CN114035288B

CN114035288B - Optical module

Info

Publication number: CN114035288B
Application number: CN202111449769.8A
Authority: CN
Inventors: 郑龙; 董玉婷; 郝世聪; 杨思更
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2021-11-30
Filing date: 2021-11-30
Publication date: 2023-07-18
Anticipated expiration: 2041-11-30
Also published as: CN114035288A

Abstract

The optical module comprises a circuit board, a secondary circuit board attached to the circuit board, a signal processing chip arranged on the secondary circuit board, a first optical transceiver secondary module, a second optical transceiver secondary module and an optical fiber connector, wherein a connecting hole is formed in the secondary circuit board; the first optical transceiver sub-module is arranged on the surface of the circuit board and positioned in the connecting hole, and is connected with the signal processing chip through a high-speed signal wire on the sub-circuit board; the second optical transceiver sub-module is arranged on the surface of the circuit board, is arranged side by side with the first optical transceiver sub-module and the signal processing chip along the left-right direction, and is connected with the signal processing chip through a high-speed signal wire on the sub-circuit board, wherein the high-speed signal wire is positioned at one side of the connecting hole; the optical fiber connector is connected with the first optical transceiver sub-module and the second optical transceiver sub-module respectively through optical fiber belts. The application adopts the double-circuit board attaching mode, increases the layout area of the circuit board, prevents signal crosstalk between wiring lines on the circuit board, improves the transmission rate of the optical module, and is beneficial to the integration of the optical module.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new business and application modes such as cloud computing, mobile internet, video and the like, the development and progress of optical communication technology become more and more important. In the optical communication technology, the optical module is a tool for realizing the mutual conversion of optical signals, is one of key devices in optical communication equipment, and the transmission rate of the optical module is continuously improved along with the development of the optical communication technology.

At present, along with the continuous improvement of the transmission rate requirement of the optical module, the integration level of the optical module is higher and higher, and the power density of the optical module is also continuously increased due to the higher and higher integration level of the optical module, so that more wiring is arranged on a circuit board of the optical module. When the photoelectric devices and the wires arranged on the circuit board are more, signal crosstalk between the wires is easy to cause, the transmission rate of the optical module is influenced, and the integration of the optical module is not facilitated.

Disclosure of Invention

The embodiment of the application provides an optical module, which aims at solving the problem that when the integration level of the optical module is high, a plurality of photoelectric devices and wires are arranged on a circuit board of the optical module, so that the transmission rate of the optical module is affected.

The application provides an optical module, include:

a circuit board;

the secondary circuit board is attached to the circuit board and is provided with a connecting hole;

the signal processing chip is arranged on the secondary circuit board;

the first optical transceiver sub-module is arranged on the surface of the circuit board, is positioned in the connecting hole and is in signal connection with the signal processing chip through a high-speed signal wire arranged on the sub-circuit board;

the second optical transceiver sub-module is arranged on the surface of the circuit board, is arranged side by side with the first optical transceiver sub-module and the signal processing chip along the left-right direction, is in signal connection with the signal processing chip through a high-speed signal wire arranged on the sub-circuit board, and is connected with the high-speed signal wire of the second optical transceiver sub-module and is positioned at one side of the connecting hole;

The optical fiber connector is connected with the first optical receiving and transmitting sub-module and the second optical receiving and transmitting sub-module through optical fiber belts respectively.

The optical module comprises a circuit board, a secondary circuit board, a signal processing chip, a first optical receiving and transmitting secondary module, a second optical receiving and transmitting secondary module and an optical fiber connector, wherein the secondary circuit board is attached to the circuit board, and the signal processing chip is arranged on the secondary circuit board; the secondary circuit board is provided with a connecting hole, the first optical transceiver secondary module is arranged on the surface of the circuit board, the first optical transceiver secondary module is positioned in the connecting hole, the first optical transceiver secondary module is in signal connection with the signal processing chip through a high-speed signal wire arranged on the secondary circuit board, and thus signals output by the signal processing chip are transmitted to the first optical transceiver secondary module through the high-speed signal wire so as to drive the first optical transceiver secondary module to transmit and receive optical signals; the second optical transceiver sub-module is arranged on the surface of the circuit board, the second optical transceiver sub-module, the first optical transceiver sub-module and the signal processing chip are arranged side by side along the left-right direction, the second optical transceiver sub-module is connected with the signal processing chip through a high-speed signal wire arranged on the sub-circuit board, the high-speed signal wire connected with the second optical transceiver sub-module is positioned at one side of the connecting hole, and thus signals output by the signal processing chip are transmitted to the second optical transceiver sub-module through the high-speed signal wire so as to drive the second optical transceiver sub-module to transmit and receive optical signals; the optical fiber connector is respectively connected with the first optical transceiver sub-module and the second optical transceiver sub-module through optical fiber belts so as to emit optical signals emitted by the first optical transceiver sub-module and the second optical transceiver sub-module and transmit the optical signals from the outside of the optical modules to the first optical transceiver sub-module and the second optical transceiver sub-module. The mode that this application adopted two circuit boards laminating, first optical transceiver submodule piece and second optical transceiver submodule piece set up on the circuit board along controlling the direction, can increase the overall arrangement area of circuit board, and photoelectric device can set up on circuit board and secondary circuit board, if set up signal processing chip on secondary circuit board for connect photoelectric device's wiring more dispersedly, can prevent the signal crosstalk between the wiring, thereby can improve optical module's transmission rate, be favorable to optical module's integrated design.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings that need to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings may be obtained according to these drawings to those of ordinary skill in the art. Furthermore, the drawings in the following description may be regarded as schematic diagrams, not limiting the actual size of the products, the actual flow of the methods, the actual timing of the signals, etc. according to the embodiments of the present disclosure.

Fig. 1 is a connection diagram of an optical communication system according to some embodiments;

fig. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of an optical module according to some embodiments;

fig. 4 is an exploded view of a light module according to some embodiments;

FIG. 5 is a schematic diagram illustrating an assembly of a circuit board, an optical transceiver sub-module, an optical fiber ribbon and an optical fiber connector in an optical module according to an embodiment of the present disclosure;

FIG. 6 is an assembled side view of a circuit board, an optical transceiver sub-module and an optical fiber ribbon in an optical module according to an embodiment of the present disclosure;

fig. 7 is an exploded schematic view of a circuit board, a secondary circuit board, and an optical transceiver secondary module in an optical module according to an embodiment of the present application;

Fig. 8 is a schematic structural diagram of a secondary circuit board in an optical module according to an embodiment of the present application;

fig. 9 is an assembly schematic diagram of a secondary circuit board and a first optical transceiver secondary module in an optical module according to an embodiment of the present application;

fig. 10 is a schematic diagram illustrating a partial exploded view of a circuit board, a secondary circuit board, and an optical transceiver secondary module in an optical module according to an embodiment of the present disclosure;

fig. 11 is a partially exploded schematic view of an optical transceiver sub-module in an optical module according to an embodiment of the present application;

fig. 12 is a front view of an optical transceiver sub-module in an optical module according to an embodiment of the present application;

fig. 13 is a schematic structural diagram of an emission housing in an optical module according to an embodiment of the present application;

fig. 14 is a partially exploded schematic view of a sub-circuit board and an optical transceiver sub-module in an optical module according to an embodiment of the present application;

fig. 15 is a schematic structural diagram of a fixing frame in an optical module according to an embodiment of the present application;

FIG. 16 is a schematic view of a partial assembly of a circuit board, a first optical transceiver sub-module, a second optical transceiver sub-module and an optical fiber ribbon in an optical module according to an embodiment of the present disclosure;

fig. 17 is a schematic diagram illustrating separation of a secondary circuit board and a signal processing chip in an optical module according to an embodiment of the present disclosure;

fig. 18 is a signal connection cross-sectional view of a first optical transceiver sub-module and a second optical transceiver sub-module in an optical module according to an embodiment of the present application;

Fig. 19 is another exploded view of a secondary circuit board and a signal processing chip in an optical module according to an embodiment of the present disclosure;

fig. 20 is a cross-sectional view of another signal connection between a circuit board and a signal processing chip in an optical module according to an embodiment of the present disclosure;

fig. 21 is a schematic signal connection diagram of a silicon optical chip and a signal processing chip in an optical module according to an embodiment of the present application;

fig. 22 is a schematic signal connection diagram of a first silicon optical chip and a secondary circuit board in an optical module according to an embodiment of the present disclosure;

fig. 23 is a schematic signal connection diagram of a second silicon optical chip and a secondary circuit board in an optical module according to an embodiment of the present application;

fig. 24 is a schematic power connection diagram of a circuit board, a signal processing chip and a first optical transceiver sub-module in an optical module according to an embodiment of the present application;

fig. 25 is a power connection cross-sectional view of a first optical transceiver sub-module in an optical module according to an embodiment of the present application;

fig. 26 is a schematic diagram of power connection between a circuit board, a signal processing chip and a second optical transceiver sub-module in an optical module according to an embodiment of the present application;

fig. 27 is a power connection cross-sectional view of a second optical transceiver sub-module in an optical module according to an embodiment of the present application;

fig. 28 is a schematic diagram of a pad structure of a secondary circuit board in an optical module according to an embodiment of the present application.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present disclosure. All other embodiments obtained by one of ordinary skill in the art based on the embodiments provided by the present disclosure are within the scope of the present disclosure.

Throughout the specification and claims, unless the context requires otherwise, the word "comprise" and its other forms such as the third person referring to the singular form "comprise" and the present word "comprising" are to be construed as open, inclusive meaning, i.e. as "comprising, but not limited to. In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", "some examples", "and the like are intended to indicate that a particular feature, structure, material, or characteristic associated with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The terms "first" and "second" are used below for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present disclosure, unless otherwise indicated, the meaning of "a plurality" is two or more.

In describing some embodiments, expressions of "coupled" and "connected" and their derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, the term "coupled" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled (communicatively coupled)" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the disclosure herein.

At least one of "A, B and C" has the same meaning as at least one of "A, B or C," both include the following combinations of A, B and C: a alone, B alone, C alone, a combination of a and B, a combination of a and C, a combination of B and C, and a combination of A, B and C.

"A and/or B" includes the following three combinations: only a, only B, and combinations of a and B.

The use of "adapted" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

As used herein, "about," "approximately" or "approximately" includes the stated values as well as average values within an acceptable deviation range of the particular values as determined by one of ordinary skill in the art in view of the measurement in question and the errors associated with the measurement of the particular quantity (i.e., limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to an information processing device such as a computer through an information transmission device such as an optical fiber or an optical waveguide, so as to complete the transmission of the information. Since the optical signal has a passive transmission characteristic when transmitted through an optical fiber or an optical waveguide, low-cost and low-loss information transmission can be realized. Further, since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform mutual conversion between the electrical signal and the optical signal in order to establish an information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electric signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electric port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides through the optical port, realizes electric connection with an optical network terminal (for example, optical cat) through the electric port, and is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to information processing equipment such as a computer through a network cable or wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, such as signal transmission of several kilometers (6-8 kilometers), on the basis of which, if a repeater is used, it is theoretically possible to realize ultra-long-distance transmission. Thus, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may typically reach several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following: routers, switches, computers, cell phones, tablet computers, televisions, etc.

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by an optical fiber 101 and a network cable 103; and the connection between the optical fiber 101 and the network cable 103 is made by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101 such that the optical module 200 establishes a bi-directional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100 such that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 performs mutual conversion between optical signals and electrical signals, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a substantially rectangular parallelepiped housing (housing), and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 and the optical module 200 establish a bidirectional electrical signal connection; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. A connection is established between the optical module 200 and the network cable 103 through the optical network terminal 100. By way of example, since the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103 and transmits a signal from the network cable 103 to the optical module 200, the optical network terminal 100 can monitor the operation of the optical module 200 as a host computer of the optical module 200. The upper computer of the optical module 200 may include an optical line terminal (Optical Line Terminal, OLT) or the like in addition to the optical network terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100 and the network cable 103.

Fig. 2 is a block diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical network terminal 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a convex portion such as a fin that increases the heat dissipation area.

The optical module 200 is inserted into the cage 106 of the optical network terminal 100, the optical module 200 is fixed by the cage 106, and heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected with an electrical connector inside the cage 106, so that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bi-directional electrical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of an optical module according to some embodiments, and fig. 4 is an exploded view of an optical module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver;

the housing includes an upper housing 201 and a lower housing 202, the upper housing 201 being capped on the lower housing 202 to form the above-described housing having two openings 204 and 205; the outer contour of the housing generally presents a square shape.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates disposed at both sides of the bottom plate and perpendicular to the bottom plate; the upper case 201 includes a cover plate, and two upper side plates disposed at two sides of the cover plate and perpendicular to the cover plate, and two side walls are combined with the two side plates to realize that the upper case 201 is covered on the lower case 202.

The direction of the connection line of the two openings 204 and 205 may be identical to the length direction of the optical module 200 or not identical to the length direction of the optical module 200. Illustratively, opening 204 is located at the end of light module 200 (right end of fig. 3) and opening 205 is also located at the end of light module 200 (left end of fig. 3). Alternatively, the opening 204 is located at the end of the light module 200, while the opening 205 is located at the side of the light module 200. The opening 204 is an electrical port, and the golden finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to be connected to the external optical fiber 101, so that the optical fiber 101 is connected to an optical transceiver device inside the optical module 200.

By adopting the assembly mode of combining the upper shell 201 and the lower shell 202, devices such as the circuit board 300, the optical transceiver and the like are conveniently installed in the shell, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when devices such as the circuit board 300 are assembled, the positioning component, the heat dissipation component and the electromagnetic shielding component of the devices are conveniently arranged, and the automatic implementation and production are facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of metal materials, which is beneficial to electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking member 203 located on an outer wall of the housing, and the unlocking member 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or release the fixed connection between the optical module 200 and the host computer.

Illustratively, the unlocking member 203 is located on the outer walls of the two lower side plates of the lower housing 202, and includes a snap-in member that mates with the cage of the host computer (e.g., cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the clamping component of the unlocking component 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, so as to change the connection relationship between the engaging member and the host computer, so as to release the engagement relationship between the optical module 200 and the host computer, and thus the optical module 200 can be pulled out from the cage of the host computer.

The circuit board 300 includes circuit traces, electronic components and chips, which are connected together by the circuit traces according to a circuit design to realize functions such as power supply, electrical signal transmission, and grounding. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET). The chips may include, for example, a micro control unit (Microcontroller Unit, MCU), transimpedance amplifier (Transimpedance Amplifier, TIA), clock data recovery chip (Clock and Data Recovery, CDR), power management chip, digital signal processing (Digital Signal Processing, DSP) chip.

The circuit board 300 is generally a hard circuit board, and the hard circuit board can also realize a bearing function due to the relatively hard material, for example, the hard circuit board can stably bear chips; the hard circuit board can also be inserted into an electrical connector in the upper computer cage.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and is conductively connected to the electrical connectors within the cage 106 by the gold fingers. The golden finger can be arranged on the surface of one side of the circuit board 300 (for example, the upper surface shown in fig. 4) or on the surfaces of the upper side and the lower side of the circuit board 300, so as to adapt to the occasion with large pin number requirements. The golden finger is configured to establish electrical connection with the upper computer to achieve power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, flexible circuit boards may also be used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board.

Fig. 5 is an assembly schematic diagram of a circuit board, an optical transceiver sub-module, an optical fiber ribbon and an optical fiber connector in an optical module according to an embodiment of the present application, and fig. 6 is an assembly side view of a circuit board, an optical transceiver sub-module and an optical fiber ribbon in an optical module according to an embodiment of the present application. As shown in fig. 5 and 6, the optical module provided in this embodiment of the present application includes a circuit board 300, a secondary circuit board 310, a signal processing chip 320, a first optical transceiver sub-module 400, a second optical transceiver sub-module 500, a plurality of optical fiber ribbons and an optical fiber connector 600, where the secondary circuit board 310 is attached to the circuit board 300, the signal processing chip 320 is disposed on the secondary circuit board 310, that is, the lower surface of the secondary circuit board 310 is attached to the upper surface of the circuit board 300, and the signal processing chip 320 is disposed on the upper surface of the secondary circuit board 310.

The sub-circuit board 310 is provided with a connection hole penetrating through the sub-circuit board 310 such that a portion of the surface of the circuit board 300 is exposed through the connection hole, so that the first optical transceiver sub-module 400 may be disposed on the upper surface of the circuit board 300 through the connection hole.

Specifically, the first optical transceiver sub-module 400 is disposed on the circuit board 300, the first optical transceiver sub-module 400 is embedded in the connection hole of the sub-circuit board 310, and one side of the first optical transceiver sub-module 400 is attached to the upper surface of the circuit board 300. After the first optical transceiver sub-module 400 is mounted on the circuit board 300 through the connection hole, signal connection between the first optical transceiver sub-module 400 and the signal processing chip 320 is realized through a high-speed differential signal wire arranged on the sub-circuit board 310, so that a signal output by the signal processing chip 320 is transmitted to an optical emission component of the first optical transceiver sub-module 400, and the optical emission component is driven to emit an optical signal; and, the electrical signal converted by the optical receiving component of the first optical transceiver sub-module 400 is transmitted to the signal processing chip 320 for subsequent processing.

The second optical transceiver sub-module 500 and the first optical transceiver sub-module 400 are disposed on the circuit board 300 side by side along the left-right direction, and are connected with the signal processing chip 320 through high-speed differential signal lines disposed on the sub-circuit board 310, and the high-speed differential signal lines connected with the second optical transceiver sub-module 500 are located at one side of the connection hole. That is, the signal processing chip 320 is connected to one end of the high-speed differential signal line on the secondary circuit board 310, the other end of the high-speed differential signal line is connected to the second optical transceiver sub-module 500 through wire bonding, and the high-speed differential signal line on the secondary circuit board 310 is located at one side of the connection hole so as to avoid the first optical transceiver sub-module 400 embedded in the connection hole. Thus, the signal output by the signal processing chip 320 can be transmitted to the light emitting component of the second light receiving and transmitting sub-module 500 through the high-speed differential signal line on the sub-circuit board 310, so as to drive the light emitting component to emit the light signal; and transmitting the electric signal converted by the light receiving component of the second optical transceiver sub-module 500 to the signal processing chip 320 for subsequent processing through the high-speed differential signal line on the sub-circuit board 310.

The plurality of optical fiber ribbons include two transmitting optical fiber ribbons and two receiving optical fiber ribbons, and the transmitting assembly of the first optical transceiver sub-module 400 is connected to one end of the transmitting optical fiber ribbon to transmit the optical signal transmitted by the first optical transceiver sub-module 400; the receiving assembly of the first optical transceiver sub-module 400 is connected to one end of a receiving optical fiber ribbon to transmit an external optical signal to the receiving assembly. The transmitting assembly of the second optical transceiver sub-module 500 is connected with one end of another transmitting optical fiber ribbon to transmit the optical signal transmitted by the second optical transceiver sub-module 500; the receiving assembly of the second optical transceiver sub-module 500 is connected to one end of another receiving optical fiber ribbon to transmit an external optical signal to the receiving assembly.

The two transmitting optical fiber belts and the two receiving optical fiber belts are connected with the optical fiber connector 600 so as to transmit optical signals carried by the transmitting optical fiber belts to external optical fibers through the optical fiber connector 600, thereby realizing the transmission of light; and transmitting the optical signal transmitted from the external optical fiber to the receiving optical fiber ribbon through the optical fiber connector 600, thereby achieving the light reception.

Fig. 7 is an exploded schematic diagram of a circuit board, a secondary circuit board, and an optical transceiver secondary module in an optical module according to an embodiment of the present application. As shown in fig. 7, the length dimension of the secondary circuit board 310 in the left-right direction is smaller than the length dimension of the circuit board 300 in the left-right direction, and the secondary circuit board 310 is close to one end of the circuit board 300 where the gold finger is disposed. The lower surface of the secondary circuit board 310 is provided with a bonding pad and a solder ball, the position of the circuit board 300 corresponding to the secondary circuit board 310 is also provided with a bonding pad, and the bonding pad of the secondary circuit board 310, the solder ball and the bonding pad of the circuit board 300 are bonded together through soldering tin so as to bond the secondary circuit board 310 on the circuit board 300.

The circuit board 300 is further provided with a first installation area and a second installation area, the first installation area and the second installation area are arranged side by side along the left-right direction, the first installation area is close to the golden finger on the circuit board 300, and the second installation area is located on the left side of the first installation area. The first optical transceiver sub-module 400 is disposed on the first mounting area through the connection hole, and the second optical transceiver sub-module 500 is disposed on the second mounting area, so as to attach the first optical transceiver sub-module 400 and the second optical transceiver sub-module 500 to the circuit board 300.

Fig. 8 is a schematic structural diagram of a secondary circuit board in an optical module provided in an embodiment of the present application, and fig. 9 is an assembly schematic diagram of the secondary circuit board and a first optical transceiver secondary module in the optical module provided in the embodiment of the present application. As shown in fig. 8 and 9, the secondary circuit board 310 is provided with a connection hole 330, and the connection hole 330 penetrates through the secondary circuit board 310, so that after the secondary circuit board 310 is attached to the circuit board 300, a first mounting area on the circuit board 300 is exposed through the connection hole 330, and the first optical transceiver sub-module 400 is mounted on the first mounting area through the connection hole 330.

In some embodiments, the first optical transceiver sub-module 400 includes a first optical emission component 410 and a first silicon optical chip 420, the first optical emission component 410 and the first silicon optical chip 420 are embedded in the connection hole 330 of the sub-circuit board 310, the first silicon optical chip 420 is close to the gold finger on the circuit board 300, the first optical emission component 410 is located at the left side of the first silicon optical chip 420, and the light beam emitted by the first optical emission component 410 is transmitted into the first silicon optical chip 420 and is subjected to electro-optic modulation by the first silicon optical chip 420.

The right side of the first silicon optical chip 420 is provided with a signal pad, a first high-speed signal wire is arranged between the right side edge of the connecting hole 330 and the signal processing chip 320, the right end of the first high-speed signal wire is connected with the signal processing chip 320, and the left end of the first high-speed signal wire is connected with the signal pad on the first silicon optical chip 420 through wire bonding so as to realize the signal connection between the signal processing chip 320 and the first silicon optical chip 420 through the first high-speed signal wire on the secondary circuit board 310.

In some embodiments, the second optical transceiver sub-module 500 includes a second optical emission component and a second silicon optical chip, the second optical emission component is located on the left side, the second silicon optical chip is located on the right side, and the light beam emitted by the second optical emission component is transmitted into the second silicon optical chip, and is subjected to electro-optic modulation by the second silicon optical chip.

The right side of second silicon optical chip is provided with the signal pad, is provided with the high-speed signal line of second between the left side edge of secondary circuit board 310 and the signal processing chip 320, and the high-speed signal line of second is located one side of connecting hole 330, and the right-hand member and the signal processing chip 320 of second high-speed signal line are connected, and the left end passes through the routing to be connected with the signal pad on the second silicon optical chip to realize signal processing chip 320 and the signal connection of second silicon optical chip through the high-speed signal line on the secondary circuit board 310.

Fig. 10 is a partially exploded schematic view of a circuit board, a secondary circuit board, and an optical transceiver secondary module in an optical module according to an embodiment of the present application. As shown in fig. 10, when the optical transceiver sub-module is installed, the sub-circuit board 310 may be first attached to the circuit board 300, and the first installation area on the circuit board 300 is exposed through the connection hole 330 on the sub-circuit board 310; then, the signal processing chip 320 is disposed on the secondary circuit board 310; then, the first optical transceiver sub-module 400 is embedded in the connection hole 330, so that the first optical transceiver sub-module 400 is mounted on the first mounting area; the second optical transceiver sub-module 500 is then mounted on the second mounting area of the circuit board 300.

After the first optical transceiver sub-module 400 and the second optical transceiver sub-module 500 are mounted on the circuit board 300, the first optical transceiver sub-module 400 and the second optical transceiver sub-module 500 need to be electrically connected to ensure photoelectric conversion of the first optical transceiver sub-module 400 and the second optical transceiver sub-module 500.

Fig. 11 is a partially exploded schematic view of an optical transceiver sub-module in an optical module according to an embodiment of the present application, and fig. 12 is a front view of the optical transceiver sub-module in the optical module according to an embodiment of the present application. As shown in fig. 11 and 12, the first silicon optical chip 420 and the first light emitting component 410 are both disposed on the heat sink 430, and the first light emitting component 410 includes an emitting housing 4110, a laser 4120, a collimator lens 4130, an optical isolator 4140 and a converging lens 4150, wherein the laser 4120, the collimator lens 4130, the optical isolator 4140 and the converging lens 4150 are all disposed on the heat sink 430, and the emitting housing 4110 covers the heat sink 430, so that the laser 4120, the collimator lens 4130, the optical isolator 4140 and the converging lens 4150 are disposed in a sealed cavity formed between the emitting housing 4110 and the heat sink 430.

In some embodiments, after the first silicon optical chip 420 is placed on the heat sink 430, the heat generated by the first silicon optical chip 420 is transferred to the heat sink 430 with high thermal conductivity, so as to ensure the heat dissipation performance of the first silicon optical chip 420.

The light beam emitted by the laser 4120 is converted into a collimated light beam by the collimating lens 4130, the collimated light beam directly passes through the optical isolator 4140, the collimated light beam passing through the optical isolator 4140 is converted into a converging light beam by the converging lens 4150, the converging light beam is incident on the first silicon optical chip 420, and the light beam is subjected to electro-optic modulation in the first silicon optical chip 420.

In some embodiments, the laser 4120, the collimating lens 4130, the optical isolator 4140 and the converging lens 4150 are sequentially disposed on the heat sink 430 along the horizontal direction, and the first silicon optical chip 420 is obliquely disposed, and the central axis of the first silicon optical chip 420 and the light emitting direction of the first light emitting component 410 are disposed at a preset angle, so that when the light beam emitted from the converging lens 4150 is reflected at the input end surface of the first silicon optical chip 420, the reflected light beam will not return to the laser 4120 along the original path, and when the reflected light beam is incident on the optical isolator 4140, the reflected light beam will be isolated by the optical isolator 4140, and thus the reflected light beam will not return to the laser 4120, thereby avoiding the influence of the reflected light beam on the light emitting performance of the laser 4120.

In some embodiments, the angle between the central axis of the first silicon optical chip 420 and the light emitting direction of the first light emitting element 410 is 8 degrees.

In some embodiments, the first light emitting component 410 further includes an optical glass block 4160, the optical glass block 4160 is located between the converging lens 4150 and the input end face of the first silicon optical chip 420, the output end of the optical glass block 4160 contacts the input end face of the first silicon optical chip 420, and the optical glass block 4160 is a wedge-shaped block for changing the light beam emitting angle, so as to ensure that the horizontal light beam emitted by the laser 4120 smoothly enters the obliquely arranged first silicon optical chip 420.

In some embodiments, the first silicon optical chip 420 may include an emitting light port and two receiving light ports, and the optical glass block 4160 is disposed corresponding to one receiving light port of the first silicon optical chip 420 to emit the light beam with the changed light path angle into the first silicon optical chip 420 through the receiving light port.

The transmitting optical port of the first silicon optical chip 420 is connected with the transmitting optical fiber ribbon 700 through the transmitting end 440, and the first silicon optical chip 420 transmits the processed optical signal to the transmitting optical fiber ribbon 700 through the transmitting optical port, so that the optical signal is transmitted to the external optical fiber through the transmitting optical fiber ribbon 700 and the optical fiber connector 600, and light transmission is realized.

The other receiving optical port of the first silicon optical chip 420 is connected with the receiving optical fiber ribbon 800 through the receiving end 450, the external optical signal is transmitted into the first silicon optical chip 420 through the receiving optical fiber ribbon 800, the first silicon optical chip 420 converts the external optical signal into an electrical signal, the electrical signal is transmitted to the signal processing chip 320 through the high-speed differential signal wire on the wire bonding and secondary circuit board 310, and the electrical signal is transmitted to the circuit board 300 after being processed by the signal processing chip 320.

In some embodiments, the emitting optical port and the receiving optical port of the first silicon optical chip 420 are located on the same end face, that is, the emitting end and the receiving end connected to the first silicon optical chip 420 are both located on the left side of the first silicon optical chip 420, so that the emitting optical fiber ribbon 700 and the receiving optical fiber ribbon 800 can be directly connected to the optical fiber connector 600 and the first silicon optical chip 420, thereby avoiding optical fiber ribbon winding and reducing power consumption.

The heat sink 430 of the first optical transceiver sub-module 400 is embedded in the connection hole 330, and the lower surface of the heat sink 430 is adhered to the first mounting area of the circuit board 300, and the first silicon optical chip 420 is adhered to the upper surface of the heat sink 430. After the first silicon optical chip 420 and the heat sink 430 are embedded in the connection hole 330, the wire bonding pad on the upper surface of the first silicon optical chip 420 may be located on the same horizontal plane as the sub-circuit board 310 because the heat sink 430 lifts the first silicon optical chip 420. Specifically, the first silicon optical chip 420 is attached to the heat sink 430 through silver paste to ensure heat dissipation of the first silicon optical chip 420.

Fig. 13 is a schematic structural diagram of an emission housing in an optical module provided in an embodiment of the present application, and fig. 14 is a schematic partially exploded view of a secondary circuit board and an optical transceiver secondary module in an optical module provided in an embodiment of the present application. As shown in fig. 13 and 14, a signal pad is provided at the left side edge of the connection hole 330 on the sub-circuit board 310, and is signal-connected to the laser 4120 by wire bonding to drive the laser 4120 to emit a laser beam. The laser beam emitted from the laser 4120 is transmitted into the first silicon optical chip 420 through the collimator lens 4130, the optical isolator 4140, the converging lens 4150 and the optical glass block 4160 in this order.

Since the laser 4120 is in signal connection with the signal pad on the secondary circuit board 310 through the wire bonding, in order to cover the wire bonding, the end 4170 of the emission housing 4110 facing away from the first silicon optical chip 420 protrudes from the connection hole 330, and the end 4170 protruding from the connection hole 330 contacts with the upper surface of the secondary circuit board 310, so that the signal pad and the wire bonding are covered in the emission housing 4110 through the end 4170, and thus the protruding end 4170 of the emission housing 4110 covers the wire bonding for protection, and meanwhile, the influence of EMI radiation generated by the wire bonding on the outside is prevented.

In some embodiments, after the laser 4120, the collimator lens 4130, the optical isolator 4140, the converging lens 4150, the optical glass block 4160, and the first silicon optical chip 420 are fixed on the heat sink 430, the assembled heat sink 430 is mounted to the first mounting area of the circuit board 300 through the connection hole 330; then, the signal pads on the secondary circuit board 310 are connected with the laser 4120 through wire bonding; the emitter housing 4110 is then capped over the heat sink 430 to cap the lasers 4120, collimating lens 4130, optical isolator 4140, converging lens 4150, optical glass block 4160 and wire bonds within the emitter housing 4110.

In some embodiments, the second optical transceiver sub-module 500 has the same structure as the first optical transceiver sub-module 400, the first optical transceiver sub-module 400 is mounted to the first mounting area on the circuit board 300 through the connection hole 330 on the sub-circuit board 310, and the electrical connection between the first optical transceiver sub-module 400 and the signal processing chip 320, the circuit board 300 is realized through wire bonding, high-speed differential signal wire, etc., so as to drive the first optical transceiver sub-module 400 to perform photoelectric conversion. Similarly, the second optical transceiver sub-module 500 is mounted on the second mounting area of the circuit board 300 and electrically connected with the sub-circuit board 310 through wire bonding, so as to realize the electrical connection between the second optical transceiver sub-module 500 and the signal processing chip 320 as well as between the second optical transceiver sub-module and the circuit board 300.

Specifically, one side of the second optical transceiver sub-module 500 is adjacent to one end of the sub-circuit board 310, and the second optical transceiver sub-module 500 is located at the left side of the sub-circuit board 310. The second optical transceiver sub-module 500 includes a second optical emission component 510, a second silicon optical chip 520, and a heat sink, where the second optical emission component 510 and the second silicon optical chip 520 are disposed on the heat sink, and the second optical emission component 510 and the second silicon optical chip 520 are lifted by the heat sink, so that the second silicon optical chip 520 and the sub-circuit board 310 are located on the same horizontal plane.

The second silicon optical chip 520 is provided with a high-speed differential signal pad, one end of the secondary circuit board 310, which is opposite to the golden finger, is provided with a high-speed differential signal pad, the high-speed differential signal pad on the second silicon optical chip 520 is electrically connected with the high-speed differential signal pad on the secondary circuit board 310 through wire bonding, and the high-speed differential signal pad on the secondary circuit board 310 is electrically connected with the signal processing chip 320 through the high-speed differential signal wire on the secondary circuit board 310, so that the electrical connection between the second optical transceiver sub-module 500 and the signal processing chip 320 is realized.

A second high-speed signal line is disposed between the left edge of the secondary circuit board 310 and the signal processing chip 320, the second high-speed signal line is located at one side of the connection hole 330, one end of the second high-speed signal line is connected with the signal processing chip 320, and the other end of the second high-speed signal line is connected with the second silicon optical chip 520 through wire bonding, so that signal transmission between the signal processing chip 320 and the second silicon optical chip 520 is realized through the second high-speed signal line on the secondary circuit board 310.

In some embodiments, the second silicon optical chip 520 may include a transmitting optical port and two receiving optical ports, the light beam transmitted by the second optical transmitting component 510 is transmitted to the second silicon optical chip 520 through the receiving optical port, and the second silicon optical chip 520 transmits the processed optical signal to the optical fiber connector 600 through the transmitting optical fiber ribbon, so as to realize light transmission; and, the external optical signal is transmitted to the second silicon optical chip 520 through the optical fiber connector 600, the receiving optical fiber ribbon, and the light reception is realized.

Because the first optical transceiver sub-module 400 is located on the right side of the second optical transceiver sub-module 500, the transmitting optical fiber ribbon 700 and the receiving optical fiber ribbon 800 connected to the first optical transceiver sub-module 400 are longer, and in order to avoid the messy arrangement of the transmitting optical fiber ribbon 700 and the receiving optical fiber ribbon 800, the transmitting optical fiber ribbon 700 and the receiving optical fiber ribbon 800 need to be fixed.

Fig. 15 is a schematic structural diagram of a fixing frame in an optical module provided in an embodiment of the present application, and fig. 16 is a schematic partial structural diagram of a circuit board, a first optical transceiver sub-module, a second optical transceiver sub-module, and an optical fiber ribbon in the optical module provided in the embodiment of the present application. As shown in fig. 15 and 16, the optical module provided in the embodiment of the present application further includes a fixing frame 900, where the fixing frame 900 is disposed on the circuit board 300, and the transmitting optical fiber ribbon 700 and the receiving optical fiber ribbon 800 connected to the first optical transceiver sub-module 400 are fixed on the circuit board 300 through the fixing frame 900.

Specifically, the fixing frame 900 includes a first fixing plate 910, a second fixing plate 920 and a third fixing plate 930, two ends of the second fixing plate 920 are respectively connected to the first fixing plate 910 and the third fixing plate 930, and the first fixing plate 910 and the third fixing plate 930 are disposed opposite to each other, so that the first fixing plate 910, the second fixing plate 920 and the third fixing plate 930 form a U-shaped fixing frame.

The first fixing plate 910 and the third fixing plate 930 are located at the outer periphery of the second optical transceiver sub-module 500, and the second fixing plate 920 is located above the second silicon optical chip 520, so that the second optical transceiver sub-module 500 is embedded in the fixing frame 900.

In some embodiments, the thickness dimension of the second fixing plate 920 in the up-down direction is smaller than the thickness dimension of the first fixing plate 910 and the third fixing plate 930 in the up-down direction, so that the second fixing plate 920 covers the second silicon optical chip 520 when the first fixing plate 910 and the third fixing plate 930 are fixed on the circuit board 300.

The right side of the second silicon photo chip 520 is provided with a high-speed differential signal pad, which is connected with the left side of the secondary circuit board 310 through wire bonding, and the second fixing plate 920 covered above the second silicon photo chip 520 can cover the high-speed differential signal pad and wire bonding to protect the wire bonding connecting the second silicon photo chip 520 and the secondary circuit board 310.

In some embodiments, a through hole 940 may be provided in the second fixing plate 920, and the through hole 940 penetrates the second fixing plate 920. After the second fixing plate 920 is disposed on the second silicon optical chip 520, a portion of the second silicon optical chip 520 may be exposed through the through hole 940, so as to be conveniently connected to the second silicon optical chip 520 through wire bonding.

After fixing the fixing frame 900 on the circuit board 300, the transmitting optical fiber ribbon 700 connected to the first optical transceiver sub-module 400 is clamped and fixed on the third fixing plate 930, and the receiving optical fiber ribbon 800 connected to the first optical transceiver sub-module 400 is clamped and fixed on the first fixing plate 910, so that the transmitting optical fiber ribbon 700 and the receiving optical fiber ribbon 800 are fixed on the circuit board 300.

In some embodiments, the second optical transceiver sub-module 500 further includes an emission housing and a second optical emission assembly, where the emission housing is covered on the second optical emission assembly, and the second optical transceiver assembly includes a laser, a collimating lens, an optical isolator, a converging lens, and an optical glass block. A signal pad is arranged on the circuit board 300 near the second light emitting component and is in signal connection with the second light emitting component through wire bonding; one end of the emission housing, which is opposite to the second silicon optical chip 520, protrudes, and the protruding end covers the signal pad and the wire to protect the wire connected to the second silicon optical chip 520.

The end of the second fixing plate 920 facing the emission housing is provided with a protrusion, the projection may contact one end of the launch housing such that the launch housing may be restrained by the projection.

After the first optical transceiver sub-module 400 and the second optical transceiver sub-module 500 are disposed on the circuit board 300, the signal processing chip 320 is required to transmit the high-frequency signal from the circuit board 300 to the first optical transceiver sub-module 400 and the second optical transceiver sub-module 500, so that the first optical transceiver sub-module 400 and the second optical transceiver sub-module 500 work normally.

Fig. 17 is a schematic diagram illustrating separation of a secondary circuit board and a signal processing chip in an optical module provided in an embodiment of the present application, and fig. 18 is a signal connection cross-sectional view of a first optical transceiver sub-module and a second optical transceiver sub-module in the optical module provided in the embodiment of the present application. As shown in fig. 17 and 18, the signal processing chip 320 is disposed on the secondary circuit board 310, and the signal transmitted by the golden finger 340 on the circuit board 300 is transmitted to the signal processing chip 320 via the secondary circuit board 310, and the signal processing chip 320 transmits the signal to the first optical transceiver sub-module 400 through the high frequency signal line, so as to drive the first optical transceiver sub-module 400 to transmit the optical signal and receive the optical signal.

Specifically, BGA (Ball Grid Array Package, ball grid array) solder balls are disposed on the back surface (the side facing the circuit board 300) of the signal processing chip 320, and the BGA solder balls are signal solder balls 3210, and when the signal processing chip 320 is disposed on the secondary circuit board 310, the signal solder balls 3210 on the signal processing chip 320 are connected to the surface of the secondary circuit board 310, so as to electrically connect the signal processing chip 320 and the secondary circuit board 310.

The signal processing chip 320 is further provided with a ground solder ball 3220, the ground solder ball 3220 is a ground attribute solder ball, the ground solder ball 3220 is disposed at the periphery of the signal solder ball 3210, that is, a circle of ground solder balls 3220 are disposed around the signal solder ball 3210, and a signal ground return path is increased through the ground solder ball 3220, so that external interference of the high-speed signal line is prevented.

In some embodiments, the side of the secondary circuit board 310 facing the circuit board 300 is also provided with signal solder balls, and when the secondary circuit board 310 is disposed on the circuit board 300, the signal solder balls on the secondary circuit board 310 are connected to the surface of the circuit board 300, so as to electrically connect the secondary circuit board 310 and the circuit board 300.

The secondary circuit board 310 is connected with the upper surface of the circuit board 300 through the signal solder balls on the back surface of the secondary circuit board 310, the signal processing chip 320 is connected with the upper surface of the secondary circuit board 310 through the signal solder balls 3210 on the back surface of the secondary circuit board 310, a high-speed differential signal wire 301 is arranged in the secondary circuit board 310, one end of the high-speed differential signal wire 301 is connected with the signal solder balls 3210 on the back surface of the signal processing chip 320, and the other end of the high-speed differential signal wire 301 is connected with a bonding pad on the circuit board 300 so as to transmit data signals on the circuit board 300 to the signal processing chip 320 through the high-speed differential signal wire 301, so that signal transmission between the circuit board 300 and the signal processing chip 320 is realized.

One end of a high-speed signal wire arranged on the surface of the circuit board 300 is in signal connection with the golden finger 340, and the other end of the high-speed signal wire is in signal connection with a high-speed differential signal wire on the back of the secondary circuit board 310, namely, one end of the high-speed differential signal wire 301 in the secondary circuit board 310 is in signal connection with the high-speed signal wire on the circuit board 300, and the other end of the high-speed signal wire is in signal connection with the signal processing chip 320, so that data signals on the circuit board 300 are transmitted to the signal processing chip 320.

In some embodiments, the secondary circuit board 310 is further provided with a ground signal line 302 inside, one end of the ground signal line 302 is connected to a ground solder ball 3220 on the back surface of the signal processing chip 320, and the other end of the ground signal line 302 is connected to a ground pad on the circuit board 300, so that the ground connection of the signal processing chip 320 is achieved through the ground signal line 302.

In some embodiments, the ground signal lines 302 in the secondary circuit board 310 are located outside the high-speed differential signal lines 301, i.e., the ground signal lines 302 are disposed on the secondary circuit board 310 at positions corresponding to the left and right sides of the signal processing chip 320, and the high-speed differential signal lines 301 are disposed between the two side ground signal lines 302. In this way, the ground signal line 302 and the high-speed differential signal line 301 form a return path, and electromagnetic radiation outside the high-speed differential signal line 301 and interference from the outside can be reduced by the ground signal line 302.

After the signal processing chip 320 is connected with the circuit board 300 through signals, the signal processing chip 320 is connected with the first silicon optical chip 420 and the second silicon optical chip 520 through the secondary circuit board 300 respectively, so as to drive the first silicon optical chip 420 and the second silicon optical chip 520 to perform light emitting and receiving processes.

In some embodiments, when the signal processing chip 320 is connected to the circuit board 300, in addition to providing the ground solder ball 3220 on the side surface of the signal processing chip 320 and providing the ground signal line 302 in the secondary circuit board 310, a ground signal hole may be additionally provided on the secondary circuit board 310, and a signal ground return path may be additionally provided through the ground signal hole, so as to prevent external interference of the high-speed signal line.

Fig. 19 is another exploded schematic view of a secondary circuit board and a signal processing chip in an optical module according to an embodiment of the present application, and fig. 20 is a cross-sectional view of another signal connection between the circuit board and the signal processing chip in the optical module according to an embodiment of the present application. As shown in fig. 19 and 20, a plurality of ground signal holes 3110 are formed in the secondary circuit board 310, the ground signal holes 3110 penetrate through the upper and lower surfaces of the secondary circuit board 310, one end of each of the ground signal holes 3110 is connected to a ground solder ball on the back surface of the signal processing chip 320, the other end is connected to a ground pad on the front surface of the circuit board 300, and the ground connection between the signal processing chip 320 and the circuit board 300 is achieved through the ground signal holes 3110 in the secondary circuit board 310.

In some embodiments, the back surface of the signal processing chip 320 is provided with a plurality of signal solder balls, and when the signal processing chip 320 is mounted on the secondary circuit board 310, the signal solder balls on the back surface of the signal processing chip 320 are connected to the secondary circuit board 310, and then the secondary circuit board 310 is mounted on the circuit board 300. The inside of the secondary circuit board 310 is provided with a high-speed differential signal line 301, one end of the high-speed differential signal line 301 is connected with a signal solder ball on the back side of the signal processing chip 320, and the other end is connected with a signal pad on the front side of the circuit board 300, so that signal transmission between the signal processing chip 320 and the circuit board 300 is realized through the high-speed differential signal line 301.

The ground signal holes 3110 are disposed outside the high-speed differential signal lines 301 in the sub-circuit board 310, that is, the ground signal holes 3110 are disposed on the left and right sides of the sub-circuit board 310 corresponding to the signal processing chip 320, the sub-circuit board 310 is connected to the circuit board 300 through the high-speed differential signal lines 301 inside thereof, the high-speed differential signal lines 301 are disposed between the two rows of the ground signal holes 3110, and thus the ground signal holes 3110 are close to the high-speed differential signal lines 301 in the sub-circuit board 310 such that the ground signal holes 3110 and the high-speed differential signal lines 301 form a reflow.

After the circuit board 300 is connected with the signal processing chip 320 through the high-speed differential signal line, the ground signal line or the ground signal hole, the signal processing chip 320 is connected with the first silicon optical chip 420 and the second silicon optical chip 520 through the high-speed signal line arranged on the front surface of the secondary circuit board 310 so as to drive the first silicon optical chip 420 and the second silicon optical chip 520 to process the emitted light signal and the received light signal.

Fig. 21 is a schematic signal connection diagram of a silicon optical chip and a signal processing chip in an optical module according to an embodiment of the present application. As shown in fig. 21, a high-frequency signal line is disposed on the surface of the secondary circuit board 310, one end of the high-frequency signal line is connected with the signal processing chip 320 in a signal manner, and the other end of the high-frequency signal line is disposed at the edge of the connection hole 330, and the first silicon optical chip 420 is connected with the high-frequency signal line at the edge of the connection hole 330 in a signal manner through wire bonding, so as to transmit the data signal output by the signal processing chip 320 to the first silicon optical chip 420.

In some embodiments, a side of the first silicon optical chip 420 facing the signal processing chip 320 is provided with a transmit pad set, a receive pad set, and a power signal pad P disposed between the transmit pad set and the receive pad set to reduce interference of a transmit signal to a receive signal.

The emission pad group includes an emission signal pad S and a first ground signal pad G disposed outside the emission signal pad S. The edge of the secondary circuit board 310, which is close to the connecting hole 330, is provided with a transmitting pad corresponding to a transmitting signal pad S and a first grounding pad corresponding to a first grounding signal pad G, the transmitting signal pad S is in signal connection with the transmitting pad on the secondary circuit board 310 through two wires, and the transmitting pad on the secondary circuit board 310 is in signal connection with the signal processing chip 320 through a high-frequency signal wire; the first ground signal pad G is signal-connected with the first ground pad on the sub circuit board 310 through three wires to form a reflow with the wires connecting the emission signal pad S and the emission pad.

Likewise, the reception pad group includes a reception signal pad S and a second ground signal pad G disposed outside the reception signal pad S. The edge of the secondary circuit board 310, which is close to the connecting hole 330, is provided with a receiving pad corresponding to a receiving signal pad S and a second grounding pad corresponding to a second grounding signal pad G, the receiving signal pad S is in signal connection with the receiving pad on the secondary circuit board 310 through two wires, and the receiving pad on the secondary circuit board 310 is in signal connection with the signal processing chip 320 through a high-frequency signal wire; the second ground signal pad G is signal-connected with the second ground pad on the secondary circuit board 310 through three wires to form a reflow with the wires connecting the reception signal pad S and the reception pad.

In some embodiments, at least three power signal pads P are disposed on the first silicon photo chip 420, and the at least three power signal pads P are disposed side by side in an up-down direction; at least three power pads 350 are disposed on the sub circuit board 310 near the edge of the connection hole 330, and at least three power pads 350 are disposed side by side in the left-right direction. That is, the first silicon photo chip 420 is provided with at least three parallel power signal pads P, and the sub circuit board 310 is provided with at least three vertical power pads 350.

One of the three power signal pads P on the first silicon optical chip 420 is connected with the nearest power signal pad 350 on the secondary circuit board 310 through at least two routing signals, the power signal pads P on both sides of the first silicon optical chip 420 are sequentially routed to the power signal pads 350 on the secondary circuit board 310, and the number of routing is two or more. That is, the middle power signal pad P is signal-connected with the left power pad 350 through 2 wires, the lower power signal pad P is signal-connected with the middle power pad 350 through 2 wires, and the upper power signal pad P is signal-connected with the right power pad 350 through 2 wires.

Specifically, the first silicon optical chip 420 is provided with a first power signal pad P, a second power signal pad P and a third power signal pad P which are arranged side by side in the up-down direction, and the second power signal pad P is located between the first power signal pad P and the third power signal pad P; the secondary circuit board 310 is provided with a first power supply pad, a second power supply pad and a third power supply pad which are arranged side by side along the left-right direction, and the second power supply pad is positioned between the first power supply pad and the third power supply pad.

The first power supply signal pad P is connected with the third power supply pad through a wire bonding, the second power supply signal pad P is connected with the first power supply pad through a wire bonding, and the third power supply signal pad P is connected with the second power supply pad through a wire bonding.

Fig. 22 is a schematic signal connection diagram of a first silicon optical chip and a secondary circuit board in an optical module according to an embodiment of the present application. As shown in fig. 22, three power signal pads P on the first silicon photo chip 420 are disposed between a first ground signal pad G of the transmit pad group and a second ground signal pad G of the receive pad group, and three power pads 350 on the sub circuit board 310 are disposed between the first ground pad and the second ground pad, and the sizes of the first ground pad and the second ground pad in the left-right direction are larger than those of the power pads in the left-right direction.

In some embodiments, the three power pads 350 on the secondary circuit board 310 are sequentially arranged left, right, and not horizontally, so that the wires are spatially staggered and form staggered return paths with two sides, thereby preventing signal crosstalk between the transmitted signal and the received signal.

The first silicon optical chip 420 is electrically connected with the golden finger 340 on the circuit board 300 through a power signal pad, wire bonding, a power pad 350 and a power line, so that an electric signal of the golden finger 340 is routed to the secondary circuit board 310 through the power line, then routed to the edge of the connection hole 330 through the inner layer and the surface layer of the secondary circuit board 310, and then connected with the power pad on the secondary circuit board 310 and the power signal pad P of the first silicon optical chip 420 through wire bonding to supply power to the first silicon optical chip 420, so that the first silicon optical chip 420 receives a laser beam.

The first silicon optical chip 420 is in signal connection with the signal processing chip 320 on the secondary circuit board 310 through the transmitting bonding pad group, the receiving bonding pad group, the wire bonding, the transmitting bonding pad, the receiving bonding pad, and the high-speed signal line, so that the signal output by the signal processing chip 320 is transmitted to the first silicon optical chip 420 through the high-speed signal line, the transmitting bonding pad, the wire bonding and the transmitting bonding pad group to provide a data signal for the first silicon optical chip 420, and thus the first silicon optical chip 420 can optically modulate the laser beam according to the data signal, and the modulated optical signal is transmitted out through the transmitting optical fiber ribbon 700.

After the external optical signal is transmitted to the first silicon optical chip 420 through the receiving optical fiber ribbon 800, the first silicon optical chip 420 processes the external optical signal, and the processed electrical signal is transmitted to the signal processing chip 320 through the receiving pad group, the wire bonding, the receiving pad and the high-speed signal wire, and is subjected to subsequent processing through the signal processing chip 320.

Fig. 23 is a schematic signal connection diagram of a second silicon optical chip and a secondary circuit board in an optical module according to an embodiment of the present application. As shown in fig. 23, a side of the second silicon optical chip 520 facing the signal processing chip 320 is provided with a transmitting pad group, a receiving pad group, and a power signal pad P disposed between the transmitting pad group and the receiving pad group to reduce interference of a transmitting signal to a receiving signal.

The emission pad group includes an emission signal pad S and a first ground signal pad G disposed outside the emission signal pad S. The left side edge of the secondary circuit board 310 is provided with a transmitting pad corresponding to a transmitting signal pad S and a first grounding pad corresponding to a first grounding signal pad G, the transmitting signal pad S is in signal connection with the transmitting pad on the secondary circuit board 310 through two routing wires, and the transmitting pad on the secondary circuit board 310 is in signal connection with the signal processing chip 320 through a high-frequency signal wire; the first ground signal pad G is signal-connected with the first ground pad on the sub circuit board 310 through three wires to form a reflow with the wires connecting the emission signal pad S and the emission pad.

Likewise, the reception pad group includes a reception signal pad S and a second ground signal pad G disposed outside the reception signal pad S. The left side edge of the secondary circuit board 310 is provided with a receiving pad corresponding to a receiving signal pad S and a second grounding pad corresponding to a second grounding signal pad G, the receiving signal pad S is in signal connection with the receiving pad on the secondary circuit board 310 through two routing wires, and the receiving pad on the secondary circuit board 310 is in signal connection with the signal processing chip 320 through a high-frequency signal wire; the second ground signal pad G is signal-connected with the second ground pad on the secondary circuit board 310 through three wires to form a reflow with the wires connecting the reception signal pad S and the reception pad.

In some embodiments, the second silicon optical chip 520 is provided with at least three power signal pads P, and the at least three power signal pads P are disposed side by side in the up-down direction; at least three power pads are provided at the left side edge of the sub circuit board 310, and at least three power pads are provided side by side in the left-right direction. That is, the second silicon photo chip 520 is provided with at least three parallel power signal pads P, and the sub circuit board 310 is provided with at least three vertical power pads.

One of the three power signal pads P on the second silicon optical chip 520 is connected with the nearest power signal pad on the secondary circuit board 310 through at least two routing signals, the power signal pads P on two sides of the second silicon optical chip 520 are respectively and sequentially routed to the power signal pads on the secondary circuit board 310, and the number of routing is two or more. That is, the middle power supply signal pad P is connected with the left power supply pad signal through 2 wires, the lower power supply signal pad P is connected with the middle power supply pad signal through 2 wires, and the upper power supply signal pad P is connected with the right power supply pad signal through 2 wires.

Specifically, the second silicon optical chip 520 is provided with a first power signal pad P, a second power signal pad P and a third power signal pad P which are arranged side by side in the up-down direction, and the second power signal pad P is located between the first power signal pad P and the third power signal pad P; the left side of the secondary circuit board 310 is provided with a first power supply pad, a second power supply pad, and a third power supply pad, which are disposed side by side in the left-right direction, with the second power supply pad being located between the first power supply pad and the third power supply pad.

Three power signal pads P on the second silicon optical chip 520 are disposed between the first ground signal pad G of the transmitting pad group and the second ground signal pad G of the receiving pad group, and three power pads on the left side of the sub circuit board 310 are disposed between the first ground pad and the second ground pad, and the sizes of the first ground pad and the second ground pad in the left-right direction are larger than those of the power pads in the left-right direction.

In some embodiments, the three power signal pads on the secondary circuit board 310 are sequentially arranged left, right, and not horizontally arranged, so that the wires are spatially staggered and form staggered return paths with two sides, and signal crosstalk between the transmitting signal and the receiving signal is prevented.

The second silicon optical chip 520 is electrically connected with the golden finger 340 on the circuit board 300 through a power signal pad, a wire bonding, a power pad and a power wire, so that the power signal of the golden finger 340 is routed to the secondary circuit board 310 through the power wire, then routed to the edge of the secondary circuit board 310 through the inner layer and the surface layer of the secondary circuit board 310, and then connected with the power pad on the secondary circuit board 310 and the power signal pad P of the second silicon optical chip 520 through the wire bonding, so as to supply power for the second silicon optical chip 520, so that the second silicon optical chip 520 receives external optical signals.

The second silicon optical chip 520 is in signal connection with the signal processing chip 320 on the secondary circuit board 310 through the transmitting pad group, the receiving pad group, the wire bonding, the transmitting pad, the receiving pad, and the high-speed signal line, so that the signal output by the signal processing chip 320 is transmitted to the second silicon optical chip 520 through the high-speed signal line, the transmitting pad, the wire bonding, and the transmitting pad group to provide a data signal for the second silicon optical chip 520, so that the second silicon optical chip 520 can optically modulate the laser beam according to the data signal, and the modulated optical signal is transmitted through the transmitting optical fiber ribbon 700.

After the external optical signal is transmitted to the second silicon optical chip 520 through the receiving optical fiber ribbon 800, the second silicon optical chip 520 processes the external optical signal, and the processed electrical signal is transmitted to the signal processing chip 320 through the receiving pad group, the wire bonding, the receiving pad and the high-speed signal wire, and is subjected to subsequent processing through the signal processing chip 320.

In some embodiments, after the signal processing chip 320 performs signal transmission with the first silicon optical chip 420 and the second silicon optical chip 520 through the high-speed signal line, the circuit board 300 is used to power the first optical transceiver sub-module 400 and the second optical transceiver sub-module 500.

Fig. 24 is a schematic power connection diagram of a circuit board, a signal processing chip and a first optical transceiver sub-module in an optical module provided in an embodiment of the present application, and fig. 25 is a power connection cross-sectional view of the first optical transceiver sub-module in the optical module provided in an embodiment of the present application. As shown in fig. 24 and 25, the back surface of the signal processing chip 320 is provided with a signal solder ball 3210, after the signal processing chip 320 is disposed on the secondary circuit board 310 through the signal solder ball 3210, an electrical signal enters the circuit board 300 from the golden finger 340, and then is connected to the secondary circuit board 310 through the signal solder ball between the circuit board 300 and the secondary circuit board 310, so as to transmit a power to the secondary circuit board 310, and power the first optical transceiver sub-module 400 through the secondary circuit board 310.

Specifically, one end of a power line disposed on the circuit board 300 is electrically connected to the gold finger 340, and the other end is electrically connected to a signal solder ball between the circuit board 300 and the sub-circuit board 310 to transmit an electrical signal to the sub-circuit board 310; the inner layer of the secondary circuit board 310 is electrically connected with the solder balls on the back surface of the secondary circuit board 310 to transmit an electrical signal to the inner layer of the secondary circuit board 310; the inner layer of the secondary circuit board 310 is electrically connected with a power line arranged on the front surface of the secondary circuit board 310 to transmit an electric signal from the inner layer of the secondary circuit board 310 to the surface of the secondary circuit board 310; the power line disposed on the front side of the secondary circuit board 310 is electrically connected to the first silicon optical chip 420 through a wire bonding, so as to transmit an electrical signal to the first silicon optical chip 420 through the power line and the wire bonding, and supply power to the first silicon optical chip 420.

In some embodiments, since the signal processing chip 320 is connected to the front side of the secondary circuit board 310 through the signal solder balls 3210, in order to avoid the signal processing chip 320 on the front side of the secondary circuit board 310, the power line for supplying power to the first silicon optical chip 420 should be disposed inside the secondary circuit board 310, and after the power line avoids the signal processing chip 320, the power line can be disposed on the front side of the secondary circuit board 310 through the via hole.

Specifically, a first power line may be disposed in the secondary circuit board 310, one end of the power signal line on the circuit board 300 is electrically connected to the golden finger 340 on the circuit board 300, the other end is electrically connected to the first power line, and the first power line is electrically connected to the first silicon optical chip 420 through wire bonding.

A first power trace may also be disposed on the front surface of the secondary circuit board 310, where one end of the first power trace is electrically connected to the first power trace through a via hole, and the other end is electrically connected to the first silicon optical chip 420 through a wire bonding.

In some embodiments, to supply power to the laser 4120 of the first optical transceiver sub-module 400, a second power trace may be further disposed on the front surface of the sub-circuit board 310, where the second power trace is located on one side of the connection hole 330, and one end of the second power trace is electrically connected to the laser 4120 through a wire bonding, and the other end is electrically connected to the first power trace through a via hole.

After the first silicon optical chip 420 and the laser 4120 of the first optical transceiver sub-module 400 receive the electrical signals, the laser 4120 emits a laser beam, the laser beam is sequentially transmitted to the first silicon optical chip 420 through the collimating lens 4130, the optical isolator 4140, the converging lens 4150 and the optical glass block 4160, and the laser beam is subjected to electro-optical modulation through the first silicon optical chip 420, so that light emission is realized.

Fig. 26 is a schematic power connection diagram of a circuit board, a signal processing chip and a second optical transceiver sub-module in an optical module provided in an embodiment of the present application, and fig. 27 is a power connection cross-sectional view of the second optical transceiver sub-module in the optical module provided in an embodiment of the present application. As shown in fig. 26 and 27, the signal processing chip 320 is disposed on the secondary circuit board 310, and an electrical signal enters the circuit board 300 from the golden finger 340, and then is connected to the secondary circuit board 310 through a signal solder ball between the circuit board 300 and the secondary circuit board 310, so as to transmit a power to the secondary circuit board 310, and power the second optical transceiver sub-module 500 through the secondary circuit board 310.

Specifically, one end of a power line disposed on the circuit board 300 is electrically connected to the gold finger 340, and the other end is electrically connected to a signal solder ball between the circuit board 300 and the secondary circuit board 310, so as to transmit an electrical signal to the signal solder ball; the inner layer of the secondary circuit board 310 is electrically connected with the signal solder balls on the back surface of the secondary circuit board 310 to transmit an electric signal to the inner layer of the secondary circuit board 310; the inner layer of the secondary circuit board 310 is electrically connected with a power line arranged on the front surface of the secondary circuit board 310 to transmit an electric signal from the inner layer of the secondary circuit board 310 to the surface of the secondary circuit board 310; the power line disposed on the front surface of the secondary circuit board 310 is electrically connected to the second silicon optical chip 520 through a wire bonding, so as to transmit an electrical signal to the second silicon optical chip 520 through the power line and the wire bonding, and supply power to the second silicon optical chip 520.

When the second silicon optical chip 520 is powered by the power line on the inner layer of the secondary circuit board 310, the power line on the inner layer of the secondary circuit board 310 needs to be located at one side of the connection hole 330, so as to avoid crosstalk between the power line connected to the first optical transceiver sub-module 400 and the power line connected to the second optical transceiver sub-module 500.

In some embodiments, since the signal processing chip 320 is connected to the front side of the secondary circuit board 310 through the signal solder balls 3210, in order to avoid the signal processing chip 320 on the front side of the secondary circuit board 310, the power line for supplying power to the second silicon optical chip 520 should be disposed inside the secondary circuit board 310, and after the power line avoids the signal processing chip 320, the power line can be disposed on the front side of the secondary circuit board 310 through the via hole.

Specifically, a second power line may be disposed in the secondary circuit board 310, where the second power line is located at one side of the connection hole 330, one end of the power signal line on the circuit board 300 is electrically connected to the gold finger 340 on the circuit board 300, the other end is electrically connected to the second power line, and the second power line is electrically connected to the second silicon optical chip 520 through wire bonding.

A third power trace may be further disposed on the front surface of the secondary circuit board 310, where the third power trace is located on one side of the connection hole 330, one end of the first power trace is electrically connected to the second power trace through the via hole, and the other end is electrically connected to the second silicon optical chip 520 through the wire bonding.

In some embodiments, to supply power to the laser of the second optical transceiver sub-module 500, a fourth power trace may be further disposed on the front surface of the sub-circuit board 310, and a power signal line is disposed on the circuit board 300 at the second optical transceiver sub-module 500, where one end of the power signal line is electrically connected to the fourth power trace, and the other end of the power signal line is electrically connected to the laser through a wire bonding.

After the second silicon optical chip 520 and the laser of the second optical transceiver sub-module 500 receive the electrical signals, the laser emits a laser beam, the laser beam is sequentially transmitted to the second silicon optical chip 520 through the collimating lens, the optical isolator, the converging lens and the optical glass block, and the laser beam is subjected to electro-optical modulation through the second silicon optical chip 520 so as to realize light emission.

After the first optical transceiver sub-module 400 receives the electrical signals and the data signals transmitted by the circuit board 300, the laser beam generated by the laser device is emitted into the first silicon optical chip 420, the first silicon optical chip 420 performs electro-optical modulation on the laser beam according to the data signals, and the modulated emission signals are emitted out through the emission optical fiber ribbon 700; after the second optical transceiver sub-module 500 receives the electrical signals and the data signals transmitted by the circuit board 300, the laser beam generated by the laser device is emitted into the first silicon optical chip 420, the second silicon optical chip 520 performs electro-optical modulation on the laser beam according to the data signals, and the modulated emission signals are emitted through the emission optical fiber band.

After the first optical transceiver sub-module 400 receives the electrical signals and the data signals transmitted by the circuit board 300, the external optical signals are transmitted to the first silicon optical chip 420 through the receiving optical fiber ribbon 800, the first silicon optical chip 420 converts the optical signals into electrical signals according to the data signals, and the electrical signals are transmitted to the signal processing chip 320 through the high-frequency signal line for processing; after the second optical transceiver sub-module 500 receives the electrical signals and the data signals transmitted by the circuit board 300, the external optical signals are transmitted to the second silicon optical chip 520 through the receiving optical fiber ribbon, the second silicon optical chip 520 converts the optical signals into electrical signals according to the data signals, and the electrical signals are transmitted to the signal processing chip 320 through the high-frequency signal line for processing.

Fig. 28 is a schematic diagram of a pad structure of a secondary circuit board in an optical module according to an embodiment of the present application. As shown in fig. 28, the back of the secondary circuit board 310 is provided with a signal pad and a protection pad, the protection pad is positioned at the outer side of the signal pad, and the secondary circuit board 310 is connected with the circuit board 300 through the signal pad and the protection pad to realize the connection of the secondary circuit board 310 and the circuit board 300

Specifically, the back surface of the secondary circuit board 310 is provided with a first signal pad 3120, and the first signal pad 3120 corresponds to a signal solder ball on the back surface of the signal processing chip 320, that is, the first signal pad 3120 on the back surface of the secondary circuit board 310 is close to the gold finger 340 on the circuit board 300. Thus, the first signal pads 3120 on the back side of the secondary circuit board 310 are connected to the front side of the circuit board 300, so that the electrical signals and data signals transmitted by the golden finger 340 on the circuit board 300 are transmitted to the secondary circuit board 310 through the first signal pads 3120 on the back side of the secondary circuit board 310, and then transmitted to the signal processing chip 320 through the secondary circuit board 310.

In some embodiments, the back side of the secondary circuit board 310 is provided with a first protection pad 3130 in addition to the first signal pad 3120, and the first protection pad 3130 is located around the first signal pad 3120. Specifically, first protection pads 3130 are disposed on the upper and lower sides of the first signal pads 3120, the first protection pads 3130 being adjacent to the first signal pads 3120 on the back side of the secondary circuit board 310, and the first protection pads 3130 may be used to protect the first signal pads 3120 from damage of the first signal pads 3120 when the secondary circuit board 310 is mounted.

In some embodiments, the first protection pad 3130 is of a ground GND property, so that after the secondary circuit board 310 is mounted on the circuit board 300, the first signal pad 3120 on the back side of the secondary circuit board 310 is connected to a pad on the front side of the circuit board 300, the first protection pad 3130 on the back side of the secondary circuit board 310 is connected to a ground pad on the front side of the circuit board 300, and a ground connection between the secondary circuit board 310 and the circuit board 300 is achieved through the first protection pad 3130.

The first protection pad 3130 can realize the grounding connection between the secondary circuit board 310 and the circuit board 300, and the first protection pad 3130 can also play a role in supporting, so that the secondary circuit board 310 is supported in the process of SMT (surface mount technology) mounting the secondary circuit board 310 on the circuit board 300, and the false soldering caused by inconsistent front and rear stress is avoided.

In some embodiments, the secondary circuit board 310 includes a first edge, a second edge, a third edge, and a fourth edge, the first edge being disposed opposite the third edge, the second edge being disposed opposite the fourth edge, and the first signal pad 3120 being proximate the fourth edge. I.e., the first edge is located on the upper side of the secondary circuit board 310, the second edge is located on the left side of the secondary circuit board 310, the third edge is located on the lower side of the secondary circuit board 310, and the fourth edge is located on the right side of the secondary circuit board 310.

The first edge and the third edge are both provided with a second protection pad 3150, the second edge is provided with a third protection pad 3160, the second protection pad 3150 is located at the upper side edge and the lower side edge of the secondary circuit board 310, the third protection pad 3160 is located at the left side edge of the secondary circuit board 310, and the edges of the secondary circuit board 310 can be supported by the second protection pad 3150 and the third protection pad 3160.

In some embodiments, a second signal pad 3180 is disposed on the secondary circuit board 310 on the left side of the connection hole 330, and the second signal pad 3180 is electrically connected to the laser 4120 through wire bonding to provide electrical signals, data signals, for the laser 4120. The fourth guard pad 3170 is provided on the left side of the second signal pad 3180 on the sub circuit board 310, and the right side of the connection hole 330. The fifth protective pad 3190 is disposed such that the edge of the connection hole 330 on the sub circuit board 310 can be supported by the fourth protective pad 3170 and the fifth protective pad 3190.

In some embodiments, a gap exists between the first guard pad 3130 and the first and third edges, and a gap exists between the second guard pad 3150 and the fourth edge; the secondary circuit board 310 is further provided with a sixth protection pad 3140, and the sixth protection pad 3140 is located outside the first protection pad 3130 and is disposed in a gap between the first protection pad 3130 and the first edge, a gap between the third edge, and a gap between the second protection pad 3150 and the fourth edge.

The second guard pad 3150, the third guard pad 3160, the fourth guard pad 3170, the fifth guard pad 3190 and the sixth guard pad 3140 are all of the property of ground GND, so that after the secondary circuit board 310 is mounted on the circuit board 300, the second guard pad 3150, the third guard pad 3160, the fourth guard pad 3170, the fifth guard pad 3190 and the sixth guard pad 3140 on the back side of the secondary circuit board 310 are respectively connected to the ground pad on the front side of the circuit board 300, so as to implement the ground connection between the secondary circuit board 310 and the circuit board 300.

The optical module comprises a circuit board, a secondary circuit board, a signal processing chip, a first optical receiving and transmitting secondary module, a second optical receiving and transmitting secondary module, a plurality of optical fiber belts and an optical fiber connector, wherein the secondary circuit board is attached to the circuit board, a connecting hole is formed in the secondary circuit board, a part of area on the circuit board 300 is exposed through the connecting hole, and the secondary circuit board is in signal connection with the circuit board through a high-speed differential signal wire; the signal processing chip is arranged on the secondary circuit board, so that the signal processing chip is closer to the shell of the optical module, and heat generated by the signal processing chip is more quickly conducted to the shell; the first optical transceiver sub-module is arranged on the surface of the circuit board and positioned in the connecting hole, and is in signal connection with the signal processing chip through a high-speed differential signal wire arranged on the sub-circuit board; the second optical transceiver sub-module is arranged on the surface of the circuit board, is arranged side by side with the first optical transceiver sub-module and the signal processing chip along the left-right direction, and is connected with a high-speed differential signal wire arranged on the sub-circuit board through wire bonding, so that the second optical transceiver sub-module is connected with the signal processing chip through the sub-circuit board through signals; the transmitting end and the receiving end of the first optical transceiver sub-module and the second optical transceiver sub-module are correspondingly connected with the optical fiber ribbon to transmit optical signals transmitted by the first optical transceiver sub-module and the second optical transceiver sub-module and transmit the optical signals to the first optical transceiver sub-module and the second optical transceiver sub-module; the optical fiber connector is connected with the optical fiber belts and is used for transmitting optical signals carried by the optical fiber belts and transmitting the optical signals to the optical fiber belts. The first optical transceiver sub-module and the second optical transceiver sub-module are arranged on the circuit board along the left-right direction in a mode of attaching the double circuit boards, so that the layout area of the circuit board is increased, and the photoelectric devices can be arranged on the circuit board and the sub-circuit board, for example, the signal processing chip is arranged on the sub-circuit board, so that wires for connecting the photoelectric devices are scattered, signal crosstalk between the wires is prevented, the transmission rate of the optical module is improved, and the integrated design of the optical module is facilitated; in addition, the signal processing chip of the main heating device is arranged on the secondary circuit board, so that the signal processing chip is closer to the upper shell of the optical module, heat generated by the signal processing chip is more quickly conducted to the upper shell, the temperature inside the module is reduced, and the heat dissipation performance of the optical module is improved; the circuit board is in signal connection with the secondary circuit board through a high-speed differential signal wire, and the first optical transceiver sub-module embedded in the connecting hole on the secondary circuit board is in signal connection with the signal processing chip through a high-speed differential signal wire arranged on the secondary circuit board to provide high-frequency signals for the first optical transceiver sub-module; the second optical transceiver sub-module arranged on the circuit board is connected with the high-speed differential signal wire arranged on the sub-circuit board through the wire bonding, and provides high-frequency signals for the second optical transceiver sub-module through the sub-circuit board, so that the high-frequency characteristics of the optical transceiver sub-module are ensured, and the high-frequency characteristics of the optical module and the heat dissipation of key devices are considered.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims

1. An optical module, comprising:

a circuit board;

a secondary circuit board attached to the circuit board, wherein the length dimension in the left-right direction of the secondary circuit board is smaller than the length dimension in the left-right direction of the circuit board; the circuit board is provided with a connecting hole, a first high-speed signal wire and a second high-speed signal wire are arranged on the surface of the circuit board, one end of the first high-speed signal wire is positioned at one side edge of the connecting hole, one end of the second high-speed signal wire is positioned at one side edge of the secondary circuit board, and the second high-speed signal wire is positioned at one side of the connecting hole;

the signal processing chip is arranged on the secondary circuit board and is respectively connected with the first high-speed signal line and the second high-speed signal line;

The first optical transceiver sub-module is arranged on the surface of the circuit board and is positioned in the connecting hole; the first high-speed signal line is connected with the first high-speed signal line through a wire bonding;

the second optical transceiver sub-module is arranged on the surface of the circuit board, is arranged side by side with the first optical transceiver sub-module and the signal processing chip along the left-right direction, and is adjacent to one end of the sub-circuit board on one side; the second high-speed signal line is connected with the first high-speed signal line through a wire bonding;

the fixing frame is arranged on the periphery of the second optical transceiver sub-module, and the optical fiber belt connected with the first optical transceiver sub-module is clamped and fixed on the fixing frame; a side plate of the fixing frame is arranged above the silicon optical chip of the second optical transceiver sub-module, a through hole is formed in the side plate of the fixing frame, and the silicon optical chip of the second optical transceiver sub-module is exposed through the through hole; wherein the fixing frame is a U-shaped fixing frame;

2. The optical module of claim 1, wherein the first optical transceiver sub-module comprises a first optical emission component and a first silicon optical chip, the optical beam emitted by the first optical emission component is incident on the first silicon optical chip, and the first silicon optical chip is close to the signal processing chip;

The first high-speed signal wire is arranged between the edge of the connecting hole and the signal processing chip, one end of the first high-speed signal wire is connected with the signal processing chip, and the other end of the first high-speed signal wire is connected with the first silicon optical chip through wire bonding.

3. The optical module of claim 2, wherein the routing surface of the first silicon optical chip is on the same surface as the secondary circuit board.

4. The optical module of claim 2, wherein the second optical transceiver sub-module includes a second optical emission component and a second silicon optical chip, the second optical emission component emits a light beam into the second silicon optical chip, and the second silicon optical chip is adjacent to an edge of the sub-circuit board facing away from the signal processing chip.

5. The optical module of claim 4, wherein the second high-speed signal line is disposed between an edge of the secondary circuit board and the signal processing chip, and one end of the second high-speed signal line is connected to the signal processing chip, and the other end is connected to the second silicon optical chip by wire bonding.

6. The optical module of claim 5, wherein the routing surface of the second silicon optical chip is on the same surface as the secondary circuit board.

7. The optical module of claim 4, wherein the first silicon optical chip and the second silicon optical chip are both disposed obliquely.

8. The optical module of claim 7, wherein an angle between a central axis of the first silicon optical chip and a central axis of the secondary circuit board is 8 degrees.

9. The optical module according to claim 1, wherein a first mounting area and a second mounting area are arranged side by side in the left-right direction on the circuit board, the first optical transceiver sub-module is mounted on the first mounting area through the connection hole, and the second optical transceiver sub-module is mounted on the second mounting area.

10. The optical module of claim 2, wherein the optical fiber ribbon comprises a transmitting optical fiber ribbon and a receiving optical fiber ribbon, wherein the transmitting optical port of the first silicon optical chip is connected to the transmitting optical fiber ribbon, and wherein the receiving optical port of the first silicon optical chip is connected to the receiving optical fiber ribbon.