CN113267847A - Optical coupling device for coupling multi-core optical fiber and integrated optical chip and preparation method thereof - Google Patents
Optical coupling device for coupling multi-core optical fiber and integrated optical chip and preparation method thereof Download PDFInfo
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- CN113267847A CN113267847A CN202110622389.3A CN202110622389A CN113267847A CN 113267847 A CN113267847 A CN 113267847A CN 202110622389 A CN202110622389 A CN 202110622389A CN 113267847 A CN113267847 A CN 113267847A
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- 238000002360 preparation method Methods 0.000 title abstract description 7
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- 238000005516 engineering process Methods 0.000 claims abstract description 15
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- 230000001747 exhibiting effect Effects 0.000 claims 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/262—Optical details of coupling light into, or out of, or between fibre ends, e.g. special fibre end shapes or associated optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12035—Materials
- G02B2006/1204—Lithium niobate (LiNbO3)
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12035—Materials
- G02B2006/12061—Silicon
Abstract
The invention provides an optical coupling device for coupling a multi-core optical fiber and an integrated optical chip and a preparation method thereof, aiming at overcoming the defects that the transmission capacity of each channel of the multi-core optical fiber is low and the requirement of upper integration cannot be met, wherein the optical coupling device comprises an optical coupler array formed by staggered arrangement of a plurality of vertical optical couplers, each vertical optical coupler comprises an epitaxial coupling waveguide structure, a three-dimensional waveguide structure and a reflector, wherein one end of each three-dimensional waveguide structure is coupled and connected with the waveguide structure of the integrated optical chip through the epitaxial coupling waveguide structure, and the other end of each three-dimensional waveguide structure is connected with the reflector; the light mode field emergent surface of the reflector and the fiber core of the multi-core fiber are on the same vertical plane. The optical coupler array is manufactured on the integrated optical chip by utilizing the three-dimensional laser direct writing technology, so that the optical mode in the integrated optical chip and the plurality of fiber cores in the multi-core optical fiber are mutually independent and coupled with low loss, and the on-chip integration is met.
Description
Technical Field
The invention relates to the technical field of optical coupling devices, in particular to an optical coupling device for coupling a multi-core optical fiber and an integrated optical chip and a preparation method thereof.
Background
With the limit that the transmission capacity of single-mode optical fibers approaches to the nonlinear shannon limit, the space division multiplexing technology is an important method for improving the transmission capacity in an optical fiber communication network system, wherein a space division multiplexing system based on multi-core optical fibers realizes space division multiplexing by means of a plurality of parallel channels provided by the multi-core optical fibers, and the communication transmission capacity can be greatly improved.
Because the multicore fiber generally adopts a hexagonal fiber core arrangement structure to ensure the stability of the preparation process, the coupling mode of the multicore fiber and the integrated optical chip is limited in the grating coupler array coupling and free space coupling modes at present. Although the existing grating coupler array coupling scheme shows the advantages of relatively low coupling loss and high integration level, the application of wavelength division multiplexing technology and deflection multiplexing technology in an optical fiber communication network system is restricted along with strong wavelength and polarization correlation, and the transmission capacity of each channel of a multi-core optical fiber is inevitably reduced; while free space coupling has a high degree of compatibility with wavelength division multiplexing and polarization multiplexing technologies, the free space coupling scheme is not satisfactory for on-chip integration.
Disclosure of Invention
The invention provides an optical coupling device for coupling a multi-core optical fiber and an integrated optical chip and a preparation method of the optical coupling device, aiming at overcoming the defects that the transmission capacity of each channel of the multi-core optical fiber is low and the upper integration cannot be met in the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows:
an optical coupling device for coupling a multi-core optical fiber and an integrated optical chip comprises an optical coupler array consisting of a plurality of vertical optical couplers, wherein each vertical optical coupler comprises an epitaxial coupling waveguide structure, a three-dimensional waveguide structure and a reflecting mirror, one end of each three-dimensional waveguide structure is coupled and connected with the waveguide structure of the integrated optical chip through the epitaxial coupling waveguide structure, and the other end of each three-dimensional waveguide structure is connected with the reflecting mirror; the light mode field emergent surface of the reflector and the fiber core of the multi-core fiber are on the same vertical plane.
In the technical scheme, the epitaxial coupling waveguide structure is used for carrying out butt-joint epitaxy with the existing waveguide on the integrated optical chip, so that an optical mode in the waveguide of the integrated optical chip is transmitted into the coupler; the three-dimensional waveguide structure is used for simultaneously widening the input optical mode in the horizontal and vertical directions, so that the mode field diameter of the optical mode is matched with the fiber core of the multi-core optical fiber; the reflector is used for changing the transmission direction of the optical mode, the optical mode transmitted along the horizontal direction is converted into the optical mode transmitted along the vertical direction after being reflected by 90 degrees, the light mode field emergent surface of the reflector and the fiber core of the multi-core fiber are on the same vertical plane, the optical mode is transmitted into the fiber core of the multi-core fiber after being reflected by the reflector, and the coupling of the multi-core fiber and the integrated optical chip is completed.
Preferably, the materials of the epitaxial coupling waveguide structure, the three-dimensional waveguide structure and the reflector respectively comprise one or more of SU8 photoresist, IP-L photoresist, IP-D photoresist, IP-S photoresist and AZ photoresist.
Preferably, the epitaxial coupling waveguide structure, the three-dimensional waveguide structure and the reflector are made of polymer materials, and the polymer materials comprise photoresist which shows that the light absorption rate is lower than 1% and the wavelength and polarization correlation is weak in a communication waveband.
Preferably, the three-dimensional waveguide structure is a width and height graded waveguide, the graded width is 3.5-14.5 micrometers, the graded height is 3.5-14.5 micrometers, and the graded length is 200-400 micrometers.
Preferably, the reflector is a total reflection mirror surface with an inclination angle of 45 degrees.
Preferably, the relative positions of the light mode field exit surfaces of the mirrors in the plurality of vertical optical couplers correspond to the position arrangement of each fiber core in the multi-core fiber, and the transverse spacing and the longitudinal spacing between the adjacent vertical optical couplers are equal.
Preferably, the waveguide structure of the integrated chip comprises one of a silicon-on-insulator waveguide, a lithium niobate-on-insulator waveguide and an SU8 waveguide.
Preferably, the waveguide structure of the integrated chip is a width-graded waveguide, the width is 80-500 nm, the thickness is less than 220 nm, and the length is less than 300 microns.
Preferably, the waveguide structure of the integrated chip is a double-layer width graded waveguide, the width of the upper layer is 150-1000 nm, the thickness is less than 250 nm, and the length is less than 150 microns; the width of the lower layer is 120-15000 nm, the thickness is less than 250 nm, and the length is less than 200 microns.
The invention also provides a preparation method of the optical coupling device for coupling the multi-core optical fiber and the integrated optical chip, which is used for preparing the optical coupling device provided by any technical scheme. Which comprises the following steps:
s1: preparing an optical structure on a substrate by utilizing photoetching and material etching technologies;
s2: dropping a photoresist on the optical structure sample obtained in the step S1;
s3: placing the sample obtained in the step S2 into a three-dimensional laser direct writing machine, and positioning a waveguide structure on an integrated optical chip to be butted by using an optical imaging system;
s4: based on the positioning result of the step S3, the sample obtained in the step S2 is directly written with three-dimensional laser to form an optical coupler array with three-dimensional topography as proposed in any of the above technical solutions;
s5: and (4) putting the optical coupler obtained in the step (S4) into a developing solution for developing and removing the redundant photoresist to obtain an optical coupler.
Compared with the prior art, the technical scheme of the invention has the beneficial effects that: in the invention, an optical coupler array is manufactured on an integrated optical chip by utilizing a three-dimensional laser direct writing technology, so that an optical mode in the integrated optical chip is mutually independent and coupled with a plurality of fiber cores in a multi-core optical fiber in a low-loss manner; the on-chip integration, the compatibility of the wavelength division multiplexing technology and the polarization multiplexing technology and the compatibility of the CMOS process are met.
Drawings
Fig. 1 is a schematic structural diagram of an optical coupling device for coupling a multi-core optical fiber and an integrated optical chip in embodiment 1.
Fig. 2 is a schematic structural view of a vertical optical coupler according to embodiment 1.
Fig. 3 is a schematic structural diagram of a vertical optical coupler array according to embodiment 1.
FIG. 4 is a flowchart of a method of making an optocoupler device of embodiment 2.
Detailed Description
The drawings are for illustrative purposes only and are not to be construed as limiting the patent;
for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product;
it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
The technical solution of the present invention is further described below with reference to the accompanying drawings and examples.
Example 1
The present embodiment provides an optical coupling device for coupling a multi-core fiber and an integrated optical chip, which is a schematic structural diagram of the optical coupling device for coupling the multi-core fiber and the integrated optical chip in this embodiment, as shown in fig. 1.
The optical coupling device for coupling a multi-core fiber and an integrated optical chip according to this embodiment includes an optical coupler array formed by staggering 5 vertical optical couplers, where the vertical optical coupler includes an epitaxial coupling waveguide structure 1, a three-dimensional waveguide structure 2, and a mirror 3, where:
one end of the three-dimensional waveguide structure 2 is coupled and connected with a waveguide structure 4 of an integrated optical chip through the epitaxial coupling waveguide structure 1, and the other end of the three-dimensional waveguide structure 2 is connected with the reflector 3;
the light mode field exit surface of the reflector 3 and the fiber core 5 of the multi-core fiber are on the same vertical plane.
The epitaxial coupling waveguide structure 1 is used for carrying out butt-joint epitaxy with the existing waveguide on the integrated optical chip, so that an optical mode in the waveguide of the integrated optical chip is transmitted into the coupler; the three-dimensional waveguide structure 2 is used for simultaneously widening an input optical mode in the horizontal and vertical directions, so that the mode field diameter of the optical mode is matched with the fiber core 5 of the multi-core optical fiber; the reflector 3 is used for changing the transmission direction of the optical mode, the optical mode transmitted along the horizontal direction is converted into the optical mode transmitted along the vertical direction after being reflected by 90 degrees, the light mode field exit surface of the reflector 3 and the fiber core 5 of the multi-core fiber are on the same vertical plane, the optical mode is transmitted into the fiber core 5 of the multi-core fiber after being reflected by the reflector 3, and the coupling of the multi-core fiber and the integrated optical chip is completed. Fig. 2 is a schematic structural diagram of the vertical optical coupler of this embodiment.
In this embodiment, the materials of the epitaxial coupling waveguide structure 1, the three-dimensional waveguide structure 2, and the reflector 3 respectively include one or more of SU8 photoresist, IP-L photoresist, IP-D photoresist, IP-S photoresist, and AZ photoresist.
Further, the epitaxial coupling waveguide structure 1, the three-dimensional waveguide structure 2, and the reflecting mirror 3 in this embodiment are made of a polymer material, and the polymer material includes a photoresist which is transparent (i.e., has a light absorption rate of less than 1%) in a communication band (10000nm to 1700nm) and has weak wavelength and polarization dependence.
In this embodiment, the three-dimensional waveguide structure 2 is a waveguide with gradually changing width and height, the size of the cross section is 3.5 × 3.5 micrometers to 14.5 × 14.5 micrometers, and the gradually changing length is 200 micrometers to 400 micrometers.
In this embodiment, the reflector 3 is a total reflection mirror 3 surface with an inclination angle of 45 degrees, and the cross-sectional dimension of the reflected light exit surface is 14.5 × 14.5 μm.
In this embodiment, the relative positions of the light mode field exit surfaces of the mirrors 3 in the 5 vertical optical couplers respectively correspond to the position arrangement of the fiber cores 5 in the multi-core fiber, and the horizontal and vertical distances between the adjacent vertical optical couplers are equal. Fig. 3 is a schematic structural diagram of the vertical optical coupler array of the present embodiment, in which the lateral spacing between adjacent mirrors 3 is 32 microns, and the longitudinal spacing is 18.5 microns.
In this embodiment, the waveguide structure 4 of the integrated optical chip includes one of a silicon-on-insulator waveguide, a lithium niobate-on-insulator waveguide, and an SU8 waveguide. When the silicon-on-insulator waveguide is selected, the waveguide structure 4 of the integrated optical chip is a width-graded waveguide, the width is 80-500 nanometers, the thickness is less than 220 nanometers, and the length is less than 300 micrometers; when the lithium niobate waveguide on the insulator is selected, the waveguide structure 4 of the integrated optical chip is a double-layer width graded waveguide, the width of the upper layer is 150-1000 nm, the thickness is less than 250 nm, and the length is less than 150 microns; the width of the lower layer is 120-15000 nm, the thickness is less than 250 nm, and the length is less than 200 microns.
In a specific implementation process, the optical coupler array of the present embodiment is positioned on the waveguide structure 4 on the integrated optical chip by using a three-dimensional laser direct writing technology, and then the vertical optical coupler with a three-dimensional shape is etched by using three-dimensional laser direct writing. The three-dimensional waveguide structure 2 in the vertical optical coupler is connected with the waveguide structure 4 through the epitaxial coupling waveguide structure 1, and the reflecting mirror 3 is arranged at the other end of the three-dimensional waveguide structure 2 and is used for reflecting and transmitting the transmitted optical mode into the fiber core 5 of the multi-core optical fiber. The waveguide structure 4, the epitaxial coupling waveguide structure 1, the three-dimensional waveguide structure 2 and the reflector 3 of the integrated optical chip are arranged on the same horizontal plane.
Wherein the optical mode transmitted in the waveguide structure 4 of the integrated optical chip is gradually coupled and converted into the three-dimensional waveguide structure 2 through the epitaxial coupling waveguide structure 1. The width and height of the three-dimensional waveguide structure 2 gradually increase such that the mode field diameter of the optical mode increases and eventually matches the mode field diameter of the core 5 in the multi-core fiber.
In the optical coupler array of the embodiment, 5 identical three-dimensional micro-mirrors 3 are adopted, and the polymer vertical optical couplers are arranged in a staggered mode, wherein the relative positions of the mirrors 3 correspond to the position arrangement of the fiber cores 5 in the multi-core optical fiber. The mirror 3 provided at the widest end of the three-dimensional waveguide structure 2 efficiently reflects the optical mode in the horizontal direction by 90 degrees to the vertical direction, and realizes high-efficiency coupling with the core 5 of the multicore fiber.
Example 2
This embodiment proposes a method for manufacturing an optical coupling device for coupling a multi-core fiber and an integrated optical chip, which is used to manufacture the optical coupling device for coupling the multi-core fiber and the integrated optical chip proposed in embodiment 1. Fig. 4 is a flow chart of the manufacturing method of this example.
The method for manufacturing an optical coupling device for coupling a multi-core fiber and an integrated optical chip according to the present embodiment includes the following steps:
s1: preparing an optical structure on a substrate by utilizing photoetching and material etching technologies;
s2: dropping a photoresist on the optical structure sample obtained in the step S1;
s3: placing the sample obtained in the step S2 into a three-dimensional laser direct writing machine, and positioning a waveguide structure 4 on the integrated optical chip to be butted by using an optical imaging system;
s4: based on the positioning result of the step S3, the sample obtained in the step S2 is directly written with three-dimensional laser to form an optical coupler array with three-dimensional topography;
s5: and (4) putting the optical coupler obtained in the step (S4) into a developing solution for developing and removing the redundant photoresist to obtain an optical coupler.
Wherein, the substrate in the step S1 is a silicon-on-insulator film or a lithium niobate film, and the silicon/lithium niobate-based optical structure is obtained, which includes the SU8 waveguide structure.
Further, the photoresist dispensed in step S2 is an IP-D photoresist.
The optical coupling device prepared in the embodiment utilizes a three-dimensional laser direct writing technology to manufacture a three-dimensional micro-reflector 3-type polymer vertical optical coupler array on an integrated optical chip, so that the optical mode in the integrated optical chip and a plurality of fiber cores 5 in a multi-core optical fiber are mutually independent and coupled with low loss, the average coupling loss of each channel is less than 4dB, the working wavelength bandwidth is more than 100 nanometers, the characteristics of low polarization correlation are achieved, and meanwhile, the requirements of on-chip integration, compatibility of a wavelength division multiplexing technology and a polarization multiplexing technology and compatibility of a CMOS (complementary metal oxide semiconductor) process are met.
The same or similar reference numerals correspond to the same or similar parts;
the terms describing positional relationships in the drawings are for illustrative purposes only and are not to be construed as limiting the patent;
it should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. An optical coupling device for coupling a multi-core optical fiber and an integrated optical chip is characterized by comprising an optical coupler array consisting of a plurality of vertical optical couplers, wherein each vertical optical coupler comprises an epitaxial coupling waveguide structure, a three-dimensional waveguide structure and a reflecting mirror, one end of each three-dimensional waveguide structure is coupled and connected with the waveguide structure of the integrated optical chip through the epitaxial coupling waveguide structure, and the other end of each three-dimensional waveguide structure is connected with the reflecting mirror; the light mode field emergent surface of the reflector and the fiber core of the multi-core fiber are on the same vertical plane.
2. The light coupling device of claim 1, wherein the materials of the epitaxially coupled waveguide structure, the three-dimensional waveguide structure, and the mirror each comprise one or more of SU8 photoresist, IP-L photoresist, IP-D photoresist, IP-S photoresist, and AZ photoresist.
3. The optical coupling device of claim 2, wherein the epitaxially coupled waveguide structure, the three-dimensional waveguide structure, and the mirror are made of a polymer material, and the polymer material comprises a photoresist exhibiting a light absorption of less than 1% and a weak wavelength-polarization dependence in the communication band.
4. The light coupling device of claim 1, wherein the three-dimensional waveguide structure is a width and height graded waveguide having a graded width of 3.5 microns to 14.5 microns, a graded height of 3.5 microns to 14.5 microns, and a graded length of 200 microns to 400 microns.
5. The light coupling device of claim 1, wherein the mirror is a 45 degree angled total reflection mirror.
6. The optical coupling device according to claim 5, wherein the optical mode field exit surfaces of the mirrors of the plurality of vertical optical couplers are arranged at positions corresponding to the position of each core of the multi-core fiber, and the mirrors of the adjacent vertical optical couplers are arranged at equal lateral and longitudinal distances.
7. The optical coupling device of claim 1, wherein the waveguide structure of the integrated optical chip comprises one of a silicon-on-insulator waveguide, a lithium niobate-on-insulator waveguide, and a SU8 waveguide.
8. The optical coupling device according to claim 7, wherein the waveguide structure of the integrated optical chip is a graded-width waveguide having a width of 80 nm to 500 nm, a thickness of less than 220 nm, and a length of less than 300 μm.
9. The optical coupling device according to claim 7, wherein the waveguide structure of the integrated optical chip is a double-layer graded waveguide, the width of the upper layer is 150 nm to 1000 nm, the thickness is less than 250 nm, and the length is less than 150 μm; the width of the lower layer is 120-15000 nm, the thickness is less than 250 nm, and the length is less than 200 microns.
10. A method for preparing an optical coupling device for coupling a multi-core optical fiber and an integrated optical chip is characterized by comprising the following steps:
s1: preparing an optical structure sample on a substrate by utilizing photoetching and material etching technologies;
s2: dropping a photoresist on the optical structure sample obtained in the step S1;
s3: placing the sample obtained in the step S2 into a three-dimensional laser direct writing machine, and positioning a waveguide structure on an integrated optical chip to be butted by using an optical imaging system;
s4: based on the positioning result of the step S3, using three-dimensional laser direct writing light to engrave the sample obtained in the step S2 with the optical coupler array having three-dimensional topography as claimed in any one of claims 1 to 9;
s5: and (4) putting the optical coupler obtained in the step (S4) into a developing solution for developing and removing the redundant photoresist to obtain an optical coupler.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114089473A (en) * | 2021-11-24 | 2022-02-25 | 深圳技术大学 | On-chip microcavity photonic integrated chip structure and preparation method thereof |
| CN114460683A (en) * | 2020-11-10 | 2022-05-10 | 中国科学院半导体研究所 | Microwave photon on-chip system based on optical core particles |
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| CN106371170A (en) * | 2016-10-26 | 2017-02-01 | 中国科学院半导体研究所 | Array waveguide type light path conversion interconnection chip |
| US20180231732A1 (en) * | 2017-02-14 | 2018-08-16 | Institut National D'optique | Photonic chip having a monolithically integrated reflector unit and method of manufacturing a reflector unit |
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