CN106371170A - Array waveguide type light path conversion interconnection chip - Google Patents
Array waveguide type light path conversion interconnection chip Download PDFInfo
- Publication number
- CN106371170A CN106371170A CN201610942347.7A CN201610942347A CN106371170A CN 106371170 A CN106371170 A CN 106371170A CN 201610942347 A CN201610942347 A CN 201610942347A CN 106371170 A CN106371170 A CN 106371170A
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- CN
- China
- Prior art keywords
- chip
- light path
- type light
- waveguide array
- path converting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B2006/12133—Functions
- G02B2006/12147—Coupler
Abstract
The invention relates to an array waveguide type light path conversion interconnection chip comprising a substrate in a rectangular shape, an array waveguide chip region, and an upper cladding layer. The array waveguide chip region includes a plurality of waveguides; each waveguide is one having a bar shape with a taper unit; and the waveguides are arranged on the substrate in sequence. The upper cladding layer covers the upper surface of the substrate and coats the array waveguide chip region. Therefore, the array waveguide type light path conversion interconnection chip is formed. According to the invention, the process is simple; and the coupling and integrated manufacturing difficulty of a photon-mixing integrated device is reduced substantially.
Description
Technical field
The invention belongs to quasiconductor communication field, particularly a kind of Waveguide array type light path converting interconnection chip.
Background technology
With communication and the developing rapidly of information technology, people the integrated level of photonic device is proposed higher and higher will
Ask, and due to current monolithic integrated technology also exist active chip with passive chip cannot realize on same base material integrated with
And the difficulty that the vertical coupled difficulty between the photon chip of different structure, size is larger, hybrid integrated has become as current light
The main development direction of sub- device.
During photon hybrid integrated device designs and produces, how to realize vertical coupled between different photon chips
And the interconnection between Small Distance highly integrated chip and big spacing chip, separate chip and fiber array have become as therein
One of important research content.The Waveguide array meeting required for photon hybrid integrated device is therefore produced with simpler method
Type light path converting interconnects chip, the manufacture for photon hybrid integrated device and answer the vital meaning of apparatus.
Waveguide array type light path converting interconnection chip is that a kind of structure design, processing technology are simple, and is capable of difference
Light path between chip is vertical coupled and Small Distance highly integrated chip and big spacing chip, separate chip and fiber array it
Between interconnection chip.
Content of the invention
It is an object of the invention to provide a kind of Waveguide array type light path converting interconnects chip, to realize between different chips
Light path is vertical coupled and Small Distance highly integrated chip and big spacing chip, separate chip and fiber array between interconnect.
Present invention design, the multichannel waveguide type optical circuit conversion interconnection chip technology making are simple, and photon mixing collection can be greatly reduced
Become the coupling of device and integrated manufacture difficulty.
The present invention provides a kind of Waveguide array type light path converting to interconnect chip, comprising:
One substrate, is rectangle；
An array waveguide core region, this Waveguide array core area includes multiple waveguides, and each waveguide is the bar shaped with taper, its
Sequential is above substrate；
One top covering, it covers the upper surface of substrate, and coats Waveguide array core area, forms Waveguide array type light path converting
Interconnection chip.
The invention has the beneficial effects as follows, it is possible to achieve the light path between different chips is vertical coupled and Small Distance is highly integrated
Interconnect between degree chip and big spacing chip, separate chip and fiber array.The Waveguide array type light path converting that the present invention provides
Interconnection chip design and processing technology are simple, and the coupling of photon hybrid integrated device and integrated manufacture difficulty can be greatly reduced.
Brief description
For making the object, technical solutions and advantages of the present invention become more apparent, below in conjunction with specific embodiment, and reference
Accompanying drawing, the present invention is described in more detail, wherein:
Fig. 1 is the structural representation that Waveguide array type light path converting interconnects chip；
Fig. 2 is the application schematic diagram that Waveguide array type light path converting interconnects chip；
Fig. 3 is the θ angle schematic diagram that Waveguide array type light path converting interconnects chip；
Wherein, reference:
1- has the photon chip that optical signal Vertical Launch receives characteristic
2- optical signal launch, reception window
3- Waveguide array type light path converting interconnects chip substrate
4- Waveguide array type light path converting interconnects chip rate core area
5- Waveguide array type light path converting interconnects chip top covering
6- big spacing chip, separate chip or fiber array
Specific embodiment
Refer to Fig. 1, it is the structural representation of the Waveguide array type light path converting interconnection chip of the present invention, comprising:
One substrate 3, is rectangle, and the material of described substrate 3 is native silicon dioxide, and thickness is 15-20 μm, and it is mainly used
In protection Waveguide array core area 4, simultaneously as photic zone, allow optical signal can enter into the complete of Waveguide array core area 4 through it
Reflection end face.
Waveguide array core area 4, this Waveguide array core area 4 includes multiple waveguides, and each waveguide is the bar shaped with taper, its
Above substrate 3, the size in the described section of Waveguide array core area 4 bigger diameter end is 6-8 × 8-11 μm to sequential, described
Waveguide array core area 4 material be doping silicon dioxide, thickness be 6-8 μm；It is mainly used in optical signal in Waveguide array type
Light path converting interconnects the optical path direction conversion in chip and transmits.
One top covering 5, it covers the upper surface of substrate 3, and coats Waveguide array core area 4, forms light path converting interconnection core
Piece, the material of described top covering 5 is native silicon dioxide, and the thickness of described top covering 5 is 500-1500 μm.
The end face side of wherein said Waveguide array core area 4 miner diameter end and substrate 3 and top covering 5 are a downward inclined-plane,
Form an angle theta, described angle theta is 35-45 degree.
Refer to Fig. 2, it is the application schematic diagram of the Waveguide array type light path converting interconnection chip of the present invention, in figure arrow
Represent the transmission direction of optical signal.Optical signal has, from lower end 1, the photon integrated chip coupling that optical signal Vertical Launch receives characteristic
Close and enter into by the 3/4/5 Waveguide array type light path converting interconnection chip collectively constituting, be then transferred to the big spacing of right-hand member 6 again
In chip, separate chip or fiber array；Or optical signal opposite direction is transmitted, and optical signal is from the big spacing chip of right-hand member 6, discrete core
Piece or fiber array are transferred in the 3/4/5 Waveguide array type light path converting interconnection chip collectively constituting, and then pass through left end again
Optic path direction conversion be coupled to lower end have optical signal Vertical Launch receive characteristic photon integrated chip 1 in, thus
Achieve optical signal in the photon integrated chip 1 with optical signal Vertical Launch reception characteristic and big spacing chip, separate chip
Or freely transmitting between fiber array 6.
If lower end is had optical signal Vertical Launch by us receives the photon integrated chip 1 of characteristic with right-hand member big spacing core
Piece, separate chip or fiber array 6 direct-coupling will be very difficult, and coupling loss is very high.We pass through middle 3/4/5
The Waveguide array type light path converting of composition interconnects chip and lower end is had the integreted phontonics core that optical signal Vertical Launch receives characteristic
Piece 1 couples together with right-hand member big spacing chip, separate chip or fiber array 6, realize optical signal large scale photon chip with
Transmission between Small Distance high integration photon chip and process are so as to collectively constitute a photon hybrid integrated device.Pass through
The making that the multichannel waveguide type optical circuit conversion interconnection chip of our designs can significantly reduce photon hybrid integrated device is difficult
Degree, lifting coupling efficiency, it all has great importance for the making of photon hybrid integrated device and application.
Refer to Fig. 3, it is the θ angle schematic diagram of the Waveguide array type light path converting interconnection chip of the present invention, in figure n1,
N2 is the refractive index in air and Waveguide array core area 4, using optical total-reflection principle: when the transmission of angle of light meets formula: sin
(90°-θ)≥n1/n2During requirement, transmission light will realize total reflection in transmission medium face, thus reach changing optic path direction
Purpose；We as a example the refractive index in Waveguide array core area 4 is 1.45, calculates and obtain sin (90 ° of-θ) with air refraction for 1.0
>=0.6897, i.e. θ≤46.4 °；Now, optical signal realizes light path converting in Waveguide array core area 4 left end, is thereby coupled to lower end
Have in the photon integrated chip 1 of optical signal Vertical Launch reception characteristic it is achieved that optical signal has optical signal Vertical Launch
Receive freely transmitting between the photon integrated chip 1 of characteristic and big spacing chip, separate chip or fiber array 6.
Particular embodiments described above, has carried out detailed further to the purpose of the present invention, technical scheme and beneficial effect
Describing in detail bright it should be understood that the foregoing is only the specific embodiment of the present invention, being not limited to the present invention, all
Within the spirit and principles in the present invention, any modification, equivalent substitution and improvement done etc., should be included in the protection of the present invention
Within the scope of.
Claims (8)
1. a kind of Waveguide array type light path converting interconnects chip, comprising:
One substrate, is rectangle；
An array waveguide core region, this Waveguide array core area includes multiple waveguides, and each waveguide is the bar shaped with taper, and it is sequentially
It is arranged in above substrate；
One top covering, it covers the upper surface of substrate, and coats Waveguide array core area, forms the interconnection of Waveguide array type light path converting
Chip.
2. Waveguide array type light path converting interconnection chip according to claim 1, wherein Waveguide array core area miner diameter end
End face side and substrate and top covering are a downward inclined-plane, form an angle theta.
3. Waveguide array type light path converting according to claim 2 interconnects chip, and wherein said angle theta is 35 degree-
46.4 degree.
4. Waveguide array type light path converting according to claim 1 interconnects chip, and the material of wherein said substrate is this
Levy silicon dioxide.
5. Waveguide array type light path converting according to claim 4 interconnects chip, and the thickness of wherein said substrate is 15-
20μm.
6. Waveguide array type light path converting according to claim 1 interconnects chip, wherein, in described Waveguide array core area
The size in the section of single waveguide bigger diameter end is 6-8 × 8-11 μm.
7. Waveguide array type light path converting according to claim 1 interconnects chip, and the material in wherein said core area is to mix
Miscellaneous silicon dioxide, thickness is 6-8 μm.
8. Waveguide array type light path converting according to claim 1 interconnects chip, and the material of wherein said top covering is
Native silicon dioxide, thickness is 500-1500 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610942347.7A CN106371170A (en) | 2016-10-26 | 2016-10-26 | Array waveguide type light path conversion interconnection chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610942347.7A CN106371170A (en) | 2016-10-26 | 2016-10-26 | Array waveguide type light path conversion interconnection chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106371170A true CN106371170A (en) | 2017-02-01 |
Family
ID=57893444
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610942347.7A Pending CN106371170A (en) | 2016-10-26 | 2016-10-26 | Array waveguide type light path conversion interconnection chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113267847A (en) * | 2021-06-03 | 2021-08-17 | 中山大学 | Optical coupling device for coupling multi-core optical fiber and integrated optical chip and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1141088A (en) * | 1993-11-08 | 1997-01-22 | 联合讯号公司 | Process for making an array of tapered photopolymerized waveguides |
| CN1469140A (en) * | 2002-07-03 | 2004-01-21 | 三星电子株式会社 | Method for producing conical light wave guide |
| CN104765102A (en) * | 2015-04-21 | 2015-07-08 | 四川飞阳科技有限公司 | Packaging structure for silicon photon chip |
| CN105158848A (en) * | 2015-08-26 | 2015-12-16 | 中国科学院微电子研究所 | Multi-mode waveguide array coupling structure of glass substrate, and manufacturing method thereof |
| CN105334580A (en) * | 2015-11-26 | 2016-02-17 | 武汉光迅科技股份有限公司 | Wavelength division multiplex light receiving assembly |
-
2016
- 2016-10-26 CN CN201610942347.7A patent/CN106371170A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1141088A (en) * | 1993-11-08 | 1997-01-22 | 联合讯号公司 | Process for making an array of tapered photopolymerized waveguides |
| CN1469140A (en) * | 2002-07-03 | 2004-01-21 | 三星电子株式会社 | Method for producing conical light wave guide |
| CN104765102A (en) * | 2015-04-21 | 2015-07-08 | 四川飞阳科技有限公司 | Packaging structure for silicon photon chip |
| CN105158848A (en) * | 2015-08-26 | 2015-12-16 | 中国科学院微电子研究所 | Multi-mode waveguide array coupling structure of glass substrate, and manufacturing method thereof |
| CN105334580A (en) * | 2015-11-26 | 2016-02-17 | 武汉光迅科技股份有限公司 | Wavelength division multiplex light receiving assembly |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113267847A (en) * | 2021-06-03 | 2021-08-17 | 中山大学 | Optical coupling device for coupling multi-core optical fiber and integrated optical chip and preparation method thereof |
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Application publication date: 20170201 |