CN208257112U - Multi-pass transmission semiconductor laser transmitter package casing - Google Patents
Multi-pass transmission semiconductor laser transmitter package casing Download PDFInfo
- Publication number
- CN208257112U CN208257112U CN201820665905.4U CN201820665905U CN208257112U CN 208257112 U CN208257112 U CN 208257112U CN 201820665905 U CN201820665905 U CN 201820665905U CN 208257112 U CN208257112 U CN 208257112U
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- China
- Prior art keywords
- semiconductor laser
- laser transmitter
- optical window
- pass transmission
- package casing
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Abstract
The utility model provides a kind of multi-pass transmission semiconductor laser transmitter package casing, belong to microelectronic packaging technology field, including metal base plate and the circumferential closed metal wall being welded on the metal base plate, the metal wall is rectangle structure, one long wall of the metal wall is equipped with rectangular window, the outside of the rectangular window is equipped with optical window bracket, rectangle optical window is welded on the outside of the optical window bracket, another long wall of the metal wall is equipped with ceramic insulator, the end face of the metal wall is equipped with blank cover.Multi-pass transmission semiconductor laser transmitter package casing provided by the utility model, enclosure volume big, at high cost technical problem when being able to solve progress multi-pass transmission existing in the prior art.
Description
Technical field
The utility model belongs to microelectronic packaging technology field, is to be related to a kind of multi-pass transmission use half more specifically
Conductor Laser emitter package shell.
Background technique
Traditional semiconductor laser transmitter shell is metal wall ceramic insulation minor structure, generally metal base plate, gold
Belong to the box body that wall, optical window bracket and optical window are constituted.Optical window is welded on the inside of optical window bracket, and optical window is circle, and can only be met
Optical transport requirement all the way.When needing multichannel optical path to input, shelling machine is complex, needs by multiple optical window brackets and multiple
Optical window collectively constitutes.Because such design scheme needs multiple optical windows and optical window holder combination to realize, at high cost, and enclosure volume
Greatly, it is not able to satisfy High Density Integration encapsulation to minimize enclosure volume, inexpensive requirement.
Utility model content
The purpose of this utility model is to provide a kind of multi-pass transmission semiconductor laser transmitter package casings, with solution
Certainly enclosure volume big, at high cost technical problem when progress multi-pass transmission existing in the prior art.
In order to achieve the above purposes, the technical solution adopted by the utility model is: provides a kind of multi-pass transmission semiconductor
Laser emitter package casing, including metal base plate and the circumferential closed metal wall being welded on the metal base plate, institute
Stating metal wall is rectangle structure, and a long wall of the metal wall is equipped with rectangular window, the rectangle window
Mouthful outside be equipped with optical window bracket, be welded with rectangle optical window on the outside of the optical window bracket, the metal wall another
Long wall is equipped with ceramic insulator, and the end face of the metal wall is equipped with blank cover.
Further, the ceramic insulator is inverted T-shaped structure, is set respectively on two surfaces up and down of T shape platform
There are multiple metal lead wires.
Further, the end face of the ceramic insulator and the metal wall is welded with becket, the blank cover
It is packaged on the becket.
Further, the surface of the rectangle optical window is equipped with one layer of anti-reflection film.
Further, the ceramic insulator is aluminium oxide ceramics part.
Further, the material of the metal base plate is tungsten copper, molybdenum copper, copper-molybdenum copper, any in controlled expansion alloy 4j29
Kind.
Further, the material of the metal wall, the becket and the optical window bracket be controlled expansion alloy 4j29,
Any one of 4j34,4j50.
Further, the rectangle optical window is made of sapphire or borosilicate glass.
Multi-pass transmission provided by the utility model is with the beneficial effect of semiconductor laser transmitter package casing: with
The prior art is compared, the utility model multi-pass transmission semiconductor laser transmitter package casing, using a rectangle light
Window effectively reduces material cost, and the rectangle optical window is welded on the outside of package casing, conveniently shelves debugging, improves life
Efficiency is produced, production difficulty is reduced；Enclosure volume can be effectively reduced, meets integrated antenna package to shell small form factor requirements.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this is practical new
Some embodiments of type for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structure that semiconductor laser transmitter package casing is used in multi-pass provided by the embodiment of the utility model transmission
Schematic diagram；
Fig. 2 is the overlooking structure diagram of Fig. 1；
Fig. 3 is the side structure schematic view of Fig. 1；
Fig. 4 is the structural schematic diagram of optical window used by the utility model embodiment；
Fig. 5 is the overlooking structure diagram of Fig. 4.
Wherein, each appended drawing reference in figure:
1- ceramic insulator；2- metal wall；3- metal base plate；4- optical window bracket；5- rectangle optical window；6- becket.
Specific embodiment
In order to which technical problem to be solved in the utility model, technical solution and beneficial effect is more clearly understood, with
Lower combination accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
It applies example to be only used to explain the utility model, is not used to limit the utility model.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or indirectly on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on the figure or position are closed
System, is merely for convenience of describing the present invention and simplifying the description, rather than the device or element of indication or suggestion meaning are necessary
It with specific orientation, is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.The meaning of " plurality " is two or two in the description of the present invention,
More than, unless otherwise specifically defined.
Also referring to Fig. 1 to Fig. 5, now multi-pass transmission provided by the utility model is sealed with semiconductor laser transmitter
Casing is illustrated.Multi-pass transmission semiconductor laser transmitter package casing, including metal base plate 3 and be welded in
Circumferential closed metal wall 2 on the metal base plate 3, the metal wall 2 are rectangle structure, the metal wall 2
A long wall be equipped with rectangular window, the outside of the rectangular window is equipped with optical window bracket 4, the optical window bracket 4
Outside be welded with rectangle optical window 5, another long wall of the metal wall 2 is equipped with ceramic insulator 1, the metal
The end face of wall 2 is equipped with blank cover.
Multi-pass transmission semiconductor laser transmitter package casing provided by the utility model, compared with prior art,
Compared with traditional multi-pass inputs shell, the shell that rectangle optical window 5 is brazed has following significant advantage:
1) current multiple optical windows and golden tin solder are changed to a rectangle optical window 5 and a solder, effectively reduced
Material cost；
2) being brazed multiple optical windows simultaneously i.e. and influence production efficiency also influences product yield, is changed to a welding rectangle optical window
5, production efficiency can be effectively improved, production difficulty is reduced, improves product yield；
3) rectangle optical window 5 is changed to soldering in outer side of shell by being brazed inside the shell, conveniently shelves debugging；Due to rectangular
Shape optical window 5 is a penetrating optical window, and optical window whole face has anti-reflection film, and centre is blocked without metal parts, can meet multichannel optical path
Incoming shell, facilitates debugging, meets multiplexing needs；
4) enclosure volume can be effectively reduced, meets integrated antenna package to shell small form factor requirements.
Blank cover and shell sealing mode are parallel seam welding.Ceramic insulator 1, metal base plate 3, becket 6, optical window branch
Frame 4, optical window and blank cover constitute seal cavity, provide airtight environment protection for internal semiconductor laser chip and circuit
And mechanical support.
The utility model provides electricity, heat for encapsulating semiconductor laser transmitter and transmitting module, for semiconductor laser
Access, mechanical support and airtight environmental protection.
Further, referring to Fig. 1, being sealed as multi-pass transmission provided by the utility model with semiconductor laser transmitter
A kind of specific embodiment of casing, the ceramic insulator 1 is inverted T-shaped structure, in two tables up and down of T shape platform
Face is respectively equipped with multiple metal lead wires.
Further, it please refers to Fig.1 to Fig.3, is sent out as multi-pass transmission provided by the utility model with semiconductor laser
The end face of a kind of specific embodiment of emitter package casing, the ceramic insulator 1 and the metal wall 2 is welded with metal
Ring 6, the blank cover are packaged on the becket 6.
Further, it refering to Fig. 4, is encapsulated as multi-pass transmission provided by the utility model with semiconductor laser transmitter
The surface of a kind of specific embodiment of shell, the rectangle optical window 5 is equipped with one layer of anti-reflection film.Optical window is welded on outside shell
Side, optical window are changed to rectangle optical window 5, and since rectangle optical window 5 is a penetrating optical window, optical window whole face has anti-reflection film, in
Between blocked without metal parts, can meet multichannel optical path be passed to shell, facilitate debugging, meet multiplexing needs.
Further, as multi-pass transmission provided by the utility model with the one of semiconductor laser transmitter package casing
Kind specific embodiment, the ceramic insulator 1 are aluminium oxide ceramics part, and ingredient is 90%~96%, using multi-layer ceramics work
Process production, metal parts are made of machining mode.
Further, as multi-pass transmission provided by the utility model with the one of semiconductor laser transmitter package casing
Kind of specific embodiment, the material of the metal base plate 3 are tungsten copper, molybdenum copper, copper-molybdenum copper, any in controlled expansion alloy 4j29
Kind.
Further, as multi-pass transmission provided by the utility model with the one of semiconductor laser transmitter package casing
Kind specific embodiment, the material of the metal wall 2, the becket 6 and the optical window bracket 4 are controlled expansion alloy
Any one of 4j29,4j34,4j50.
The technological process of production of the utility model are as follows: porcelain powder is through casting technique at strip, and strip is again via punching, metallization
Printing, lamination, lamination, earnestly at single green part, green part is sintered mature porcelain piece namely ceramic insulator by high temperature sintering furnace
1.Being brazed after ripe porcelain piece nickel plating with metal parts such as metal base plate 3, metal wall 2, becket 6 and optical window brackets 4 is shell, outside
Shell is welded as finished shell with optical window after craft of gilding.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (8)
1. multi-pass transmission semiconductor laser transmitter package casing, it is characterised in that: including metal base plate and be welded in institute
State the circumferential closed metal wall on metal base plate, the metal wall is rectangle structure, one of the metal wall
Long wall is equipped with rectangular window, and the outside of the rectangular window is equipped with optical window bracket, and the outside of the optical window bracket is welded
It is connected to rectangle optical window, another long wall of the metal wall is equipped with ceramic insulator, the end face of the metal wall
Equipped with blank cover.
2. multi-pass transmission semiconductor laser transmitter package casing as described in claim 1, it is characterised in that: the pottery
Porcelain insulator is inverted T-shaped structure, is respectively equipped with multiple metal lead wires on two surfaces up and down of T shape platform.
3. multi-pass transmission semiconductor laser transmitter package casing as described in claim 1, it is characterised in that: the pottery
The end face of porcelain insulator and the metal wall is welded with becket, and the blank cover is packaged on the becket.
4. multi-pass transmission semiconductor laser transmitter package casing as described in claim 1, it is characterised in that: the length
The surface of rectangular optical window is equipped with one layer of anti-reflection film.
5. multi-pass transmission semiconductor laser transmitter package casing as described in claim 1, it is characterised in that: the pottery
Porcelain insulator is aluminium oxide ceramics part.
6. multi-pass transmission semiconductor laser transmitter package casing as described in claim 1, it is characterised in that: the gold
The material for belonging to bottom plate is any one of tungsten copper, molybdenum copper, copper-molybdenum copper, controlled expansion alloy 4j29.
7. multi-pass transmission semiconductor laser transmitter package casing as claimed in claim 3, it is characterised in that: the gold
The material for belonging to wall, the becket and the optical window bracket is any one of controlled expansion alloy 4j29,4j34,4j50.
8. multi-pass transmission semiconductor laser transmitter package casing as described in claim 1, it is characterised in that: the length
Rectangular optical window is made of sapphire or borosilicate glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820665905.4U CN208257112U (en) | 2018-05-04 | 2018-05-04 | Multi-pass transmission semiconductor laser transmitter package casing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820665905.4U CN208257112U (en) | 2018-05-04 | 2018-05-04 | Multi-pass transmission semiconductor laser transmitter package casing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208257112U true CN208257112U (en) | 2018-12-18 |
Family
ID=64634814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820665905.4U Active CN208257112U (en) | 2018-05-04 | 2018-05-04 | Multi-pass transmission semiconductor laser transmitter package casing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208257112U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114122901A (en) * | 2021-11-13 | 2022-03-01 | 深圳市宏钢机械设备有限公司 | Packaging tube shell for laser television semiconductor laser and production process thereof |
-
2018
- 2018-05-04 CN CN201820665905.4U patent/CN208257112U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114122901A (en) * | 2021-11-13 | 2022-03-01 | 深圳市宏钢机械设备有限公司 | Packaging tube shell for laser television semiconductor laser and production process thereof |
| CN114122901B (en) * | 2021-11-13 | 2022-11-18 | 深圳市宏钢机械设备有限公司 | Packaging tube shell for laser television semiconductor laser and production process thereof |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 050200 No. 21 Changsheng Street, Luquan Economic Development Zone, Shijiazhuang City, Hebei Province Patentee after: Hebei Zhongchi Electronic Technology Co., Ltd. Address before: 050200 No. 21 Changsheng Street, Luquan Economic Development Zone, Shijiazhuang City, Hebei Province Patentee before: HEBEI SINOPACK ELECTRONIC TECHNOLOGY CO., LTD. |
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| CP01 | Change in the name or title of a patent holder |