CN102967906A - Packaging shell for semiconductor photoelectric module - Google Patents
Packaging shell for semiconductor photoelectric module Download PDFInfo
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- CN102967906A CN102967906A CN2012104980264A CN201210498026A CN102967906A CN 102967906 A CN102967906 A CN 102967906A CN 2012104980264 A CN2012104980264 A CN 2012104980264A CN 201210498026 A CN201210498026 A CN 201210498026A CN 102967906 A CN102967906 A CN 102967906A
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Abstract
The invention discloses a packaging shell for a semiconductor photoelectric module. The packaging shell comprises a chassis, a wall body welded around the chassis, ceramic insulating sub-porcelain pieces and a cover plate. The chassis, the cover plate and the wall body form a sealed rectangular cavity. A through hole is arranged on the side face of the wall body. A light window is embedded into the through hole. Ceramic insulating sub-porcelain pieces which are connected integrally are uniformly distributed on the other three side faces of the wall body to form a U-shaped structure. Printing circuits are arranged inside the ceramic insulating sub-porcelain pieces. A connecting lead is externally connected with the outer surface of the printing circuit opposite to the light window, and the lead is communicated with the ceramic insulating sub-porcelain pieces. According to the packaging shell for the semiconductor photoelectric module provided by the invention, with the adoption of the packaging shell of the small photoelectric module of the U-shaped ceramic pieces, the inner wiring space is enlarged, and wires are arranged according to demand, so that the design and process difficulties of the photoelectric module are reduced. Under the premise that the size of the shell structure is unchanged, the wiring number is increased, and the demand of large capacity and high speed transmission of a photoelectric sensor is satisfied.
Description
Technical field
The present invention relates to a kind of semiconductor optoelectronic module package casing; belong to fiber optic communication field; especially a kind of U-shaped porcelain insulator porcelain piece construction packages shell for the semiconductor optoelectronic module is for inside chip and circuit provide electricity, heat passage, mechanical support and airtight environmental protection.
Background technology
In Fibre Optical Communication Technology, usually adopt semiconductor laser as the signal source of optical fiber communication.For the laser that semiconductor laser is produced imports in the optical fiber, semiconductor laser coupling need to be encapsulated in certain specific encapsulating structure.
The encapsulating structure of optical-electric module commonly used is metal one ceramic package encapsulating structure at present, comprise metal chassis in the structure, be welded on metal body of wall around the metal base plate, be welded on porcelain insulator porcelain piece in the metal body of wall opening, be welded on the metal lead wire on porcelain insulator porcelain piece surface and be welded on the metal body of wall top encapsulation cover plate relative with metal base plate, metal lead wire links to each other with interior external circuit by the hole of running through porcelain insulator porcelain piece inside, and electric signal is directly realized inside and outside transmission by metal lead wire and porcelain insulator porcelain piece.The miniaturization photo-electricity module adopts metallic cavity, and the porcelain insulator porcelain piece is rectangle, and the porcelain insulator porcelain piece is welded on the relative side of optical window, and P.e.c. is positioned at a side of shell.Chassis and the welding of metal body of wall, light signal is by optical window and inside chip coupling.The ceramic member bonding region of enclosure concentrates on a side, and bonding region quantity is few, chip and circuit can only be at the bonding regions of arranging near a side of porcelain piece, wiring space is little, inside chip and circuit design have been limited, can't satisfy the encapsulation requirement of complicated circuit, and also increase the difficulty of optical-electric module design and processes.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of semiconductor optoelectronic module package casing, this package casing increases than the internal wiring zone of traditional structure, in the constant situation of shell physical dimension, improve wiring quantity, can satisfy the electric connection needs of complicated circuit.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of semiconductor optoelectronic module package casing, comprise the chassis, be welded on chassis body of wall and cover plate on every side, described chassis, cover plate and body of wall form the rectangular inner cavity of sealing, a side opening that it is characterized in that described body of wall is provided with a through hole, be inlaid with optical window in the described through hole, be laid with the porcelain insulator porcelain piece on other three sides of body of wall, described porcelain insulator porcelain piece connects as one, form U-shaped structure, porcelain insulator porcelain piece inboard row is furnished with P.e.c., the outside of body of wall one side relative with described optical window is circumscribed with connecting lead wire, and described lead-in wire is communicated with the porcelain insulator porcelain piece.
Said structure is described further, by the optical window stent support, welds between body of wall and the optical window support between described optical window and the through hole.The present invention is provided with the optical window support between optical window and body of wall, by optical window stent support optical window, the convenient installation also is convenient for changing optical window.
Said structure is described further, and described lead-in wire is individual layer or bilayer.
Said structure is described further, and offers notch on relative body of wall one side of optical window support, described porcelain insulator porcelain piece passes notch and body of wall is welded and fixed.
Said structure is described further, is provided with seal mouth ring around the described cover plate, adopt the parallel seam welding mode to carry out seal welding between cover plate and the body of wall.Need to be tightly connected between cover plate among the present invention and the body of wall, because structure of the present invention is less than normal, adopt common welding to be difficult to realize sealing, therefore need parallel weld seam mode to seal, satisfy the sealing structure requirement.
Said structure is described further, and described porcelain insulator porcelain piece is aluminium oxide ceramics, and its content is 90%～96%, and other are calcium, magnesium, sila matter atom.
The beneficial effect that adopts technique scheme to produce is:
The present invention is than traditional miniaturization photo-electricity module housing, for inside chip and circuit provide electricity, heat passage, mechanical support and airtight environmental protection, the present invention adopts the miniaturization photo-electricity module housing of the porcelain insulator porcelain piece of U-shaped structure to have following significant advantage: 1) the inner chamber wiring space increases, P.e.c. can connect up according to the needs of inside chip and circuit, make things convenient for the assembling of optical-electric module, reduced the design and processes difficulty of optical-electric module; 2) shell wiring zone increases, and can increase P.e.c. quantity, has improved wiring quantity in the constant situation of shell physical dimension, can satisfy the electric connection needs of complicated circuit.
Description of drawings
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Fig. 1 is structural representation of the present invention;
Fig. 2 is the full sectional view of overlooking of Fig. 1;
Fig. 3 is the left view of Fig. 1;
Wherein: 1, lead-in wire, 2, the porcelain insulator porcelain piece, 3, seal mouth ring, 4, body of wall, 5, the chassis, 6, the optical window support, 7, optical window, 8, inner chamber, 9, cover plate, 10, telltale mark.
Embodiment
1-3 as can be known with reference to the accompanying drawings, the present invention is specifically related to a kind of semiconductor optoelectronic module package casing, be used for the encapsulation of optical fiber communication optical-electric module, this shell mechanism comprises chassis 5, be welded on chassis 5 body of wall 4 and cover plate 9 on every side, described chassis 5, cover plate 9 and body of wall 4 form the rectangular inner cavity 8 of sealing, the side opening of described body of wall 4 is provided with through hole, be inlaid with optical window 7 in the through hole, be laid with porcelain insulator porcelain piece 2 on other three sides of body of wall 4, described porcelain insulator porcelain piece 2 connects as one, and forms U-shaped structure, and porcelain insulator porcelain piece 2 inboard row are furnished with P.e.c., the bonding region number of can arranging is the 5-25 root, and individual layer or double-deck lead all can.
2 can find out with reference to the accompanying drawings, and chassis 5 is the slab construction of metal among the present invention, and size is identical with metal body of wall 4, and four jiaos without pilot hole.Body of wall 4 one end perforates welding optical window support 6 with optical window support 6 relative end otch, is used for welding ceramics insulator porcelain piece 2.Optical window 7 is welded on the inwall circular hole of the optical window support 6 of shell.Adopt the parallel seam welding mode to carry out seal welding between cover plate 9 and the body of wall 4.
A side external surface relative with optical window 7 is circumscribed with connecting lead wire 1, and lead-in wire 1 is communicated with porcelain insulator porcelain piece 2.
Described porcelain insulator porcelain piece 2 is aluminium oxide ceramics, and its content is 90%～96%, and other are calcium, magnesium, sila matter atom.
This porcelain insulator porcelain piece 2 adopts the multi-layer ceramics process to make.Adopt casting technique to make the aluminium oxide ceramic chips, the machining small on ceramic chips with mould and punch device, in aperture, fill tungsten slurry or molybdenum slurry, make P.e.c. on the ceramic chips surface with tungsten slurry or molybdenum slurry, laminated ceramic chips forces together into the green array, and each array comprises a plurality of green spares.The mode that the preparation of single ceramic spare is adopted is: the green array is cut into single ripe porcelain piece to ripe porcelain array with cutting equipment again by the ripe porcelain piece of high temperature sintering.Ceramic member with metal base plate, metal body of wall, seal mouth ring, lead-in wire, optical window support welding, carries out surface gold-plating through nickel plating again, and gold-plated rear welding optical window is made finished product.
The present invention is than traditional miniaturization photo-electricity module housing, adopt the miniaturization photo-electricity module housing tool of U-shaped porcelain piece, can be that the internal wiring space increases, connect up as required, thereby reduced the design and processes difficulty of optical-electric module, in the situation of shell mechanism size constancy, improved wiring quantity, satisfy the requirement of the large capacity of photoelectric sensor, high-speed transfer.
Claims (6)
1. semiconductor optoelectronic module package casing, comprise chassis (5), be welded on chassis (5) body of wall (4) on every side, porcelain insulator porcelain piece (2) and cover plate (9), described chassis (5), cover plate (9) and body of wall (4) form the rectangular inner cavity (8) of sealing, a side opening that it is characterized in that described body of wall (4) is provided with a through hole, be inlaid with optical window (7) in the described through hole, be laid with porcelain insulator porcelain piece (2) on other three sides of body of wall (4), described porcelain insulator porcelain piece (2) connects as one, form U-shaped structure, porcelain insulator porcelain piece (2) inboard row is furnished with P.e.c., the outside of body of wall (4) one sides relative with described optical window (7) is circumscribed with connecting lead wire (1), and described lead-in wire (1) is communicated with porcelain insulator porcelain piece (2).
2. semiconductor optoelectronic module package casing according to claim 1 is characterized in that supporting by optical window support (6) between described optical window (7) and the through hole, welding between body of wall (4) and the optical window support (6).
3. semiconductor optoelectronic module package casing according to claim 1 is characterized in that described lead-in wire (1) is individual layer or bilayer.
4. semiconductor optoelectronic module package casing according to claim 2 is characterized in that offering notch on relative body of wall (4) one sides with optical window support (6), and described porcelain insulator porcelain piece (2) passes notch and body of wall (4) is welded and fixed.
5. semiconductor optoelectronic module package casing according to claim 1 is characterized in that described cover plate (9) is provided with seal mouth ring (3) on every side, adopts the parallel seam welding mode to carry out seal welding between cover plate (9) and the body of wall (4).
6. the described semiconductor optoelectronic module of any one package casing according to claim 1-5 is characterized in that described porcelain insulator porcelain piece (2) is aluminium oxide ceramics, and its content is 90%～96%, and other are calcium, magnesium, sila matter atom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104980264A CN102967906A (en) | 2012-11-29 | 2012-11-29 | Packaging shell for semiconductor photoelectric module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104980264A CN102967906A (en) | 2012-11-29 | 2012-11-29 | Packaging shell for semiconductor photoelectric module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102967906A true CN102967906A (en) | 2013-03-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104980264A Pending CN102967906A (en) | 2012-11-29 | 2012-11-29 | Packaging shell for semiconductor photoelectric module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102967906A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104243937A (en) * | 2014-09-27 | 2014-12-24 | 成都思迈科技发展有限责任公司 | Mine rockfall protective video surveillance light transmission device |
| CN104345411A (en) * | 2014-09-27 | 2015-02-11 | 成都思迈科技发展有限责任公司 | Underground dustproof fiber optical transceiver |
| CN109936932A (en) * | 2019-03-08 | 2019-06-25 | 河北中瓷电子科技有限公司 | Ceramics, glass and metal ternary encapsulating package and preparation method |
| CN110854210A (en) * | 2019-11-18 | 2020-02-28 | 中航光电科技股份有限公司 | Ultrahigh frequency radio frequency photoelectric detector based on BOX encapsulation |
Citations (9)
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|---|---|---|---|---|
| JPH1117041A (en) * | 1997-06-20 | 1999-01-22 | Sumitomo Electric Ind Ltd | Package for optical semiconductor |
| JP2003174108A (en) * | 2001-12-06 | 2003-06-20 | Sumitomo Metal Electronics Devices Inc | Package for optical communication and method of manufacturing the same |
| CN1719675A (en) * | 2004-07-06 | 2006-01-11 | 日本光进株式会社 | Optical module |
| JP2007036046A (en) * | 2005-07-28 | 2007-02-08 | Sumitomo Electric Ind Ltd | Optical transmitting device |
| CN201072756Y (en) * | 2007-07-02 | 2008-06-11 | 大连艾科科技开发有限公司 | Mixed optoelectronic packaging outer casing |
| JP2009212161A (en) * | 2008-02-29 | 2009-09-17 | Sumitomo Metal Electronics Devices Inc | Semiconductor device storage package for optical communication |
| CN201611399U (en) * | 2010-03-05 | 2010-10-20 | 河北中瓷电子科技有限公司 | Shell for photoelectric emission module |
| CN201611661U (en) * | 2010-03-05 | 2010-10-20 | 河北中瓷电子科技有限公司 | Metal-ceramic packaging shell for a photoelectric receiving module |
| CN201741982U (en) * | 2010-03-05 | 2011-02-09 | 河北中瓷电子科技有限公司 | Metal wall-multilayer ceramic insulator encapsulating shell for semiconductor laser |
-
2012
- 2012-11-29 CN CN2012104980264A patent/CN102967906A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1117041A (en) * | 1997-06-20 | 1999-01-22 | Sumitomo Electric Ind Ltd | Package for optical semiconductor |
| JP2003174108A (en) * | 2001-12-06 | 2003-06-20 | Sumitomo Metal Electronics Devices Inc | Package for optical communication and method of manufacturing the same |
| CN1719675A (en) * | 2004-07-06 | 2006-01-11 | 日本光进株式会社 | Optical module |
| JP2007036046A (en) * | 2005-07-28 | 2007-02-08 | Sumitomo Electric Ind Ltd | Optical transmitting device |
| CN201072756Y (en) * | 2007-07-02 | 2008-06-11 | 大连艾科科技开发有限公司 | Mixed optoelectronic packaging outer casing |
| JP2009212161A (en) * | 2008-02-29 | 2009-09-17 | Sumitomo Metal Electronics Devices Inc | Semiconductor device storage package for optical communication |
| CN201611399U (en) * | 2010-03-05 | 2010-10-20 | 河北中瓷电子科技有限公司 | Shell for photoelectric emission module |
| CN201611661U (en) * | 2010-03-05 | 2010-10-20 | 河北中瓷电子科技有限公司 | Metal-ceramic packaging shell for a photoelectric receiving module |
| CN201741982U (en) * | 2010-03-05 | 2011-02-09 | 河北中瓷电子科技有限公司 | Metal wall-multilayer ceramic insulator encapsulating shell for semiconductor laser |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104243937A (en) * | 2014-09-27 | 2014-12-24 | 成都思迈科技发展有限责任公司 | Mine rockfall protective video surveillance light transmission device |
| CN104345411A (en) * | 2014-09-27 | 2015-02-11 | 成都思迈科技发展有限责任公司 | Underground dustproof fiber optical transceiver |
| CN104345411B (en) * | 2014-09-27 | 2016-01-13 | 成都思迈科技发展有限责任公司 | Down-hole dustproof optic fibre transceiver |
| CN104243937B (en) * | 2014-09-27 | 2017-04-19 | 成都思迈科技发展有限责任公司 | Mine rockfall protective video surveillance light transmission device |
| CN109936932A (en) * | 2019-03-08 | 2019-06-25 | 河北中瓷电子科技有限公司 | Ceramics, glass and metal ternary encapsulating package and preparation method |
| CN110854210A (en) * | 2019-11-18 | 2020-02-28 | 中航光电科技股份有限公司 | Ultrahigh frequency radio frequency photoelectric detector based on BOX encapsulation |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Application publication date: 20130313 |