CN113791474A - Coupler and optical fiber array packaging method, packaging structure and chip - Google Patents
Coupler and optical fiber array packaging method, packaging structure and chip Download PDFInfo
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- CN113791474A CN113791474A CN202110945656.0A CN202110945656A CN113791474A CN 113791474 A CN113791474 A CN 113791474A CN 202110945656 A CN202110945656 A CN 202110945656A CN 113791474 A CN113791474 A CN 113791474A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4212—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element being a coupling medium interposed therebetween, e.g. epoxy resin, refractive index matching material, index grease, matching liquid or gel
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12083—Constructional arrangements
- G02B2006/12097—Ridge, rib or the like
Abstract
The application discloses a packaging method, a packaging structure and a chip of an optical fiber array, wherein a first fiber core is connected to a second fiber core, and the second fiber core penetrates through a cover body to obtain the optical fiber array; and arranging a low-refractive-index waveguide to partially cover the wedge waveguide, arranging a substrate to cover the low-refractive-index waveguide and the wedge waveguide to obtain a coupler, butting the fiber end face of the fiber array with the coupling end face of the low-refractive-index waveguide, and connecting a first butting area on the surface of the cover body, which is adjacent to the fiber end face, with a second butting area on the surface of the substrate, which is adjacent to the coupling end face. The core diameter of the second fiber core is regulated and controlled to enable the fiber end face of the second fiber core to be matched with the mode field of the low-refractive-index waveguide, and the low-refractive-index waveguide partially covers the wedge-shaped waveguide, so that the first fiber cores of the fiber array with various different core diameters can be coupled and butted with the coupler through the second fiber core to carry out light transmission, and the coupling loss between the second fiber core and the low-refractive-index waveguide is reduced.
Description
Technical Field
The present disclosure relates to the field of laser detection technologies, and in particular, to a method, a structure and a chip for packaging a coupler and an optical fiber array.
Background
Besides the applications of silicon-based optoelectronic devices in the field of optical communication, silicon-based optoelectronic devices are also widely regarded in the field of laser radars. Especially in FMCW (Frequency Modulated Continuous Wave) laser radar systems, how to realize efficient coupling transmission between optical fibers and silicon-based optoelectronic devices is an important factor that limits the range finding capability of the whole laser radar system.
Disclosure of Invention
The embodiment of the application provides a packaging method, a packaging structure and a chip of a coupler and an optical fiber array, which can solve the problem of coupling loss of the coupler and the optical fiber array.
In a first aspect, an embodiment of the present application provides a method for packaging a coupler and an optical fiber array, including:
providing an optical fiber array, wherein the optical fiber array comprises a cover body, a first fiber core and a second fiber core connected with the first fiber core, the second fiber core penetrates through the cover body, the second fiber core is provided with an optical fiber end face, and a first butt joint area is arranged on the part, adjacent to the optical fiber end face, of the surface of the cover body.
Providing a coupler comprising a low index waveguide, a wedge waveguide, and a substrate, the low index waveguide partially covering the wedge waveguide and covering the substrate over the index waveguide and the wedge waveguide, the low index waveguide comprising a coupling end face, the substrate having a second butt-joint region adjacent to the coupling end face.
And moving at least one of the optical fiber array and the coupler to enable the optical fiber array and the coupler to be close to each other, enabling the first butt joint area to be connected with the second butt joint area, and enabling the optical fiber end face of the second fiber core to be in butt joint with the coupling end face of the low-refractive-index waveguide, wherein the orthographic projection of the coupling end face completely covers the orthographic projection of the optical fiber end face along the length direction of the second fiber core.
In some exemplary embodiments, the packaging method further comprises the steps of: and arranging a first bonding layer between the first butt joint area and the second butt joint area, and connecting the first butt joint area and the second butt joint area through the first bonding layer.
In some exemplary embodiments, the packaging method further comprises the following steps after disposing a first adhesive layer between the first and second docking areas: and providing a support body, connecting the support body to the base body and the cover body, and arranging the support body and the cover body on the same side of the base body.
In some exemplary embodiments, the support body includes a first support surface, a second support surface connected to one side of the first support surface, and a third support surface connected to the other side of the first support surface, the second support surface being opposite to the third support surface; and moving the support body to approach the optical fiber array and the coupler, connecting the first support surface to the base body of the coupler, connecting the second support surface to the cover body of the optical fiber array, wherein the third support surface is a plane parallel to the length direction of the second fiber core, and the base body comprises a mounting surface which is butted and leveled with the third support surface.
In a second aspect, an embodiment of the present application provides a coupler and optical fiber array package structure, where the coupler and optical fiber array package structure includes an optical fiber array and a coupler, the optical fiber array includes a cover, a first fiber core penetrating through the cover, and a second fiber core connected to the first fiber core, the second fiber core has an optical fiber end face, and a portion of a surface of the cover, which is adjacent to the optical fiber end face, has a first butt-joint region; the coupler is arranged corresponding to the optical fiber array and comprises a wedge-shaped waveguide, a low-refractive-index waveguide partially covering the wedge-shaped waveguide and a substrate covering the wedge-shaped waveguide and the low-refractive-index waveguide, and the low-refractive-index waveguide is provided with a coupling end face;
the orthographic projection of the coupling end face completely covers the orthographic projection of the optical fiber end face along the length direction of the second fiber core, the part of the surface of the base body, which is adjacent to the coupling end face, comprises a second butt joint area, the second butt joint area is butted with the first butt joint area, and the coupling end face is in coupling butt joint with the optical fiber end face, so that light can be transmitted between the low-refractive-index waveguide and the second fiber core.
In some exemplary embodiments, the package structure further includes a first adhesive layer disposed between the first and second butt-joint regions, the second butt-joint region is connected to the first butt-joint region by the first adhesive layer, and the low-index waveguide is connected to the second core by the first adhesive layer.
In some exemplary embodiments, the cover includes a first surface facing the base, the first docking area being located at the first surface, the first surface including a first mounting area connected with the first docking area; the base body comprises a second surface facing the cover body, the second docking area is located on the second surface, and the second surface comprises a second mounting area connected with the second docking area; the second mounting regions and the first mounting regions are arranged in a staggered mode along the direction perpendicular to the length direction of the second fiber core; or the second mounting region corresponds to and is connected with the first mounting region.
In some exemplary embodiments, the second mounting regions and the first mounting regions are staggered along a direction perpendicular to the length direction of the second core, and the package structure further includes a support body including a first support surface connected to the second mounting region and a second support surface connected to the first support surface, and the second support surface is connected to the cover body.
In some exemplary embodiments, the supporting body further includes a third supporting surface connected to the first supporting surface and opposite to the second supporting surface, the base further includes a mounting surface connected to the second mounting region, the mounting surface and the third supporting surface are both parallel to the second core length direction, and the mounting surface is flush with the third supporting surface.
In some exemplary embodiments, the substrate includes a substrate layer, a silica intermediate layer, and a silica cover plate layer, the silica intermediate layer is disposed on the substrate layer, a transition surface is disposed on a side of the silica intermediate layer away from the substrate layer, the wedge waveguide is disposed on the transition surface, the wedge waveguide has a wedge end, the low refractive index waveguide is disposed on the transition surface and covers the wedge end, and the silica cover plate layer is disposed on the transition surface and covers the wedge waveguide and the low refractive index waveguide.
In some exemplary embodiments, the optical fiber array further includes a first cladding layer coated on the outer layer of the first fiber core, and a second cladding layer coated on the outer layer of the second fiber core, where the first fiber core and the first cladding layer constitute a first optical fiber, the first optical fiber is a single-mode optical fiber or a polarization-maintaining optical fiber, the second fiber core and the second cladding layer constitute a second optical fiber, and the second optical fiber is a high-numerical-aperture optical fiber.
In some exemplary embodiments, the optical fiber array includes a plurality of first cores and a plurality of second cores that are connected in an equal number and in a one-to-one correspondence, the coupler includes a plurality of wedge waveguides and a plurality of low refractive index waveguides that are connected in an equal number and in a one-to-one correspondence, the plurality of second cores and the plurality of low refractive index waveguides are equal in number, and coupling end surfaces of the plurality of low refractive index waveguides and the optical fiber end surfaces of the plurality of second cores are in a one-to-one correspondence coupling butt joint.
In a third aspect, an embodiment of the present application provides a chip, where the chip includes an encapsulation layer and the coupler and fiber array package structure described above.
According to the packaging method, the packaging structure and the chip of the coupler and the optical fiber array, the optical fiber array comprises the first fiber core and the second fiber core, the core diameter of the second fiber core is regulated, so that the fiber end face of the second fiber core is matched with the coupling end face of the low-refractive-index waveguide, the wedge-shaped waveguide is partially covered by the low-refractive-index waveguide, and therefore the first fiber cores with various different core diameters of the optical fiber array can be in coupling butt joint with the coupler through the second fiber core to carry out light transmission. Furthermore, the orthographic projection of the optical fiber end surface of the second fiber core and the coupling end surface of the low-refractive-index waveguide in the length direction of the second fiber core are overlapped, so that the mode fields of the second fiber core and the low-refractive-index waveguide are matched, and the coupling loss between the second fiber core and the low-refractive-index waveguide is reduced. And under the condition that the coupling end face is coupled and butted with the optical fiber end face, the second butt joint region adjacent to the coupling end face is butted with the first butt joint region adjacent to the optical fiber end face so as to fixedly connect the base body and the cover body and ensure the packaging stability of the coupler and the optical fiber array packaging structure.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a cross-sectional view of a coupler and fiber array package structure with staggered first and second mounting regions according to an embodiment of the present disclosure;
FIG. 2 is a perspective view of a coupler assembly according to an embodiment of the present application;
FIG. 3 is a perspective view of an optical fiber array and a supporting body according to an embodiment of the present disclosure;
FIG. 4 is a cross-sectional view of a coupler and fiber array package with a support body according to an embodiment of the present application;
FIG. 5 is a schematic perspective view of an optical fiber array according to an embodiment of the present application;
FIG. 6 is a cross-sectional view of a coupler and fiber array package configuration with a first mounting area mated to a second mounting area in accordance with one embodiment of the present application;
fig. 7 is a flowchart illustrating a method for packaging a coupler and an optical fiber array according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The inventor finds that (1) the grating coupler is adopted to couple the optical signal to the silicon-based optoelectronic device from the optical fiber, grating coupling loss and packaging volume are large, and the silicon-based optoelectronic device is difficult to have the advantages of miniaturization and integration; (2) the end face coupler is adopted to couple an optical signal from an optical fiber to the silicon-based photoelectronic device, the end face coupler is provided with the inverted cone waveguide, but the core diameter of the single-mode optical fiber is larger, and if the single-mode optical fiber is directly coupled with the end face coupler, the problem of mode spot mismatch exists, and larger loss still exists; (3) adopt cantilever beam end face coupler with light signal from optic fibre coupling to silicon-based opto-electronic ware's mode, cantilever beam end face coupler output end face is equivalent to single mode fiber spot size, and the loss is less, but when there are a plurality of transmission channel, cantilever beam coupler's cantilever beam is unsettled structure on the one hand, and on the other hand cantilever beam coupler has the stair structure behind the scribing, will increase the degree of difficulty of optical fiber array and the butt joint of cantilever beam end face coupler coupling. Therefore, the embodiments of the present application provide a coupler and an optical fiber array package structure, which can solve the coupling loss during the coupling and docking process of the optical fiber array and the coupler.
As shown in fig. 1 to 6, which are schematic diagrams of a coupler and fiber array package structure 10 provided in an embodiment of the present application, the coupler and fiber array package structure 10 includes a fiber array 100 and a coupler 200 disposed corresponding to the fiber array 100.
Specifically, the optical fiber array 100 includes a cover 110, a first core 121 and a second core 122, the core diameter of the first core 121 may be larger or smaller than the core diameter of the second core 122, the first core 121 is connected to one end of the second core 122, the second core 122 has a fiber end surface 122a facing away from the first core 121, the second core 122 penetrates through the cover 110, and a portion of the surface of the cover 110 adjacent to the fiber end surface 122a includes a first butt-joint region 111 a. The cover 110 has a transmission channel therein, and after the first fiber core 121 is connected to the end of the second fiber core 122, the first fiber core 121 is inserted into the transmission channel of the cover 110, and the length of the first fiber core 121 is adjusted to enable the fiber end surface 122a of the first fiber core 121 to smoothly transition with the first butt-joint region 111a of the cover 110 adjacent to the transmission channel, for example, the fiber end surface 122a is flush with the surface of the cover 110.
The low-index waveguide 220 includes a coupling end face 220a, and an orthogonal projection of the coupling end face 220a entirely covers an orthogonal projection of the fiber end face 122a in the length direction of the second core 122. The portion of the surface of the body 230 adjacent to the coupling end face 220a includes a second docking area 231a, and the second docking area 231a docks with the first docking area 111a so that the coupling end face 220a is coupled and docked with the fiber end face 122a, thereby allowing the low index waveguide 220 to receive light transmitted by the second core 122. The low-refractive-index waveguide 220 may be disposed to partially cover the wedge-shaped waveguide 210 and extend in a direction away from the wedge-shaped waveguide 210, and the coupling end surface 220a of the low-refractive-index waveguide 220 is smoothly transited to the second butt-joint region 231a of the cover 110, for example, the coupling end surface 220a is flush with the second butt-joint region 231a, so that the coupling end surface 220a of the low-refractive-index waveguide 220 is butted with the fiber end surface 122a of the fiber array 100.
In the coupler and optical fiber array package structure 10 according to the embodiment of the application, the optical fiber array 100 includes the first fiber core 121 and the second fiber core 122, and the core diameter of the second fiber core 122 is regulated, so that the fiber end surface 122a of the second fiber core 122 is matched with the coupling end surface 220a of the low-refractive-index waveguide 220, and the low-refractive-index waveguide 220 partially covers the wedge-shaped waveguide 210, so that the first fiber cores 121 of multiple different core diameters of the optical fiber array 100 can be coupled and butted with the coupler 200 through the second fiber core 122 to perform light transmission. Further, by arranging the orthographic projection of the fiber end surface 122a of the second core 122 and the coupling end surface 220a of the low-refractive-index waveguide 220 in the length direction of the second core 122 to be overlapped, the mode fields of the second core 122 and the low-refractive-index waveguide 220 are matched, and the coupling loss between the second core 122 and the low-refractive-index waveguide 220 is reduced. In the case that the coupling end face 220a is coupled and butted with the fiber end face 122a, the second butting region 231a adjacent to the coupling end face 220a is butted with the first butting region 111a adjacent to the fiber end face 122a to fixedly connect the base 230 and the cover 110, so as to ensure the packaging stability of the coupler and the fiber array packaging structure 10.
The second fiber core 122 can be fused to the end of the first fiber core 121 away from the end face 122a of the optical fiber, and light can be smoothly transmitted in the fused first fiber core 121 and the fused second fiber core 122. As shown in fig. 1, the optical fiber array 100 further includes a first cladding 123 coated on an outer layer of the first fiber core 121, and a second cladding 124 coated on an outer layer of the second fiber core 122, the first fiber core 121 and the first cladding 123 form a first optical fiber, the first optical fiber is a single-mode fiber or a polarization maintaining fiber, a core diameter range of the single-mode fiber or the polarization maintaining fiber is 8 μm to 10 μm, the second fiber core 122 and the second cladding 124 form a second optical fiber, the second optical fiber is a high numerical aperture fiber, a core diameter range of the high numerical aperture fiber is 3 μm to 6 μm, a common single-mode fiber or polarization maintaining fiber is fused at a tail end of the high numerical aperture fiber, the high numerical aperture fiber is used for coupling with the low refractive index waveguide of the coupler 200, and the high numerical aperture fiber is used for coupling with the low refractive index waveguide 220, and a mode field of the high numerical aperture fiber can be matched with a mode field of the low refractive index waveguide 220, so that a high coupling efficiency can be obtained, and the coupler 200 having the low refractive index waveguide 220 and the wedge waveguide 210 does not need to be similar to a coupler 200 such as a cantilever end-face coupler The special-shaped structures such as steps need to be etched on the surface of the optical fiber array packaging structure, the problem that the special-shaped structures affect the coupling efficiency is solved, and the packaging stability of the coupler and the optical fiber array packaging structure 10 is ensured.
The optical fiber array 100 includes a plurality of first fiber cores 121 and a plurality of second fiber cores 122 which are equal in number and connected in a one-to-one correspondence manner, the coupler 200 includes a plurality of wedge waveguides 210 and a plurality of low refractive index waveguides 220 which are equal in number and connected in a one-to-one correspondence manner, the plurality of second fiber cores 122 and the plurality of low refractive index waveguides 220 are equal in number, and coupling end surfaces 220a of the plurality of low refractive index waveguides 220 are coupled and butted with optical fiber end surfaces 122a of the plurality of second fiber cores 122 in a one-to-one correspondence manner, so that a plurality of light transmission paths for light propagation are formed. The plurality of second cores 122 may be arranged side by side in a direction perpendicular to a length direction thereof, a direction in which the plurality of second cores 122 are arranged side by side is a first direction a, the plurality of first cores 121 are connected to the plurality of second cores 122 in a one-to-one correspondence, and the plurality of first cores 121 are also arranged side by side in the first direction a.
As shown in fig. 1, the package structure further includes a first adhesive layer 101 disposed between the first docking area 111a and the second docking area 231a, the second docking area 231a is connected to the first docking area 111a through the first adhesive layer 101, the low refractive index waveguide 220 is connected to the second core 122 through the first adhesive layer 101, specifically, the coupling end surface 220a is connected to the fiber end surface 122a through the first adhesive layer 101, and the first adhesive layer 101 may be formed by curing a liquid glue such as a low refractive index matching liquid that allows light to pass through and has a low refractive index for light. In addition to the first adhesive layer 101 covering all of the fiber end face 122a and the coupling end face 220a, the first adhesive layer 101 also covers the surface of the second cladding 124 adjacent to the fiber end face 122a, and the first adhesive layer 101 may also extend to cover all of the first docking area 111a and the second docking area 231a, so as to improve the connection stability between the base body 230 and the cover body 110, and further improve the docking stability between the fiber end face 122a and the coupling end face 220 a.
As shown in fig. 1 and 3, the cover 110 includes a first surface 111 facing the base 230, the first docking area 111a is located on the first surface 111, and the first surface 111 includes a first mounting area 111b connected to the first docking area 111 a; the base body 230 includes a second surface 231 facing the cover body 110, the second docking area 231a is located at the second surface 231, the second surface 231 includes second mounting areas 231b connected to the second docking area 231a, and the second mounting areas 231b and the first mounting areas 111b are alternately arranged in a direction perpendicular to the length direction of the second cores 122. Specifically, when the number of the second fiber cores 122 is multiple, the second mounting region 231b and the first mounting region 111b are respectively disposed on two opposite sides of the plane where the multiple second fiber cores 122 are located along the direction perpendicular to the arrangement direction of the multiple second fiber cores 122, and during packaging, the liquid glue forming the first adhesive layer 101 is controlled to be in the second mounting region 231b and the first mounting region 111b, so that the liquid glue is prevented from overflowing to the first mounting region 111b or the second mounting region 231b to cause excessive liquid glue usage, it is ensured that the deformation stress in the curing process of the liquid glue does not pull the cover 110 and the base 230 to move relatively, the relative movement of the low refractive index waveguide 220 and the second fiber cores 122 is prevented from deviating from the optimal coupling position, and thus higher coupling efficiency is obtained.
As shown in fig. 4, when the second mounting regions 231b and the first mounting regions 111b are alternately arranged along a direction perpendicular to the length direction of the second cores 122, the package structure may further include a support 300 connected to both the cover 110 and the base 230, and the support 300 is used to connect to other mounting structures to provide support for the cover 110. Specifically, the cover 110 further includes a connecting surface 112 facing the support body 300, the connecting surface 112 is connected with the first abutting region 111a of the first surface 111, the support body 300 includes a first supporting surface 310 connected with the second mounting region 231b, a second supporting surface 320 connected with the first supporting surface 310, and the second supporting surface 320 is connected with the connecting surface 112 of the cover 110. As shown in fig. 5, the connection surface 112 of the cover 110 may include a planar portion 112a and a recessed portion 112b connected to the planar portion 112a, the recessed portion 112b is used to form a recess corresponding to the second core 122, and after the planar portion 112a of the connection surface 112 is connected to the second supporting surface 320 of the support 300, the second supporting surface 320 and the recessed portion 112b together define a transmission channel for installing the second core 122, which is configured such that the planar portion 112a is connected to the second supporting surface 320 after the second core 122 is placed in the recess, thereby facilitating the installation of the optical fiber.
The supporting body 300 further includes a third supporting surface 330 connected to the first supporting surface 310 and opposite to the second supporting surface 320, the base 230 further includes a mounting surface 213a connected to the second mounting region 231b of the second surface 231, the mounting surface 213a and the third supporting surface 330 are disposed on the same side of the second fiber core 122, the mounting surface 213a and the third supporting surface 330 are both planes parallel to the length direction of the second fiber core 122, and the mounting surface 213a is flush with the third supporting surface 330, so as to improve the placement stability of the entire package structure on other mounting structures.
As shown in fig. 6, in some other embodiments, the second mounting region 231b corresponds to and is connected to the first mounting region 111b, and when the number of the second cores 122 is multiple, the second mounting region 231b and the first mounting region 111b are disposed on the same side of the plane where the length direction of the multiple second cores 122 is located. Similarly, the first adhesive layer 101 needs to be controlled in the second mounting region 231b and the first mounting region 111b, so as to avoid that the liquid colloid is too much and the butt joint stability of the low refractive index waveguide 220 and the second optical fiber is affected due to too large deformation stress in the process of forming the first adhesive layer 101 by curing. After the liquid glue is cured to form the first adhesive layer 101, the glue is filled between the second mounting region 231b and the first mounting region 111b and cured to form the second adhesive layer 102, so as to connect and fix the first mounting region 111b and the second mounting region 231b, and sufficiently fix the cover 110 and the base 230.
As shown in fig. 2 and 4, the substrate 230 includes a substrate layer 213, a silica intermediate layer 223, and a silica cover plate layer 233, the silica intermediate layer 223 is disposed on the substrate layer 213, a side of the silica intermediate layer 223 facing away from the substrate layer 213 has a transition surface 223a, the wedge waveguide 210 is disposed on the transition surface 223a, the wedge waveguide 210 has a wedge end 211, the low-refractive-index waveguide 220 is disposed on the transition surface 223a and covers the wedge end 211, and the silica cover plate layer 233 is disposed on the transition surface 223a and covers the wedge waveguide 210 and the low-refractive-index waveguide 220. One part of the second butt-joint region 231a is located on the surface of the silicon dioxide cover plate layer 233, the other part of the second butt-joint region is located on the surface of the silicon dioxide intermediate layer 223, the second installation region 231b is located on the surface of the substrate layer 213, the installation surface 213a is located on the surface of the substrate layer 213, which is far away from the silicon dioxide intermediate layer 223, and the thickness of the substrate layer 213 in the stacking direction of the substrate layer 213 and the silicon dioxide intermediate layer 223 can be adjusted to enable the installation surface 213a to be flush with the third support surface 330.
The embodiment of the present application further provides a chip, which may be an FMCW (Frequency Modulated Continuous Wave) chip. Specifically, the chip includes the package and the coupler and fiber array package structure 10 as described above, the package wraps the periphery of the coupler 200 and the fiber array 100, the chip further includes a first transmission terminal disposed on the package and connected to the wedge waveguide 210 of the coupler 200, and a second transmission terminal connected to the first fiber core 121 of the fiber array 100, and the wedge waveguide 210 performs signal transmission with other structures through the first transmission terminal and the first fiber core 121 respectively through the second transmission terminal.
As shown in fig. 7, an embodiment of the present invention further provides a method for packaging a coupler and an optical fiber array, which is used to prepare the above-mentioned coupler and optical fiber array packaging structure 10, and the method for packaging a coupler and an optical fiber array specifically includes the following steps:
step S101, providing an optical fiber array 100, where the optical fiber array 100 includes a cover 110, a first fiber core 121, and a second fiber core 122 connected to the first fiber core 121, the second fiber core 122 is disposed through the cover 110, the second fiber core 122 has a fiber end surface 122a, and a portion of the surface of the cover 110 adjacent to the fiber end surface 122a has a first butt-joint region 111 a.
Specifically, the first fiber core 121 may be fused to the end of the second fiber core 122, the first cladding 123 may be coated on the periphery of the first fiber core 121 to form a first optical fiber, the second cladding 124 may be coated on the periphery of the second fiber core 122 to form a second optical fiber, and the first optical fiber may be inserted into the transmission channel in the cover 110, where the first cladding 123 and the second cladding 124 may be integrally formed to improve the connection stability between the first fiber core 121 and the second fiber core 122.
Step S102, providing a coupler 200, wherein the coupler 200 comprises a low-refractive-index waveguide 220, a wedge-shaped waveguide 210 and a substrate 230, the low-refractive-index waveguide 220 partially covers the wedge-shaped waveguide 210 and covers the substrate 230 on the refractive-index waveguide 220 and the wedge-shaped waveguide 210, the low-refractive-index waveguide 220 comprises a coupling end face 220a, and the substrate 230 is provided with a second butt-joint area 231a adjacent to the coupling end face 220 a. The low-refractive-index waveguide 220 may extend to the second butt-joint region 231a of the substrate 230 in a direction away from the wedge-shaped waveguide 210, and the coupling end surface 220a of the low-refractive-index waveguide 220 and the second butt-joint region 231a of the second surface 231 are in smooth transition, so as to avoid the low-refractive-index waveguide 220 from being too convex.
Step S101 of preparing the optical fiber array 100 may be performed after step S102 of preparing the coupler 200, or step S101 and step S102 may be performed simultaneously.
Step S103, moving at least one of the optical fiber array 100 and the coupler 200 to make the optical fiber array 100 and the coupler 200 approach each other, so that the first butt-joint region 111a is connected with the second butt-joint region 231a, and the end surface of the second fiber core 122 is butted with the coupling end surface 220a of the low-refractive-index waveguide 220, wherein, along the length direction of the second fiber core 122, the orthographic projection of the coupling end surface 220a completely covers the orthographic projection of the optical fiber end surface 122a, and after the alignment between the optical fiber end surface 122a and the coupling end surface 220a is completed, the cover 110 is fixedly connected with the base 230.
Specifically, the base 230 of the coupler 200 may be fixed to the mounting structure, the cover 110 of the optical fiber array 100 may be mounted on the fixture, the optical fiber array 100 may be moved toward the coupler 200 to bring the first butt-joint region 111a and the second butt-joint region 231a close to each other, and then the position of the optical fiber array 100 may be preliminarily adjusted under a microscope to make the optical fiber end surface 122a of the second fiber core 122 correspond to the coupling end surface 220a of the low refractive index waveguide 220.
When the number of the low-refractive-index waveguides 220, the wedge waveguides 210, the first fiber cores 121 and the second fiber cores 122 is multiple, two wedge waveguides 210 at two ends are selected to be conducted through a loopback waveguide (not shown in the figure), one first fiber core 121 at two ends is selected to be connected to a detection light source capable of emitting light, the other first fiber core 121 is selected to be connected to a light power meter, two first fiber cores 121 in the multiple first fiber cores 121 in the middle are selected to be connected to a red light pen, the two red light pens are opened to introduce red light into the corresponding first fiber cores 121, the position of the optical fiber array 100 is moved, and after the observed light sequentially passes through the first fiber cores 121, the second fiber cores 122 and the refractive-index waveguides and enters the wedge waveguides 210, coarse coupling alignment is completed. And (3) turning on a detection light source, introducing detection light into the corresponding first fiber core 121, finely adjusting the position of the optical fiber array 100, reading the degree of the optical power meter in real time, and finishing coupling fine alignment after the data displayed by the optical power meter is maximum, wherein at this time, the cover body 110 can be fixedly connected to the base body 230 so as to fix the relative position between the optical fiber end surface 122a and the coupling end surface 220a unchanged.
The packaging method may further include disposing a liquid adhesive between the first and second docking areas 111a and 231a, and curing the liquid adhesive to form the first adhesive layer 101 connected between the first and second docking areas 111a and 231 a. Specifically, a liquid colloid through which light can pass may be filled between the first docking area 111a and the second docking area 231a, and after the reading of the optical power meter is further increased, the position of the optical fiber array 100 is further adjusted until the reading of the optical power meter reaches the maximum, and the position of the corresponding optical fiber array 100 is determined to be the optimal packaging position. Then, a stepped curing mode is adopted, for example, when the ultraviolet lamp is adopted for irradiation and curing to form the first bonding layer 101, the curing power is set from small to large, and the curing time is set from short to long, so that the stress caused by thermal expansion can be released in time, the optical fiber array 100 is prevented from deviating from the optimal position, the specific curing time and power are adjusted according to the filling amount of the liquid colloid, the displayed numerical value of the optical power meter is monitored constantly in the curing process, and if the numerical value displayed by the optical power meter is sharply reduced, the power of the ultraviolet lamp is adjusted and controlled in time to release the stress in the curing process, so that the optical fiber array 100 is always kept at the optimal position until the indication of the optical power meter is not changed any more.
When the surfaces of the cap 110 and the base 230 facing each other only partially overlap in the length direction of the second core 122, that is, the second mounting region 231b of the base 230 and the first mounting region 111b of the cap 110 are respectively disposed on two opposite sides of the second core 122, the encapsulation method further includes the following steps after the liquid glue is cured to form the first adhesive layer 101: providing a support 300, connecting the support 300 to the base 230 and the cover 110, and disposing the support 300 and the cover 110 on the same side of the base 230, then filling an adhesive between the second mounting region 231b of the base 230 and the surface of the support 300 facing the base 230, and curing the adhesive to form the second adhesive layer 102 by using a method of changing the curing conditions in a stepwise manner, so as to avoid that the deformation stress of the adhesive pulls the cover 110 or the base 230 when the second adhesive layer 102 is formed, which may affect the alignment stability of the optical fiber end face 122a and the coupling end face 220 a.
The supporting body 300 comprises a first supporting surface 310, a second supporting surface 320 connected to one side of the first supporting surface 310, and a third supporting surface 330 connected to the other side of the first supporting surface 310, wherein the second supporting surface 320 is opposite to the third supporting surface 330; the movable support 300 approaches the optical fiber array 100 and the coupler 200, the first support surface 310 is connected to the base 230 of the coupler 200, the second support surface 320 is connected to the cover 110 of the optical fiber array 100, the third support surface 330 is a plane parallel to the length direction of the second fiber core 122, and the base 230 includes a mounting surface 232 abutting and flush with the third support surface 330. For example, when the mounting structure is a flat mounting plate, the mounting surface 213a of the substrate 230 is flush with the surface of the support 300 away from the fiber array 100, so that the mounting stability of the coupler 200, the fiber array 100 and the support 300 can be improved, the overall structure of the manufactured coupler and the fiber array package structure 10 is compact, and the stability of mounting the coupler and the fiber array package structure 10 on other structures in the transportation process is ensured.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (13)
1. A method for packaging a coupler and an optical fiber array, comprising:
providing an optical fiber array, wherein the optical fiber array comprises a cover body, a first fiber core and a second fiber core connected with the first fiber core, the second fiber core is arranged in the cover body in a penetrating mode, the second fiber core is provided with an optical fiber end face, and a first butt joint area is arranged on the part, adjacent to the optical fiber end face, of the surface of the cover body;
providing a coupler comprising a low index waveguide, a wedge waveguide, and a substrate, the low index waveguide partially covering the wedge waveguide and covering the substrate over the index waveguide and the wedge waveguide, the low index waveguide comprising a coupling end face, the substrate having a second butt-joint region adjacent the coupling end face;
and moving at least one of the optical fiber array and the coupler to enable the optical fiber array and the coupler to be close to each other, enabling the first butt joint area to be connected with the second butt joint area, and enabling the optical fiber end face of the second fiber core to be in butt joint with the coupling end face of the low-refractive-index waveguide, wherein the orthographic projection of the coupling end face completely covers the orthographic projection of the optical fiber end face along the length direction of the second fiber core.
2. The method of claim 1, further comprising the steps of: and arranging a first bonding layer between the first butt joint area and the second butt joint area, and connecting the first butt joint area and the second butt joint area through the first bonding layer.
3. The method of claim 2, wherein the optical fiber array is packaged in a package,
the packaging method further comprises the following steps after the first adhesive layer is arranged between the first butt joint area and the second butt joint area: and providing a support body, connecting the support body to the base body and the cover body, and arranging the support body and the cover body on the same side of the base body.
4. The method of claim 3, wherein the supporting body comprises a first supporting surface, a second supporting surface connected to one side of the first supporting surface, and a third supporting surface connected to the other side of the first supporting surface, the second supporting surface being opposite to the third supporting surface;
and moving the support body to approach the optical fiber array and the coupler, connecting the first support surface to the base body of the coupler, connecting the second support surface to the cover body of the optical fiber array, wherein the third support surface is a plane parallel to the length direction of the second fiber core, and the base body comprises a mounting surface which is butted and leveled with the third support surface.
5. A coupler and fiber array package, comprising:
the optical fiber array comprises a cover body, a first fiber core penetrating through the cover body and a second fiber core connected with the first fiber core, wherein the second fiber core is provided with a fiber end face, and a part of the surface of the cover body, which is adjacent to the fiber end face, is provided with a first butt joint area; and
the coupler is arranged corresponding to the optical fiber array and comprises a wedge-shaped waveguide, a low-refractive-index waveguide partially covering the wedge-shaped waveguide and a substrate covering the wedge-shaped waveguide and the low-refractive-index waveguide, and the low-refractive-index waveguide is provided with a coupling end face;
the orthographic projection of the coupling end face completely covers the orthographic projection of the optical fiber end face along the length direction of the second fiber core, the part of the surface of the base body, which is adjacent to the coupling end face, comprises a second butt joint area, the second butt joint area is butted with the first butt joint area, and the coupling end face is in coupling butt joint with the optical fiber end face, so that light can be transmitted between the low-refractive-index waveguide and the second fiber core.
6. The coupler and fiber array package of claim 5, further comprising a first adhesive layer disposed between the first and second mating regions, the second mating region being connected to the first mating region by the first adhesive layer, the low index waveguide being connected to the second core by the first adhesive layer.
7. The coupler and fiber array package structure of claim 5, wherein the cover includes a first surface facing the base, the first mating region being at the first surface, the first surface including a first mounting region connected to the first mating region; the base body comprises a second surface facing the cover body, the second docking area is located on the second surface, and the second surface comprises a second mounting area connected with the second docking area;
the second mounting regions and the first mounting regions are arranged in a staggered mode along the direction perpendicular to the length direction of the second fiber core;
or the second mounting region corresponds to and is connected with the first mounting region.
8. The package of claim 7, wherein the second mounting region and the first mounting region are staggered along a direction perpendicular to a length direction of the second core, and the package further comprises a support body, the support body comprises a first supporting surface connected to the second mounting region, a second supporting surface connected to the first supporting surface, and the second supporting surface is connected to the cover.
9. The structure of claim 8, wherein the support body further comprises a third support surface connected to the first support surface and opposite to the second support surface, the base body further comprises a mounting surface connected to the second mounting region, the mounting surface and the third support surface are both parallel to the second core length direction, and the mounting surface is flush with the third support surface.
10. The structure of claim 5, wherein the substrate comprises a substrate layer, a silica intermediate layer, and a silica cover plate layer, the silica intermediate layer is disposed on the substrate layer, a transition surface is disposed on a side of the silica intermediate layer facing away from the substrate layer, the wedge waveguide is disposed on the transition surface, the wedge waveguide has a wedge end, the low refractive index waveguide is disposed on the transition surface and covers the wedge end, and the silica cover plate layer is disposed on the transition surface and covers the wedge waveguide and the low refractive index waveguide.
11. The package structure of claim 5, wherein the optical fiber array further comprises a first cladding layer covering the outer layer of the first fiber core, and a second cladding layer covering the outer layer of the second fiber core, wherein the first fiber core and the first cladding layer form a first optical fiber, the first optical fiber is a single-mode fiber or a polarization-maintaining optical fiber, the second fiber core and the second cladding layer form a second optical fiber, and the second optical fiber is a high-numerical-aperture optical fiber.
12. The package structure of claim 5, wherein the optical fiber array comprises a plurality of first cores and a plurality of second cores, the first cores and the second cores are connected in an equal number and in a one-to-one correspondence, the coupler comprises a plurality of wedge waveguides and a plurality of low refractive index waveguides, the second cores and the low refractive index waveguides are connected in an equal number and in a one-to-one correspondence, and coupling end surfaces of the low refractive index waveguides and end surfaces of the optical fibers of the second cores are in a one-to-one correspondence coupling butt joint.
13. A chip, comprising:
a packaging layer; and
the coupler and fiber array package of any of claims 5-12.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114967004A (en) * | 2022-05-27 | 2022-08-30 | 武汉华工正源光子技术有限公司 | Coupling method of optical fiber array and silicon optical chip and optical module |
| CN115185040A (en) * | 2022-09-09 | 2022-10-14 | 之江实验室 | Passive alignment optical packaging structure of silicon photonic chip and optical switch equipment |
| CN115656975A (en) * | 2022-12-14 | 2023-01-31 | 深圳市速腾聚创科技有限公司 | Waveguide conversion chip, frequency modulation continuous wave laser radar and automatic driving equipment |
| WO2023155638A1 (en) * | 2022-02-18 | 2023-08-24 | 华为技术有限公司 | Optical device, optical module, and communication device |
| WO2024045805A1 (en) * | 2022-09-01 | 2024-03-07 | 华为技术有限公司 | Optical assembly, optical chip, electronic device, and optical communication system |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203133318U (en) * | 2012-11-27 | 2013-08-14 | 孙麦可 | Planar optical waveguide and optical fiber coupling structure |
| JP2014048628A (en) * | 2012-09-04 | 2014-03-17 | Nippon Telegr & Teleph Corp <Ntt> | Optical connection component |
| CN109613665A (en) * | 2018-12-29 | 2019-04-12 | 联合微电子中心有限责任公司 | The coupling packaging structure and method of single mode optical fiber and the sub- chip end face of silicon based opto-electronics |
| CN110542949A (en) * | 2019-09-20 | 2019-12-06 | 光越科技(深圳)有限公司 | optical fiber manufacturing method and heating device for silicon optical waveguide connection and coupling |
| CN110632702A (en) * | 2019-10-23 | 2019-12-31 | 北京工业大学 | LNOI-based optical waveguide reverse wedge-shaped spot coupler and preparation method thereof |
| CN112394446A (en) * | 2019-08-13 | 2021-02-23 | 中国科学院苏州纳米技术与纳米仿生研究所 | End face coupler, manufacturing method thereof and end face coupling method |
| CN112433303A (en) * | 2019-08-26 | 2021-03-02 | 阿里巴巴集团控股有限公司 | Silicon optical module and optical transmission device |
| CN213934284U (en) * | 2021-01-12 | 2021-08-10 | 深圳市砺芯科技有限公司 | Optical waveguide mode spot converter |
-
2021
- 2021-08-17 CN CN202110945656.0A patent/CN113791474B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014048628A (en) * | 2012-09-04 | 2014-03-17 | Nippon Telegr & Teleph Corp <Ntt> | Optical connection component |
| CN203133318U (en) * | 2012-11-27 | 2013-08-14 | 孙麦可 | Planar optical waveguide and optical fiber coupling structure |
| CN109613665A (en) * | 2018-12-29 | 2019-04-12 | 联合微电子中心有限责任公司 | The coupling packaging structure and method of single mode optical fiber and the sub- chip end face of silicon based opto-electronics |
| CN112394446A (en) * | 2019-08-13 | 2021-02-23 | 中国科学院苏州纳米技术与纳米仿生研究所 | End face coupler, manufacturing method thereof and end face coupling method |
| CN112433303A (en) * | 2019-08-26 | 2021-03-02 | 阿里巴巴集团控股有限公司 | Silicon optical module and optical transmission device |
| CN110542949A (en) * | 2019-09-20 | 2019-12-06 | 光越科技(深圳)有限公司 | optical fiber manufacturing method and heating device for silicon optical waveguide connection and coupling |
| CN110632702A (en) * | 2019-10-23 | 2019-12-31 | 北京工业大学 | LNOI-based optical waveguide reverse wedge-shaped spot coupler and preparation method thereof |
| CN213934284U (en) * | 2021-01-12 | 2021-08-10 | 深圳市砺芯科技有限公司 | Optical waveguide mode spot converter |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023155638A1 (en) * | 2022-02-18 | 2023-08-24 | 华为技术有限公司 | Optical device, optical module, and communication device |
| CN114967004A (en) * | 2022-05-27 | 2022-08-30 | 武汉华工正源光子技术有限公司 | Coupling method of optical fiber array and silicon optical chip and optical module |
| WO2024045805A1 (en) * | 2022-09-01 | 2024-03-07 | 华为技术有限公司 | Optical assembly, optical chip, electronic device, and optical communication system |
| CN115185040A (en) * | 2022-09-09 | 2022-10-14 | 之江实验室 | Passive alignment optical packaging structure of silicon photonic chip and optical switch equipment |
| CN115656975A (en) * | 2022-12-14 | 2023-01-31 | 深圳市速腾聚创科技有限公司 | Waveguide conversion chip, frequency modulation continuous wave laser radar and automatic driving equipment |
| CN115656975B (en) * | 2022-12-14 | 2023-05-23 | 深圳市速腾聚创科技有限公司 | Waveguide conversion chip, frequency modulation continuous wave laser radar and automatic driving equipment |
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|---|---|
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