CN112433303A - Silicon optical module and optical transmission device - Google Patents
Silicon optical module and optical transmission device Download PDFInfo
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- CN112433303A CN112433303A CN201910789740.0A CN201910789740A CN112433303A CN 112433303 A CN112433303 A CN 112433303A CN 201910789740 A CN201910789740 A CN 201910789740A CN 112433303 A CN112433303 A CN 112433303A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
Abstract
The specification provides a silicon optical module and an optical transmission device. The silicon optical module includes: a substrate; and the silicon optical chip is packaged on the substrate, and the side part of the silicon optical chip is provided with an optical coupling port. The cover body is packaged on the substrate and covers the outside of the silicon optical chip; a first opening part is formed in the side part of the cover body, and the optical coupling port is exposed from the first opening part. And the optical fiber element is provided with an optical fiber, the optical fiber element is coupled and connected with the silicon optical chip in the first opening part, and the optical fiber is butted with the optical coupling port.
Description
Technical Field
The present disclosure relates to the field of optical communications technologies, and in particular, to a silicon optical module and an optical transmission device.
Background
In the field of digital communications, transmission and telecommunications, optical modules are used to transmit and receive optical signals and are the core components in the entire optical network. The conventional optical module adopts a discrete structure, and couples an optical signal in an optical chip into an optical fiber through a passive device, such as a lens. For a long-distance transmission module, since many passive devices are needed, it is often necessary to perform coupling alignment on each passive device one by one during the assembly process. Therefore, it requires high time cost, labor cost, process cost, material cost, and the like.
Disclosure of Invention
The present specification provides a silicon optical module and an optical transmission device with an integrated structure.
According to a first aspect of embodiments herein, there is provided a silicon light module comprising:
a substrate;
the silicon optical chip is packaged on the substrate, and an optical coupling port is formed in the side part of the silicon optical chip;
the cover body is packaged on the substrate and covers the outside of the silicon optical chip; a first opening part is formed in the side part of the cover body, and the optical coupling port is exposed from the first opening part;
and the optical fiber element is provided with an optical fiber, the optical fiber element is coupled and connected with the silicon optical chip in the first opening part, and the optical fiber is butted with the optical coupling port.
The fixing piece is arranged on the upper surface of the silicon optical chip and exposed from the first opening part;
the side end face of the fixing piece is flush with the side end face of the silicon optical chip, which is provided with the optical coupling port, and the fixing piece is connected with the optical fiber element in an adhesion mode.
Furthermore, a connecting part is formed on the side part of the fixing part in an extending manner in the direction close to the optical fiber element, and the lower surface of the connecting part is abutted against the upper surface of the optical fiber element.
Further, the optical coupling port is located at the lateral upper portion of the silicon optical chip, and a lateral end face of the silicon optical chip, where the optical coupling port is located, is located at the inner side of the substrate.
Further, a side end surface of the cover body, on which the first opening portion is opened, is flush with a side end surface of the substrate.
Further, the optical coupling port is located at a lateral lower portion of the silicon optical chip, and a lateral end face of the silicon optical chip, where the optical coupling port is located, is located at an inner side of the substrate;
and a second opening part is formed in the side part of the substrate, the second opening part is positioned below the first opening part, and the side end face of the silicon optical chip, which is provided with the optical coupling port, protrudes out of the second opening part.
Further, a side end surface of the cover body, on which the first opening portion is opened, is flush with a side end surface of the substrate.
Further, the optical coupling port is located at a lateral lower portion of the silicon optical chip, and a lateral end face of the silicon optical chip, which is provided with the optical coupling port, protrudes out of the substrate.
Furthermore, a side end face of the cover body, on which the first opening portion is formed, protrudes from the substrate, a portion of the cover body protruding from the substrate extends in a direction approaching the substrate to form an extension portion, and the extension portion abuts against the side end face of the substrate.
Further, the lower surface of extension is equipped with the protection piece, the protection piece with the lower surface of base plate is flush.
Furthermore, the number of the optical coupling ports is multiple, and the number of the optical fibers corresponds to the number of the optical coupling ports; the optical fiber includes a laser input port, a signal launch port, and a signal receive port.
Further, the plurality of optical coupling ports are arranged in the same direction, and the plurality of optical fibers are arranged in the same arrangement direction as the plurality of optical coupling ports.
According to a second aspect of embodiments herein, there is provided a light module comprising: a circuit board and at least one silicon optical module as described in any of the above embodiments, the substrate being disposed on the circuit board.
According to the technical scheme, the cover body of the silicon optical module is coated outside the silicon optical chip, so that the silicon optical chip can be protected. The cover body is provided with the first opening part, so that the optical coupling opening part of the silicon optical chip is exposed, the optical fiber element and the silicon optical chip are conveniently coupled, an integrated structure is formed, the assembly is easy, and the labor and material costs are saved.
Drawings
Fig. 1 shows a schematic perspective view of a silicon optical module with a laser according to an exemplary embodiment of the present disclosure.
Fig. 2 is a perspective view of the silicon optical module shown in fig. 1 after a cover is removed.
Fig. 3 is a side view of fig. 2.
Fig. 4 is a perspective view of another silicon light module according to an exemplary embodiment of the present disclosure.
Fig. 5 is a perspective view of the silicon optical module shown in fig. 4 with the silicon optical chip and the optical fiber element removed.
Fig. 6 is a perspective view of the silicon optical module shown in fig. 4 with the cover and the optical fiber element removed.
Fig. 7 is a perspective view of the silicon optical module shown in fig. 4 with the optical fiber element removed.
FIG. 8 is a side view of the silicon optical module shown in FIG. 4 with the cover removed.
Fig. 9 illustrates a perspective view of another silicon optical module in an exemplary embodiment of this disclosure.
Fig. 10 is a perspective view of the silicon optical module shown in fig. 9 with the cover and the optical fiber element removed.
Fig. 11 is a perspective view of the silicon optical module shown in fig. 9 after fiber removal.
Fig. 12 is a bottom view of the silicon light module shown in fig. 9.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present specification. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the specification, as detailed in the appended claims.
The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the description. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.
It should be understood that although the terms first, second, third, etc. may be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, the first information may also be referred to as second information, and similarly, the second information may also be referred to as first information, without departing from the scope of the present specification. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.
Silicon optics are based on waveguide transmission and utilize the well-established silicon wafer processing technology of the semiconductor industry to highly integrate various devices, such as optical modulators, receivers and passive waveguide devices, together on a silicon substrate through an etching process. Therefore, the silicon optical chip module has the advantages of small volume and high integration level, and can reduce the assembly links and improve the test efficiency, thereby saving various costs of time, labor, process, materials and the like.
The specification provides a silicon optical module and an optical module with an integrated structure. The silicon optical module and the optical module according to the present specification will be described in detail below with reference to the accompanying drawings. The features of the following examples and embodiments may be combined with each other without conflict.
Referring to fig. 1 to 3, an embodiment of the present disclosure provides a silicon optical module, including: substrate 10, silicon optical chip 20, cover 30 and optical fiber element 40. The silicon optical chip 20 is packaged on the substrate 10, and the cover 30 is packaged on the substrate 10 and covers the silicon optical chip 20. It is understood that the cover 30 has a recessed cavity formed therein for receiving the silicon microchip 20 therein. The silicon photo chip 20 and the substrate 10 may be attached to the substrate 10 by a Flip chip (Flip chip) process. The cover 30 and the substrate 10 may be sealed by glue.
The side of the silicon optical chip 20 is provided with an optical coupling port. A first opening 31 is formed at a side of the cover 30, and the optical coupling port is exposed from the first opening 31. It is understood that the first opening 31 may be formed by notching the top surface and the side surface of the cover 30 together to expose a portion of the top surface of the silicon optical chip 20 and the side surface provided with the optical coupling opening for assembling the optical fiber component 40. Optionally, the optical coupling port may be a light exit port or a light entrance port.
The optical fiber element 40 is provided with an optical fiber 41, the optical fiber element 40 is coupled with the silicon optical chip 20 in the first opening portion 31, and the optical fiber 41 is butted with the optical coupling port. In practice, the silicon optical module of the present description may be used in conjunction with a laser 50. The laser 50 may be used as an external device to cooperate with the silicon optical module of this specification through an optical fiber, or may be packaged together with the silicon optical module of this specification in a packaging manner (for example, a flip chip process) to be used as an integral module. That is, the silicon optical module in this specification can be used in a scene where the laser is external, and can also be used in a scene where the laser is internal.
According to the above technical solution, in the silicon optical module of the present specification, the cover 30 covers the outside of the silicon optical chip 20, so as to protect the silicon optical chip 20. The cover body 30 is provided with the first opening part 31, so that the optical coupling opening part of the silicon optical chip 20 is exposed, the optical fiber element 40 and the silicon optical chip 20 are conveniently coupled, an integrated structure is formed, the assembly is easy, and the labor and material costs are saved.
In an alternative embodiment, the substrate 10 and the cover 30 are rectangular plates, and the size of the cover 30 is matched with the size of the cover 10 to ensure the smoothness of the appearance of the silicon optical module and facilitate assembly. The width of the first opening portion 31 is smaller than the width of the silicon optical chip 20, the inner side wall 32 of the first opening portion 31 and the rear end portion of the cover 30 can be coated outside the silicon optical chip 20 from the front-rear direction, the left end portion and the right end portion of the cover 30 can be coated outside the silicon optical chip 20 from the left-right direction, and further the silicon optical chip 20 is coated from the front-rear direction and the left-right direction, so that the silicon optical chip 20 can be protected. Alternatively, the substrate 10 may employ an organic material. The cover 30 may be made of a metal material, such as nickel-copper alloy, which not only can protect the silicon optical chip 20, but also can perform a good heat dissipation function.
In an alternative embodiment, fiber optic component 40 is less strongly bonded directly to silicon photonics chip 20 due to the small thickness of silicon photonics chip 20. In order to facilitate assembling the optical fiber element 40, the silicon optical module may further include a fixing member 60, the fixing member 60 may be disposed on an upper surface of a portion of the silicon optical chip 20 exposed from the first opening 31 of the cover 30 by adhesive bonding, and the fixing member 60 is also exposed from the first opening 31. Alternatively, the fixing member 60 may be a separate member, and the fixing member 60 may be integrally formed with the cover 30 or integrally formed with the optical fiber member 40 for easier installation.
The first opening 31 is formed by notching the upper surface and the side surface of the cover 30 together to expose a part of the upper surface of the silicon optical chip 20, so that the optical fiber element 40 can be clamped by a tool fixture when the optical fiber element 40 is assembled, and the position where the optical fiber element 40 is butted with the silicon optical chip 20 is accurate. Specifically, the optical fiber element 40 may be aligned with the optical coupling port of the silicon photonics chip 20 through an edge coupling process and adhesively attached to the fixture 60, thereby securing the optical fiber element 40 to the silicon photonics chip 20.
The side end face of the fixing member 60 is flush with the side end face (shown as a front end face) of the silicon photonic chip 20 provided with the optical coupling port, and the fixing member 60 and the optical fiber element 40 are bonded and connected by a glue, so that the optical fiber element 40 and the silicon photonic chip 20 are fixed to each other. Optionally, the height of the upper surface of the fixing member 60 is lower than that of the upper surface of the cover 30 to ensure the flatness of the appearance of the silicon optical module.
In order to further improve the assembling accuracy of the optical fiber element 40 and the silicon optical chip 20 and the stability of the connection position of the two, a connection portion 61 is formed by extending the side portion of the fixing member 60 in a direction approaching the optical fiber element 40, and the lower surface of the connection portion 61 is in contact with the upper surface of the optical fiber element 40. The connecting part 61 can limit the optical fiber element 40, and can prevent the position of the optical fiber element 40 from deviating upwards during assembly, so that the effects of accurate assembly and position fixing are achieved.
In an alternative embodiment, the optical coupling port is located at a lateral upper portion of the silicon optical chip 20, the position of the optical coupling port can be referred to a direction of a dotted line in fig. 3, and a lateral end surface of the silicon optical chip 20, where the optical coupling port is located, is located at an inner side of the substrate 10. It will be appreciated that by placing the optical coupling port on the upper side of the silicon photonics chip 20, the thickness of the silicon photonics chip 20 may be increased appropriately, with the edge of the silicon photonics chip 20 not exceeding the edge of the substrate 10. Thus, when the silicon optical chip 20 is mounted on the substrate 10, even if a small amount of flash glue exists, the optical coupling port will not be affected, and the device can work normally.
Further, a side end surface (a front end surface in the figure) of the cover 30 on which the first opening 31 is opened is flush with a side end surface of the substrate 10, so that the flatness of the appearance of the silicon optical module can be ensured for assembly.
In an alternative embodiment, the fiber optic component 40 may take the form of a ribbon fiber. The number of the optical coupling ports may be plural, and the number of the optical fibers 41 corresponds to the number of the optical coupling ports, and the optical fibers are butted in a one-to-one correspondence manner. The optical fiber 41 includes a Laser input port (Laser input port), a signal transmission port (TX port), and a signal reception port (RX port). In the present embodiment, the total number of the optical fibers 41 may be ten, wherein the number of the laser input ports may be two, and the number of the signal transmitting ports and the number of the signal receiving ports may be four, respectively. Of course, in other embodiments, the number of the optical fibers 41 may be set according to actual needs, and the description does not limit this.
The plurality of optical coupling ports may be arranged in the same direction, for example, in the width direction of the silicon optical chip 20, so that the thickness of the silicon optical chip 20 may be reduced, and the overall space of the silicon optical module may be reduced, and the plurality of optical fibers 41 may be arranged in the same arrangement direction as the plurality of optical coupling ports, so as to be conveniently butted to the optical coupling ports.
Referring to fig. 4 to 8, in an alternative embodiment, the optical coupling port is located at a lower side portion of the silicon optical chip 20, and a side end surface of the silicon optical chip 20, where the optical coupling port is located, is located at an inner side of the substrate 10. The optical coupling port is disposed at the lower side of the silicon optical chip 20, and when the silicon optical chip 20 is mounted on the substrate 10, the optical coupling port may be affected by the overflow of glue, thereby affecting the normal operation of the device. A second opening 11 is formed in a side portion of the substrate 10, the second opening is located below the first opening 31, and a side end surface of the silicon optical chip 20, on which the optical coupling port is formed, protrudes from the second opening 11.
The optical coupling port is disposed at the lower side of the silicon optical chip 20, and when the silicon optical chip 20 is mounted on the substrate 10, the optical coupling port may be affected by the overflow of glue, thereby affecting the normal operation of the device. Therefore, by forming the second opening 11 on the substrate 10, the position below the optical coupling port of the silicon optical chip 20 is suspended, and when the silicon optical chip 20 is mounted on the substrate 10, even a small amount of glue overflow does not affect the optical coupling port, thereby ensuring that the device can work normally.
In order to ensure the smoothness of the external appearance of the silicon optical module, ensure the optimum position of coupling, and save the overall volume of the silicon optical module, the thickness of the optical fiber element 40 is generally greater than the thickness of the silicon optical chip 20, and a portion of the optical fiber element 40 can be sunk into the second opening 11, so that the thickness space of the substrate 10 is utilized to avoid the smoothness of the external appearance of the silicon optical module being affected by the thickness of the optical fiber element 40 exceeding the upper surface of the cover 30.
In an alternative embodiment, the substrate 10 and the cover 30 are rectangular plates, and the size of the cover 30 is matched with the size of the cover 10 to ensure the smoothness of the appearance of the silicon optical module and facilitate assembly. The width of the first opening portion 31 is smaller than the width of the silicon optical chip 20, the inner side wall 32 of the first opening portion 31 and the rear end portion of the cover 30 can be coated outside the silicon optical chip 20 from the front-rear direction, the left end portion and the right end portion of the cover 30 can be coated outside the silicon optical chip 20 from the left-right direction, and further the silicon optical chip 20 is coated from the front-rear direction and the left-right direction, so that the silicon optical chip 20 can be protected. Alternatively, the substrate 10 may employ an organic material. The cover 30 may be made of a metal material, such as nickel-copper alloy, which not only can protect the silicon optical chip 20, but also can perform a good heat dissipation function.
In an alternative embodiment, fiber optic component 40 is less strongly bonded directly to silicon photonics chip 20 due to the small thickness of silicon photonics chip 20. In order to facilitate assembling the optical fiber element 40, the silicon optical module may further include a fixing member 60, the fixing member 60 may be disposed on an upper surface of a portion of the silicon optical chip 20 exposed from the first opening 31 of the cover 30 by adhesive bonding, and the fixing member 60 is also exposed from the first opening 31.
The first opening 31 is formed by notching the upper surface and the side surface of the cover 30 together to expose a part of the upper surface of the silicon optical chip 20, so that the optical fiber element 40 can be clamped by a tool fixture when the optical fiber element 40 is assembled, and the position where the optical fiber element 40 is butted with the silicon optical chip 20 is accurate. Specifically, the optical fiber element 40 may be aligned with the optical coupling port of the silicon photonics chip 20 through an edge coupling process and adhesively attached to the fixture 60, thereby securing the optical fiber element 40 to the silicon photonics chip 20.
The side end face of the fixing member 60 is flush with the side end face of the silicon optical chip 20 provided with the optical coupling port, and the fixing member 60 and the optical fiber element 40 are bonded and connected through glue, so that the optical fiber element 40 and the silicon optical chip 20 are fixed to each other. Optionally, the height of the upper surface of the fixing member 60 is lower than that of the upper surface of the cover 30 to ensure the flatness of the appearance of the silicon optical module.
In order to further improve the connection stability between the optical fiber element 40 and the silicon optical chip 20, a connecting portion 61 is formed on the side portion of the fixing member 60 extending in a direction approaching the optical fiber element 40, and the lower surface of the connecting portion 61 is in contact with the upper surface of the optical fiber element 40 and fixed to each other. The optical fiber element 40 is fixed with the fixing member 60 from both the horizontal direction and the vertical direction, so that the optical fiber element 40 and the silicon optical chip 20 are better fixed, and the condition that the optical fiber element 40 and the silicon optical chip 20 are not firmly adhered to each other is avoided.
Furthermore, the side end surface of the cover 30, on which the first opening 31 is opened, is flush with the side end surface of the substrate 10, so that the flatness of the appearance of the silicon optical module can be ensured for assembly.
In an alternative embodiment, the number of the optical coupling ports is multiple, and the number of the optical fibers 41 corresponds to the number of the optical coupling ports, and the optical fibers are butted in a one-to-one correspondence manner. The optical fiber 41 includes a Laser input port (Laser input port), a signal transmission port (TX port), and a signal reception port (RX port). In the present embodiment, the total number of the optical fibers 41 may be ten, wherein the number of the laser input ports may be two, and the number of the signal transmitting ports and the number of the signal receiving ports may be four, respectively. Of course, in other embodiments, the number of the optical fibers 41 may be set according to actual needs, and the description does not limit this.
The plurality of optical coupling ports may be arranged in the same direction, for example, in the width direction of the silicon optical chip 20, so that the thickness of the silicon optical chip 20 may be reduced, and the overall space of the silicon optical module may be reduced, and the plurality of optical fibers 41 may be arranged in the same arrangement direction as the plurality of optical coupling ports, so as to be conveniently butted to the optical coupling ports.
Referring to fig. 9 to 12, in an alternative embodiment, the optical coupling port is located at a lower side portion of the silicon optical chip 20, and a side end surface of the silicon optical chip 20, which is provided with the optical coupling port, protrudes from the substrate 10. The optical coupling port is disposed at the lower side of the silicon optical chip 20, and when the silicon optical chip 20 is mounted on the substrate 10, the optical coupling port may be affected by the overflow of glue, thereby affecting the normal operation of the device.
Therefore, the side end face of the silicon optical chip 20, which is provided with the optical coupling port, is arranged to protrude out of the substrate 10, so that the position below the optical coupling port of the silicon optical chip 20 is suspended, and when the silicon optical chip 20 is mounted on the substrate 10, the optical coupling port is not affected even if a small amount of glue overflows, and the device can work normally.
Since the side end face of the silicon optical chip 20 provided with the optical coupling port protrudes from the substrate 10, in order to protect the portion of the silicon optical chip 20 protruding from the substrate, the side end face of the cover 30 provided with the first opening 31 protrudes from the substrate 10, the portion of the cover 30 protruding from the substrate 10 extends in the direction close to the substrate 10 to form an extension portion 33, and the extension portion 33 abuts against the side end face of the substrate 10, so that the silicon optical chip 20 can be protected. It is understood that both side walls of the first opening portion 31 are formed with an extension portion 33, respectively.
A space is formed between the two extending portions 33 of the cover 30, the thickness of the optical fiber element 40 is generally greater than the thickness of the silicon microchip 20, and a portion of the optical fiber element 40 can sink into the space according to the position of the optical coupling port of the silicon microchip 20, so as to ensure the optimal coupling position with the silicon microchip 20.
Further, in order to protect the silicon photonics chip 20 better, the lower surface of the extension portion 33 is provided with a protection sheet 34, and the protection sheet 34 is flush with the lower surface of the substrate 10 and covers the exposed portion of the bottom surface of the silicon photonics chip 20. Alternatively, the protective sheet 34 may be a metal protective sheet, which may have a certain heat dissipation effect.
In an alternative embodiment, the substrate 10 and the cover 30 are rectangular plates, and the size of the cover 30 is matched with the size of the cover 10 to ensure the smoothness of the appearance of the silicon optical module and facilitate assembly. The width of the first opening portion 31 is smaller than the width of the silicon optical chip 20, the inner side wall 32 of the first opening portion 31 and the rear end portion of the cover 30 can be coated outside the silicon optical chip 20 from the front-rear direction, the left end portion and the right end portion of the cover 30 can be coated outside the silicon optical chip 20 from the left-right direction, and further the silicon optical chip 20 is coated from the front-rear direction and the left-right direction, so that the silicon optical chip 20 can be protected. Alternatively, the substrate 10 may employ an organic material. The cover 30 may be made of a metal material, such as nickel-copper alloy, which not only can protect the silicon optical chip 20, but also can perform a good heat dissipation function.
In an alternative embodiment, fiber optic component 40 is less strongly bonded directly to silicon photonics chip 20 due to the small thickness of silicon photonics chip 20. In order to facilitate assembling the optical fiber element 40, the silicon optical module may further include a fixing member 60, the fixing member 60 may be disposed on an upper surface of a portion of the silicon optical chip 20 exposed from the first opening 31 of the cover 30 by adhesive bonding, and the fixing member 60 is also exposed from the first opening 31.
The first opening 31 is formed by notching the upper surface and the side surface of the cover 30 together to expose a part of the upper surface of the silicon optical chip 20, so that the optical fiber element 40 can be clamped by a tool fixture when the optical fiber element 40 is assembled, and the position where the optical fiber element 40 is butted with the silicon optical chip 20 is accurate. Specifically, the optical fiber element 40 may be aligned with the optical coupling port of the silicon photonics chip 20 through an edge coupling process and adhesively attached to the fixture 60, thereby securing the optical fiber element 40 to the silicon photonics chip 20.
The side end face of the fixing member 60 is flush with the side end face of the silicon optical chip 20 provided with the optical coupling port, and the fixing member 60 and the optical fiber element 40 are bonded and connected through glue, so that the optical fiber element 40 and the silicon optical chip 20 are fixed to each other. Optionally, the height of the upper surface of the fixing member 60 is lower than that of the upper surface of the cover 30 to ensure the flatness of the appearance of the silicon optical module.
In order to further improve the connection stability between the optical fiber element 40 and the silicon optical chip 20, a connecting portion 61 is formed on the side portion of the fixing member 60 extending in a direction approaching the optical fiber element 40, and the lower surface of the connecting portion 61 is in contact with the upper surface of the optical fiber element 40 and fixed to each other. The optical fiber element 40 is fixed with the fixing member 60 from both the horizontal direction and the vertical direction, so that the optical fiber element 40 and the silicon optical chip 20 are better fixed, and the condition that the optical fiber element 40 and the silicon optical chip 20 are not firmly adhered to each other is avoided.
The embodiment of the present specification further provides an optical module, which includes a circuit board and at least one silicon optical module, where a substrate of the silicon optical module is disposed on the circuit board. It should be noted that the description of the silicon optical module in the above embodiments and embodiments is also applicable to the optical module in this specification. Alternatively, the optical module may be a QSFP DD module, a Co-package module, or the like. The circuit board of the QSFP DD module can be provided with a silicon optical module. The circuit board of the Co-package module can be provided with a plurality of silicon optical modules.
According to the technical scheme, the cover body of the silicon optical module adopted by the optical module in the specification is coated outside the silicon optical chip, so that the silicon optical chip can be protected. The cover body is provided with the first opening part, so that the optical coupling opening part of the silicon optical chip is exposed, the optical fiber element and the silicon optical chip are conveniently coupled, an integrated structure is formed, the assembly is easy, and the labor and material costs are saved.
Other embodiments of the present disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This specification is intended to cover any variations, uses, or adaptations of the specification following, in general, the principles of the specification and including such departures from the present disclosure as come within known or customary practice within the art to which the specification pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the specification being indicated by the following claims.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above description is only a preferred embodiment of the present disclosure, and should not be taken as limiting the present disclosure, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present disclosure should be included in the scope of the present disclosure.
Claims (13)
1. A silicon light module, comprising:
a substrate;
the silicon optical chip is packaged on the substrate, and an optical coupling port is formed in the side part of the silicon optical chip;
the cover body is packaged on the substrate and covers the outside of the silicon optical chip; a first opening part is formed in the side part of the cover body, and the optical coupling port is exposed from the first opening part;
and the optical fiber element is provided with an optical fiber, the optical fiber element is coupled and connected with the silicon optical chip in the first opening part, and the optical fiber is butted with the optical coupling port.
2. The silicon optical module according to claim 1, further comprising a fixing member disposed on an upper surface of the silicon optical chip, the fixing member being exposed from the first opening portion;
the side end face of the fixing piece is flush with the side end face of the silicon optical chip, which is provided with the optical coupling port, and the fixing piece is connected with the optical fiber element in an adhesion mode.
3. The silicon optical module as claimed in claim 2, wherein the side portion of the fixing member is formed with a connecting portion extending in a direction approaching the optical fiber member, and a lower surface of the connecting portion abuts against an upper surface of the optical fiber member.
4. The silicon optical module according to claim 1, wherein the optical coupling port is located at an upper side portion of the silicon optical chip, and a side end surface of the silicon optical chip where the optical coupling port is located at an inner side of the substrate.
5. The silicon optical module according to claim 4, wherein a side end surface of the cover body on which the first opening is formed is flush with a side end surface of the substrate.
6. The silicon optical module according to claim 1, wherein the optical coupling port is located at a lower side portion of the silicon optical chip, and a side end surface of the silicon optical chip, where the optical coupling port is located, is located at an inner side of the substrate;
and a second opening part is formed in the side part of the substrate, the second opening part is positioned below the first opening part, and the side end face of the silicon optical chip, which is provided with the optical coupling port, protrudes out of the second opening part.
7. The silicon optical module according to claim 6, wherein a side end surface of the cover body on which the first opening is formed is flush with a side end surface of the substrate.
8. The silicon optical module as claimed in claim 1, wherein the optical coupling port is located at a lower side portion of the silicon optical chip, and a side end surface of the silicon optical chip, where the optical coupling port is located, protrudes from the substrate.
9. The silicon optical module as claimed in claim 8, wherein a side end surface of the cover body on which the first opening is formed protrudes from the substrate, and an extension portion is formed by extending a portion of the cover body protruding from the substrate in a direction approaching the substrate, the extension portion abutting against the side end surface of the substrate.
10. The silicon light module of claim 9, wherein a lower surface of the extension is provided with a protective sheet that is flush with a lower surface of the substrate.
11. The silicon optical module according to claim 1, wherein the number of the optical coupling ports is plural, and the number of the optical fibers corresponds to the number of the optical coupling ports; the optical fiber includes a laser input port, a signal launch port, and a signal receive port.
12. The silicon optical module of claim 11, wherein the plurality of optical coupling ports are arranged in a same direction, and the plurality of optical fibers are arranged in a same arrangement direction as the plurality of optical coupling ports.
13. An optical transmission device, comprising: a circuit board and at least one silicon light module as claimed in any one of claims 1 to 12, the substrate being disposed on the circuit board.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910789740.0A CN112433303A (en) | 2019-08-26 | 2019-08-26 | Silicon optical module and optical transmission device |
| TW109117865A TW202113413A (en) | 2019-08-26 | 2020-05-28 | Silicon optical module and optical transmission component |
| PCT/CN2020/110206 WO2021036900A1 (en) | 2019-08-26 | 2020-08-20 | Silicon optical module and optical transmission component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910789740.0A CN112433303A (en) | 2019-08-26 | 2019-08-26 | Silicon optical module and optical transmission device |
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| Publication Number | Publication Date |
|---|---|
| CN112433303A true CN112433303A (en) | 2021-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910789740.0A Pending CN112433303A (en) | 2019-08-26 | 2019-08-26 | Silicon optical module and optical transmission device |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN112433303A (en) |
| TW (1) | TW202113413A (en) |
| WO (1) | WO2021036900A1 (en) |
Cited By (3)
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| CN113791474A (en) * | 2021-08-17 | 2021-12-14 | 深圳市速腾聚创科技有限公司 | Coupler and optical fiber array packaging method, packaging structure and chip |
| CN113839302A (en) * | 2021-08-17 | 2021-12-24 | 深圳市速腾聚创科技有限公司 | End face coupler and optical fiber array packaging structure and packaging method |
| CN114137656A (en) * | 2021-11-18 | 2022-03-04 | 深圳市艾德光子有限公司 | Silicon optical device and optical transmission apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI795024B (en) * | 2021-10-12 | 2023-03-01 | 互宇向量股份有限公司 | Integrated optical chip module and multi-axis fiber optic sensor |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW202113413A (en) | 2021-04-01 |
| WO2021036900A1 (en) | 2021-03-04 |
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