrate exemplary embodiments of the invention and together with the description serve to explain principles of the invention.

Fig. 1 is an exploded view of an integrated optical chip module according to an embodiment of the present invention.

Fig. 2 is a plan view of the integrated optical chip of the integrated optical chip module according to the embodiment of the present invention.

Fig. 3 is a cross-sectional view of an integrated optical chip module according to an embodiment of the present invention.

Fig. 4 is a longitudinal sectional view of an integrated optical chip module according to an embodiment of the present invention.

Fig. 5 is a perspective view of a multi-axis optical fiber sensor according to an embodiment of the present invention.

9:Integrated optical chip module

101: cover body

1012: block

102:Integrated optical chip

103: box body

104: carrier board

105: Electric signal probe

106: Export fiber optic module

107: Inlet fiber optic module

108: Export fiber array

109: Inlet fiber array

P1~P3: holes

309: wedge groove

311: Acoustic absorbing coating

313: Dielectric glue coating

Claims (15)

An integrated optical chip module, comprising: An integrated optical chip (102), a first side and a second side opposite to each other are respectively provided with an inlet fiber module (107) and an outlet fiber module (106); an entrance fiber optic array (109), coupled to the entrance fiber optic module (107); An outlet fiber array (108), coupled to the outlet fiber module (106); A box body (103), a first side and a second side opposite to each other are provided with two holes (P1, P2) to respectively expose the inlet fiber array (109) and the outlet fiber array (108) a part; a carrier plate (104), used for carrying the integrated optical chip (102); an acoustic wave absorbing coating (311), arranged between a bottom inner side of the box body (103) and the carrier plate (104), for bonding the carrier plate (104) and the box body (103); a dielectric adhesive coating (313), arranged between the carrier (104) and the integrated optical chip (102), for bonding the carrier (104) and the integrated optical chip (102 ); at least one electrical signal probe (105), through at least one hole (P3) of a third side adjacent to the first side and the second side of the box body (103) from the box body (103) The outside of the box body (103) penetrates into the inside of the box body (103), and is electrically connected to the integrated optical chip (102); and A cover (101) is used to cover the box (103) to seal the integrated optical chip (102) in the box (103). The integrated optical chip module according to claim 1, wherein the integrated optical chip (102) includes an optical chip substrate (201), an optical waveguide array (207), at least one set of optical phase modulators ( 206), two optical fiber coupling interfaces (208, 209), the inlet fiber module (107) and the outlet fiber module (106), wherein the optical waveguide array (207) is formed on a surface of the optical chip substrate (201) Above, the optical waveguide array (207) is coupled to the two optical fiber coupling interfaces (208, 209), the entrance fiber module (107) and the exit fiber module (106) are formed on the optical chip substrate (201) opposite to each other On both sides, the two fiber coupling interfaces (208, 209) are formed on the surface of the optical chip substrate (201), and are respectively coupled to the inlet fiber module (107) and the outlet fiber module (106), and respectively coupling the entrance optical fiber array (109) and the exit optical fiber array (108), and the optical phase modulator (206) is formed on the optical chip substrate (201), and is electrically connected to the electric signal probe (105); Wherein an optical signal to be modulated is introduced from the entrance optical fiber array (109), and sequentially passes through the entrance optical fiber module (107), the optical fiber coupling interface (208) and the optical waveguide array (207), the optical signal is in the The optical waveguide array (207) is modulated by the optical phase modulator (206), and the modulated optical signal is transmitted by the optical waveguide array (207), and sequentially passes through the other optical fiber coupling interface (209) and the exit optical fiber After the module (106), it is exported by the outlet optical fiber array (108). The integrated optical chip module as claimed in item 2, wherein the at least one group of optical phase modulators (206) is three groups of the optical phase modulators (206), and the optical waveguide array (207) includes interleaved Three sets of Y-branched optical waveguides. The integrated optical chip module as described in claim 3, wherein the optical phase modulator (206) is used to modulate the optical signal of the optical waveguide array (207), and the way of modulating the optical signal is through an electro-optic effect, a plasmonic dispersion effect, an acousto-optic effect or a piezoelectric effect to modulate. The integrated optical chip module as claimed in item 3, wherein the acoustic wave absorbing coating (311) is used to absorb a vibrating sound wave generated by a stress, and the dielectric glue coating (313) is used to release a A thermal electron produced by the thermoelectric effect. The integrated optical chip module as described in Claim 5, wherein the dielectric adhesive coating (313) is an optical refractive index adjustment conductive adhesive, an ultraviolet curing conductive adhesive or a conductive silicon adhesive. The integrated optical chip module as described in claim 3, wherein the entrance optical fiber module (107) is a V-shaped groove array optical fiber module, a U-shaped groove array optical fiber module or a U-shaped groove array optical fiber module, matched with a Optical glue secures the optical fibers of the inlet optical fiber array (109), wherein the optical fiber is a single mode optical fiber, a multimode optical fiber or a polarization maintaining optical fiber. The integrated optical chip module as described in claim 3, wherein the outlet optical fiber module (106) is a V-shaped groove array optical fiber module, a U-shaped groove array optical fiber module or a U-shaped groove array optical fiber module, matched with a Optical glue fixes the plurality of optical fibers of the exit optical fiber array (108), wherein the optical fiber is a single-mode optical fiber, a multi-mode optical fiber or a polarization-maintaining optical fiber. The integrated optical chip module as described in claim 3, wherein the optical waveguide array (207) can be on a silicon-based material substrate, a group III-V material substrate, a silicon substrate, a sapphire substrate, a ceramic substrate, On a quartz substrate or a nonlinear optical material substrate, it is realized by using a channel waveguide, a diffuse waveguide, a ridge waveguide or a buried waveguide array, wherein the nonlinear optical material is a lithium niobate, a Lithium tantalate or potassium titanyl phosphate materials. The integrated optical chip module as described in claim 3, wherein the carrier (104) is a stainless steel substrate, a Kovar alloy (KOVAR) substrate, a silicon substrate, a sapphire substrate, a ceramic substrate, a Quartz substrate or a nonlinear optical material substrate, wherein the nonlinear optical material is a lithium niobate, a lithium tantalate or a potassium titanyl phosphate material. The integrated optical chip module as described in claim 3, wherein the at least one electrical signal probe (105) is a plurality of the electrical signal probes (105), and the electrical signal probes (105) are processed by electroplating technology A stainless steel material, a Kovar alloy material (KOVAR), an aerospace aluminum alloy material or a magnetically permeable metal alloy material, wherein the arrangement direction of the electrical signal probes (105) is parallel to the integrated optical chip ( 102), and is electrically connected to electrodes on the integrated optical chip (102) through a plurality of signal wires (404). The integrated optical chip module as described in claim 11, wherein the plurality of signal wires (404) are implemented through a metal wire bonding technology, and the metal wire bonding technology consists of a metal ball bonding technology, a metal wedge bonding technology, a metal strip bonding technology or a thermocompression bonding technology. The integrated optical chip module as described in claim 3, wherein the material of the cover (101) and the box (103) is a stainless steel material processed by electroplating technology, a Kovar alloy material (KOVAR), An aerospace aluminum alloy material or a magnetically permeable metal alloy material. The integrated optical chip module according to claim 3, wherein the joining of the box body (103) and the cover body (101) is realized through a laser welding technique, an optical bonding technique or an airtight welding method. A multi-axis fiber optic sensor comprising: A plurality of multi-axis induction optical fiber rings (502-504); The integrated optical chip module (9) as described in one of claims 3-14; An optical fiber sensor bracket (501), used for installing the sensing optical fiber rings (502-504) and accommodating the integrated optical chip module (9) therein; Wherein the outlet fiber array (108) of the integrated optical chip module (9) and the plurality of fibers (F) of the inlet fiber array (109) are coupled to the induction fiber rings (502-504).

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